Acconeer A1 User Manual

A111 – Pulsed Coherent Radar (PCR)
Datasheet v1.8
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
© 2019 Copyright by Acconeer 2019-06-12 Page 2 of 34
A111 Overview
The A111 is a radar system based on pulsed coherent radar (PCR) technology and is setting a new benchmark for power consumption and distance accuracy – fully integrated in a small package of 29 mm2.
The A111 60 GHz radar system is optimized for high precision and ultra-low power, delivered as a one package solution with integrated Baseband, RF front-end and Antenna in Package (AiP). This will enable easy integration into any portable battery driven device.
The A111 is based on leading-edge patented sensor technology with pico-second time resolution, capable of measuring absolute distance with mm accuracy up to a range of 2 m
(1)
and with a continuous sweep update
frequency fully configurable up to 1500 Hz
(2)
.
The A111 60 GHz radar remains uncompromised by any natural source of interference, such as noise, dust, color and direct or indirect light.
Applications
High precision distance measurements with
mm accuracy and high update frequency
Proximity detection with high accuracy and
the possibility to define multiple proximity zones
Motion detection, Speed detection
Enables material detection
High precision object tracking, enabling
gesture control
High precision tracking of 3D objects
Monitor vital life signs such as breathing and
pulse rate
(1)
2m ranging is guaranteed for an object size, shape and dielectric properties corresponding to a spherical corner reflector of 5 cm radius.
(2)
System integration dependent – e.g. Host MCU and SPI performance.
A111 Pulsed Coherent Radar (PCR)
Datasheet, v1.8
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Table of Contents
1 Revision History ........................................................................................................................................... 4
2 Description .................................................................................................................................................... 5
2.1 Functional Block Diagram .................................................................................................................. 6
3 Pin Configuration and Functions ............................................................................................................... 7
4 Specifications ............................................................................................................................................... 9
4.1 Absolute Maximum Ratings ............................................................................................................... 9
4.2 Environmental Sensitivity ................................................................................................................... 9
4.3 Recommended Operating Conditions ............................................................................................ 10
4.4 Electrical Specification ..................................................................................................................... 10
4.5 Power Consumption Summary ....................................................................................................... 11
4.6 RF Specification ................................................................................................................................ 11
5 Timing Requirements .................................................................................................................................12
5.1 Serial Peripheral Interface ............................................................................................................... 12
6 Typical Characteristics ...............................................................................................................................14
6.1 Distance Accuracy ............................................................................................................................ 14
6.2 Amplitude Accuracy .......................................................................................................................... 15
6.3 Relative Phase Accuracy ................................................................................................................. 15
6.4 Half Power Beamwidth (HPBW) ..................................................................................................... 16
7 Functional Description ...............................................................................................................................17
7.1 Acconeer Software ........................................................................................................................... 18
7.2 Software Integration ......................................................................................................................... 18
7.3 Power Up Sequence......................................................................................................................... 19
8 Layout Recommendations .........................................................................................................................21
8.1 Bill of Material (BoM) ........................................................................................................................ 22
8.2 XTAL ................................................................................................................................................... 23
8.3 External clock source ....................................................................................................................... 24
8.4 Power supply ..................................................................................................................................... 25
9 Regulatory Approval ................................................................................................................................ ...27
9.1 ETSI .................................................................................................................................................... 27
9.1.1 EU declaration of conformity ..................................................................................................... 27
9.2 FCC Approval .................................................................................................................................... 28
9.2.1 FCC Regulatory Notes ................................................................................................................ 28
9.2.2 FCC Grant Authorization ............................................................................................................ 29
10 Mechanical Data ................................................................................................................................ .....30
10.1 Recommended Reflow Profile ........................................................................................................ 32
11 Abbreviations ..........................................................................................................................................33
Disclaimer .............................................................................................................................................................34
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
© 2019 Copyright by Acconeer 2019-06-12 Page 4 of 34
1 Revision History
Revision
Comment
V1.0
Released version
V1.1
Minor reference correction in chapter 5.1. A111 marking info added in chapter 2.
V1.2
Relative phase accuracy added in chapter 6.3
V1.3
Ordering information added in chapter 2. Equation corrected in XTAL chapter 8.1.
V1.4
- EU declaration of conformity added, chapter 9.0.
- Pin configuration alphabetically order corrected, chapter 3.
- Acconeer Software chapter 7.1 updated including updated software integration info, chapter 7.2.
V1.5
Removed introduced error in chapter 3, pin configuration.
