V3 Semiconductor V363EPC-50REVA0 Datasheet

© 2000 V3 Semiconductor Corp. V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101
1
V363EPC A0 Local Bus to PCI Bridge
for Embedded Processors
1.0 About the V363EPC
V363EPC A0 Data Sheet
Direct interface to these processors:
• AMD
AM29030/40™
• IBM
PowerPC 401™ Gx
• Intel
i960® Cx/Hx/Jx/Sx
Fully compliant with PCI Local Bus
Specification, Revision 2.1
Configurable for system master, PCI bus
master, or PCI target operation
Type 0 and Type 1 PCI configuration cyclesUp to 1 kB burst access on the PCI or
the local bus
640 bytes of programmable FIFO storage with
Dynamic Bandwidth Allocation™ architecture
64-byte read FIFO in each directionEnhanced support for 8-bit/16-bit local bus
devices with programmable region sizes
Dual bi-directional address space remapping10-bit bus watch timerOn-the-fly byte order (endian) conversion
I
2
O-Ready™ ATU and messaging unit,
including hardware controlled circular queues
Two-channel DMA, multiprocessor DMA
chaining, and demand mode DMA
Hot Swap Capable™ according to the PICMG
Hot Swap Specification, version 2.1
Sixteen 8-bit bi-directional mailbox registers
with doorbell interrupts
Support for real-mode MS-DOS
holes
Flexible PCI and local interrupt managementOptional power-on serial EEPROM
initialization
Up to 50 MHz on both PCI and local bus clocks3.3 V operation; 5 V tolerant inputIndustrial temperature range (40°C to +85°C)Low-cost 160-pin EIAJ PQFP package
(Electronic Industries Association of Japan Plastic Quad Flat Pack)
About the V363EPC
2
V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101 © 2000 V3 Semiconductor Corp.
The V363EPC offers the highest performance, most flexible, and most economical solution for interfacing either 32-bit or 16-bit local bus applications to the PCI bus. It is also an ideal candidate for a variety of high-performance applications based on Motorola, IBM, DEC, Hitachi, and other popular embedded processors where only a minimal amount of glue logic is needed.
V363EPC is the 3.3 V enhanced version of the V350EPC and V360EPC Rev A1 devices and supports powerful features like Hot Swap and DMA chaining. The PCI bus operates at up to 50 MHz, independent of local bus clock frequency. The overall throughput of the system is dramatically improved by using our unique Dynamic Bandwidth Allocation™ architecture.
Access to the PCI bus can be performed through two programmable address apertures. Two more apertures are provided for PCI-to-local bus accesses. There are 64 bytes of read FIFOs in each direction, 32 bytes dedicated for each aperture.
Two high-performance DMA channels with chaining and demand mode capabilities provide a powerful data transfer engine for bulk data transfers. Mailbox registers and flexible PCI interrupt controllers also provide a simple mechanism to emulate PCI device control ports. The part is available in a 160-pin, low-cost PQFP package.
This document contains the product codes, pinouts, package mechanical information, DC characteristics, and AC characteristics for the V363EPC. Detailed functional information is contained in the User’s Manual.
Note:
V3 Semiconductor retains the rights to change documentation, specifications, or device functionality at any time without notice. Please verify that you have the latest copy of all documents before finalizing a design.
Product Codes
© 2000 V3 Semiconductor Corp. V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101
3
Figure 1: Example Applications
2.0 Product Codes
Table 1: Product Codes
Product Code Package Frequency
V363EPC-50 REV A0 160-pin EIAJ PQFP 50 MHz
CPU
PCI Edge Connector
SCSI
Controller
Card acts as a bus master; it receives and transmits data on the PCI bus
Hard
Disk
Graphics
Engine
PCI Edge Connector
Frame Buffer
and RAMDAC
Card is never a bus master and receives video data from other masters
To
Monitor
V363EPC
CPU
PCI Bus
PCI T arget
Add-In
Card
PCI T arget
Add-In
Card
PCI T arget
Add-In
Card
V363EPC
V380SDC
SDRAM
Controller
PCI Bus
SDRAM
V363EPC
I
2O Ready
V363EPC
I
2O Ready
Pin Descriptions and Pinouts
4
V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101 © 2000 V3 Semiconductor Corp.
3.0 Pin Descriptions and Pinouts
Table 2 lists the pin types found on the V363EPC. Together, Tab l e 3 and Tab l e 4 describe the function of each pin on
the V363EPC. Table 5 lists the RESET state for test mode pins. Section 3.2 lists processor-mode-specific pin assignments and shows the pinouts for the 160-pin EIAJ PQFP package. Figure 6 shows the mechanical dimensions of the package.
Tabl e 2 : Pin Types
Pin T ype Description
PCI I PCI input only pin.
PCI O PCI output only pin.
PCI I/O PCI tri-state I/O pin.
PCI I/O
D
PCI input with open drain output.
I/O
4
TTL I/O pin with 4 mA output drive.
I TTL input only pin.
O
4
TTL output pin with 4 mA output drive.
Table 3: Signal Descriptions: Non-Processor Mode Dependent
Signal Type
Reset
State
Description
PCI Bus Interface Signals
AD[31:0] PCI I/O Z
Address and Data
multiplexed on the same pins.
C/BE[3:0] PCI I/O Z
Bus Command and Byte Enables
multiplexed on the same pins.
PAR PCI I/O Z
Parity
represents even parity across AD[31:0] and C/BE
[3:0].
FRAME PCI I/O Z
Cycle Frame
indicates the beginning and burst length of an access.
