TAG SV-4102-X214 Operation Manual

TAG

22355 TAG Way

Dulles, VA 20166

4U Single Quad Core Xeon PICMG Server

SV-4102-X214

Operations Manual

279-MNL-006

Operations Manual

1 Copyright © 2008 Technology Advancement Group®, Inc.

(TAG®)

All rights reserved. This publication and its contents are proprietary to TAG. No part of
this publication may be reproduced in any form or by any means without the written
permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.

TAG has made every effort to ensure the correctness and completeness of the material
in this document. TAG shall not be liable for errors contained herein. The information in
this document is subject to change without notice. TAG makes no warranty of any kind
with regard to this material, including, but not limited to, the implied warranties of
merchantability and fitness for a particular purpose.

1.1 Trademarks

All trademarks, marks, names, or product names referenced in this publication are the
property of respective owners, and TAG neither endorses nor otherwise sponsors any
such products or services referred to herein.

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2 About TAG

2.1 Summary of Qualifications

TAG has served as a leading provider of IT solutions to DoD customers over the past
20+ years and has a long-standing and respected history of providing Systems
Engineering, Electronic Equipment and Program Management support to US Military
warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft.
engineering and manufacturing facility provides all the infrastructure, equipment, and
manpower necessary to engineer, design, test, manufacture, and certify products to the
rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San
Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support
across the globe.

TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD
programs with specific MIL-STD requirements. TAG’s comprehensive Quality
Assurance (QA) policy – enforced through application of our UL-registered ISO
9001:2000 certified processes – enables TAG to rapidly deploy systems and solutions
that reliably withstand the stresses of the tactical environment. Today, there are over
20,000 TAG systems deployed across various weapons platforms throughout the US
Military. TAG effectively balances all corporate assets – our people, expertise,
infrastructure, and experience – to consistently and successfully execute and deliver to
the DoD.

TAG’s success lies in focusing on the
corporate Mission Statement and leveraging
the tenets of our business model to ensure

the customer’s expectations are exceeded

throughout lengthy program lifecycles.

TAG’s Mission is to resolve our customers’ IT

challenges with World-Class:

 Engineering;
 Manufacturing and Integration; and

 Lifecycle Management

TAG has a proven track record in
implementing these tenets to serve as a trusted advisor to our Government customers.
TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and
the customer can consistently rely on the company, our equipment, and our services.

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2.2 Core Competences

2.2.1 Engineering

TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and
rigorous design reviews. Although PMs drive the schedule at TAG, Engineering
leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD)
modeling, rapid prototyping processes, and diverse test equipment and facilities to
ensure requirements are being met at every step of the design. TAG Engineering
follows a proven design-review process, ensuring all entrance and exit criteria are met
at each stage. Rigorous documentation is compiled to demonstrate requirement
compliance, risks are mitigated, and decisions are prudent – throughout the design
process.

TAG prides itself on its engineering
laboratories and facilities. Over the past
three years, TAG has invested in several
pieces of equipment that allow TAG to test
and certify products directly onsite to the
harshest environmental requirements of
military standards – including the MIL-STD­810F and DO 160D.

TAG’s onsite test equipment currently

includes a Highly Accelerated Lifecycle
Testing (HALT) Chamber, an
Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal
test chamber. TAG’s facility also provides:

 A floor plan designed to support a cellular manufacturing model with modular

assembly lines

 A dedicated 24-hour system burn-in room
 A modern production status tracking and Enterprise Resource Planning (ERP)

system with external web collaboration capabilities

 Dedicated Quality Assurance workstations for system compliance and validation

inspection

2.2.2 Manufacturing and Integration

TAG implements Cellular Manufacturing processes through our compartmentalized,
state-of-the-art production facility to minimize waste byproducts and maximize

production efficiency. TAG’s manufacturing facility is physically partitioned to model the

major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s

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production cells are capable of operating in isolation; however personnel and tools are
shared across all cells to streamline manufacturing operations, costs, and the
production/integration scheduling. TAG’s floor technicians are cross-trained in multiple
disciplines so they can be redistributed to any cell that encounters production
bottlenecks, which ensures optimal efficiency.

2.2.3 Lifecycle Management

TAG’s world-class Program Management discipline models the renowned
methodologies of the Project Management Institute (PMI) to ensure successful
completion of the task at hand. Our Program Managers (PMs) serve as the voice of the
customer – driving requirements to which the rest of TAG’s organization answers. As

an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost,

schedule, and technical compliance throughout a project’s period of performance, but

also ensure the customer is supported well beyond it.

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Date

Version

Number

Updated By

Description of

Changes

10/11/2010

1.0

Alan Huckerby

Author

Operations Manual

Document Revision History

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3 About This Manual

3.1 Scope and Audience

This Manual provides an introductory overview
of the SV-4102-X214. Designed to endure the
rigors of harsh environments, this device can
withstand shock and vibration, high and low
temperatures. All of our devices are based on
the latest Intel and AMD technology. Also, this
device doesn't use Intel Core Due or Pentium
M technology (only THS servers).

