Samsung DVD-P360/XEL, DVD-P360/FOU, DVD-P360/XEG, DVD-P360/XEH, DVD-P360/XEO Service Manual

...
DVD PLAYER
Chassis : Maxino DVD-P360/
CDM, FOU, SED, XEC, XEE, XEG,
XEH, XEL, XEO, XET, XEU, XTL
DVD-P365/
AFR, AND, CDM, ELT, FOU, HACO,
RAD, SAM, SED, SEO, SMR, TAW, TWN, UMG, XAX, XBG, XEC,
XEE, XEG, XEV, XEH, XEL, XET, XEO, XEU, XFA, XSA, XSE, XSG, XSH, XSS,
XST, XSV, XTL
SERVICE
Œ 37mm With LED Display
´ Zoran Vaddis 882-1 chip solution
ˇ Divx Playback support
¨ 14-bit Video DAC
ˆ Multi-Progressive Scan Video Out
Ø High-Quality Audio
Manual
DVD PLAYER
Merit & Character regarding Product
SERVICE MANUAL
DVD-P360/DVD-P365
ELECTRONICS
© Samsung Electronics Co., Ltd. FEB . 2006
Printed in Korea
AK82-01027A
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.
CONTENTS
1. Precautions 1-1 ~ 1-6
1-1 Safety Precautions (1-1)
1-2 Servicing Precautions (1-3) 1-3 ESD Precautions (1-4) 1-4 Handling the optical pick-up (1-5) 1-5 Pick-up disassembly and reassembly (1-6)
2. Product Specification 2-1 ~ 2-4
2-1 Product Specification (2-1) 2-2 Chassis Product Specification (2-2)
2-3 Option Product Specification (2-3)
3. Alignment and Adjustments 3-1 ~ 3-4
3-1 Location of Test Point (3-1) 3-2 Skew Adjustment (3-2)
4. Disassembly and Reassembly 4-1 ~ 4-10
4-1 Cabinet and PCB (4-1) 4-2 Deck (4-5)
5. Troubleshooting 5-1 ~ 5-12
6. Exploded View and Parts List 6-1 ~ 6-8
6-1 Cabinet Assembly (DVD-P360 Only) (6-2) 6-2 Cabinet Assembly (DVD-P365 Only) (6-4) 6-3 DVD Mechanical Parts (6-6)
7. Electrical Parts List 7-1 ~ 7-8
8. Block Diagrams 8-1 ~ 8-4
8-1 All Block Diagram (8-2) 8-2 ZIC1 (Vaddis 882 Integrated) Block Diagram (8-3) 8-3 FIC1 (FAN8026) Block Diagram (8-4)
9. Wiring Diagram 9-1 ~ 9-2
CONTENTS
10. PCB Diagrams 10-1 ~ 10-6
10-1 Main DVD PCB (10-2) 10-2 Jack PCB (10-4) 10-3 Power key PCB (DVD-P360 Only) (10-6) 10-4 Power key PCB (DVD-P365 Only) (10-6)
11. Schematic Diagrams 11-1 ~ 11-8
11-1 S.M.P.S (Jack PCB) (11-2) 11-2 Front Micom (Jack PCB) (11-3) 11-3 Audio (DVD Main PCB) (11-4) 11-4 AV Decoder (DVD Main PCB) (11-5) 11-5 RF-Servo (DVD Main PCB) (11-6) 11-6 Video (DVD Main PCB) (11-7) 11-7 Power Key (Power Key PCB) (11-8)
12. Operating Instructions 12-1 ~ 12-10
13. Circuit Operating Descriptions 13-1 ~ 13-12
13-1 Power (13-1) 13-2 System Control (13-7) 13-3 DVD Data Processor (13-8) 13-4 Video (13-9) 13-5 Audio (13-10)
14. Reference Information 14-1 ~ 14-12
14-1 Introduction to DVD (14-1) 14-2 DVD-Video Fromat (14-3) 14-3 DivX (DVD-P365 Only) (14-9)
Samsung Electronics 1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer, always make a safety check of the entire instrument, including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing. (1)Protective shields are provided to protect both the technician and the customer. Correctly replace all missing protective shields, including any removed for servicing convenience. (2)When reinstalling the chassis and/or other as­sembly in the cabinet, be sure to put back in place all protective devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and compartment covers/shields, and isolation resistor/capacitor networks. Do not oper­ate this instrument or permit it to be operated with­out all protective devices correctly installed and functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert their fingers and contact a hazardous voltage. Such openings include, but are not limited to, excessive­ly wide cabinet ventilation slots, and an improper­ly fitted and/or incorrectly secured cabinet back cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use an iso­lation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards institute (ANSI) C101.1 Leakage Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instrument’s AC switch first in the ON position and then in the OFF position, measure from a known earth ground (metal water pipe, conduit, etc.) to all exposed metal parts of the instrument (antennas, handle brackets, metal cabinets, screw­heads, metallic overlays, control shafts, etc.), espe­cially any exposed metal parts that offer an electri­cal return path to the chassis.
Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the out­let and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated before returning the instrument to the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chas­sis, the reading must be infinite. If the reading is not within the limits specified, there is the possibil­ity of a shock hazard, and the instrument must be repaired and rechecked before it is returned to the customer. See Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
DEVICE UNDER
TEST
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE CURRENT
TESTER
EARTH
GROUND
TEST ALL
EXPOSED METER
SURFACES
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
2-WIRE CORD
Antenna Terminal
Exposed Metal Part
ohm
ohmmeter
Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety re­lated notes on or inside the cabinet, or on the chas­sis.
3) Design Alteration Warning-Do not alter or add to the mechanical or electrical design of this instru­ment. Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the user. Any design alterations or additions will make you, the servicer, responsible for personal injury or property damage resulting therefrom.
4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas: (1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch ther­mally hot parts), (3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or frayed wiring, Do not change spacing between a component and the printed-circuit board. Check the AC power cord for damage.
5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with components, parts and/ or wiring that meet original specifications. Additionally, determine the cause of overheating and/or damage and, if necessary, take corrective action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechani­cal parts have special safety-related characteristics which are often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have spe­cial safety characteristics are identified by shading, an ( )or a ( )on schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might create shock, fire and/or other hazards. Product safety is under review con­tinuously and new instructions are issued whenev­er appropriate.
Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing units covered by this service manual and its supplements, read and follow the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety pre­cautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving or reinstalling any component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or other electrical connection, (3) connecting a test substitute in parallel with an electrolytic capaci­tor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-
locks with which instruments covered by this service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all solid-state device heat sinks are correctly in­stalled.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connect­ing the test instrument positive lead. Always remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servic­ing, follow the printed or indicated service precau­tions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength. When replacing components, use components which have the same ratings. Components identi­fied by shading, by( ) or by ( ) in the circuit dia­gram are important for safety or for the characteris­tics of the unit. Always replace them with the exact replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heat­ing components. Install such elements as they were.
(5) After servicing, always check that the removed
screws, components, and wiring have been in­stalled correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plug and accessible conductive parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resi­stance meter (500V) to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible conductive parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal pan­els, input terminals, earphone jacks, etc.
Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be dam­aged easily by static electricity. Such components commonly are called Electrostati­cally Sensitive Devices(ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available dis­charging wrist strap device, which should be removed for potential shock reasons prior to apply­ing power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conduc­tive surface such as aluminum foil, to prevent elec­trostatic charge buildup or exposure of the assem­bly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as “anti-static” can generate electrical charges suffi­cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your are ready to install it.(Most replacement ESD devices are packaged with leads electrically short­ed together by conductive foam, aluminum foil or comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device, touch the protective material to the chassis or cir­cuit assembly into which the device will be installed.
CAUTION : Be sure no power is applied to the ch­assis or circuit, and observe all other safety precau­tions.
(8) Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise harm­less motion such as the brushing together of your clothes fabric or the lifting of your foot from a car­peted floor can generate static electricity sufficient to damage an ESD device).
Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec­trostatic breakdown because of potential static elec­tricity from clothing and your body.
The following method is recommended. (1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static sources to touch the unit.
Be sure to put on a wrist strap grounded to the
sheet.
Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the Pick­Up. (The short terminal is shorted when the Pick­Up Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-
nal on the PCB.
