XILIX XC1765EPC20C, XC1765ELVO8I, XC1765ELVO8C, XC1765ELSO8I, XC1765ELPD8I, XC1765ELSO8C, XC1765ELPD8C, XC1765ELPC20I, XC1765ELPC20C, XC1765EVO8I, XC1765EVO8C, XC1765ESO8I, XC1765ESO8C, XC1765EPD8I, XC1765EPD8C, XC1765EPC20I, XC1736EPD8I, XC1736EPD8C, XC1736EPC20I, XC1736EPC20C, XC17256EVO8I, XC17256EVO8C, XC17256EPD8I, XC17256EPD8C, XC17256EPC20I, XC17512LSO20I, XC17512LSO20C, XC17512LPD8I, XC17512LPD8C, XC17512LPC20I, XC17512LPC20C, XC1736EVO8I, XC1736EVO8C, XC1736ESO8I, XC1736ESO8C, XC17128EPD8I, XC17128EPD8C, XC17128EPC20I, XC17128EPC20C, XC17128ELVO8I, XC17128ELVO8C, XC17128ELPD8I, XC17128ELPC20I, XC17128ELPD8C, XC17128ELPC20C, XC17256EPC20C, XC17256ELVO8I, XC17256ELVO8C, XC17256ELPD8I, XC17256ELPD8C, XC17256ELPC20I, XC17128EVO8I, XC17128EVO8C, XC1701SO20C, XC1701PD8I, XC1701PD8C, XC1701PC20I, XC1701PC20C, XC1701LSO20I, XC1701LSO20C, XC1701LPD8I, XC1701LPD8C, XC1701LPC20I, XC1704LVQ44I, XC1704LVQ44C, XC1704LPC44I, XC1704LPC44C, XC1702LVQ44I, XC1702LVQ44C, XC1702LPC44I, XC1702LPC44C, XC1701SO20I, XC1701LPC20C Datasheet

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XILIX XC1765EPC20C, XC1765ELVO8I, XC1765ELVO8C, XC1765ELSO8I, XC1765ELPD8I, XC1765ELSO8C, XC1765ELPD8C, XC1765ELPC20I, XC1765ELPC20C, XC1765EVO8I, XC1765EVO8C, XC1765ESO8I, XC1765ESO8C, XC1765EPD8I, XC1765EPD8C, XC1765EPC20I, XC1736EPD8I, XC1736EPD8C, XC1736EPC20I, XC1736EPC20C, XC17256EVO8I, XC17256EVO8C, XC17256EPD8I, XC17256EPD8C, XC17256EPC20I, XC17512LSO20I, XC17512LSO20C, XC17512LPD8I, XC17512LPD8C, XC17512LPC20I, XC17512LPC20C, XC1736EVO8I, XC1736EVO8C, XC1736ESO8I, XC1736ESO8C, XC17128EPD8I, XC17128EPD8C, XC17128EPC20I, XC17128EPC20C, XC17128ELVO8I, XC17128ELVO8C, XC17128ELPD8I, XC17128ELPC20I, XC17128ELPD8C, XC17128ELPC20C, XC17256EPC20C, XC17256ELVO8I, XC17256ELVO8C, XC17256ELPD8I, XC17256ELPD8C, XC17256ELPC20I, XC17128EVO8I, XC17128EVO8C, XC1701SO20C, XC1701PD8I, XC1701PD8C, XC1701PC20I, XC1701PC20C, XC1701LSO20I, XC1701LSO20C, XC1701LPD8I, XC1701LPD8C, XC1701LPC20I, XC1704LVQ44I, XC1704LVQ44C, XC1704LPC44I, XC1704LPC44C, XC1702LVQ44I, XC1702LVQ44C, XC1702LPC44I, XC1702LPC44C, XC1701SO20I, XC1701LPC20C Datasheet

R

XC1700E and XC1700L Series

Configuration PROMs

DS027 (v3.1) July 5, 2000

Product Specification

Features

One-time programmable (OTP) read-only memory designed to store configuration bitstreams of Xilinx FPGA devices

Simple interface to the FPGA; requires only one user I/O pin

Cascadable for storing longer or multiple bitstreams

Programmable reset polarity (active High or active Low) for compatibility with different FPGA solutions

XC17128E/EL, XC17256E/EL, XC1701 and XC1700L series support fast configuration

Low-power CMOS Floating Gate process

XC1700E series are available in 5V and 3.3V versions

XC1700L series are available in 3.3V only

Available in compact plastic packages: 8-pin SOIC, 8-pin VOIC, 8-pin PDIP, 20-pin SOIC, 20-pin PLCC, 44-pin PLCC or 44-pin VQFP.

