Samsung D61B Training Manual

CONTENTS

Precautions Reference Information Specifications Introduction PDP Alignment and Adjustments Troubleshooting Circuit Description Handling Description Glossary Schematic Diagrams

10.

PLASMA DISPLAY TV

Chassis : D61B

ELECTRONICS

Printed in Korea

AA82-01375A

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

1. Precautions

1-1 Safety Precautions

1. Be sure that all of the built-in protective devices are replaced. Restore any missing protective shields.

2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including: nonmetallic control knobs and compartment covers.

3. Make sure that there are no cabinet openings through which people—particularly children—might insert fingers and contact dangerous voltages. Such openings include the spacing between fornt cabinet and back cabinet, excessively wide cabinet

ventilation slots, and improperly fitted back

covers.

4. Leakage Current Hot Check (Figure 1-1): Warning: Do not use an isolation transformer during this test. Use a leakagecurrent tester or a metering system that complies with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters Laboratories (UL Publication UL1950.5.2).

5. With the unit completely reassembled, plug the AC line cord directly into the power outlet. With the unit’s AC switch first in the ON position and then OFF, measure the current between a known earth ground (metal water pipe, conduit, etc.) and all exposed metal parts, including: antennas, handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 3.5 milliamp. Reverse the powerplug prongs in the AC outlet and repeat the test.

Fig. 1-1 AC Leakage Test

6. Antenna Cold Check: With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs. Connect one lead of the ohmmeter to an AC prong. Connect the other lead to the coaxial connector.

7. High Voltage Limits: High voltage must be measured each time servicing is done on the B+, horizontal deflection

or high voltage circuits.

Precautions

Samsung Electronics 1-1

LEAKAGE CURRENT

TESTER

DEVICE UNDER

TEST

TEST ALL

EXPOSED METAL

SURFACES

2-WIRE CORD

ALSO TEST WITH

PLUG REVERSED

(USING AC ADAPTER

PLUG AS REQUIRED)

EARTH

GROUND

(READING SHOULD

NOT BE ABOVE

0.5mA)

Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such as electrical shock and X-rays.

1-2 Safety Precautions (Continued)

8. High voltage is maintained within specified limits by close-tolerance, safety-related components and adjustments. If the high voltage exceeds the specified limits, check each of the special components.

9. Design Alteration Warning: Never alter or add to the mechanical or electrical design of this unit. Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any design changes or additions will void the manufacturer’s warranty.

10. Hot Chassis Warning: Some TV receiver chassis are electrically connected directly to one conductor of the AC power cord. If an isolation transformer is not used, these units may be safely serviced only if the AC power plug is inserted so that the chassis is connected to the ground side of the AC source.

To confirm that the AC power plug is inserted correctly, do the following: Using an AC voltmeter, measure the voltage between the chassis and a known earth ground. If the reading is greater than 1.0V, remove the AC power plug, reverse its polarity and reinsert. Re-measure the voltage between the chassis and ground.

11. Some TV chassis are designed to operate with 85 volts AC between chassis and ground, regardless of the AC plug polarity. These units can be safely serviced only if an isolation transformer inserted between the receiver and the power source.

12. Some TV chassis have a secondary ground system in addition to the main chassis ground. This secondary ground system is not isolated from the AC power line. The two ground systems are electrically separated by insulating material that must not be defeated or altered.

13. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any potential hazards.

14. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and especially the AC and high

voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the AC power cord for damage. Make sure that leads and components do not touch thermally hot parts.

15. Product Safety Notice: Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual inspection. These safety features and the protection they give might be lost if the replacement component differs from the original—even if the replacement is rated for higher voltage, wattage, etc.

Components that are critical for safety are indicated in the circuit diagram by shading, ( ) or ( ).

Use replacement components that have the same ratings, especially for flame resistance and dielectric strength specifications. A replacement part that does not have the same safety characteristics as the original might create shock, fire or other hazards.

Precautions

1-2 Samsung Electronics

1-3 Servicing Precautions

1. Servicing precautions are printed on the cabinet. Follow them.

2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in parallel with an electrolytic capacitor.