V1.6
FCC modular approval added, chapter 9.2.
V1.7
Power supply specification added, chapter 8.4.
V1.8
Added clarification, section 9.2.
A111 Pulsed Coherent Radar (PCR)
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2 Description
The A111 is an optimized low-power, high-precision, 60 GHz radar sensor with integrated Baseband, an RF front-end and an Antenna in Package (AIP).
The sensor is based on pulsed coherent radar (PCR) technology, featuring a leading-edge patented solution with picosecond time resolution. The A111 is the perfect choice for implementing high­accuracy, high-resolution sensing systems with low-power consumption.
Ordering information
Part number
Package
Size (nom)
Primary component container
A111-001-T&R
fcCSP50
5.2 x 5.5 x 0.88 mm
Tape & reel
A111-001-TY
fcCSP50
5.2 x 5.5 x 0.88 mm
13” Tray
Acconeer A111 marking
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
© 2019 Copyright by Acconeer 2019-06-12 Page 6 of 34
2.1 Functional Block Diagram
A111 One Package Solution
A111 Silicon
TX
RX
PLL
LDOs
PoR
Communication
Program memory
Data
memory
SPI (4) INTERRUPT XIN (ref clk)
XOUT
1.8V Single
power supply
ENABLE
Digital
Power
Timing
mmWave Radio
Tx ant.
Rx ant.
Figure 2.1. The A111 functional block diagram.
The A111 silicon is divided into four functional blocks: Power, Digital, Timing and mmWave radio. The Power functional block includes LDOs and a Power on Reset (PoR) block. Each LDO creates its
own voltage domain. The PoR block generates a Reset signal on each power-up cycle. The host interfaces the Power functional block of the sensor via 1.8V Single power supply and ENABLE.
The Digital functional block includes sensor control. The data memory stores the radar sweep data from the ADC. The host interfaces the Sensor via an SPI interface, a Clock (XIN, XOUT) and INTERRUPT signal.
The Timing block includes the timing circuitry. The mmWave radio functional block generates and receives radar pulses and includes transmitter
(TX), receiver (RX) and interfaces toward the integrated antennas.
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3 Pin Configuration and Functions
The below figure shows the A111 pin configuration, top view:
1 2 3 4 5 6 7 8 9
10
A NC
B
NC
C VIO_1a
VIO_2a
GND D VIO_1b
VIO_2b
Supply
E
I/O
F
ENABLE
CLK
G
Analog H
XOUT
NC J VBIAS
SPI_SS
VIO_3a
XIN
K SPI_CLK
SPI_MISO
SPI_MOSI
INTERRUPT
VIO_3b
Figure 3.1. Pin configuration of the A111 sensor, top view.
The below table shows the A111 total number of 50 pins:
Pin
Pin name
Pin type
Description
Comment
A2
NC Must no connect
A3-A8
GND
Ground
Must be connected to solid ground plane
A9
GND
Ground
Must be connected to solid ground plane
B1
NC Must no connect
B2, B9
GND
Ground
Must be connected to solid ground plane
B10
GND
Ground
Must be connected to solid ground plane
C1
GND
Ground
Must be connected to solid ground plane
C2
VIO_1a
Supply voltage
Supply voltage, RF part
(1)
C9
VIO_2a
Supply voltage
Supply voltage, RF part
(1)
C10
GND
Ground
Must be connected to solid ground plane
D1
VIO_1b
Supply voltage
Supply voltage, RF part
(1)
D2, D9
GND
Ground
Must be connected to solid ground plane
D10
VIO_2b
Supply voltage
Supply voltage, RF part
(1)
E1, E2, E9, E10
GND
Ground
Must be connected to solid ground plane F1
GND
Ground
Must be connected to solid ground plane
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
© 2019 Copyright by Acconeer 2019-06-12 Page 8 of 34
Pin
Pin name
Pin type
Description
Comment
F2, F9
GND
Ground
Must be connected to solid ground plane
F10
ENABLE
I/O
Must be connected to host MCU available GPIO. ENABLE is active high
G1, G10
GND
Ground
Must be connected to solid ground plane H1
GND
Ground
Must be connected to solid ground plane
H2, H9
GND
Ground
Must be connected to solid ground plane
H10
XOUT
CLK
XTAL out
No connect if no XTAL
J1
VBIAS
Analog
The analog VBIAS must be connected to VIO_3
J2
SPI_SS
I/O
SPI slave select, active low select.
