3M™Low Static Polyimide Film Tape (Linered) 5433
Application Ideas
• Mask for printed circuit boards during wave solder or solder dip process.
• Used as release surface in fabrication of parts cured at elevated temperatures.
Storage
Store under normal conditions of 60° to 80°F (16° to 27°C) and 40 to 50% R.H. in the original carton.
Shelf Life
To obtain best performance, use this product within 12 months from date of manufacture.
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Key Attributes
Features Advantages Benefits
Polyimide film Dimensionally stable at high temperatures Helps promote high productivity
Flame retardant and chemical resistant Protects surfaces, helping reduce replacement
Silicone adhesive High temperature performance reduces Helps promote high productivity
adhesive transfer
Low static Virtually eliminates circuit board Helps reduce costly board waste due to
degradation due to electrostatic component failure
discharge
Unique release liner Easy release from silicone adhesive Capability to product die cut parts
Features
• 3M™ Low Static Polyimide Film Tape 5433 employs a proprietary technology that results in extremely low electrostatic
discharge at unwind and removal from the PWB. Conventional polyimide tapes can typically generate over 10,000 volts
during use which can damage board mounted electronic components. 3M tape 5433 overcomes this problem without any
of the typical drawbacks of conventional “anti-static” or “static-free” tapes (e.g., variable adhesion and opaqueness).
• At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or
decreases, the properties of the polyimide film are less affected than polyester.
• Polyimide film does not soften at elevated temperatures, thus, the film providesan excellent release surface at elevated
temperatures.
• RoHS compliant.