THE UNIT
WRIST-STRAP FOR GROUNDING
1M
1M
CONDUCTIVE SHEET
Precautions
1-6 Samsung Electronics
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1) Remove the power cord.
2) Disassemble the Deck-Assy.
3) Make solder land 2 points short on Pick-up. (See Fig. 1-4)
4) Disassemble the Pick-up.
1-5-2 Assembly
1) Replace the Pick-up.
2) Remove the soldering 2 points on Pick-up.
3) Reassemble the Deck-Assy.
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
PICK-UP ASS'Y
SOLDER LAND 2 POINTS SHORT
Fig. 1-4
Samsung Electronics
2-1
2. Product Specification
2-1 Product Specification
* : Nominal specification
Power Requirements AC110-240V, 60/50Hz
Power Consumption 9W
General
Weight 1.7Kg
Dimensions 430mm (W) x 205mm (D) x 37mm (H)
Operating Temperature Range +5°C to 35°C
Operating Humidity Range 10% to 75%
DVD
Reading Speed : 3.49 ~ 4.06m/sec.
(Digital Versatile Disc)
Approx. Play Time
(Single Sided, Single Layer Disc) : 135min.
CD : 12Cm Reading Speed : 4.8 ~ 5.6m/sec.
Disc (Compact Disc) Maximum Play Time : 74min.
CD : 8cm Reading Speed : 4.8 ~ 5.6m/sec.
(Compact Disc) Maximum Play Time : 20min.
VCD : 12Cm
Reading Speed : 4.8 ~ 5.6m/sec.
Maximum Play Time : 74min. (Video+Audio)
Composite Video 1 channel ; 1.0Vp-p (75Ω load)
Component Video Y: 1.0 Vp-p (75Ω load)
Pr: 0.70 Vp-p (75Ω load)
Video Output
Pb: 0.70 Vp-p (75Ω load)
S-Video
Luminance Signal : 1.0Vp-p (75Ω load)
Chrominance Signal : 0.3Vp-p (75Ω loa)
2 Channel L(1/L), R(2/R)
*Ferquency Response
48KHz Sampling : 4Hz to 22KHz
Audio Output
96KHz Sampling : 4Hz to 44KHz
*Dynamic Range 100dB
Product Specification
2-2
Samsung Electronics
2-2 Chassis Product Specification
Compatibility
Video
Audio
Convenience
Clasification Item DVD-P360/365 DVD-P350/355
DVD, DVD-Audio, CD, SACD, VCD Disc Play O O
DVD-RAM/-R/-RW/+RW(Video Mode) O O
CD-R/-RW O O
Progressive Scan Video O O
108MHz/14 Bit O O
Integrated Audio DAC Down Sampling O
DTS/AC-3 Decoder X X
MP3/WMA Decoder O O
Digital Out (DTS/AC-3) O O
VCD Playback X O
SVCD/CDV CVD 1.0 Not Compatible O
Instant Replay/Skip O O
Kodak Picture CD (JPEG) O O
FRONT DISPLAY LED LED
Description Fig Description Parts No Remark
Product Specification
2-3
Samsung Electronics
Remote
Control
Batteries for
Remote Control
AK59-00054B
AC43-12002H
Model Standard of
DVD-P365/XET
Model Standard of
DVD-P365/XET
S.N.A
Model Standard of
DVD-P365/XET
Model Standard of
DVD-P365/XET
AK68-01006C
AC39-42001R
Owners Instructions
Video/Audio
Cable
2-3 Option Product Specification
Samsung Electronics 3-1
3. Alignment and Adjustment
3-1 Location of Test Point
Fig. 3-1 Location of Test Point
Alignment and Adjustment
3-2 Samsung Electronics
3-2-1 Adjustment Spec. and Test Point
3-2 Skew Adjustment
Test Disc Adjustment Spec. Test Point Adjustment Location
TDV-533 “RF” Screw A / B
Chapter 14 Flat Waveform (Main PCB - Component Side) Ass’y Deck - Top Side
(See Fig. 3-1) (See Fig. 3-2)
Fig. 3-2 Ass’y Deck (Top Side)
Test Disc ; Service not Available
<Table 3-1>
Alignment and Adjustment
Samsung Electronics 3-3
3-2-2 SKEW Adjustment Method
Needed to minimize the variations in Skew of the Pickup unit and to provide optimum match with the recorded signal on the Disc.