J3, J5, J6, J8
GND
Ground
Must be connected to solid ground plane J9
VIO_3a
Supply voltage
Supply voltage, digital part
(1)
J10
XIN
CLK
XTAL input OR external ref clk input
1.1V domain
K2
SPI_CLK
I/O
SPI Serial Clock
K3
SPI_MISO
I/O
Master Input – Slave Output
K4
GND
Ground
Must be connected to solid ground plane
K5
GND
Ground
Must be connected to solid ground plane
K6
SPI_MOSI
I/O
Master Output – Slave Input
K7
GND
Ground
Must be connected to solid ground plane
K8
INTERRUPT
I/O
Interrupt signal, that is used as an interrupt in the host, more details are found in section 7, Description.
mandatory
K9
VIO_3b
Supply voltage
Supply voltage, digital part
(1)
Table 3.1. A111 sensor pin list
(1) VIO_1a and VIO_1b are short circuit inside the sensor. VIO_2a and VIO_2b are short circuit inside the sensor. VIO_3a
and VIO_3b are short circuit inside the sensor.
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Datasheet, v1.8
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4 Specifications
4.1 Absolute Maximum Ratings
The below table shows the A111 absolute maximum ratings over operating temperature range, on package, unless otherwise noted:
Parameter
Description
Min.
Max.
Unit
VIO_1
(2)
1.8 V RF power supply
0
2.0
V
VIO_2
(2)
1.8 V RF power supply
0
2.0
V
VIO_3
1.8 V digital power supply
0
2.0
V
XIN
(1)
Clock input port for crystal or reference clock
-0.5
1.6
V
I/O
I/O supply voltage
-0.5
VIO_3+0.5
V
TOP
Operating temperature range
-40
85
°C
T
STG
High temperature storage
150
°C
Table 4.1. Absolute maximum ratings
(1) XIN input may not exceed 0V when ENABLE is low. (2) VIO_1 and VIO_2 must never exceed VIO_3.
Stresses beyond those listed in table 4.1 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions or at any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
4.2 Environmental Sensitivity
The below table shows the A111 environmental sensitivity:
Parameter
Standard
Max.
Unit
Storage temperature
JESD22-A103
(1)
150
(1)
ºC
Reflow soldering temperature
(1)
J-STD-020
(1)
260
ºC
Moisture Sensitivity Level
JESD22-A113
(1)
MSL3
ESD, Charge Device Model (CDM)
JS-002, Class C2
500
V
ESD, Human Body Model (HBM)
JS-001, Class 1C
1000
V
Latch-up
JESD78, Class I
Pass
Table 4.2 Environmental sensitivity
(1) For reference only. The package is generically qualified by the manufacturer. Acconeer does not guarantee adherence to
standard.
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
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4.3 Recommended Operating Conditions
The below table shows the A111 recommended operating conditions, on package:
Parameter
Min.
Typ.
Max.
Unit
Operating power supply voltage, VIO_1
1.71
1.8
1.89
V
Operating power supply voltage, VIO_2
1.71
1.8
1.89
V
Operating power supply voltage, VIO_3
1.71
1.8
1.89
V
I/O operating range
-0.3
VIO_3+0.3
V
XIN operating range
(1)
-0.3 1.2
V
Operating temperature
-40 85
ºC
Table 4.3. Recommended operating conditions
(1) XIN input must not exceed 0V when ENABLE is low.
4.4 Electrical Specification
The below table shows the A111 electrical DC specification conditions, on package, at TA = 25ºC:
Parameter
Min.
Typ.
Max.
Unit
Current into any power supply
100
mA
I/O VIL Low-level input voltage
-0.3
0.10*VIO_3
V
I/O VIH High-level input voltage
0.90*VIO_3
VIO_3+0.3
V
I/O VOL Low-level output voltage
0.4
V
I/O VOH High-level output voltage
1.6
V
I/O IOL (VOL = 0.4V)
7.8
mA
I/O IOH (VOH = VIO_3-0.4)
5.8
mA
I/O IIL Low-level input current
<1
µA
I/O IIH High-level input current
<1
µA
XIN VIL Low-level input voltage
-0.3 0.4
V
XIN VIH High-level input voltage
1.0 1.2
V
XIN IIL Low-level input current
<1
µA
XIN IIH High-level input current
<1
µA
Table 4.4. Electrical DC conditions
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The below table shows the A111 electrical AC specification conditions, on package, at TA = 25ºC:
Parameter
Min.
Typ.
Max.