3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used. The internal wiring is sometimes clamped to prevent contact with thermally hot components. Reinstall all such elements to their original position.

4. After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that the portion around the serviced part has not been damaged.

5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal panels, input terminals and earphone jacks).

6. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all solid-state heat sinks are correctly installed.

7. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead; always remove the instrument’s ground lead last.

8. Plasma display panels have partial afterimages when a same picture continues to be displayed for a certain time. This happens due to the degradation of brightness caused by a scale-down effect. To prevent such afterimages when displaying a same picture for a certain time, be sure to reduce the level of brightness and contrast. ex) Contrast : 50 or 75, Brightness : 25

9. Plasma display is an array of pixels(cells). Therefore, if at least 99.9% pixels keep normal, the appropriate panel is judged as ‘approved product.’ Even though some of pixels keep luminescent or always light off, do not worry because the panel is approved.

Precautions

Samsung Electronics 1-3

Warning 1 : First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a

conflict between the servicing and safety precautions, always follow the safety precautions.

Warning 2 : An electrolytic capacitor installed with the wrong polarity might explode.

1-4 Precautions for Electrostatically Sensitive Devices (ESDs)

1. Some semiconductor (“solid state”) devices are easily damaged by static electricity. Such components are called Electrostatically Sensitive Devices (ESDs); examples include integrated circuits and some field-effect transistors. The following techniques will reduce the occurrence of component damage caused by static electricity.

2. Immediately before handling any semicon ductor components or assemblies, drain the electrostatic charge from your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it prior to applying power— this is an electric shock precaution.)

3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent accumulation of electrostatic charge.

4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static”; these can accumulate sufficient electrical charge to damage ESDs.

7. Do not remove a replacement ESD from its protective package until you are ready to install it. Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum foil or other conductive materials.

8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material to the chassis or circuit assembly into which the device will be installed.

9. Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Precautions

1-4 Samsung Electronics

CAUTION

These servicing instructions are for use by qualified service personnel only. To reduce the risk of electric shock do not perform any servicing other than that contained in the operating instructions unless you are qualified to do so.

Reference Information

Samsung Electronics 2-1

2. Reference Information

2-1 Tables of Abbreviations and Acronyms

A Ah Å dB dBm

°C °F °K F G GHz g H Hz h ips kWh kg kHz kΩ km km/h kV kVA kW I MHz

Ampere Ampere-hour Angstrom Decibel Decibel Referenced to One Milliwatt Degree Celsius Degree Fahrenheit degree Kelvin Farad Gauss Gigahertz Gram Henry Hertz Hour Inches Per Second Kilowatt-hour Kilogram Kilohertz Kilohm Kilometer Kilometer Per Hour Kilovolt Kilovolt-ampere Kilowatt Liter Megahertz

MV MW MΩ m µA µF µH µm µs µW mA mg mH mI mm ms mV nF

Ω

pF Ib rpm rps s V VA W Wh

Megavolt Megawatt Megohm Meter Microampere Microfarad Microhenry Micrometer Microsecond Microwatt Milliampere Milligram Millihenry Milliliter Millimeter Millisecond Millivolt Nanofarad Ohm Picofarad Pound Revolutions Per Minute Revolutions Per Second Second (Time) Volt Volt-ampere Watt Watt-hour

Table 2-1 Abbreviations

Reference Information

2-2 Samsung Electronics

Table 2-2 Table of Acronyms

ABL AC ACC AF AFC AFT AGC AM ANSI APC APC A/V AVC BAL BPF B-Y CATV CB CCD CCTV Ch CRT CW DC DVM EIA ESD ESD FBP FBT FF FM FS GND G-Y H HF HI-FI IC IC IF