1) Connect an Oscilloscope to the “RF” (See Fig. 3-1).
2) Connect Power, Open the Tray and Play the Ch.14 whish is in the TDV-533 Disc.
Set the Oscilloscope Range as follows :
(Voltage ; 20mV/Div., Frequency ; 10m Sec.)
3) Adjust the Screws “A” and “B” (See Fig. 3-2) using a Hex screwdriver until you obtain a Flat Waveform and the picture is stable. Then, go to Chapter 1 and make sure the Waveform is Flat here as well. If not, you have to go back to Chapter 14 and adjust again. If you cannot obtain a Flat waveform, then the unit is defective.
Note : The Deck must be in a horizontal position. Use both “A” and “B” screws to adjust.
    

      
Typical Waveform before Adjustment Waveform after Correct Adjustment
Fig.3-3 Envelope Waveform
Samsung Electronics
4-1
4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-1-1 Top Cabinet Removal
1) Remove 3 Screws Œ the back Top Cabinet.
2) Lift up the Top Cabinet in direction of arrow.
3 SCREWS
Fig. 4-1 Top Cabinet Removal
Note : Reassembly in reverse order.
4-2
Samsung Electronics
Disassembly and Reaasembly
2 HOOKS
1 HOOK
2 HOOKS
1 HOOK
Ass’y Front-Cabinet
Fig.4-2 Ass’y Front-Cabinet Removal
4-1-2 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ ¨ and Remove the Ass’y Front-Cabinet ˆ.
Disassembly and Reaasembly
Samsung Electronics
4-3
ASS'Y-DECK
FLAT-CABLE
3 SCREWS
4-1-3 Ass’y Deck Removal
1) Disconnect Flat-Cable from DCN1, DCN2 on Main PCB.
2) Remove 3 Screws Œ from the Ass’y Deck ´ and lift it up.
Fig. 4-4 Ass’y Deck Removal
4-4
Samsung Electronics
Disassembly and Reaasembly
3 SCREWS
Jack PCB
¨
ˆ
Main PCB
Power key PCB
6 SCREWS
´
Fig. 4-5 Main PCB, Power Key PCB and Jack PCB Removal
4-1-4 Main PCB, Power Key PCB and Jack PCB Removal
1) Remove 6 Screws Œ from the Main PCB ´, Power key PCB ˇ and lift it up.
2) Remove 3 Screws ¨ from the Jack PCB ˆ and lift it up.
Disassembly and Reaasembly
Samsung Electronics
4-5
4-2 Deck
4-2-1 Holder Chuck Removal
1) Push 4 Hooks Œ in the direction of arrow “A” and lift up the Holder Chuck ´.
Fig. 4-6 Holder Chuck Removal
´ HOLDER CHUCK
Œ 2 HOOKS
Œ 2 HOOKS
"A"
"A"
4-6
Samsung Electronics
Disassembly and Reaasembly
4-2-2 Tray Disc Removal
1) Insert a Screw Driver Œ into Emergency Hole ´ and push the Slider Housing ˇ in the direction arrow “A”.
2) When the Tray Disc ¨ comes out a little, pull it in the direction arrow “B” by hand.
Fig.4-7 Tray Disc Removal
ˇ SLIDER HOUSING
¨ TRAY DISC
Œ SCREW DRIVER
´ EMERGENCY HOLE
"B"
"A"
Disassembly and Reaasembly
Samsung Electronics
4-7
4-2-3 Assy P/U Deck Removal
1) Remove the 4 Soldering Œ (SL+, SL-, SP+, SP-).
2) Remove the 1 Screw ´ and lift up the Ass’y P/U Deck ˇ
Fig. 4-8 Assy P/U Deck Removal
´ 1 SCREW
ˇ ASS'Y P/U DECK
¨ CHASSIS SUB
Œ 4 SOLDERING
<Assembly Point>
SL - (BLK)
SP - (BLK)
TM - (BLK)
TM + (BLK)
SL + (RED)
SP + (RED)
4-8
Samsung Electronics
Disassembly and Reaasembly
4-2-4 Ass’y Housing Removal
1) Remove the 2 Soldering Œ. (TM+, TM-)
2) Push the 2 Hooks ´ in the direction of arrow “A” and remove Ass’y PCB Deck ˇ.
