The information in this guide is subject to change without notice.
There are no representations or warranties, either expressed or implied, with respect to the
contents hereof and specifically disclaims any warranties of merchantability or fitness for any
particular purpose. The software described in this manual is sold or licensed "as is". Should
the programs prove defective following their pur ch as e, th e bu ye r (n ot the ma n uf ac tur e r,
distributor, or its dealer) assumes the entire cost of all necessary servicing, repair, and any
incidental or consequential damages resulting from any defect in the software.
ii
Page 3
Conventions
NOTE
The following conventions are used in this manual:
!
WARNING:
Indicates a potential for personal injury.
!
CAUTION:
Indicates a potential loss of data or damage to equipment.
IMPORTANT:
+
Indicates information that is important to know for the proper completion of a
procedure, choice of an option, or completing a task.
NOTE:
:
Follow local regulations for battery and circuit board disposal. Batteries and Circuit
Boards >10 cm² have been highlighted with a yellow rectangle.
The following typographical conventions are used in this document:
Book titles, directory names, file names, path names, and program/process names are
shown in italics.
Example:
the DRS5 User's Guide
/usr/local/bin/fd
the /TPH15spool_M program
Computer output (text that represents information displayed on a computer screen,
such as menus, prompts, responses to input, and error messages) are shown in
constant width.
Example:
[01] The server has been stopped
User input (text that represents information entered by a computer user, such as
command names, option letters, and words) are shown in constant width bold.
Variables contained within user input are shown in angle brackets (< >).
Example:
At the prompt, type run <file name> -m
Keyboard keys are shown in bold italics.
Example:
After entering data, press Enter.
iii
Page 4
General Information0
This service guide provides all technical information relating to the basic configuration for Acer
global product offering. To better fit local market requirements and enhance product
competitiveness, your regional office may have decided to extend the functionality of a
machine (such as add-on cards, modems, or extra memory capabilities). These localized
features are not covered in this generic service guide. In such cases, contact your regional
offices or the responsible personnel/channel to provide further technical details.
When ordering FRU parts:
Check the most up-to-date information available on your regional Web or channel. If, for
whatever reason, a part number change is made, it may not be noted in this printed service
guide.
Acer-authorized Service Providers:
Your Acer office may have a differ ent part num ber code than those given in the FRU list in this
service guide. The list provided by your regional Acer office must be used to order FRU parts
for repair and service of customer machines.
drive, flash drive, and battery)
Weight (equipped with optical
drive, flash drive, and battery)
Input power
Operating voltage12.0 V dc @ 1.5 A - 18 W
Operating current1.5 A
Temperature
Operating (not writing to
optical disc)
Operating (writing to optical
disc)
Nonoperating-20°C to 60°C-4°F to 140°F
Relative humidity
Operating10% to 90%
Nonoperating5% to 95%
13.3mm0.52in
750g1.65lb
N/AN/A
0°C to 50°C32°F to 122°F
0°C to 50°C32°F to 122°F
Maximum altitude (unpressurized)
Operating-15 m to 3,048 m-50 ft to 10,000 ft
Nonoperating-15 m to 12,192 m-50 ft to 40,000 ft
Shock
Operating125 g, 2 ms, half-sine
Nonoperating200 g, 2 ms, half-sine
Random vibration
Operating0.75 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min sweep rate
Nonoperating1.50 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min sweep rate
:
Applicable product safety standards specify thermal limits for plastic surfaces. The comp uter
operates well within this range of temperatures.