. Configuration options include extended
memory and enhanced video optimization. All
of our servers are backed by our world-class
lifecycle management and post sales support.

3.1.1 Organization:

 Chapter 1 Provides Cautions and Warnings.
 Chapter 2 Provides operational information.
 Chapter 3 Contains all relevant Procedures.

This manual is divided into the following
chapters:

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Table of Contents

Contents

1 Copyright © 2008 Technology Advancement Group®, Inc. (TAG®) ............................ 2

1.1 Trademarks ............................................................................................................ 2

2 About TAG ................................................................................................................... 3

2.1 Summary of Qualifications ...................................................................................... 3

2.2 Core Competences ................................................................................................. 4

2.2.1 Engineering ................................................................ ................................ ....... 4

2.2.2 Manufacturing and Integration ........................................................................... 4

2.2.3 Lifecycle Management ...................................................................................... 5

3 About This Manual ....................................................................................................... 7

3.1 Scope and Audience .............................................................................................. 7

3.1.1 Organization: ..................................................................................................... 7

4 Safety Instructions ....................................................................................................... 12

4.1 Types of Warnings used in this Manual .................................................................. 12

4.1.1 Safety Symbols and Labels ............................................................................... 12

4.1.2 Conventions ...................................................................................................... 12

5 SV-4102-X214 Overview ............................................................................................. 15

5.1 Product Information ................................................................................................ 15

6 SV-4102-X214 ............................................................................................................. 16

6.1.1 SV-4102-X214‖ Specifications .......................................................................... 18

6.1.2 SV-4102-X214 Components ............................................................................. 19

6.1.3 Server-Class PCI Express Backplane ............................................................... 19

6.1.4 Trenton PICMG 1.3 Sys/Host Board ................................................................ 21

6.1.5 Trenton PICMG 1.3 Sys/Host Board Components ............................................ 21

6.1.6 PCI Express System Host Board Components ................................................. 22

6.1.7 IOB30 I/O Expansion Board .............................................................................. 23

6.1.8 NI PCI-GPIB for Windows Vista/XP/2000.......................................................... 24

6.1.9 IEEE 1394 FireWire® PCI Card ........................................................................ 26

6.1.10 IEEE 1394 FireWire® PCI Card ...................................................................... 27

6.1.11 Adaptec SAS RAID ......................................................................................... 29

6.1.12 3.5inch 15K-RPM SAS Hard Drive .................................................................. 31

6.2 Power Management ............................................................................................... 33

6.2.1 Power Supply .................................................................................................... 33

6.2.2 Power Supply Components ............................................................................... 34

6.3 COTS 28 Vin Filter ................................................................................................. 36

6.3.1 Vin Filter Features ............................................................................................. 36

7 Procedures .................................................................................................................. 38

7.1 SV-4102-X214 Startup ........................................................................................... 38

7.2 SV-4102-X214 Shutdown ....................................................................................... 38

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8 Identifying Server Components Using Device Manager ............................................... 39

8.1 Working with Device Properties .............................................................................. 42

8.2 Installing and Removing Hardware in Windows...................................................... 44

8.2.1 Using the Add New Hardware Wizard ............................................................... 45

8.3 Installing Legacy Peripherals .................................................................................. 46

8.3.1 Removing Legacy Peripherals .......................................................................... 46

8.4 TAG Approved BIOS .............................................................................................. 49

8.4.1 BIOS Configuration for Nightvision .................................................................... 49

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List of Figures

Figure 5-1 SV-4102-X214 ............................................................................................. 15

Figure 6-1 SV-4102-X214 (Front View) ......................................................................... 16

Figure 6-2 SV-4102-X214 (Rear View) .......................................................................... 16

Figure 6-3 Warning Label .............................................................................................. 17

Figure 6-4 PCI Express Backplane ............................................................................... 19

Figure 6-5 Trenton PICMG 1.3 Sys/Host Board ............................................................ 21

Figure 6-6 IOB30 I/O Expansion Board ................................................................... 23

Figure 6-7 High-Performance GPIB Interface for PCI ............................................................... 24

Figure 6-8 IEEE 1394 FireWire® PCI Card ................................................................... 27

Figure 6-9 Adaptec 5805 ............................................................................................... 29

Figure 8-1 Control Panel ............................................................................................... 39

Figure 8-2 System Properties ........................................................................................ 40

Figure 8-3 Device Manger ............................................................................................. 40

Figure 8-4 Device Manager ........................................................................................... 42

Figure 8-5 Properties Dialog Box .................................................................................. 43

Figure 8-6 Control Panel ............................................................................................... 45

Figure 8-7 Add Hardware Wizard .................................................................................. 45

Figure 8-8 Control Panel ............................................................................................... 46

Figure 8-9 System Properties ........................................................................................ 47

Figure 8-10 Device Manager ......................................................................................... 47

List of Tables

Table 6-1 Specifications. ............................................................................................... 29

Table 6-2 Adaptec SATA & SAS RAID Specifications. .................................................. 30

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Chapter 1

Cautions and Warnings.

