3M 583 Technical Data

3M™Bonding Film 583

Product Description

3M™ Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermoplastic bonding film. It can be heat or

solvent activated for bonding. 3M™ Bonding Film 583 can also be lightly crosslinked using a post heat exposure. This

crosslinking will provide additional heat and solvent resistance as well as somewhat higher shear strengths.

3M™ Bonding Film 583 must be stored at or below 40°F (4°C) for maximum storage life.

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Typical Physical Properties

Note: The following technical information and data should be considered representative or typical only and should not be

used for specification purposes.

Technical Data September, 2008

Base Resin

Nitrile phenolic

Adhesive Thickness

2 mil (0.05 mm)

Tack

Slight

Color

Brown

Construction

Before Crosslinking After Crosslinking

Tensile (psi) 400 3,140

Elongation (%) 800 180

Modulus (psi) 240 13,800

2 Lb. Dead Load Overlap Shear Heat Resistance 160°F (71°C) >300°F (149°C)

Key Features

• Flexible • Slight surface tack

• Heat or solvent activation • Heat crosslinkable option

• Can be die-cut

• Tensile and elongation conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638.

• 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85).

2 mil adhesive

3 mil silicone paper liner

3M™Bonding Film 583

Directions For Use – Heat Activation

To make a bond, remove the liner and place the adhesive film between the two substrates. The bond is then made through

heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment.

Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can then be

removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and pressure. Since

3M™ Bonding Film 583 has a slight surface tack, in some cases it may be tacked to a substrate with pressure only (no

Suggested TACKING Conditions

100°F to 120°F (38°C to 49°C) bondline temperature

2-5 seconds dwell time

5-20 psi pressure

Suggested BEGINNING Bonding Conditions

225°F to 300°F (107°C to 149°C) bondline temperature

2-5 seconds dwell time

15-20 psi pressure

Application Equipment Suggestions

Note: Appropriate application equipment can enhance bonding film performance. We suggest the following equipment for

the user’s evaluation in light of the user’s particular purpose and method of application.

The type of application equipment used to bond 3M™ Bonding Film 583 will depend on the application involved and on

the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll laminator

where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated static

press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or three-

dimensional part, a hot shoe or thermode method may be appropriate.

It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions should

be predetermined with substrates specific to user’s application.

For optimum bonding, the heat, pressure and dwell time for using 3M™ Bonding Film 583 will depend upon the type and

thickness of the substrates being bonded together.

A suggested starting point, however, is to use the bonding conditions described below.

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3M™Bonding Film 583

Directions For Use – Heat Activation

(continued)

One approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series of

bonding temperatures, for example 200, 225, 250, 275 and 300°F (93, 107, 121, 135 and 149°C). Time and pressure will be

dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and surfaces that may

be more difficult to bond will require longer times, higher pressures and higher temperatures. If voids are experienced in

the bondline, they can be minimized by increasing pressure.

Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally,

cooling the bondline below 150°F (66°C) is adequate to allow the bonded parts to be unfixtured/unclamped and handled.

For reference, the following table shows typical bond strengths for bonds made at various temperatures. Such data can be

used to evaluate optimum bondline temperatures. It is important to note that this table is valid only for the specific

substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should develop a similar

table with substrates specific to user’s application.

Note: Temperatures shown are bondline temperatures and not heat block or roll settings!

90° Peel Strengths of Bonds made at Various Temperatures

(2 and 20 sec. Dwell at Bondline Temperature) using 3M™ Bonding Film 583

Bondline FR-4 / Aluminum CRS / Aluminum

Temperature 2 sec. 20 sec. 2 sec. 20 sec.

75°F (24°C) 9 piw 9 piw 5 piw 6 piw

95°F (35°C) 9 piw 9 piw 6 piw 6 piw

115°F (46°C) 9 piw 9 piw 6 piw 6 piw

135°F (57°C) 10 piw 10 piw 6 piw 7 piw

155°F (68°C) 11 piw 11 piw 7 piw 9 piw

175°F (79°C) 12 piw 13 piw 8 piw 10 piw

195°F (90°C) 13 piw 14 piw 9 piw 12 piw

215°F (101°C) 14 piw 14 piw 11 piw 14 piw

235°F (113°C) 14 piw 13 piw 12 piw 13 piw

255°F (124°C) 12 piw 12 piw 13 piw 13 piw

275°F (135°C) 12 piw 12 piw 12 piw 12 piw

295°F (146°C) 12 piw 11 piw 12 piw 12 piw

315°F (157°C) 11 piw 11 piw 11 piw 12 piw

335°F (168°C) 11 piw 11 piw 10 piw 11 piw

355°F (179°C) 11 piw 10 piw 6 piw 9 piw

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• Peel values given in piw (pounds per inch width). ASTM D1876.

• Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel

(MEK wiped).* Bonds made on Sencorp device using 20 lbs. pressure.

*Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use.