Hardware Specifications and Configurations1-15
Page 24
System Board Major Chips
ItemSpecification
Core logicTegra 250 Dual cortex A9, 1GHz
VGAIntegrate in Tegra 250 CPU
LANnot in this computer
USB 2.0 Integrate in Tegra 250 CPU
Super I/O controller N/A
Bluetooth Broadcom BCM4329
Wireless Broadcom BCM4329
PCMCIA N/A
Audio codec Wolfson WM8903
Card readerSD 2.0 Integrate in Tegra 250 CPU
LVDS transmitterSN75LVDS83B
PMUTI TPS658621C
LDDR2 Elpida EDB8132B2PB 1GB
ULPI Phy for USB SMSC USB3315
GPSBroadcom BCM4751
TOUCH controllerAtmel ATMXT 1386-CHIPSET1PJA101
eMMCHynix H26M32001DAR
CAMERA
BIOS vendor
BIOS Version
BIOS ROM type
BIOS ROM size
Features
LAN Interface (N/A)
ItemSpecification
LAN Chipset
LAN connector type
LAN connector location
Features
Keyboard (N/A)
ItemSpecification
Type
Total number of keypads
Windows logo key
Internal & external keyboard
work simultaneously
Features
Hardware Specifications and Configurations1-19
Page 28
Hard Disk Drive (AVL components) (N/A)
NOTE
ItemSpecification
Vendor & Model
Name
Capacity (GB)
Bytes per sector
Data heads
Drive Format
Disks
Spindle speed
(RPM)
Performance Specifications
Buffer size
Interface
Fast data transfer
rate (Mbits / sec,
max)
Media data transfer
rate
(Mbytes/sec max)
DC Power Requirements
Voltage tolerance
:
1-20Hardware Specifications and Configurations
Page 29
Embedded MultiMediaCard (AVL components)
ItemSpecification
Vendor & Model
Name
Capacity (GB)
Sandisk
SDIN4C2-16G
Samsung
KLMAG4EEHM
16G16G32G32G
DC Power Requirements
Voltage tolerance1.8V
Super-Multi Drive (N/A)
ItemSpecification
Vendor & Model name
Performance Specification
Transfer rate (KB/sec)
Buffer Memory
Interface
Applicable disc format
Loading mechanism
Power Requirement
Input Voltage
Sandisk
SDIN4E2-32G
Samsung
KLMBG8FEJA
BD Drive (N/A)
ItemsSpecifications
Vendor & Model
name
Performance
Specification
Transfer rate
(KB/sec)
Buffer Memory
Interface
Applicable disc
format
Loading mechanism
Power Requirement
Input Voltage
Hardware Specifications and Configurations1-21
Page 30
LED 10.1”
ItemSpecification
Vendor/Model nameAUO/B101EW05 V1
Screen Diagonal (mm)255.85 mm
Active Area (mm)216.96 mm x 135.6 mm
Display resolution (pixels)1280x 3(RGB) x 800
Pixel Pitch (mm)0.1695mm × 0.1695mm
Typical White Luminance
2
(cd/m
) also called Brightness
300 cd/m2
Contrast Ratio1000 min / 1300 type
Response Time (Optical Rise
25 ms / 35 ms
Time/Fall Time) msec
Typical Power Consumption
3.4 W
(watt)
Weight (without inverter)180 max
Physical Size (mm)229.46 mm x 149.1mm x 5.2 max
Electrical Interface1 channel LVDS
Viewing Angle (degree)
Vendor & Model name
Brightness conditions
Input voltage (v)
Input current (mA)
Output voltage (V, RMS)
Output current (mA, RMS)
Output voltage frequency
(KHz)
1-22Hardware Specifications and Configurations
Page 31
Display Supported Resolution (LCD)
NOTE
NOTE
Resolution16 bits32 bitsIntelNVIDIAATI
1280x 3(RGB) x 800XXXVX
:
Resolution fixed at 1280 x 800. Not adjustable by end user.
Graphics Controller (N/A)
ItemSpecification
VGA Chip
Supports
Display Supported Resolution (GPU)
Resolution16 bits32 bitsIntelNVDIAATI
1280x 3(RGB) x 800XXXVX
:
Resolution fixed at 1280 x 800. Not adjustable by end user.
Bluetooth Interface
ItemSpecifications
ChipsetAzurewave AW-NH611- Broadcom 4329 SIP
Data throughput
Protocol
TX 1.2Mbits/sec
RX 1.2Mbits/sec
OPP 1.0 (Object Push Profile)
OBEX 1.1 (Object Exchange Profile)
HSP 1.1 (Headset Profile)
A2DP 1.2 (Advanced Audio Distribution Profile)
AVRCP 1.0 (Audio/Video Remote Control Profile)
GAVDP 1.0 (Generic Audio/Video Distribution Profile)
GAP (Generic Access Profile)
ControllerAzurewave AW-NH611 - Broadcom BCM43 29 SoC
Features
Hardware Specifications and Configurations1-23
Fully support BT 2.1 +EDR
UART Interface
Page 32
Front Camera
ItemSpecification
Vendor and Model Chicony / Aptina 2031
Type2M
Rear Camera
ItemSpecification
Vendor and Model
Liteon / OV5650 CSI
Liteon / Aptina 5140
Type5M
Mini Card
ItemSpecification
Number supported1
Features1 mini card slot (for WWAN)
3G Card
ItemSpecification
Features
3G Module with Huawei 770W
3G Module with Huawei 820W
3G Module with Ericsson 5521gw
3G Module with Gobi3000
1-24Hardware Specifications and Configurations
Page 33
Audio Codec and Amplifier
ItemSpecification
Audio ControllerAudio codec: Wolfson WM8903
Features
4.5mW Power consumption for DAC to headphone playback
DAC SNR 96dB typical , THD -86dB typical
ADC SNR 92dB typical , THD -80dB typical
Control sequencer for pop minimized start-up and shut-down
Single register write for default start-up sequ ence
Stereo digital microphone input
3 single ended inputs per stereo channel
2 pseudo differential inputs per stereo channel
1 fully differential mic inputs per stereo channel
Digital Dynamic Range Controller
Digital sidetone mixing
Ground-referenced headphone driver
Ground-referenced line input
Stereo differential line driver for direct interface to WM9001
40-pin5x5mm QFN package
AmplifierN/A
FeaturesN/A
Audio Interface
speaker driver
ItemSpecification
Audio ControllerWolfson WM8903
Audio onboard or optionalOn board
Mono or StereoStereo
ResolutionSupport 24bit
CompatibilityI2S audio Interface
Sampling rateSample rate up to 44.1KHz
Internal microphoneYes
Internal speaker/quantityYes/(1W speakers x2)
Hardware Specifications and Configurations1-25
Page 34
Wireless Module 802.11b/g/n
ItemSpecification
ChipsetAzurewave AW-NH611 - Broadcom BCM4329 SoC
Data throughput
This chapter contains general info rmation about the notebook, a list of tools needed to perform
the required maintenance and step by step procedures on how to remove and install
components from the notebook computer.