Electronically distributed. Subject to user discretion when printed.

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DANGER

WARNING

CAUTION

These warnings and
cautions indicate situations
or practice that might
result in property damage.

Operations Manual

4 Safety Instructions

4.1 Types of Warnings used in this Manual

Read this manual thoroughly, paying special attention to the cautions and warnings.

4.1.1 Safety Symbols and Labels

4.1.2 Conventions

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4.1.2.1 Important Messages

Important messages appear where
mishandling of components is possible or when
work orders can be misunderstood. These
messages also provide vital information
associated with other aspects of system

operation. The word ―important‖ is written as

―IMPORTANT,‖ both capitalized and bold and

is followed by text in italics. The italicized text
is the important message.

4.1.2.2 Warnings

Warnings appear where overlooked details
may cause damage to the equipment or result
in personal injury. Warnings should be taken
seriously. Warnings are easy to recognize. The

word ―warning‖ is written as ―WARNING,‖ both

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capitalized and bold and is followed by text in
italics. The italicized text is the warning
message.

4.1.2.3 Cautions

Cautionary messages should also be heeded
to help you reduce the chance of losing data or
damaging the system. Cautions are easy to

recognize. The word ―caution‖ is written as

―CAUTION,‖ both capitalized and bold and is

followed by text in italics. The italicized text is the

cautionary message.

4.1.2.4 Notes

Notes inform the reader of essential but non­critical information. These messages should be
read carefully as any directions or instructions
contained therein can help you avoid making
mistakes. Notes are easy to recognize. The

word ―note‖ is written as ―NOTE,‖

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Chapter 2

SV-4102-X214

.

Electronically distributed. Subject to user discretion when printed.

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5 SV-4102-X214 Overview

Figure 5-1 SV-4102-X214

5.1 Product Information

The SV-4102-X214 sets the standard for
Servers with state-of-the-art technology. The
newest Server can stand up to the harshest
environments, and is designed specifically to
be fully customized to support unique, mission­critical applications.

Your system may contain components not
described in this User Manual. For detailed
information on these components, refer to the
manufactures website or contact TAG
Technical Support at [e-mail].

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6 SV-4102-X214

Figure 6-1 SV-4102-X214 (Front View)

Figure 6-2 SV-4102-X214 (Rear View)

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NOTE: The Power Input Toggle Switch has two (2) positions:

1. 28 VDC UP

2. 220 VAC DOWN

WARNING: It is imperative that the instructions on the warning label are adhered
to.

CUSTOM PIN OUT:

A. = (+28VDC)
B. = (-V)
C. = LINE
D. = NEUTRAL
E. = EARTH GROUND
F. = NC

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Figure 6-3 Warning Label

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6.1.1 SV-4102-X214” Specifications
Chassis & Power Supply

 Dimensions: 7‖H x 17.125‖W x 20.750‖D.
 Weight: 30 lbs.

 Input Voltage: The input power is 28VDC OR

220 VAC.

System Specifications.

 Intel Quad Core Low-voltage CPU (L5408,

2.13GHz).

 Cache: 12MB L2 Cache.
 Memory: 4GB (2 x 2GB Modules)/Expandable

to 8GB. Type: FB-DIMM RAM.

System Management:
 Intelligent fan controller. With Custom Thermal

solution to provide operation in extreme
temperature environment

 Environmentally aware
 Acoustically optimized

Additional Components:

 2X 3.5inch 15K-RPM SAS Hard Drives.
 Trenton PICMG 1.3 Sys/Host Board.
 IOB30 I/O Expansion Board.

 NI PCI-GPIB for Windows Vista/XP/2000.
 Server-Class PCI Express Backplane.
 IEEE 1394 FireWire® PCI Card.
 Adaptec 5805 Card.
 Low-profile DVD±RW/CD-RW drive

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Maintenance and Repair

 The SV-4102-X214 is considered a line

replaceable unit (LRU) and will be maintained
and spared at the LRU level.

6.1.2 SV-4102-X214 Components

This section provides an overview of the most
common components installed in the SV-4102­X214. Information is also provided on how to
identify specific components within your SV­4102-X214. For detailed information on the
specific components installed, refer the
manufactures websites.

6.1.3 Server-Class PCI Express Backplane

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Figure 6-4 PCI Express Backplane

Specifications

 14-slot form factor supports PCI Express, PCI-X

and PCI option cards

 One SHB Express (PICMG 1.3) System
 Host Board Slot (Server Class)

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 One x16 and one x8 PCI Express Slot
 (mechanical)
 Two PCI-X 64-bit/ 133MHz Slots and Eight PCI-

X 64-bit/ 100MHz Slots

 PCI-X slots support universal, 64-bit/ 32-bit PCI

cards

 Four USB 2.0 backplane I/ O connections**
 Two 10/100/1000Base-T backplane Ethernet

ports**

 Operating Temp: 0°C to 60°C
 Storage Temp: -20° to 70°C
 Humidity: 5% to 90% non-condensing.

