Ace ACE632EM Schematics

ACE632
N&P Pair Enhancement Mode MOSFET
Description
The ACE632 is the N- and P-Channel enhancement mode power field effect transistors are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where high-side switching, low in-line power loss, and resistance to transients are needed.
Features
N-Channel
20V/0.95A,R 20V/0.75A,R 20V/0.65A,R
=380mΩ@V
DS(ON)
=450mΩ@V
DS(ON)
=800mΩ@V
DS(ON)
=4.5V
GS
=2.5V
GS
=1.8V
GS
P-Channel
-20V/1.0A,R
-20V/0.8A,R
-20V/0.7A,R
= 520mΩ@V
DS(ON)
= 700mΩ@V
DS(ON)
= 950mΩ@V
DS(ON)
=-4.5V
GS
=-2.5V
GS
=-1.8V
GS
Super high density cell design for extremely low RDS(ON)
Exceptional on-resistance and maximum DC current capability
Application
Power Management in Note book
Portable Equipment
Battery Powered System
DC/DC Converter
Load Switch
DSC
LCD Display inverter
VER 1.4 1
Thermal Resistance Steady State
SOT-363
Description
1
Source 1
3
Drain 2
4
Source 2
5
Gate 2
6
Drain 1
Halogen - free
ACE632
N&P Pair Enhancement Mode MOSFET
Absolute Maximum Ratings
(TA=25 Unless otherwise noted)
Parameter Symbol
N-Channel P-Channel
Drain-Source Voltage VDS 20 -20 V
Gate-Source Voltage VGS ±12 ±12 V
Continuous Drain Current (TJ=150℃)
A
TA=80 0.9 -0.7
I
D
=25
T
Pulsed Drain Current1) IDM 4 -3 A
Continuous Source Current (Diode Conduction) IS 0.6 -0.6
Power Dissipation
A
TA=70 0.19
P
D
=25
T
Operating Junction T emperature TJ -55 to 150
Storage Temperature Range T
-55 to 150
STG
T10sec
-Junction to Ambient
R
θJA
Typical
1.2 -1.0
0.3
360 360 400 400
Unit
A
W
O
C
O
C
O
C/W
Packaging Type
SOT-363
6 5 4
2 Gate 1
1 2 3
N-Channel P-Channel
Ordering information
ACE632 EM + H
Pb - free EM : SOT363
VER 1.4 2
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
ACE632
N&P Pair Enhancement Mode MOSFET Electrical Characteristics
Static
V
=0V, ID=250uA N-Ch 20
Drain-Source Break do wn Voltage V
Drain-Source On Resistance R
Gate Threshold Volt age V
Gate Leakage Current I
(BR)DSS
DS(ON)
GS(th)
GSS
GS
VGS=0V, ID=250uA P-Ch -20
V
=4.5V, ID=0.95A N-Ch 0.26 0.38
GS
VGS=-4.5V, ID=-1.0A P-Ch 0.42 0.52 VGS=2.5V, ID=0.75A N-Ch 0.32 0.45 VGS=-2.5V, ID=-0.8A P-Ch 0.58 0.70 VGS=1.8V, ID=0.65A N-Ch 0.42 0.80 VGS=-1.8V, ID=-0.5A P-Ch 0.75 0.95 V
DS=VGS
, ID=250uA N-Ch 0.35 1.0
VDS=VGS, ID=-250uA P-Ch -0.35 -1.0
V
=0V, VGS=±12V N-Ch 100
DS
VDS=0V, VGS=±12V P-Ch -100
V
Ω
V
nA
Zero Gate Voltage Drain Current I
On-State Drain Current I
Diode Forward Voltage VSD
Forward Transconductance gfs
Total Gate Charge Qg
Gate-Source Charge Qgs
Gate-Drain Charge Qgd
DSS
D(ON)
V
=20V, VGS=0V N-Ch 1
DS
VDS=-20V, VGS=0V P-Ch -1
VDS=20V, VGS=0V TJ=55 N-Ch 5
VDS=-20V, VGS=0V TJ=55 P-Ch -5
V
≧4.5V, VGS =5V N-Ch 2
DS
VDS≦-4.5V, VGS =-5V P-Ch -2
I
=0.5A, VGS=0V N-Ch 0.8 1.2
S
IS=-0.5A, VGS=0V P-Ch -0.8 -1.2
V
=10V, ID=1.2A N-Ch 2.6
DS
VDS=-10V, ID=-1.0A P-Ch 1.5
Dynamic
N-Channel
V
=10V, VGS=4.5V,
DS
I
1.2A
D
P-Channel
V
=-10V, VGS=-4.5V,
DS
I
-1.0A
D
N-Ch 1.2 2.0 P-Ch 1.1 1.8 N-Ch 0.2 P-Ch 0.3 N-Ch 0.3 P-Ch 0.2
uA
A
V
S
nC
Turn-On Time
Turn-Off Time
t
d(on)
t
d(off)
tr
I
D
I
=-0.5A, V
D
tf
N-Channel
V
=10V,RL=20Ω
DD
=0.5A, V
P-Channel
V
=-10V,RL=20Ω
DD
=4.5V,RG=6Ω
GEN
=-4.5V, RG=6Ω
GEN
P-Ch 18 30 N-Ch 20 30 P-Ch 25 40
ns
N-Ch 25 40 P-Ch 20 30 N-Ch 12 20 P-Ch 12 20
VER 1.4 3
N-Ch 15 25
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