Zetex (Now Diodes) ZXTP25140BFH Schematic [ru]

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ZXTP25140BFH

140V, SOT23, PNP medium power transistor

Summary

BV(BR)CEX > -180V; BV(BR)CEO > -140V

BV(BR)ECO > -7V ;

IC(cont) = -1A

Rce(sat) = 180 m typical

Vce(sat) < -260mV @ 1A ;

PD = 1.25W

Description

Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.

Features

High power dissipation SOT23 package

180V forward blocking voltage

Low saturation voltage

Applications

DC-DC converters

High side switching

Ordering information

Device

Reel size

Tape width

Quantity per

 

(inches)

 

reel

 

 

 

 

ZXTP25140BFHTA

7

8mm

3,000

 

 

 

 

Device marking

026

C

B

E

Pinout - top view

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© Zetex Semiconductors plc 2006

ZXTP25140BFH

Absolute maximum ratings

Parameter

 

Symbol

Limit

Unit

 

 

 

 

Collector-base voltage

VCBO

-180

V

Collector-emitter voltage (forward blocking)

VCEX

-180

V

Collector-emitter voltage

VCEO

-140

V

Emitter-collector voltage (reverse blocking)

VECO

-7

V

Emitter-base voltage

 

VEBO

-7

V

Continuous collector current (a)

IC

-1

A

Peak pulse current

 

ICM

-3

A

Power dissipation at T

=25°C (a)

PD

0.73

W

A

 

 

5.84

mW/°C

Linear derating factor

 

 

 

 

 

 

 

Power dissipation at T

=25°C (b)

PD

1.05

W

A

 

 

8.4

mW/°C

Linear derating factor

 

 

 

 

 

 

 

Power dissipation at T

=25°C (c)

PD

1.25

W

A

 

 

9.6

mW/°C

Linear derating factor

 

 

 

 

 

 

 

Power dissipation at T

=25°C (d)

PD

1.81

W

A

 

 

14.5

mW/°C

Linear derating factor

 

 

 

 

 

 

Operating and storage temperature range

Tj, Tstg

-55 to 150

°C

Thermal resistance

Parameter

Symbol

Limit

Unit

 

 

 

 

Junction to ambient (a)

R JA

171

°C/W

Junction to ambient (b)

R JA

119

°C/W

Junction to ambient (c)

R JA

100

°C/W

Junction to ambient (d)

R JA

69

°C/W

NOTES:

(a)For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b)Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.

(c)Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.

(d)As (c) above measured at t<5secs.

Issue 1 - March 2006

2

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© Zetex Semiconductors plc 2006

ZXTP25140BFH

Characteristics

Issue 1 - March 2006

3

www.zetex.com

© Zetex Semiconductors plc 2006

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