General Information0
Recommended Equipment0
The following tools are required to perform maintenance on the notebook:
Wrist grounding strap and conductive mat
Flat screwdriver
Philips screwdriver
Screw NameQuantity
M2.0x4.0 Ni14
M2.0x3.07
Machine Maintenance Procedures3-3
Page 46
Maintenance Flowchart0
The flowchart in Figure 3-1 provides a graphic representation of the module removal and
installation sequences. It provides information on what components need to be removed and
installed during servicing.
Figure 3-1. Maintenance Flow
3-4Machine Maintenance Procedures
Page 47
Getting Started0
The flowchart (Figure 3-1) identifies sections illustrating the entire removal and install
sequence. Observe the order of the sequence to avoid damage to any of the hardware
components.
Perform the following prior to performing any maintenance procedures:
1. Place system on a flat work surface.
2. Disconnect AC Adapter and remove all cables from system and peripherals.
3. Make sure system is completely powered down.
4. To make sure system is completely powered down, press and hold power button (A) for 4
seconds. (Figure 3-2)
a. If the device is in powered down mode, allow device to complete boot process
(approx. 10 sec). Then power down normally.
b. If device is in sleep mode, wait for Home Screen to clear. Then power down
normally.
A
Figure 3-2. Device Overview with Power Button
5. Press and hold Power button for 4 seconds to show Tablet Options dialog.
6. Select Power Off to power down device.
7. From Power Off dialog, select OK.
Machine Maintenance Procedures3-5
Page 48
SIM/Micro-SD Card Removal0
1. Open SIM/Micro-SD card cover. (Figure 3-3)
Figure 3-3. Opening SIM/Micro-SD Card Cover
2. Remove SIM card from spring locking mechanism. (Figure 3-4)
Figure 3-4. Removing SIM Card
3-6Machine Maintenance Procedures
Page 49
3. Remove Micro-SD card from spring locking mechanism. (Figure 3-5)
Figure 3-5. Removing Micro-SD Card
4. Secure SIM/Micro-SD card cover. (Figure 3-6)
Figure 3-6. Securing SIM/Micro-SD Card Cover
Machine Maintenance Procedures3-7
Page 50
SIM/Micro-SD Card Installation0
1. Open SIM/Micro-SD card cover. (Figure 3-3)
2. Install and secure SIM card. (Figure 3-4)
3. Install and secure Micro-SD card. (Figure 3-5)
4. Close and secure SIM/Micro-SD card cover. (Figure 3-6)
3-8Machine Maintenance Procedures
Page 51
Lower Case Removal0
Prerequisite:
SIM/Micro-SD Card Removal
1. Open SIM/Micro-SD card cover (A). (Figure 3-7)
Figure 3-7. Opening SIM/Micro-SD Card Cover
2. Insert plastic pry into slot below Micro-SD card cover as shown in Figure 3-8 to unlock
latch. (Figure 3-8)
Figure 3-8. Unlocking Locking Latches (1 of 5)
Machine Maintenance Procedures3-9
Page 52
3. Starting from edge as shown in Figure 3-9, unlock locking latches on rear cover from
bezel.
