Samsung NP540U3C, Lotus-13R-TSP Service Manual

NP540U3C

Lotus-13R-TSP

SERVICE

MANUAL

540U3CContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−2

2.3.Comparingproductspecications...............................................................................................2−8

2.4.FunctionofProduct..................................................................................................................2−9

2.5.NewT echnology/ability..........................................................................................................2−13

2.6.Hardware...............................................................................................................................2−31

2.7.Software................................................................................................................................2−38

2.8.SystemSetup(BiosSetup).........................................................................................................2−41

2.9.HW&OptionMaterials............................................................................................................2−48

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem............................................................................................................................3−1

3.2.LCD......................................................................................................................................3−4

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.HardwareTroubleshooting........................................................................................................4−5

4.3.1.LCD.........................................................................................................................4−5

4.3.2.MainSystem..............................................................................................................4−6

4.4.Diagnosisapplication...............................................................................................................4−11

4.5.Bios&MicomUpdate..............................................................................................................4−13

4.6.RTCReset..............................................................................................................................4−14

4.7.BatteryUsetime......................................................................................................................4−15

4.8.CPUF ANControl....................................................................................................................4−16

4.9.SystemDiagnosis....................................................................................................................4−18

4.10.HardwareUpgrade...................................................................................................................4−19

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.BoardComponent....................................................................................................................5−4

iCopyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution

1.Precaution

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales
serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway .

›Ifadefectisfound,repairorreplaceitimmediately .

(Thereisadangerofelectricshockorre)

5)Makesurethatitisproperlygrounded.

(Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

DEVICE
UNDER
TES T

(READING S HOULD)
NOT BE ABOVE 0 .5mA

LEAKAGE
CURR ENT
TES TER

TES T ALL
EXPO SED METAL
SUR FACES

2-WIRE C ORD

*ALSO TE ST WITH
PLUG R EVERS ED
(USING AC ADAPTER
PLUG AS REQUIRED)

EARTH
GRO UND

Figure1.1LeakageCurrentT estCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

Copyright©1995-2012SAMSUNG.Allrightsreserved.1-1

1.Precaution

1.2.SafetyPrecautions

1)EMI

ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitTest(LogicTest)Precautions

TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.

b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.

c)Youmustuseasolderingironwithoutaleakagecurrent.

d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.

e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged.

f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame.

g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.

j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.

k)T akecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.

l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea
multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif
theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto
thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa
metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV ,radioantenna,aluminumwindoworgaspipe,becausethis
doesnotactuallygroundtheproductandmaybedangerous.

Theredboxofeachimageisearthwithoverlapwheninsertingaplugormultiple-tabintothesocket.

Pleasecheckthatitshouldbeputtheoutletcompletely.

Copyright©1995-2012SAMSUNG.Allrightsreserved.1-3

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity .Usinganelectrostaticdischarge(ESD)deviceisveryimportant
forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair
andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)T ouchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic

Electricityfromyourbodybeforehandlingtheparts.

3)T ouchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

1-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

2.Introduction

2.1.ProductFeatures

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-1

2.Introduction

2.2.Specication

Processor*andMotherboard

CPUIntel®IvyBridgeProcessori33217U1.50Hz,3MB

Intel®IvyBridgeProcessori53317U1.70Hz,3MB(Upto2.6GHz)

Intel®IvyBridgeProcessori73517U1.9GHz,4MB(Upto3GHz)-MaxSpec

CacheL3:3~4MB

ChipsetIntelHM76

BIOS64MbitSPIash,upgradeable

ThermalDesign(TDP)MAX.17W

Memory*

MaximumCapacityMAX.12GB(onBD4GB+8GBx1)

Type(MHz)DDR3(1333MHz/1600MHz)

Modules4GB((onBD4GB)

6GB(onBD4GB+2GBx1)

8GB(onBD4GB+4GBx1,Laterintroductionschedule)SODIMM

Sockets1-slotSODIMM&On-board(upto4GB)'1SlotPerMax.8GBSupport'

UpgradeablebyusersYes

※PC3-10600(1333Mhz),PC3-12800(1600Mhz)conrmedthecompatibilitytest.