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6.1.4 Trenton PICMG 1.3 Sys/Host Board

The PCI Systems Host board (SHBs) offers a
wide variety of board configurations designed
to excel in your most demanding and diverse
server-class computing applications. Dual-Core
processor options provide two and Quad-Core
processors provide four execution cores per
CPU. For dual-processor board configurations,
each CPU has its own independent system
bus to reduce data bottlenecks while
maximizing processing throughput. The four­channel memory interface features
DDR2-667 FB-DIMMS with a maximum of
16GB.

NOTE: This Unit provides a Single Quad
core CPU.

6.1.5 Trenton PICMG 1.3 Sys/Host Board Components

 Dual or Quad-Core Intel® Xeon® Processors

with Independent Front Side Bus Support,

 Quad Channel DDR2-667 Memory Interface

Up to 16GB

 Ultro ATA/100 Interface.
 Duel USB Interfaces.

Figure 6-5 Trenton PICMG 1.3 Sys/Host Board

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Figure 6-9 MCG-Series PICMG 1.3 PCI Express System Host Board

6.1.6 PCI Express System Host Board Components

 Dual- or Quad-Core Intel® Xeon® Processors

and the Intel® 5000P chipset.

 A single-board design with two processors that

provide up to eight processor execution cores
per board (1 + 2 = 8

 An independent 1066/1333MHz system bus for

each processor.

 Support for 32-bit and 64-bit operating

systems.

 A four-channel system memory interface with

standard memory (16GB) and extended
memory (32GB) support.

 Six SATA/300 ports that support RAID 0, 1, 5

and 10 drive arrays.

 Three Gigabit Ethernet interfaces and eight

USB 2.0 ports.

 Supports PCI Express™, PCI-X and PCI option

cards.

 Power and Backplane I/O Connector.

 Operating Temperature: 0° to 40° C. (3.16GHz

X5460 CPUs)

 Operating Temperature: 0° to 55° C. (L5408

and LV5138 CPUs)

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 Operating Temperature: 0° to 45° C.
 Air Flow Requirement: 300LFM continuous

airflow

 Storage Temperature: - 40° to 70° C.

 Humidity: 5% to 90% non-condensing

6.1.7 IOB30 I/O Expansion Board

The IOB30 I/O Expansion Board for the
Trenton PICMG 1.3 System Host Boards

Optional plug-in module provides legacy I/O
system support. This board Features two RS­232 serial COM ports and one PS/2 port on the
I/O plate Additional on-board interfaces
available Supports Trenton TQ9, MCX and
MCG-series PICMG 1.3 SHBs

Figure 6-6 IOB30 I/O Expansion Board

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Specifications

 Two DB9 serial port connectors on the I/O

plate provide RS-232 COM functionality

 An I/O plate mounted PS/2 MiniDin connector

supports PS/2 keyboard and mouse devices

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 On board headers for additional parallel printer,

floppy functionality or alternative mouse and
keyboard connections

6.1.8 NI PCI-GPIB for Windows Vista/XP/2000

Figure 6-7 High-Performance GPIB Interface for PCI

Specifications

PCI-GPIB is a high-performance plug-and-play
IEEE 488 interface for PCs and workstations
with PCI expansion slots. You can use the NI
PCI-GPIB in PCs running Windows
Vista/XP/2000/Me/9x/NT.

Maximum IEEE 488 Bus Transfer Rates

 IEEE 488 interlocked handshake......... 1.5

MB/s

 IEEE 488 noninterlocked

 (HS488) handshake......................... 7.7 MB/s

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 (actual rates depend on system configuration

and instrument capabilities)

GPIB Analyzer Performance

 Sampling rate...................................... 20 MHz

 Timestamp resolution ......................... 50 ns

Ethernet Performance

 10BASE-T 10 Mb/s, full-duplex
 100BASE-TX 100 Mb/s, full-duplex
 1000BASE-T 1000 Mb/s, full-duplex

Power Requirements

 PCI-GPIB, PXI-GPIB, PCI-GPIB/LP (183617x-

01-based board)

 +5 VDC 1.5 W typical, 2.25 W maximum
 PCI-GPIB, PXI-GPIB (188513x-01-based

board) +3.3 VDC 0.4 W typical, 0.6 W
maximum

 PCI-GPIB+ +3.3 VDC 0.6 W typical, 1.9 W

maximum

 PCI-8232 +5 VDC. 4.4 W typical, 5.8 W

maximumPXI-8232

 +3.3 VDC 3.0 W typical, 4.0 W maximum
 PCI signaling level Universal

Physical Dimensions

 PCI (183617x-01-based board)............ 13.3 by

10.7 cm (5.3 by 4.2 in.)