Unit
I/O output operating frequency
100
MHz
I/O load capacitance
20
pF
XIN operating frequency
20 80
(1)
MHz
XIN capacitance
0.2
pF
Table 4.5 Electrical AC conditions
(1) The maximum external reference clock frequency is 80 MHz and the maximum XTAL frequency is 50 MHz.
4.5 Power Consumption Summary
The below table summarizes the power consumption, maximum current ratings and average current ratings at all power terminals (VIO_1, VIO_2, VIO_3), at TA = 25ºC, VIO 1.8 V:
Parameter
Min.
Typ.
Max.
Unit
Current consumption, continuous TX active mode
71 mA
Average power consumption, 0.1 Hz sweep rate
(2)
0.2
(1)
mW
Average power consumption, 10 Hz sweep rate
(2)
3
(1)
mW
Average power consumption, 100 Hz sweep rate
20
(1)
mW
Current leakage at ENABLE low
66 µA
Table 4.6. Maximum and Average current ratings at power terminals.
(1) Measuring window set to 0.24 m, configuration with maximize on depth resolution used. Leakage current in ENABLE
low not removed.
(2) Supply voltage turned off in between measurements.
4.6 RF Specification
The below table shows the A111 RF specification:
Parameter
Min.
Typ.
Max.
Unit
Center frequency fc
60.5 GHz
EIRP
10
dBm
HPBW, elevation plane
(1)
40 degrees
HPBW, horizontal plane
(1)
80 degrees
Update frequency (configurable)
(2)
1500
Hz
Table 4.7 A111 RF specification
(1) See chapter 6 Typical Characteristics for elevation (E-plane) and horizontal (H-plane) HPBW. (2) System integration dependent e.g. Host MCU and SPI performance.
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5 Timing Requirements
5.1 Serial Peripheral Interface
The Serial Peripheral Interface (SPI) is a 4-wire serial bus, used for configuration and reading output from the A111 radar sensor. The A111 radar sensor is an SPI slave device connected to the SPI master, as described in figure 5.1. The A111 allows several devices to be connected on the same SPI bus, with a dedicated slave-select signal. Daisy-chain is not supported.
Host
(SPI Master)
A111
(SPI Slave)
A111
(SPI Slave)
SPI_CLK
SPI_MOSI
SPI_SS1
SPI_SS2
SPI_MISO
Figure 5.1. SPI master-slave connection
The serial data transfer input (MOSI) and output (MISO) to the A111 are synchronized by the SPI_CLK. The Slave Select signal (SS) must be low before and during transactions. The MOSI is always read on the rising edge of SCLK and the MISO changes value on the falling edge of SPI_CLK (SPI mode 0, CPOL/CPHA = 0). SS requires release in between transactions. See figure 5.2 and table
5.1 for timing characteristics.
SPI_ClK
MOSI
MISO
SS
SS setup time
MSB
MOSI hold time MOSI setup time MISO propagation delay SS hold time
LSB
15
15 14
14
13
13
0
0
1
1
2
2
Figure 5.2: Timing diagram of SPI, CPOL=0 and CPHA=0.
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Parameter
Min.
Typ.
Max.
Unit
Clock frequency
(1)
50
MHz
SS setup time
1.0
ns
SS hold time
2.0
ns
MOSI setup time
1.0
ns
MOSI hold time
2.5
ns
MISO propagation delay
(2)
5.5
ns
Table 5.1 SPI timing characteristics
(1) The 50 MHz clock frequency requires that the reference clock is at least 20.625 MHz (2) 10pF load on SPI_MISO
A111 Pulsed Coherent Radar (PCR) Datasheet, v1.8
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6 Typical Characteristics
6.1 Distance Accuracy
Conditions: TA = 25 ºC, VDD = 1.8 V. Statistical result based on sweep count 100, 20 tested devices. The below figure shows the standard deviation of distance estimation, configuration using envelope
service with maximize depth resolution profile, 0.06-0.30 m. Object metal cylinder, 40 mm in diameter.
Figure 6.1. Standard deviation of distance estimation, maximize on depth resolution 0.06-0.30 m.
The below figure shows the standard deviation of distance estimation, configuration using envelope service with maximize SNR profile, 1.76-2.0 m. Object 50 mm radius spherical metal corner reflector.