DisplayandGraphics*

LCD13.3"WithTSP(T ouchScreenPanel:electrostatic,temperedglass)

*Notsupport3Display

Ratio16:9

PanelTN

SurfaceTypeNonGlare

BackLightLED

InterfaceLED

VendorSamsung

Resolution(NumberofPixel)HD(1366x768)Win7Support/Win8Support

(1366X768,1360X768,1280X768,1280X720,1280x600,1024X768,800X

600)

ViewableArea293.42(H)X164.97(V)

ViewingangleHor.+45/-45,V er .+15/-30(typ)

PixelPitch0.2148(H)x0.2148(V)

ContrastRatioMin.300,Typ.400

Brightnesstyp.300(cd/m2)

Colors16.2M

ResponsetimeTyp.16ms,Max.25ms(Rising+Falling=LCDresponsespeed)

GraphicsController11.IntelHDGraphics4000(Internal)

2-2Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

Max.resolutionforVGAMaxresolutionof2560x1600at60Hzat85Hzrefreshrate(ext.)

Supportedresolution(640x480,800x600,1024x768,1152x864,
1280x800,1280x960,1280x1024,1400x1050,1440x900,1600x1024,1600x1200,
1680x1050,1920x1200,1920x1440,2560x1600)

[Ext.monitorresolutionssupportedbyEDIDinformation]

Max.resolutionforHDMISupportv1.4acompliant/aresolutionof1920x1200pixelswith32-bitcolor

at60Hz

Max.ResolutionforLFPLVDSduallinkresolutionof2560X2048perlink/amaximumtheoreticalpixelrate

of224MP/s

(640x480,800x600,1024x768,1152x864,1280x800,1280x960,1280x1024,
1400x1050,1440x900,1600x1024,1600x1200,1680x1050,2560x2048)

[Ext.monitorresolutionssupportedbyEDIDinformation]

Multimedia

SoundHighDenitionAudio

ControllerHDAudioCodec,ALC269Q-VC2-GR

ConversionBuilt-inhighperformance24-bitADC&24-bitDAC

InternalInterfacesEmbeddedstereospeakers,InternalMonoMIC

SpeakerPowerRating2Speakersx2W attwithenclosureeach

ExternalInterfacesHeadphone/MicCombo,NotSupportS/PDIF

ControlsKeyboardvolumecontrol

Camera

Imagesensor1.3MegaCMOSColorImageSensor

StillImageCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240

VideoCaptureResolution1280*1024(Max.),1280*720,800*600,640*480,352*288,320*240

FrameRate30fps@HD,24MHzMCLK

OutputVideoFormatSXGA,HD,SVGA,VGA,CIandQVGA

InterfaceUSB2.0

UVCSupportSupported

Storage*

HardDiskDrive7mmH2.5"HDD,Removable(withExpresscache24GB=iSSDSA T A3)

*9.5mmH2.5"HDDinstallationimpossibility

VendorHITACHI(BA59-03210A)

SupportsSA TAhostcontrollersupport48bitLBA

AverageAccessTime12msec.

InterfaceSA TA2(3.0Gbps)*SATA1Support,SA T A3NotSuppot.

Speed5400rpm

Capacity500GB(Max)

SolidStateDrivemSAT ASSD,Removable

VendorSanDisk(BA59-03232C)

SupportsSA TAhostcontrollersupport48bitLBA

AverageAccessTimeRead:Upto450MB/SWrite:Upto350MB/s

InterfaceSA TA3(6.0Gbps)*SA TA1,2Support.

Speed6.0Gbps

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-3

2.Introduction

Capacity128GB(Max.256GB)

NetworkT ools

LANIntegrated10/100/1000MbpsEthernet

ControllerRTL8111E

VendorRealtek

FeaturesRJ45Output

WirelessLANJacksonPeak22x2Combo(BA59-03294A)*WiDiSupport

Module802.11a/g/n2x2WLANandBT4.0(BLE,BT3.0+HS)

TypeMiniCardhalfsize

InterfaceWLAN(PCI-E),BT(USB2.0)

ChipsetIntelCentrinoAdvanced-N6235

Max.LinkSpeedWi-FiRx/TxThroughput300Mbps(LinkSpeedisonlystandardvalue,Actually

valuewilldecidedbyeachenvironmant)

Antenna2AntennaSupport:WLAN(2Tx/Rx)

WirelessLANAtherosWB225(BA92-08418A)

Module802.11b/g/n1x1WLANandBT4.0(BLE,BT3.0+HS)