Programming support by leading programmer manufacturers.

Design support using the Xilinx Alliance and Foundation series software packages.

Guaranteed 20 year life data retention

Description

The XC1700 family of configuration PROMs provides an easy-to-use, cost-effective method for storing large Xilinx FPGA configuration bitstreams.

When the FPGA is in Master Serial mode, it generates a configuration clock that drives the PROM. A short access time after the rising clock edge, data appears on the PROM DATA output pin that is connected to the FPGA DIN pin. The FPGA generates the appropriate number of clock pulses to complete the configuration. Once configured, it disables the PROM. When the FPGA is in Slave Serial mode, the PROM and the FPGA must both be clocked by an incoming signal.

Multiple devices can be concatenated by using the CEO output to drive the CE input of the following device. The clock inputs and the DATA outputs of all PROMs in this chain are interconnected. All devices are compatible and can be cascaded with other members of the family.

For device programming, either the Xilinx Alliance or Foundation series development system compiles the FPGA design file into a standard Hex format, which is then transferred to most commercial PROM programmers.

 

VCC

VPP

GND

 

 

RESET/

CE

 

 

 

CEO

OE

 

 

 

 

 

 

 

 

or

 

 

 

 

 

OE/

 

 

 

 

 

RESET

 

 

 

 

 

 

CLK

 

Address Counter

TC

 

 

 

 

 

 

 

 

EPROM

Output

OE

 

 

 

Cell

DATA

 

 

 

 

 

 

 

Matrix

 

 

 

 

 

 

 

DS027_01_021500

Figure 1: Simplified Block Diagram (does not show programming circuit)

© 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS027 (v3.1) July 5, 2000

www.xilinx.com

1

Product Specification

1-800-255-7778

 

XC1700E and XC1700L Series Configuration PROMs

R

Pin Description

DATA

Data output is in a high-impedance state when either CE or

OE are inactive. During programming, the DATA pin is I/O. Note that OE can be programmed to be either active High or active Low.

CLK

Each rising edge on the CLK input increments the internal address counter, if both CE and OE are active.

VPP

Programming voltage. No overshoot above the specified max voltage is permitted on this pin. For normal read operation, this pin must be connected to VCC. Failure to do so may lead to unpredictable, temperature-dependent operation and severe problems in circuit debugging. Do not leave VPP floating!

VCC and GND

Positive supply and ground pins.

RESET/OE

When High, this input holds the address counter reset and puts the DATA output in a high-impedance state. The polarity of this input pin is programmable as either RESET/OE or OE/RESET. To avoid confusion, this document describes the pin as RESET/OE, although the opposite polarity is possible on all devices. When RESET is active, the address counter is held at "0", and puts the DATA output in a high-impedance state. The polarity of this input is programmable. The default is active High RESET, but the preferred option is active Low RESET, because it can be driven by the FPGAs INIT pin.

The polarity of this pin is controlled in the programmer interface. This input pin is easily inverted using the Xilinx HW-130 Programmer. Third-party programmers have different methods to invert this pin.

CE

When High, this pin disables the internal address counter, puts the DATA output in a high-impedance state, and forces the device into low-ICC standby mode.

CEO

Chip Enable output, to be connected to the CE input of the next PROM in the daisy chain. This output is Low when the CE and OE inputs are both active AND the internal address counter has been incremented beyond its Terminal Count (TC) value. In other words: when the PROM has been read, CEO will follow CE as long as OE is active. When OE goes inactive, CEO stays High until the PROM is reset. Note that OE can be programmed to be either active High or active Low.

PROM Pinouts

 

 

 

 

 

 

 

 

8-pin

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PDIP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SOIC

20-pin

20-pin

44-pin

44-pin

 

Pin Name

 

VOIC

SOIC

PLCC

 

VQFP

PLCC

 

 

 

 

 

 

 

 

 

 

 

 

DATA

 

1

 

1

2

 

40

2

 

 

 

 

 

 

 

 

 

 

 

 

 

CLK

 

2

 

3

4

 

43

5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

8

6

 

13

19

 

RESET/OE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(OE/RESET)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4

 

10

8

 

15

21

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

GND

 

5

 

11

10

 

18, 41

24, 3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6

 

13

14

 

21

27

 

CEO

 

 

 

 