Figure 6.2. Standard deviation of distance estimation, maximize on SNR 1.76-2.0 m
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6.2 Amplitude Accuracy
Conditions: TA = 25 ºC, VDD = 1.8 V. Statistical result based on sweep count 100, 20 tested devices. The below figure shows the standard deviation of amplitude estimation, configuration using envelope
service with maximize depth resolution profile, 0.06-0.30 m. Object metal cylinder 40 mm diameter.
Figure 6.3. Standard deviation of amplitude estimation, maximize on depth resolution 0.06-0.30 m.
The below figure shows the standard deviation of amplitude estimation, configuration using envelope service with maximize SNR profile, 1.76-2.0 m. Object 5 cm radius spherical metal corner reflector.
Figure 6.4. Standard deviation of amplitude estimation, maximize on SNR 1.76-2.0 m.
6.3 Relative Phase Accuracy
Conditions: TA = 25 ºC, VDD = 1.8 V. Statistical result based on sweep count 100, 20 tested devices. Standard deviation of phase estimation, measured at a distance of 0.35 m. Object metal cylinder, 40
mm in diameter. Average STD of relative phase estimation:
6.1 degrees in relative phase accuracy, translates to 42 µm in relative distance accuracy.
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6.4 Half Power Beamwidth (HPBW)
Conditions: TA = 25 ºC, VDD = 1.8 V. Statistical result based on sweep count 100 (20 tested devices). This section shows the A111 Elevation plane (E-plane) and Horizontal plane (H-plane) radiation
pattern. The below figure shows the normalized radiation pattern at E-plane, configuration using envelope
service with maximize depth resolution profile, with a 5 cm radius spherical metal corner reflector. HPBW for E-plane is ±20 degrees, as shown in the below figure.
Figure 6.5. Normalized radiation pattern at E-plane.
The below figure shows the normalized radiation pattern at H-plane, configuration using envelope service with maximize depth resolution profile, with a 5 cm radius spherical metal corner reflector. The HPBW for H-plane is ±40 degrees, as shown in the below figure.
Figure 6.6. Normalized radiation pattern at H-plane
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7 Functional Description
The below figure shows the A111 system integration with Host MCU:
Host MCU
A111
Sensor
TCXO
ENABLE x1
SPI x4
INTERRUPT x1
1.8V single power supply
CLK ref. 20-80 MHz
Figure 7.1. System integration
The Acconeer software is executed on Host MCU that handles sensor initiation, configuration, sweep acquisition and signal processing.
The Serial Peripheral Interface (SPI) is a 4-wire serial bus, used for configuration and reading output from the A111 radar sensor. The A111 radar sensor is an SPI slave device, connected to the SPI master (Host MCU), and allows several devices to be connected on same SPI bus, with a dedicated slave-select signal. Daisy-chain is not supported.
The sensor provides support for ENABLE and INTERRUPT as interrupt signal, always output, that is used as an interrupt in the Host MCU.
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7.1 Acconeer Software
The Acconeer software has been written in C and is portable to any OS and HW platform. The Acconeer software is executed on Host MCU and delivered as binaries, except for integration software that is delivered as source code.
The below figure shows the A111 software offer.
Figure 7.2. Acconeer Software offer
The RSS (Radar System Software) provides output at two different levels, Service and Detector. RSS provides an API (Application Programming Interface) for Application utilization of various Services and Detectors.
The Service output is pre-processed sensor data as a function of distance E.g. Envelope data (amplitude of sensor data), Power bin data (integrated amplitude data in pre-defined range intervals), IQ modulated data (representation in cartesian) etc.
Detectors are built on Service data as input and the output is a result E.g. Distance detector that presents distance and amplitude result based on envelope Service etc.
Customer can either use Acconeer detector or develop their own signal processing based on Service data.
Acconeer provides several example applications to support customer own application development. Also, customer guidelines are provided for application development utilizing the Acconeer RSS API.
Acconeer provides several reference drivers as source code, e.g. Support for Cortex M4, Cortex M7 MCU’s.
7.2 Software Integration
Integration software shall implement functions defined in a definitions file provided in Acconeer Software offer. This includes handling of SPI, ENABLE and INTERRUPT as well as potential OS functions.
See reference HAL - User Guide for guideline on software integration and HAL implementation (https://www.acconeer.com/products).
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7.3 Power Up Sequence
The power-up sequence is described using the recommended integration shown in the below figure:
A111
INTERRUPT SPI_SS
SPI_MISO
SPI_MOSI
SPI_CLK
ENABLE
VIO_1a,b
VIO_2a,b
VIO_3a,b
VBIAS
XIN
XOUT
GNDs
R1
1.8V
X1
C8C7
R2 C4
C1
C5
C2
C6
C3
Host
Figure 7.3. Recommended integration of the A111 radar sensor.