Figure 3-9. Unlocking Locking Latches (2 of 5)
Figure 3-10. Unlocking Locking Latches (3 of 5)
3-10Machine Maintenance Procedures
Page 53
Figure 3-11. Unlocking Locking Latches (4 of 5)
Figure 3-12. Unlocking Locking Latches (5 of 5)
Machine Maintenance Procedures3-11
Page 54
4. Remove lower case from bezel. (Figure 3-13)
Figure 3-13. Removing Lower Case
Lower Case Installation0
1. Open SIM/Micro-SD card cover. (Figure 3-14)
Figure 3-14. Opening SIM/Micro-SD Card Cover
3-12Machine Maintenance Procedures
Page 55
2. Align Micro-SD port with slot on bezel. (Figure 3-15)
Figure 3-15. Aligning Lower Case with Bezel
3. Install lower case on bezel. (Figure 3-16)
Figure 3-16. Installing Lower Case on Bezel
Machine Maintenance Procedures3-13
Page 56
4. Starting at volume button, secure locking latches to rear cover on all sides of bezel.
(Figure 3-17 through Figure 3-20)
Figure 3-35. Disconnecting Docking Board FFC from Mainboard
4. Remove three (3) screws (C) from bezel. (Figure3-36)
C
D
Figure 3-36. Removing Docking Board Screws
3-26Machine Maintenance Procedures
Page 69
5. Remove docking board from bezel. (Figure 3-37)
Figure 3-37. Removing Docking Board
Machine Maintenance Procedures3-27
Page 70
Docking Board Installation0
1. Align docking board with bezel guides (E). (Figure 3-38)
E
Figure 3-38. Aligning Docking Board Bezel Guides
2. Install board on bezel. (Figure 3-37)
3. Install and secure three (3) screws (D) to bezel. (Figure 3-36)
4. Install and connect docking board FFC (C), labeled MB, to mainboard connector (c).
(Figure 3-35)
5. Install and connect docking board FFC (B) to docking board connector (b). (Figure 3-34)
6. Install battery.
IDSizeQuantityScrew Ty pe
BM2.0x3.03
3-28Machine Maintenance Procedures
Page 71
GPS Antenna Removal0
Prerequisite:
Battery Removal
1. Disconnect GPS antenna (A) from mainboard connector. (Figure 3-39)
A
Figure 3-39. Disconnecting GPS Antenna
2. Remove GPS module. (Figure 3-40)
Figure 3-40. Removing GPS Module
Machine Maintenance Procedures3-29
Page 72
GPS Antenna Installation0
1. Install GPS module on bezel. (Figure 3-40)
2. Connect GPS antenna (A) to mainboard connector. (Figure 3-39)
3. Install battery.
3-30Machine Maintenance Procedures
Page 73
Mainboard Removal0
Prerequisite:
3G Module Removal
1. Disconnect the following cables: (Figure 3-41)
Front and rear microphone cables (A) from mainboard connectors (a)
Touch screen cable (B) from mainboard connector (b)
Main (black) WLAN cable (C) from mainboard connector (c)
Front camera FFC (D) from mainboar d conn e cto r (d )
LVDS cable (E) from mainboard connector (e)
Speaker cable (F) from mainboard connector (f)
USB FFC (G) from mainboard connector (g)
F
g
G
f
e
d
b
E
a
D
C
B
A
Figure 3-41. Disconnecting Cables from Mainboard
Machine Maintenance Procedures3-31
Page 74
2. Remove screw (H) and four (4) screws (J) from bezel. (Figure 3-42)
H
Figure 3-42. Removing Mainboard Screws
3. Lift and remove mainboard from bezel. (Figure 3-43)
J
Figure 3-43. Removing Mainboard
3-32Machine Maintenance Procedures
Page 75
Mainboard Installation0
!
CAUTION:
The touch screen lock button guides may be damaged when the mainboard
screws are secured. Make sure to align the touch screen lock button switch with
the lock button guides.
1. Set touch screen lock button (K) to unlock position. (Figure 3-44)
K
unlockedlocked
Figure 3-44. Setting Touch Screen Lock Button
2. Install mainboard on bezel. (Figure 3-45)
Figure 3-45. Install Mainboard
Machine Maintenance Procedures3-33
Page 76
3. Align with bezel guide pins (L). (Figure 3-46)
L
Figure 3-46. Aligning Mainboard with Bezel Guide Pins
5. Install and secure one screw (H) and four (4) screws (J) to bezel. (Figure 3-42)
6. Connect the following cables: (Figure 3-41)
Front and rear microphone cables (A) to mainboard connectors (a)
Touch screen cable (B) to mainboard connector (b)
Main (black) WLAN cable (C) to mainboard connector (c)
Front camera FFC (D) to mainboard connector (d)
LVDS cable (E) to mainboard connector (e)
Speaker cable (F) to mainboard connector (f)
USB FFC (G) to mainboard connector (g)