 PCI (188513x-01-based board)............ 12.0 by

6.44 cm (4.72 by 2.54 in.)

 PCI (low-profile) .................................. 12.0 by

6.44 cm (4.72 by 2.54 in.)

 PXI ....................................................... 16 by

10 cm (6.3 by 3.9 in.)

I/O Connectors

 GPIB.. IEEE 488 standard 24-pin

 Ethernet........................................ RJ45

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Operating Environment

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 Ambient temperature............. 0 to 55 °C

 Relative humidity . 10 to 90%, noncondensing
 (tested in accordance with
 IEC-60068-2-1, IEC-60068-2-2,
 and IEC-60068-2-56)

Storage Environment

 Ambient temperature.......... -20 to 70 °C

 Relative humidity .. 5 to 95%, noncondensing
 (tested in accordance with
 IEC-60068-2-1, IEC-60068-2-2,
 and IEC-60068-2-56)

Shock and Vibration

 PXI-GPIB, PXI-8232

 Functional shock .......... 30 g peak, half-sine,

11 ms pulse (tested in accordance with

 IEC-60068-2-27; test profile developed in

accordance with MIL-PRF-28800F)

 Random vibration

 Operating....... 5 to 500 Hz, 0.3 grms

 Nonoperating............... 5 to 500 Hz, 2.4 grms

(tested in accordance with IEC-60068-2­64;nonoperating test profile exceeds the
requirements of MIL-PRF-28800F, Class 3)

6.1.9 IEEE 1394 FireWire® PCI Card

Used to add FireWire® capabilities to PCs
without FireWire® ports, or for current users
desiring extra ports on an existing FireWire®
system. Simply slides into an empty PCI slot.

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Figure 6-8 IEEE 1394 FireWire® PCI Card

6.1.10 IEEE 1394 FireWire® PCI Card

 Add IEEE 1394 FireWire® capabilities to your

PC, and instantly connect digital video
camcorders, FireWire® storage drives, i.LINK®
compatible devices and all other IEEE 1394
devices.

 Provides 3 additional 400Mbps FireWire®

ports.

 Easy drop in, and user-friendly Plug-and-Play

installation.

 Compatible with Windows® 98.
 Fully compliant with PCI v2.1 and current IEEE

1394 specifications.

 64 Bit PCI card (also fits into32 Bit PCI slots)
 33 MHz/64 Bit and 33 MHz/32 Bit PCI Interface
 PCI 2.2 Compliant

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 Fully backward compatible to 1394a
 OHCI Compliant 1394b Host controller with

support for 100 Mb/sec. (12.5 MB/sec), 200

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Mb/sec. (25 MB/sec.), 400 Mb/sec. (50
MB/sec.) and 800 Mb/sec. (100 MB/sec.) data
transfer speeds.

 1394b Cable power: 12V, 9W max from PCI

bus and optional 12V internal connector for
power from PC power supply

 Connect up to 63 devices, up to 16 devices

daisy chained together in a single chain.

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Adaptec

RAID

5805

Form Factor

MD2 - Low Profile

Ports

8 internal

Connectors

2 SFF-8087 (int.)

Bus
Interface

8-Lane PCIe

Processor

1.2 GHz Dual Core

Cache

512MB

Operations Manual

6.1.11 Adaptec SAS RAID

The Adaptec RAID 5805 is equipped with
industry-leading 1.2GHz DualCore RAID on
Chip (ROC), the latest x8 PCI-Express
connectivity, and 512MB of DDR2 cache to
deliver over 250,000 IO per second and

1.2GB/s. Eight internal ports in this Unified
Serial controller allow you to connect up to 256
SATA/SAS disk drives through SAS
expanders. The Adaptec RAID 5805 features
Adaptec RAID Code (ARC) with RAID levels 0,
1, 1E, 5, 5EE, 6, 10, 50, 60, JBOD, as well as
Copyback Hot Spare.

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Figure 6-9 Adaptec 5805

Table 6-1 Specifications.

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 Supports up to 256 SATA or

SAS devices using SAS
expanders

 RAID levels 0, 1, 1E, 5, 5EE,

6, 10, 50, 60 and JBOD

 Quick initialization
 Online Capacity Expansion
 Copyback Hot Spare
 Dynamic caching algorithm
 Native Command Queuing

(NCQ)

 Background initialization
 Hot-plug drive support
 RAID Level Migration

 Hot spares - global,

dedicated, and pooled

 Automatic/manual rebuild

of hot spares

 SAF-TE enclosure

management

 Configurable stripe size
 S.M.A.R.T. support
 Multiple arrays per disk

drive

 Dynamic sector repair
 Staggered drive spin-up
 Bootable array support
 Optimized Disk Utilization

(ASM)

 Java-based GUI

Management Utility

 Remote configuration,

monitoring and notification

 ASM OS Support:

Windows, Linux, SCO,
Solaris,

 Microsoft VDS Support
 SNMP, SMTP
 Remote firmware updates

 Command Line Interface

Utility (ACU)