The power up sequence is shown in below figure.
Time
VIO_1-3a,b
ENABLE
t
1
t
2
XIN
Figure 7.4. Power up sequence
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It is recommended to allow the supply voltage on the sensor to stabilize before activating ENABLE. That is shown as the time t1 in figure 7.4 and the actual time depends on the power supply and the value of the decoupling capacitors.
Next step in the power up sequence is to have a settling time for the XTAL oscillator to stabilize, shown as time t2 in figure 7.4. This may take up to several milliseconds depending on the XTAL performance. The sensor does not require any settling time if it is integrated using an external reference clock. It is advised to have the clock inactive at 0 V while ENABLE is inactive.
Now the A111 radar sensor is ready for SPI communication. All I/Os must never exceed VIO_3 voltage, accordingly if VIO_3 voltage is set to 0V between sensor usage then all I/Os must also be set to 0V. Otherwise, the internal ESD protection diodes will draw current from the I/O source.
After power up is complete, the sensor is loaded with a program. Up until the point where the sensor’s
program is started, the INTERRUPT is high impedance. However, after the sensor’s program has started the INTERRUPT is configured to a push-pull CMOS output. Therefore it is required that the host I/O is configured as input before any programs are started on the sensor.
The power down sequence is recommended to be executed in the reverse order as the power up sequence: First ensure that all I/O inputs are at 0V which includes ENABLE, after that all VIO1_3a,b can be turned off.
VIO_1 and VIO_2 must never have higher voltage than VIO_3, and it is recommended to enable/disable the three supplies simultaneously.
External clock reference, if used, needs always to be available to sensor.
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8 Layout Recommendations
A111 sensor free space integration should take the following into consideration:
Any material above the sensor should have as low permittivity and loss as possible, e.g. plastic or
glass with low permittivity.
To conclude on optimum distance from the sensor, a simulation/measurement investigation is
required.
The sensor antennas are of a folded dipole type, with its ground reference in the package ground plane, extending over the whole area of the sensor. To further enhance the directivity of the sensor, the package ground plane should be extended to the package by soldering all GND connections of the sensor to the board top layer ground. This top layer ground plane below the sensor should be continuous and should have low impedance.
The below table shows the sensor gain loss versus solid ground plane area.
Ground plane area
Sensor gain loss
625 mm2
0 dB
425 mm2
-0.2 dB
225 mm2
-0.4 dB
127 mm2
-2.2 dB
29 mm2
-4.0 dB
Table 8.1 Simulated relative maximum gain as function of extended solid ground plane area. The area is quadratic.
It is recommended to keep the layout around XIN and XOUT symmetrical to the XTAL and capacitors.
VIO_1a and VIO_1b are short circuit inside the sensor and are recommended to be connected to each other on the PCB as well. VIO_2a and VIO_2b are short circuit inside the sensor and are recommended to be connected to each other on the PCB as well. VIO_3a and VIO_3b are short circuit inside the sensor and are recommended to be connected to each other on the PCB as well. It is recommended to have decoupling capacitors on the supplies placed as close as possible to the supply terminals. It is recommended as minimum 100 nF in parallel with 1 uF decoupling capacitance on each supply.
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8.1 Bill of Material (BoM)
The below table shows BOM for integration of the A111:
Component
Value
Description
C1, C2, C3
100 nF
VIO_1, VIO_2, VIO_3 decoupling
C4, C5, C6
1 µF
VIO_1, VIO_2, VIO_3 decoupling
R2
100 kΩ
INTERRUPT pull down resistor
R1
30 Ω
SPI_MISO series resistance (optional)
X1 XTAL 24 MHz, Epson TSX-3225 (optional)
C7, C8
8 pF
(1)
XTAL freq. tuning capacitor (optional)
Table 8.2 BOM list
(1) See details in chapter 7.1 XTAL for C7, C8 value calculation.
See figure 7.3 that shows the optional XTAL populated.
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8.2 XTAL
The input clock can origin from a crystal (XTAL), connected to XIN and XOUT. The A111 sensor has a built-in XTAL oscillator and by adding an external XTAL component, as
shown in the below figure 8.1, a reference design without any external clock reference supplied is possible. Note however, that the external clock reference still is supported and if used instead of an external XTAL, it is connected to XIN.