 

 

 

 

 

 

 

 

VPP

 

7

 

18

17

 

35

41

 

VCC

 

8

 

20

20

 

38

44

Capacity

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Devices

 

 

Configuration Bits

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XC1704L

 

 

 

4,194,304

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XC1702L

 

 

 

2,097,152

 

 

 

 

 

 

 

 

 

 

 

 

 

XC1701/L

 

 

 

1,048,576

 

 

 

 

 

 

 

 

 

 

 

 

 

XC17512L

 

 

 

524,288

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XC1736E

 

 

 

36,288

 

 

 

 

 

 

 

 

 

 

 

 

XC1765E/EL

 

 

65,536

 

 

 

 

 

 

 

 

 

 

 

XC17128E/EL

 

 

131,072

 

 

 

 

 

 

 

 

 

 

XC17256E/EL

 

 

262,144

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

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DS027 (v3.1) July 5, 2000

 

1-800-255-7778

Product Specification

R

XC1700E and XC1700L Series Configuration PROMs

Xilinx FPGAs and Compatible PROMs

 

Configuration

 

Device

Bits

PROM

 

 

 

XC4003E

53,984

XC17128E(1)

XC4005E

95,008

XC17128E

 

 

 

XC4006E

119,840

XC17128E

 

 

 

XC4008E

147,552

XC17256E

 

 

 

XC4010E

178,144

XC17256E

 

 

 

XC4013E

247,968

XC17256E

 

 

 

XC4020E

329,312

XC1701

 

 

 

XC4025E

422,176

XC1701

 

 

 

XC4002XL

61,100

XC17128EL(1)

XC4005XL

151,960

XC17256EL

 

 

 

XC4010XL

283,424

XC17512L

 

 

 

XC4013XL/XLA

393,632

XC17512L

 

 

 

XC4020XL/XLA

521,880

XC17512L

 

 

 

XC4028XL/XLA

668,184

XC1701L

 

 

 

XC4028EX

668,184

XC1701

 

 

 

XC4036EX/XL/XLA

832,528

XC1701L

 

 

 

XC4036EX

832,528

XC1701

 

 

 

XC4044XL/XLA

1,014,928

XC1701L

 

 

 

XC4052XL/XLA

1,215,368

XC1702L

 

 

 

XC4062XL/XLA

1,433,864

XC1702L

 

 

 

XC4085XL/XLA

1,924,992

XC1702L

 

 

 

XC40110XV

2,686,136

XC1704L

 

 

 

XC40150XV

3,373,448

XC1704L

 

 

 

XC40200XV

4,551,056

XC1704L +

 

 

XC17512L

 

 

 

XC40250XV

5,433,888

XC1704L+

 

 

XC1702L

 

 

 

XC5202

42,416

XC1765E

 

 

 

XC5204

70,704

XC17128E

 

 

 

 

Configuration

 

Device

Bits

PROM

 

 

 

XC5206

106,288

XC17128E

 

 

 

XC5210

165,488

XC17256E

 

 

 

XC5215

237,744

XC17256E

 

 

 

XCV50

559,232

XC1701L

 

 

 

XCV100

781,248

XC1701L

 

 

 

XCV150

1,041,128

XC1701L

 

 

 

XCV200

1,335,872

XC1702L

 

 

 

XCV300

1,751,840

XC1702L

 

 

 

XCV400

2,546,080

XC1704L

 

 

 

XCV600

3,608,000

XC1704L

 

 

 

XCV800

4,715,648

XC1704L +

 

 

XC1701L

 

 

 

XCV1000

6,127,776

XC1704L +

 

 

XC1702L

 

 

 

XCV50E

630,048

XC1701L

 

 

 

XCV100E

863,840

XC1701L

 

 

 

XCV200E

1,442,106

XC1702L

 

 

 

XCV300E

1,875,648

XC1702L

 

 

 

XCV400E

2,693,440

XC1704L

 

 

 

XCV405E

3,340,400

XC1704L

 

 

 

XCV600E

3,961,632

XC1704L

 

 

 

XCV812E

6,519,648

2 of XC1704L

 

 

 

XCV1000E

6,587,520

2 of XC1704L

 

 

 

XCV1600E

8,308,992

2 of XC1704L

 

 

 

XCV2000E

10,159,648

3 of XC1704L

 

 

 

XCV2600E

12,922,336

4 of XC1704L

 

 

 

XCV3200E

16,283,712

4 of XC1704L

 

 

 

Notes:

1.The suggested PROM is determined by compatibility with the higher configuration frequency of the Xilinx FPGA CCLK. Designers using the default slow configuration frequency (CCLK) can use the XC1765E or XC1765EL for the noted FPGA devices.