TypeMiniCardhalfsize

InterfaceWLAN(PCI-E),BT(USB2.0)

ChipsetAR9485(WLAN)+AR3012(Bluetooth)

Max.LinkSpeedWi-FiRx/TxThroughput150Mbps(LinkSpeedisonlystandardvalue,Actually

valuewilldecidedbyeachenvironmant)

Antenna1AntennaSupport:WLAN(1TX,1RX),BT(1TX/RX)

I/OInterface

MemoryCardReader

-maximumsupportcapacity

3-in-1(SD/SDHC/SDXC)

SD(SDHC+SDXC)

SDHC:32GB

SDXC:1TB

ControllerGL823

VendorGENESY

Vendor

ExpressCardSlotsN/A

I/OPorts

USBPort1XUSB3.0(Chargeable→iphoneRecharge),2XUSB2.0

VGAPortminiVGAAdapter(Option)[BA39-01189A]

AudioJacksHeadPhone-out,MIC-inCombo(4pole)*US,L/R/G/M

WiredLANRJ45

HDMI1xHDMI

SecuritySlotN/A

Power1xDC-injackforACadapter(3Pie)

InputDevices

Keyboard

TypeChicklets

2-4Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

SpecicationTravellength:1.5mm,height:3.9mm,Pitch:19.05mm

Keynumbers80-key(US,KOR,RUS,SEK)81-Key(UK,FRA,GER,SPA,ITA)

NumKeypadN/A

TouchpadStandardTouchpadwith2buttons(withgesturefunction),99.0x53.0

LEDIndicatorPower,AC-in/battery,HDD,WLAN

SecuritySolutions

TPM(Option)TrustedPlatformModule1.2

InterfaceLPC

ControllerSLB9635TT1.2

VendorInneon

ApplicationOmnipass/TPMHostSW

PowerandPowerManagement

Systempowermanagement

PowermanagementfeaturesACPIV2.0compliantS0~S5,C1~C6Mode

Standardbattery

ModelcodeAA-PLWN4AB

TypeLi-Polymer

Detailsofcell4cells

Batterycapacity6890mAh

Batteryrating52Wh

V oltage7.56V

ColorBlack

Dimension265.8*104.11*6mm(WxDxH)

Weightapproximate315g

RechargingTimeapproximate3hours

VendorSDI,Dynapack

ACAdapter

ModelNameAD-4019P(BA44-00279A)

OutputPower40W

Dimension92.5x38.5x27.5mm(WxHxD)

Weight(ACAdapter)175g(Max)

WorldwideCompatibilityAuto-sensing100-240VAC

LineFrequency50/60Hz

AdapterRating-Input100V AC~240V AC,1.0A

AdapterRating-Output19.0VDC/2.1A

SystemDimensions

PyxicalInformation

Dimensions(WXDXH)315.1x218.9x19.9mm

Weight1.64Kg(W/SSD)1.69Kg(W/HDD)

-ConditionFullSystemwith4cellBattery(WithBag:±0.06Kg,WithOutBag:±0.04)

Packagedimensions(WxDxH)AllNationCommon(Withbag)386x136x345mm(Withoutbag)395x330

x82mm

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-5

2.Introduction

Design

LCDBackAluminum

LCDFrontGlass

SystemTopAluminum

SystemBottomPA/GF50%

OS

OperatingsystemWin8

2-6Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

LabelLocation

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-7

2.Introduction

2.3.Comparingproductspecications

2-8Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

2.4.FunctionofProduct

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-9

2.Introduction

2-10Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

Keyboard

Keyboardarrangementandsizecandiffertobyeachcountry.

○:KBDWaterChecksheetLocation

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-11

2.Introduction

2-12Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

2.5.NewTechnology/ability

InnerBattery

※PleaseRefertotheTrainingmanualchapter1.

TPM(Option)

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-13

2.Introduction

2-14Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-15

2.Introduction

2-16Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-17

2.Introduction

USB3.0

2-18Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

iSSD

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-19

2.Introduction

WirelessDisplay

※PleaseRefertotheTrainingmanualchapter1.

2-20Copyright©1995-2012SAMSUNG.Allrightsreserved.

2.Introduction

※PleaseRefertotheTrainingmanualchapter1.

Copyright©1995-2012SAMSUNG.Allrightsreserved.2-21