C7
C8
GND
GNDGND
XOUT
XIN
TSX-3225
XTAL 26 MHz
I/O
GND
I/O
GND
Figure 8.1. External XTAL schematics.
To enable the internal XTAL oscillator to drive the external resonator, the relation in equation 1 must be fulfilled.
Equation 1
  


 


 
Equation 2
  󰇛 

󰇜
Equation 3

   

 
The capacitance values are calculated in equation 2. CL and R
ESR
are XTAL parameters and vary from XTAL to XTAL. The stray capacitance is the sum of the capacitance between XIN and XOUT, which are found in the traces on PCB and in the package; 2 to 5 pF is a general estimation.
Example:
f = 26 MHz
CL = 9 pF
R
ESR
= 40 ohm
Assuming that C
stray
= 5 pF gives C7, C8 = 8 pF and that the condition is met with the result 0.63 <
0.7.
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8.3 External clock source
The input clock can origin from an external clock source connected to XIN, with XOUT left open. As an example given in table 8.3, maximum phase noise figures are given using 40 MHz external
clock reference.
Offset frequency (Hz)
Min.
Typ.
Max.
Unit
1000
-80
dBc/Hz
10 000
-100
dBc/Hz
100 000
-120
dBc/Hz
1 000 000
-140
dBc/Hz
10 000 000
-155
dBc/Hz
Table 8.3: Phase noise using 40 MHz external clock reference
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8.4 Power supply
The A111 sensor has got three power supplies where the VIO_3 power supply is sensitive to power supply ripple. Power supply ripple on VIO_3 may degrade performance since VIO_3 supplies the internal clock generation blocks. Table 8.4 provides the required power supply ripple specification for VIO_3.
Frequency (Hz)
Min.
Typ.
Max.
Unit
10 000
18.7
mVpp
100 000
2.6
mVpp
1 000 000
0.26
mVpp
3 000 000
0.09
mVpp
10 000 000
0.23
mVpp
100 000 000
3.0
mVpp
Table 8.4: Required power supply ripple specification for VIO_3
Low-cost LC filter solution Acconeer provides recommended low-cost LC filter solution, the recommended filter is displayed in
figure 8.2. The values of the component demonstrate an example filter design, exact values depend on switching frequency and ripple amplitude of the supply regulator. However, be aware of LC filter peaking at the series resonance frequency 1/(2π*sqrt(LC)). A small resistor, 250 mΩ in the example filter, can be inserted to lower the Q factor of the filter. In certain applications, where disturbances at the series resonance frequency is present, the filter may not be an optimal solution and an external LDO such as TPS7A8801 or equal is recommended to use instead of the low-cost LC filter.
VIO_3a,b
22uF
2.2uH
250 mΩ
Supply
100nF
Figure 8.2: Low cost LC supply filter
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Figure 8.3: Simulated performance with 10mV
pp
supply ripple with low cost LC supply filter.
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9 Regulatory Approval
To be noted is that some regulatory specifications also specify the usage of the sensor, so users of the sensor must check regulatory requirements for their own use case and determine if the regulatory approvals described below are sufficient.
9.1 ETSI
Hereby, Acconeer declares that the A111 sensor is compliant with directive 2014/53/EU for the following software configuration profiles:
- Maximize depth resolution
- Maximize SNR
9.1.1 EU declaration of conformity
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9.2 FCC Approval
Hereby, Acconeer declares that the A111 sensor has modular approval granted by FCC for the following software configuration profiles:
- Maximize depth resolution
- Maximize SNR
The configuration of the A111 sensor is done through two different profiles with different emission, which are covered in the conformity test that Acconeer has conducted at accredited test house. The two profiles are called maximize depth resolution and maximize SNR. When certifying a given use case the sensor should be configured with the longest range window applicable to the use case and the fastest update rate supported by the application.
The A111 sensor meets the title 47 of the Code of Federal Regulations, part 15 section 15.255 for intentional radiators operating in the 57-71 GHz band for the following type of applications.
- Field disturbance sensor employed for fixed operations.
- Short range device for interactive motion sensing. Warning: The end user needs to maintain 20 cm distance to radiating parts of the device. FCC ID: 2AQ6KA1 The host product manufacturer is responsible for compliance to any other FCC rules that apply to the
host not covered by the modular transmitter grant of certification.
9.2.1 FCC Regulatory Notes
Modifications Aconeer has not approved any changes to this device. Any changes or modifications to this device
could invalid the FCC approval. Interference statement This device complies with Part 15 of the FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
RF exposure This device complies with the FCC radiation exposure limits set forth for an uncontrolled
environment. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures.
