3M 5595, 5595S Technical Data

3M™Thermally Conductive Interface Pads 5595/5595S

Product Description

3M™ Thermally Conductive Interface Pads 5595 and 5595S are designed to provide a preferential heat-transfer path

between heat-generating components and heat sinks, heat spreaders or other cooling devices.

• The specialized silicone chemistry of Interfacel Pads 5595 and 5595S provides for good thermal stability of the base

polymer with excellent softness of the thermal pad.

• Interface Pad 5595 offers good thermal conductivity in a soft silicone polymer base.

• Interface Pad 5595S has a permanent PEN film 9 micrometer thick on one side to provide for a non-tacky surface,

increased puncture resistance, ease of handling and rework.

• Interface Pads 5595 and 5595S have a tacky feel. The product tack is such that a mechanical means to support the pad in

a final assembly is required.

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Technical Data January, 2010

Product Construction

3M™ Thermally Conductive Interface Pads 5595 and 5595S

Color Grey

Pad Type Filled Silicone Polymer

Pad Thickness 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm (> 2 mm thickness available. Please inquire.)

Primary Filler Type Ceramic

Top Liner / Film Type Interface Pad 5595 – Silicone Coated Polyester removable Liner /

Interface Pad 5595S – 9 µm PEN Film

Base Liner Thickness Base Liner 3 mils (75 µm)

Polyethylene Naphthalate (PEN) film (9 µm) =
Interface Pad 5595S or Interface Pad 5595
with release liner

Filled Silicone Elastomer

Release Liner

3M™Thermally Conductive Interface Pads 5595/5595S

(2)

Typical Physical Properties and Performance Characteristics

Note: The following technical information and data should be considered representative or typical only and should not be

used for specification purposes.

Property Method Value

Product Number* 3M™ Thermally Conductive Interface Pads 5595 / 5595S

Thermal Conductivity (W/m-K) 1.6 W/m-K 3M Test Method

with low pressure

(<10 psi)

Operating Temperature Range**** -60° to 125°C 3M Test Method

Shelf Life 24 months from date of manufacturing when stored at 25°C 3M Test Method

and 50% relative humidity in the pads original packaging.

Shelf life relates to liner release characteristics.

Hardness Shore 00** Shore 00 results depend on test method and thickness of the Modified

sample tested. Typical results are in the 50-60 Shore 00 ASTM D2240

range @ 6 mm test thickness without the PEN film.

Ask 3M for more details on pad softness.

Dielectric Breakdown 400 V/mil AC (Interface Pad 5595S tested) 3M TM

(ASTM D149)

Volume Resistivity 5 x 10

12

Ohms (Interface Pad 5595S tested) ASTM D257

Flammability Rating*** UL-94-V0 (3M tested.) UL-94-V0 TM

Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and

rework. **Interface Pad 5595 tested with-out PET film on product. ***9 µm PEN film is a non-FR version. ****Potential Operating Temperature
Range (°C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested
Temperature range is based on a 3M Test Method.

Application Guidelines

Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.

A clean surface can improve the thermal performance of an application.

1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface

contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily

components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents

(such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease,

machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.

Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.

2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to

help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner

before application.

3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with

the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat.

Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because

one of the flexible substrate can conform to the other substrates during application.