IRDY
PCI I/O Z
Initiator R e a dy
indicates the initiating agent’s (bus master’ s ) ability
to complete the current data phase of the transaction.
TRDY PCI I/O Z
Target Ready
indicates the target agent’s (selected device’s) ability
to complete the current data phase of the transaction.
STOP
PCI I/O Z
Stop
indicates that the current target is requesting the master to stop
the current transaction (retry or disconnect).
DEVSEL PCI I/O Z
Device Select
, when actively driven by a target, indicates the driving device has decoded its address as the target of the current access. As an input to the initiator, DEVSEL
indicates whether any device on
the bus has been selected.
Pin Descriptions and Pinouts
© 2000 V3 Semiconductor Corp. V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101
5
IDSEL PCI I
Initialization Device Select
is used as a chip select during configuration read and write transactions. It must be driven high in order to access the chip’s internal configuration space.
REQ PCI O Z
Request
indicates to the arbiter that this agent requests use of the
bus.
GNT
PCI I
Grant
indicates to the agent that access to the bus has been
granted.
PCLK PCI I
PCI Clock
provides timing for all transactions on the PCI bus.
PRST
PCI I/O Z/L
PCI Reset
acts as an input when RDIR is high, an output when RDIR is low. As an input it is asserted low to bring all internal EPC operation to a reset state.
PERR PCI I/O Z
Parity Err or
is used to report data parity errors during al l PCI
transactions except a Special Cycle.
SERR
PCI I/OD Z
System Error
is used to report address parity errors, data par ity errors on the Special Cycle command, or any other system error where the result will be catastrophic.
INT[A:D] PCI I/OD Z
Interrupt
is used to receive or generate level-sensitive interrupt
requests.
Serial EEPROM Interface Signals
SCL/LPERR O
4
X
EEPROM Clock, Local Parity Error.
SDA I/O
4
X
EEPROM D a ta
.
Configuration Signal
RDIR I
Reset Direction
: tie low to drive PRST
out and LRST in; tie high to
drive LRST
out and PRST in.
Power and Ground Signals
V
CC
Power
leads for external connection to a 3.3 V VCC board plane.
GND
Ground
leads for external connection to a GND board plane.
Table 3: Signal Descriptions: Non-Processor Mode Dependent
Signal Type
Reset
State
Description
Pin Descriptions and Pinouts
6
V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101 © 2000 V3 Semiconductor Corp.
Table 4: Signal Descriptions: Processor Mode Dependent
De-Multiplexed A/D M ultiplexed A/D
Type
Reset
State
Description
AM29030/40 i960Cx/Hx i960Jx i960Sx
ID[31:0] LD[31:0] LAD[31:0] LAD[15:0] I/O
4
Z
De-multiplexed data bus. Multiplexed address and data bus.
LA[31:2] LA[31:2] LA[5:2]
LA[31:16]
LA[5:2]
I/O
4
Z
Address Bus
LA[5:2] are output only in
Multiplexed A/D mode.
BWE
[3:0] BE[3:0] BE[3:0] BE[1:0] I/O
4
Z
Byte Enables
R/W W/R W/R W/R I/O
4
Z
Read-Write
strobe.
——ALEALEI/O
4
Z
Address Latch Enable
LREQ ADS ADS AS I/
O
4
Z
Address Strobe is asserted low to indicate the beginning of a bus cycle; interpreted as LREQ
in AM29030/40 mode.
RDY READY RDYRCY READY I/O
4
Z
Data Ready
LBREQ HOLD HOLD HOLD O
4
L
1
1. The reset state is ‘H’ in AM29030/40 mode.
Bus Mastership Request
LBGRT
HOLDA HOLDA HOLDA I
Bus Mastership Grant
LPAR[3:0] LPAR[3:0] LPAR[3:0] LPAR[1:0] I/O
4
Z
Data Parity
BURST
BLAST BLAST BLAST I/O
4
Z
BURST
:
Burst Request
BLAST
:
Burst Last
ERR BTERM BTERM I/
O
4
Z
ERR:
Bus Time-out
BTERM
:
Burst Terminate
LINT
LINT LINT LINT O
4
H
Local Interrupt Request
LRST LRST LRST LRST I/O
4
L/Z
Local Bus RESET
MEMCLK LCLK LCLK LCLK I
Local Bus Clock
Pin Descriptions and Pinouts
Test Mode Pins
© 2000 V3 Semiconductor Corp. V363EPC A0 Data Sheet Rev 1.01 DS-EC301-0101
7
3.1 Test Mode Pins
Several device pins are used during the manufacturing test to put the V363EPC device into various test modes.
Note:
These pins must be maintained at proper levels during reset to insure proper
operation.
This is typically handled through pull-up or pull-down resistors (typically 1–10 k) on the signal pins if they are not
guaranteed to be at the proper level during reset. Table 5 shows the reset states for test mode pins.
3.2 Processor-mode Specific Pin Assignments
The following tables and diagrams describe the pin assignments for the V363EPC A0 in its various processor modes.
• AM29030/040 mode: Table 6 and Figure 2
• i960 Cx/Hx mode: Table 7 and Figure 3
• i960 Jx mode: Table 8 and Figure 4
• i960 Sx mode: Ta b l e 9 and Figure 5
Table 5: RESET State for Test Mode Pins
Mode Pin 134 Pin 135 Pin 153
i960 Cx/Hx
Pull up Pull up Pull up
AMD 2930/40
Pull down Pull up Pull up
i960 Jx
Pull down Pull up Pull down
i960 Sx
Pull down Pull down Pull down
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