Zetex (Now Diodes) ZXTP25140BFH Schematic [ru]
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ZXTP25140BFH
140V, SOT23, PNP medium power transistor
Summary
BV(BR)CEX > -180V; BV(BR)CEO > -140V
BV(BR)ECO > -7V ;
IC(cont) = -1A
Rce(sat) = 180 m typical
Vce(sat) < -260mV @ 1A ;
PD = 1.25W
Description
Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.
Features
•High power dissipation SOT23 package
•180V forward blocking voltage
•Low saturation voltage
Applications
•DC-DC converters
•High side switching
Ordering information
Device |
Reel size |
Tape width |
Quantity per |
|
(inches) |
|
reel |
|
|
|
|
ZXTP25140BFHTA |
7 |
8mm |
3,000 |
|
|
|
|
Device marking
026
C
B
E
Pinout - top view
Issue 1 - March 2006 |
1 |
www.zetex.com |
© Zetex Semiconductors plc 2006
ZXTP25140BFH
Absolute maximum ratings
Parameter |
|
Symbol |
Limit |
Unit |
|
|
|
|
|
Collector-base voltage |
VCBO |
-180 |
V |
|
Collector-emitter voltage (forward blocking) |
VCEX |
-180 |
V |
|
Collector-emitter voltage |
VCEO |
-140 |
V |
|
Emitter-collector voltage (reverse blocking) |
VECO |
-7 |
V |
|
Emitter-base voltage |
|
VEBO |
-7 |
V |
Continuous collector current (a) |
IC |
-1 |
A |
|
Peak pulse current |
|
ICM |
-3 |
A |
Power dissipation at T |
=25°C (a) |
PD |
0.73 |
W |
A |
|
|
5.84 |
mW/°C |
Linear derating factor |
|
|
||
|
|
|
|
|
Power dissipation at T |
=25°C (b) |
PD |
1.05 |
W |
A |
|
|
8.4 |
mW/°C |
Linear derating factor |
|
|
||
|
|
|
|
|
Power dissipation at T |
=25°C (c) |
PD |
1.25 |
W |
A |
|
|
9.6 |
mW/°C |
Linear derating factor |
|
|
||
|
|
|
|
|
Power dissipation at T |
=25°C (d) |
PD |
1.81 |
W |
A |
|
|
14.5 |
mW/°C |
Linear derating factor |
|
|
||
|
|
|
|
|
Operating and storage temperature range |
Tj, Tstg |
-55 to 150 |
°C |
|
Thermal resistance
Parameter |
Symbol |
Limit |
Unit |
|
|
|
|
Junction to ambient (a) |
R JA |
171 |
°C/W |
Junction to ambient (b) |
R JA |
119 |
°C/W |
Junction to ambient (c) |
R JA |
100 |
°C/W |
Junction to ambient (d) |
R JA |
69 |
°C/W |
NOTES:
(a)For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b)Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c)Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d)As (c) above measured at t<5secs.
Issue 1 - March 2006 |
2 |
www.zetex.com |
© Zetex Semiconductors plc 2006
ZXTP25140BFH
Characteristics
Issue 1 - March 2006 |
3 |
www.zetex.com |
© Zetex Semiconductors plc 2006