 BIOS level configuration

utility

 Flashable BIOS support

Windows XP, Server 2003/2008, Vista, Red Hat Enterprise Linux
(RHEL), SUSE Linux Enterprise Server (SLES), SCO
OpenServer, UnixWare, Sun Solaris 10 x86, FreeBSD

5085/5405/5445/5805 — 2.5‖H
x 6.6‖L (167mm x 64mm)

51245/51645/52445 — 4.6‖H x

6.43‖L (164mm x 116mm)

Operating Temperature(incl.
battery)

0°C to 35°C (without airflow)
0°C to 55°C (with 200 LFM
airflow)

0°C to 30°C (without airflow)
0°C to 55°C (with 200 LFM
airflow)

Operating Voltage

0.45A @ 3.3V; 1A @ 12V

0.47A @ 3.3V; 1.8A @ 12V

MTBF

873,402 hours at 40°C

Operations Manual

6.1.11.1 Adaptec SAS RAID Specifications

Table 6-2 Adaptec SATA & SAS RAID Specifications.

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6.1.12 3.5inch 15K-RPM SAS Hard Drive

Figure 6-16 3.5‖, SAS, Industrial Hard Drive

6.1.12.1 3.5”, SAS, Industrial Hard Drive

The 300GB, 4-platter configuration provides
low power consumption, high reliability, and
faster internal data rates.

Functional Specifications

 Storage capacity (formatted)1 300.0 GB
 Disks 1 2 4
 Heads (read/write) 2 4 8
 Bytes/sector 512
 Seek time Track to track Read: 0.2 ms (typ.) /

Write: 0.4 ms (typ.)

 Average Read: 3.4 ms (typ) / Write: 3.9 ms

(typ)

 Full track Read: 8.0 ms (typ) / Write: 9.0 ms

(typ)

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 Average latency time 2.00 ms
 Rotational speed (RPM) 15,000

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 Areal density 112.8 Gbits/sq. in.
 Data transfer To/from media 179MB/sec rate

To/from host SAS: 3Gb/sec, SCSI: 320MB/sec,
FCAL: 4Gb/sec

 Recording code 60/62 MEEPRML
 Interface Dual Port SAS (RC Series), SCA-2

80Pin (NC Series), 68Pin Wide (NP Series),
Dual Port FCAL (FC series)

 Head positioning method Rotary VCM
 Start time 30 s (typ)
 Stop time 30 s (typ)
 Buffer size SCSI 8 MB
 SAS, FC 16 MB

Physical Specifications

 Power Voltage 5 V ± 5%, 12 V ± 5%

requirements Spin-up 12 V ± 5% @ 2.5 A
(peak)

 A (peak < 100 us)
 5 V ± 5% @ 0.8 A
 Idle (typ.) SAS 12.8 W
 SCSI 12.4 W
 FC 13.4 W
 Dimensions (HxWxD) 25.4 mm x 101.6 mm x

146.0 mm

 Weight 800 g
 Ambient Operating 5°C to 55°C (HDD surface

60°C max) temperature Non-operating -40°C to
70°C

 Gradient 20°C/Hour (max)
 Relative Operating 5% to 95% (non-

condensing)

 humidity Non-operating 5% to 95% (non-

condensing)

 Max. wet bulb 29°C (operating)
 Vibration Operating 0.6 mm (5 to 20 Hz) / 1.0

G (20 to 300 Hz)

 Non-operating 3.1 mm (5 to 20 Hz) / 5.0 G (20

to 300 Hz)

 Shock Operating 65 G max. (2 ms)

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 Non-operating 250 G max. (2 ms)
 Altitude Operating 3,048 m (max.) (operation)

Non-operating 12,192 m (max.)

 Acoustic Noise (idle sound power) (typ.) </=

3.6 bels (idle)

Reliability Specifications

 Mean time between failures (MTBF) 1,400,000

hours

 Error rates Unrecoverable errors 1 per 1015

bits read

 Seek errors 10 per 108 seeks

6.2 Power Management

Modern motherboards provide Advanced
Configuration and Power Management
Interface (ACPI) settings such as wake-up,
power button function and standby/suspend
timers. These functions are configured in the
CMOS Setup. (Section 8-4 BIOS Setup).

6.2.1 Power Supply

Two 300W DC power supply modules are
supplied.

 One 300W DC module will supply power solely

to the .backplane ATX connector.

 The second 300W DC module will supply all

other power requirements. Including power
supply to auxiliaries such as: Fans, HD, etc.

Figure 6-17 Zippy Power Supply

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6.2.2 Power Supply Components

Output Wattage

 300W.

Dimension

 225.00x100.00x40.50mm.
 8,85x3.94x1.59‖ inch.

DC Input Spec

 Voltage: DC20V~28V
 Input Current: 20.0A (RMS) for 24VDC.

Inrush Current: 20.0A Max.

