Zetex (Now Diodes) ZXTN19100CFFTA Schematic [ru]

ZXTN19100CFF

100V, SOT23F, NPN high gain power transistor

Summary

BVCEX > 200V

BVCEO > 100V

BVECO > 5V

IC(cont) = 4.5A

VCE(sat) < 60mV @ 1A

RCE(sat) = 38m

PD = 1.5W

Complementary part number ZXTP19100CFF

Description

Advanced process capability has been used to maximise the performance of this transistor. The SOT23F package is compatible with the industry standard SOT23 footprint but offers lower profile and higher dissipation for applications where power density is of utmost importance

Features

•High forward blocking voltage

•Low saturation voltage

•High gain

•Low profile high dissipation package

Applications

•Relay and solenoid driving

•DC fans

•Industrial and automotive switching

Ordering information

Device	Reel size	Tape width	Quantity
	(inches)	(mm)	per reel
ZXTN19100CFFTA	7	8	3000

Device marking

1E5

C

B

E

E

C

B Pinout - top view

Issue 1 - January 2007

1

www.zetex.com

© Zetex Semiconductors plc 2007

ZXTN19100CFF

Absolute maximum ratings

Parameter	Symbol	Limit	Unit
Collector-base voltage	VCBO	200	V
Collector-emitter voltage (forward blocking)	VCEX	200	V
Collector-emitter voltage	VCEO	100	V
Emitter-collector voltage (reverse blocking)	VECO	5	V
Emitter-base voltage	VEBO	7	V
Continuous collector current(c)	IC	4.5	A
Base current	IB	1	A
Peak pulse current	ICM	6	A
Power dissipation at Tamb = 25°C(a)		0.84
Linear derating factor	PD	6.72	W
Power dissipation at Tamb = 25°C(b)		1.34	mW/°C
Linear derating factor	PD	10.72	W
Power dissipation at Tamb = 25°C(c)		1.5	mW/°C
Linear derating factor	PD	12.0	W
Power dissipation at Tamb = 25°C(d)		2	mW/°C
Linear derating factor	PD	16.0	W
Operating and storage temperature range	Tj, Tstg	- 55 to 150	°C

Thermal resistance

Parameter	Symbol	Limit	Unit
Junction to ambient(a)	R JA	149.3	°C/W
Junction to ambient(b)	R JA	93.4	°C/W
Junction to ambient(c)	R JA	83.3	°C/W
Junction to ambient(d)	R JA	60	°C/W

NOTES:

(a)For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b)Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.

(c)Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions.

(d)As (c) above measured at t<5secs.

Issue 1 - January 2007

2

www.zetex.com

© Zetex Semiconductors plc 2007

ZXTN19100CFF

Characteristics

Issue 1 - January 2007

3

www.zetex.com

© Zetex Semiconductors plc 2007