DS027 (v3.1) July 5, 2000

www.xilinx.com

3

Product Specification

1-800-255-7778

 

XC1700E and XC1700L Series Configuration PROMs

R

Controlling PROMs

Connecting the FPGA device with the PROM.

The DATA output(s) of the of the PROM(s) drives the DIN input of the lead FPGA device.

The Master FPGA CCLK output drives the CLK input(s) of the PROM(s).

The CEO output of a PROM drives the CE input of the next PROM in a daisy chain (if any).

The RESET/OE input of all PROMs is best driven by the INIT output of the lead FPGA device. This connection assures that the PROM address counter is reset before the start of any (re)configuration, even when a reconfiguration is initiated by a VCC glitch. Other methods—such as driving RESET/OE from LDC or system reset—assume the PROM internal power-on-reset is always in step with the FPGA’s internal power-on-reset. This may not be a safe assumption.

The PROM CE input can be driven from either the LDC or DONE pins. Using LDC avoids potential contention on the DIN pin.

The CE input of the lead (or only) PROM is driven by the DONE output of the lead FPGA device, provided that DONE is not permanently grounded. Otherwise, LDC can be used to drive CE, but must then be unconditionally High during user operation. CE can also be permanently tied Low, but this keeps the DATA output active and causes an unnecessary supply current of 10 mA maximum.

FPGA Master Serial Mode Summary

The I/O and logic functions of the Configurable Logic Block (CLB) and their associated interconnections are established by a configuration program. The program is loaded either automatically upon power up, or on command, depending on the state of the three FPGA mode pins. In Master Serial mode, the FPGA automatically loads the configuration program from an external memory. The Xilinx PROMs have been designed for compatibility with the Master Serial mode.

Upon power-up or reconfiguration, an FPGA enters the Master Serial mode whenever all three of the FPGA mode-select pins are Low (M0=0, M1=0, M2=0). Data is read from the PROM sequentially on a single data line. Synchronization is provided by the rising edge of the temporary signal CCLK, which is generated during configuration.

Master Serial Mode provides a simple configuration interface. Only a serial data line and two control lines are required to configure an FPGA. Data from the PROM is

read sequentially, accessed via the internal address and bit counters which are incremented on every valid rising edge of CCLK.

If the user-programmable, dual-function DIN pin on the FPGA is used only for configuration, it must still be held at a defined level during normal operation. The Xilinx FPGA families take care of this automatically with an on-chip default pull-up resistor.

Programming the FPGA With Counters

Unchanged Upon Completion

When multiple FPGA-configurations for a single FPGA are stored in a PROM, the OE pin should be tied Low. Upon power-up, the internal address counters are reset and configuration begins with the first program stored in memory. Since the OE pin is held Low, the address counters are left unchanged after configuration is complete. Therefore, to reprogram the FPGA with another program, the DONE line is pulled Low and configuration begins at the last value of the address counters.

This method fails if a user applies RESET during the FPGA configuration process. The FPGA aborts the configuration and then restarts a new configuration, as intended, but the PROM does not reset its address counter, since it never saw a High level on its OE input. The new configuration, therefore, reads the remaining data in the PROM and interprets it as preamble, length count etc. Since the FPGA is the master, it issues the necessary number of CCLK pulses, up to 16 million (224) and DONE goes High. However, the FPGA configuration will be completely wrong, with potential contentions inside the FPGA and on its output pins. This method must, therefore, never be used when there is any chance of external reset during configuration.

Cascading Configuration PROMs

For multiple FPGAs configured as a daisy-chain, or for future FPGAs requiring larger configuration memories, cascaded PROMs provide additional memory. After the last bit from the first PROM is read, the next clock signal to the PROM asserts its CEO output Low and disables its DATA line. The second PROM recognizes the Low level on its CE input and enables its DATA output. See Figure 2.

After configuration is complete, the address counters of all cascaded PROMs are reset if the FPGA RESET pin goes Low, assuming the PROM reset polarity option has been inverted.

To reprogram the FPGA with another program, the DONE line goes Low and configuration begins where the address counters had stopped. In this case, avoid contention between DATA and the configured I/O use of DIN.

4

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DS027 (v3.1) July 5, 2000

 

1-800-255-7778

Product Specification

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