 Temperature range: operating 10℃～40℃.
 Humidity:operating:20%-95%, non-

operating:10%-95%.

 Remarks: 85% is normal condition and 95% is

with special coating process.

 Hold up time1.6ms minimum at full load &

nominal input voltage.

 Dielectric withstand: input/output 1500 vac for

1 second.

 Input to frame ground 1500 vac for 1 second.
 Efficiency: 65% typical at full load*power good

signal: on delay 100ms to 500ms.

 Overload Protection：130±20%.
 Over Voltage Protection: +5v→5.5v～7.0v ,

+3.3v→4.0v～4.5v.

 Short Circuit Protection: +5v、+12v、+3.3v.
 Emi Noise Filter :fcc class a, cispr22 class a.
 Safety : ul 60950, csa 22.2 iec60950, tuv

en60950.

 Remote on/off Control.
 The unit shall accept a logic open collector

level which will disable/enable all the output
voltage (exclude +5v stand by).

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 As logic level is low, outputs voltage were

enabled.

 As logic level is high, outputs voltage were

disabled.

 Cooling :two 40mm dc fans.

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6.3 COTS 28 Vin Filter

Figure 6018 Vin Filter

The M-FIAM5 is a DC front-end module
that provides EMI filtering and transient
protection. The M-FIAM5 enables designers
using Vicor’s Maxi, Mini, Micro Series 24 V
DC-DC converters to meet conducted
emission/ conducted susceptibility per
MIL-STD-461E; and input transients per
MIL-STD-704E/F. The M-FIAM5 accepts an
input voltage of 14 – 36 Vdc and delivers
output current up to 20 A.

6.3.1 Vin Filter Features

• Transient protection-MIL-STD-704E/F.

• Environments-MIL-STD-810, MIL-STD- 202.

• Environmental stress screening.

• Low profile mounting options.

• Output current up to 20 A.

• Mini sized package.

• Inrush current limiting.

• Reverse polarity protection.

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Chapter 3

Procedures.

Electronically distributed. Subject to user discretion when printed.

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7 Procedures

The procedures within this Chapter contain
relevant information to ensure the SV-4102­X214 maintains its maximum performance
potential.

7.1 SV-4102-X214 Startup

1. Check to make sure that all the cables are

seated and connected correctly to the back of
the unit such as keyboard, mouse, monitor
video cable and both power cables.

2. Then Press the power switch ON to start the

computer (power switch is located in the front
of the unit)

3. Once the unit starts, System will go thru Power

On self Test (POST) (no action is required at
this time)

4. At windows dialog box press Ctrl+Alt+Delete

at once to login

5. Type in the correct user name and password

and then press enter to login

6. Once the operator is logged on to the unit they

could use the computer as they wish.

NOTE: Assuming the SV-4102-X214is not
connected to any network.

7.2 SV-4102-X214 Shutdown

1. The operator needs to save all data, and then

close all applications.

2. Once all data is saved and applications are

closed, click on Start menu, select shutdown
and then click OK to shutdown the computer.

NOTE: Holding down the front panel “on”

switch for two (2) seconds shuts down the
machine it does not save files. This is an

immediate power off switch.

7.2.1.1 Passwords

In most cases a user (startup) password and a
supervisor (setup) password can be set in the

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CMOS. When a Setup password is required,
the computer will prompt for it when you try to
access the BIOS setup. When a Startup
password is configured, the computer will
prompt for it at every startup.

The CMOS password can be reset by shorting
the "CMOS restore to factory defaults jumper"
or by temporarily removing the CMOS battery.

8 Identifying Server Components Using Device Manager

The Device Manager is one of Windows' most
useful diagnostic tools. It lets you see all of the
devices attached to your computer, and which
resources they are each using. To access the
Device Manager do the following:

1. Click Start, point to Settings, and then click

Control Panel. (Figure 8-1).

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Figure 8-1 Control Panel

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2. Double-click the System icon. (Figure 8-2).

Figure 8-2 System Properties

3. Click the Hardware tab, and then click the

Device Manager button. (Figure 8-3).

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Figure 8-3 Device Manger

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After opening Device Manager, you will see a
list of all the devices Windows detected on
your system. The Device Manager display is
recreated each time the computer is started, or
whenever a dynamic change to the computer
configuration occurs, such as addition of a new
device while the system is running.

NOTE: To include hidden devices, on the
View menu, click Show hidden devices. A
check mark next to Show hidden devices
indicates hidden devices are showing.
Click it again to clear the check mark.
Hidden devices include non-PnP devices
and devices that have been physically
removed from the computer but have not
had their drivers uninstalled.

The devices shown represent the computer's
current hardware configuration information.
Any non-functioning devices are displayed with
an exclamation point, indicating that a problem
exists with the device; disabled devices are
displayed with a small red "x" over the icon.

You can use Device Manager to enable or
disable devices, troubleshoot devices, update
drivers, use driver rollback, and change
resources such as interrupt requests (IRQs)
assigned to devices.

