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ZXTP23015CFH
15V, SOT23, PNP medium power transistor
Summary
V(BR)CES > -15V, V(BR)CEO > -15V
V(BR)ECO > -6V
IC(CONT) = -6A
RCE(SAT) = 20m typical
VCE(SAT) < -36mV @ -1A
PD = 1.25W
Complementary part number ZXTN23015CFH
Description
Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.
Feature
•Higher power dissipation SOT23 package
•High peak current
•Low saturation voltage
•15V forward blocking voltage
•6V reverse blocking voltage
Applications
•High side disconnect switches
•DC - DC converters
•MOSFET and IGBT gate driving
•Motor drive
•Relay, lamp, and solenoid drive
Ordering information
Device |
Reel size |
Tape width |
Quantity per reel |
|
(inches) |
|
|
|
|
|
|
ZXTP23015CFHTA |
7 |
8mm |
3000 |
|
|
|
|
Device marking
317
C
B
E
E
C
B Pinout - top view
Issue 2 - May 2007 |
1 |
www.zetex.com |
© Zetex Semiconductors plc 2007
ZXTP23015CFH
Absolute maximum ratings
Parameter |
Symbol |
Limit |
Unit |
|
|
|
|
|
|
|
|
Collector-base voltage |
VCBO |
-15 |
V |
|
|
Collector-emitter voltage |
V(BR)CES |
-15 |
V |
|
|
Collector-emitter voltage |
VCEO |
-15 |
V |
|
|
Emitter-base voltage |
VEBO |
-7.0 |
V |
|
|
Emitter-collector voltage |
VECO |
-6.0 |
V |
|
|
Peak pulse current |
ICM |
-10 |
A |
|
|
Continuous collector current (c) |
IC |
-5 |
A |
|
|
Continuous collector current (d) |
IC |
-6 |
A |
|
|
Base current |
IB |
-1.2 |
A |
|
|
|
|
|
|
|
|
Power dissipation @ T =25oC (a) |
PD |
0.73 |
W |
|
|
A |
|
5.84 |
mW/ |
o |
C |
Linear derating factor (a) |
|
||||
|
|
|
|||
Power dissipation @ T =25oC (b) |
PD |
1.05 |
W |
|
|
A |
|
8.4 |
mW/ |
o |
C |
Linear derating factor (b) |
|
||||
|
|
|
|||
Power dissipation @ T =25oC (c) |
PD |
1.25 |
W |
|
|
A |
|
9.6 |
mW/ |
o |
C |
Linear derating factor (c) |
|
||||
|
|
|
|||
Power dissipation @ T =25oC (d) |
PD |
1.81 |
W |
|
|
A |
|
14.5 |
mW/ |
o |
C |
Linear derating factor (d) |
|
||||
|
|
|
|||
Operating and storage temperature |
Tj:Tstg |
-55 to |
oC |
|
|
|
|
+150 |
|
|
|
|
|
|
|
|
|
Thermal resistance
Parameter |
Symbol |
Value |
Unit |
|
|
|
|
Junction to ambient (a) |
R JA |
171 |
oC/W |
Junction to ambient (b) |
R JA |
119 |
oC/W |
Junction to ambient (c) |
R JA |
100 |
oC/W |
Junction to ambient (d) |
R JA |
69 |
oC/W |
NOTES:
(a)For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b)Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(c)Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.
(d)As (c) above measured at t<5secs.
Issue 2 - May 2007 |
2 |
www.zetex.com |
© Zetex Semiconductors plc 2007
ZXTP23015CFH
Characteristics
Issue 2 - May 2007 |
3 |
www.zetex.com |
© Zetex Semiconductors plc 2007