The RF exposure has been calculated with a 20 cm separation distance I.e. Mobile devices. Labelling requirements for the host device The host device shall be labelled to identify the modules within the host device, which means that the
host device shall be labelled to display the FCC ID of the module preceded by words "Contains transmitter module" or "Contains", E.g.
Contains FCC ID: 2AQ6KA1
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9.2.2 FCC Grant Authorization
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10 Mechanical Data
The A111 is available in fcCSP package for mounting on a substrate. The below table shows mechanical data:
Parameter
Min.
Typ.
Max
Unit
Body X
5.15
5.20
5.25
mm
Body Y
5.45
5.50
5.55
mm
Body Z (height)
0.821
0.899
mm
Ball pitch
0.45
0.50
0.55
mm
Ball diameter
0.25
0.30
0.35
mm
Ball height
0.15
0.24
mm
Ball count
50 #
Table 10.1. Mechanical data
The A111 footprint is shown in Figure 10.1.
Figure 10.1. A111 footprint
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The physical layout of the A111 sensor is shown in Figure 10.2, 10.3 and 10.4.
Figure 10.2. Physical layout of the A111 sensor, top view.
Figure 10.3. Physical layout of the A111 sensor, side view.
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Primary datum C and seating plane are defined by the spherical crowns of the solder balls. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. All dimensions and tolerances conform to ASME Y14.5 – 2009.
Figure 10.4. Physical layout of the A111 sensor, bottom view.
The bottom view shows 50 solder balls. The pitch of the BGA balls is 500 µm, the ball diameter is 300 µm ±5 µm and the collapsed ball height is 0.244 ± 0.050 mm.
10.1 Recommended Reflow Profile
Reflow Profiles per JEDEC J-STD-020.
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11 Abbreviations
ADC
Analog digital converter
AiP
Antenna in package
API
Application programming interface
BGA
Ball grid array
BOM
Bill of materials
CE
"Conformité Européene" (which literally means "European Conformity")
CPHA
Clock phase
CPOL
Clock polarity
EIRP
Equivalent isotropically radiated power
ESD
Electrostatic discharge
ETSI
European Telecommunications Standards Institute
FCC
Federal Communications Commission
fcCSP
Flip-chip chip-scale package
GND
Ground
HAL
Hardware abstraction layer
HPBW
Half power beamwidth
LDO
Low-dropout regulator
MCU
Microcontroller unit
MISO
Master input, slave output
MOSI
Master output, slave input
NC
No connect
PCR
Pulse coherent radar
PLL
Phase locked loop
PoR
Power on reset
RCS
Radar cross section
RF
Radio frequency
RX
Receiver
SPI
Serial peripheral interface
SS
Slave select
STD
Standard deviation
TCXO
Temperature compensated crystal oscillator
TX
Transceiver
XTAL
Crystal
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Disclaimer
The information herein is believed to be correct as of the date issued. Acconeer AB (“Acconeer”) will not be responsible for damages of any nature resulting from the use or reliance upon the information contained herein. Acconeer makes no warranties, expressed or implied, of merchantability or fitness
for a particular purpose or course of performance or usage of trade. Therefore, it is the user’s
responsibility to thoroughly test the product in their particular application to determine its performance, efficacy and safety. Users should obtain the latest relevant information before placing orders.
Unless Acconeer has explicitly designated an individual Acconeer product as meeting the requirement of a particular industry standard, Acconeer is not responsible for any failure to meet such industry standard requirements.
Unless explicitly stated herein this document Acconeer has not performed any regulatory conformity
test. It is the user’s responsibility to assure that necessary regulatory conditions are met and approvals
have been obtained when using the product. Regardless of whether the product has passed any
conformity test, this document does not constitute any regulatory approval of the user’s product or application using Acconeer’s product.
Nothing contained herein is to be considered as permission or a recommendation to infringe any patent or any other intellectual property right. No license, express or implied, to any intellectual property right is granted by Acconeer herein.
Acconeer reserves the right to at any time correct, change, amend, enhance, modify, and improve this document and/or Acconeer products without notice.
This document supersedes and replaces all information supplied prior to the publication hereof.
© 2018 by Acconeer – All rights reserved
Acconeer AB www.acconeer.com IDEON Gateway info@acconeer.com Scheelevägen 27 +46 10 218 92 00 223 63 LUND Sweden
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