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8.1 Working with Device Properties

To display a device's properties do the
following:

1. Access the Device Manager as described in

steps 1 through 3. (Figure 8-4).

Figure 8-4 Device Manager

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2. In the Device manager dialog box (Figure4-4\),

double-click the device, or select the device
and then click the Properties toolbar button.
(Figure 8-5).

Figure 8-5 Properties Dialog Box

In the device's Properties dialog box, there
might be several tabs. You can view the status
and configuration information, as well as the
device manufacturer, device type, and location
in the upper portion of the General tab.

The Device status box in the middle of the
General tab displays the status of the device,
including any errors. If the device has any
problems, the Device Status box briefly
describes the problem, and usually describes
the appropriate course of action to correct the
problem.

3. Click Troubleshoot... to use the built-in

mechanisms for detecting the nature of the
problem.

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Other tabs include the Driver tab, which
displays the details of the driver being used.
This tab also lets you update or uninstall the
driver. The Resources tab displays the
hardware resources being used. This tab
allows you to see and resolve any conflicts
caused by non-PnP devices. Along with these
tabs, some devices have additional advanced
settings or tabs for device-specific settings.

8.2 Installing and Removing Hardware in Windows

Plug and Play (PnP) is a standard that makes
installing new hardware devices easier. Prior to
PnP, installing new hardware meant finding
and installing peripheral drivers and making
sure the new device didn't conflict with another
device. Theoretically, if you have a computer
designed for PnP and are using a PnP
operating system (like Windows), installing a
printer, sound card, modem, or other peripheral
is a simple matter of plugging in the device.

It's not always quite this simple. Assuming you
are using a PnP computer, when you attach a
PnP device, you may see a message indicating
that Windows has recognized the new device­either immediately or the next time you start up
your system. If Windows needs a driver that is
not currently installed, you may at that point be
asked to insert a disk or the Windows CD­ROM. If you don't see a message but the
device appears to be working, you can assume
that everything is fine.

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8.2.1 Using the Add New Hardware Wizard

If the device is not working properly, try using the
Add New Hardware Wizard. To run this wizard, do
the following:

1. From the Start menu, point to Settings and then

click Control Panel. (Figure 8-6).

Figure 8-6 Control Panel

2. Double-click the Add Hardware icon. (Figure

8-7).

Figure 8-7 Add Hardware Wizard

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8.3 Installing Legacy Peripherals

When you install what Microsoft calls a legacy
peripheral, you will need to use the Add
Hardware Wizard, as described to let Windows
know about the new device.

NOTE: The term legacy refers to anything
that's no longer on the cutting edge.

8.3.1 Removing Legacy Peripherals

When removing a legacy peripheral from your
system, you need to let Windows know that the
device is gone. This enables Windows to reuse the
resources (places in memory and internal
communications channels) that it previously
allocated to that device.

To tell Windows that you have removed a legacy
device, perform the following steps:

1. From the Start menu, point to Settings and then

click Control Panel. (Figure 8-8).

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Figure 8-8 Control Panel

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2. Double-click the System icon. (Figure 8-9).

Figure 8-9 System Properties

3. Click the Hardware tab.

4. Click the Device Manager button. (Figure 8-

10).

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Figure 8-10 Device Manager

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5. Click the name of the item you have removed from

your system. If you don't see the item, look for a
category heading that describes the type of device
you removed, and then click the plus sign to its left
to display a list of items in that category.

6. From the Action menu, click Uninstall.

7. Click OK.

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8.4 TAG Approved BIOS

The BIOS (basic input/output system) is the
program stored on the CMOS that the server's
microprocessor uses to get the system started
after you turn it on. The BIOS also manages
data flow between the computer's operating
system and attached devices such as the hard
disk, video adapter, keyboard, and mouse.

CAUTION: The server's hardware and

software was loaded and tested with a
specific "BIOS" version. If you desire to
have the BIOS updated, consult TAG
technical support in advance as updates to
your approved BIOS may cause your
system to become unstable or inoperable.

8.4.1 BIOS Configuration

Enter BIOS by pressing Delete when prompted
in POST. Once the BIOS Configuration Utility
has been entered scroll to the exit tab using
the arrow keys. Under the exit menu option
select ―Load Optimal Defaults‖ when prompted
select OK to load optimal defaults. Scroll back
to the Main menu and ensure that all of the
settings seen in the screenshots below are set.
Upon exit ensure that settings are saved upon
exit.

NOTE: A BIOS update is under review, as soon as that is completed
an addendum to this manual will be dispatched.

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CONTACT

8.4.2

22355 TAG Way
Dulles, VA 20166
Tel: [phone]

www.tag.com

Technical Support

USA 1-800-824-7693
Outside USA

While every precaution has been taken
to ensure the accuracy and completeness
of this literature. TAG assumes
no responsibility and disclaims and liability
for damage resulting from use of this information
or for any errors or omissions.