3) Push the Slider Housing ¨ in the direction arrow “B”.
4) Push the 1 Hook ˆ in the direction of arrow “C” and lift up the Slider Housing ¨.
5) Remove the Belt Pulley Ø and 2 Screws , Ass’y Motor Load ”.
6) Push the 1 Hook in the direction of arrow “D” and lift up the Gear Pulley ˝, Gear Tray Ô.
Fig. 4-9 Ass’y Housing Removal
"B"
"D"
"A"
"A"
"C"
¨ SLIDER HOUSING
ˇ ASS'Y PCB DECK
Œ 2 SOLDERING
2 SCREWS
Ø BELT PULLEY
Ô GEAR TRAY
˝ GEAR PULLEY
1 HOOK
ˆ 1 HOOK
ASS'Y MOTOR LOAD
´ 2 HOOKS
Disassembly and Reaasembly
Samsung Electronics
4-9
4-2-5 Ass’y Bracket Deck Removal
1) Push the Hook Œ in the direction of arrow “A” and lift up the Gear Feed B ´.
2) Push the Hook ˇ in the direction of arrow “B” and lift up the Gear Feed B ¨.
3) Remove the 2 Screws ˆ and lift up Motor Feed Ass’y Ø.
4) Remove the 2 Screws and lift down Motor Spindl Ass’y ”.
5) Remove the 3 Screws and remove 3 Holder Cam Skew ˝, Shaft Pick Up Ô, Ass’y Pick Up .
6) Remove the 1 Screws Ú and remove Gear Back Lash Æ.
Fig. 4-10 Ass’y Bracket Deck Removal
´ GEAR FEED B
¨ GEAR FEED A
ˆ 2 SCREWS
Ø MOTOR FEED
ASS'Y
Ú 2 SCREWS
2 SCREWS
MOTOR SPINDLE
CHASSIS SUB
˝ 3 HOLDER CAM SKEW
3 SCREWS
Ô SHAFT PICK UP
ASS'Y PICK UP
Æ GEAR BACK LASH
"A"
"B"
Œ HOOK
ˇ HOOK
Samsung Electronics 5-1
5. Troubleshooting
No pick-up home positing
Troubleshooting
5-2 Samsung Electronics
No Search Operation
Actual velocity occurs
at ZIC1-201 terminal?
Actual velocity occurs
at FIC1-13, 14 terminal?
Check ZIC1 peripheral circuit.
Check FIC1 peripheral circuit.
No
No
No
Yes
RF SUM signal is OK?
Focus On?
Yes
Yes
A
See "Fine Seek Check"
No
Troubleshooting
Samsung Electronics 5-3
No focus incoming
FIC1-27,28
output are normal?
Check open state from
FIC1 to pick-up.
Check FIC1.
Yes
No
A
Troubleshooting
5-4 Samsung Electronics
FINE SEEK Check
ZIC1-195
output is normal?
FIC1-25, 26(T+, T-)
terminal outputs are normal?
Check RFSUM input from P/U.
Check FIC1 peripheral circuit.
Check DCN1 and P/U.
Yes
Yes
No
No
Troubleshooting
Samsung Electronics 5-5
Abnormal rotation of
disc motor
Input of RF SUM signal is normal?
(ZIC1-157)
SPD output is normal?
(ZIC1-198)
Check ZIC1 peripheral circuit.
FIC1-25 output
is normal?
FIC1-23 signal
MON is "H" ?
Check or replace disc motor.
Check ZIC1.
Check FIC1 soldering and power.
Check RIC1 peripheral
circuit and A, B, C, D.
Yes
Yes
Yes
Yes
No
No
No
No
(SPD Waveform)
Troubleshooting
5-6 Samsung Electronics
No Tray open/close
ZIC1-193, 194 Close End (Open;”L”, Close ; "H") Open End (Open;”H”, Close ; "L")
Check FIC1-11
output at OPEN/CLOSE.
Check signal line state from
FIC1-11 to tray motor.
Check ZIC1 perpheral circuit.
Check FIC1 perpheral circuit.
Yes
Yes
No
No
Loading...
+ 73 hidden pages