Automatic Brightness Limiter Alternating Current Automatic Chroma Control Audio Frequency Automatic Frequency Control Automatic Fine Tuning Automatic Gain Control Amplitude Modulation American National Standards Institute Automatic Phase Control Automatic Picture Control Audio-Video Automatic Volume Control Balance Bandpass Filter Blue-Y Community Antenna Television (Cable TV) Citizens Band Charge Coupled Device Closed Circuit Television Channel Cathode Ray Tube Continuous Wave Direct Current Digital Volt Meter Electronics Industries Association Electrostatic Discharge Electrostatically Sensitive Device Feedback Pulse Flyback Transformer Flip-Flop Frequency Modulation Fail Safe Ground Green-Y High High-Frequency High Fidelity Inductance-Capacitance Integrated Circuit Intermediate Frequency

I/O L L LED LF MOSFET MTS NAB NEC NTSC OSD PCB PLL PWM QIF R RC RF R-Y SAP SAW SIF SMPS S/N SW TP TTL TV UHF UL UV VCD VCO VCXO VHF VIF VR VTR VTVM TR

Input/output Left Low Light Emitting Diode Low Frequency Metal-Oxide-Semiconductor-Field-Effect-Tr Multi-channel Television Sound National Association of Broadcasters National Electric Code National Television Systems Committee On Screen Display Printed Circuit Board Phase-Locked Loop Pulse Width Modulation Quadrature Intermediate Frequency Right Resistor & Capacitor Radio Frequency Red-Y Second Audio Program Surface Acoustic Wave(Filter) Sound Intermediate Frequency Switching Mode Power Supply Signal/Noise Switch Test Point Transistor Transistor Logic Television Ultra High Frequency Underwriters Laboratories Ultraviolet Variable-Capacitance Diode Voltage Controlled Oscillator Voltage Controlled Crystal Oscillator Very High Frequency Video Intermediate Frequency Variable Resistor Video Tape Recorder Vacuum Tube Voltmeter Transistor

Specifications

Samsung Electronics 3-1

3. Specifications

MODEL

Display Display

Screen Size

Voltage

Power Consumption

Number of Pixels

External Control

AUDIO Input

AUDIO Output

VIDEO Input

VIDEO Output

Dimensions

Weight

PPM42S3Q 1027(W) x 79(D) x 630.5(H) mm / 40.43(W) x 3.11(D) x 24.82(H) inches 31 Kg / 68.34 lbs (without stand) 107 Cm / 42 Inches AC 120V, 60Hz / AC100-250V, 50/60Hz 330 Watts 852(H) X 480(V) RS-232C IN(Mini jack), RS-232C OUT(D-SUB 9P)

VIDEO / S-VIDEO COMPONENT 1 COMPONENT 2 RGB(PC) 1/2 DVI

External Speaker (10W+10W) Audio Output (L/R RCA)

VIDEO S-VIDEO COMPONENT 1 - 480i / 480p / 720p / 1080i COMPONENT 2/RGB2(PC) IN (BNC, 5P, 480i~1080i, VGA~XGA) RGB1(PC1) - D-SUB 15P DVI

Monitor Output (RCA)

3-2 Samsung Electronics

MEMO

4. Introduction PDP

4-1 Cell Structure of PDP

Introduction PDP

Bus electrode

Dielectric

Barrier

Front panel

ITO electrodeMgO layer

Phosphors

Address

Electrode

Samsung Electronics 4-1

Back panel

Y480

～

∫

A2 A3 A4 A5

A6 A7

- A1,A2,,,:AddressElectrode

- Y1,Y2,,,:Scan&SustainElectrode

- X : Common & Sustain Electrode

4-2 Electrode arrangement of SD PDP

4-2

Samsung Electronics

Introduction PDP

•

Electrode covered with dielectric

•

dielectric limits current

•

emission from both side

PDP

X Y

Y – X

Making of Voltage

(Over Vf)

Y – X

Making of Voltage

(Over Vf)

Discharge

(Discharge Current)

Discharge

(Discharge Current)

X Y

－

＋

－

＋

－

＋

X Y

－－－＋＋＋

Wall Charge

(Stop Discharge)

Wall Charge

(Stop Discharge)

4-3 Discharge in AC PDP

Samsung Electronics

4-3

Introduction PDP

－

Seed electron

E-Field

Seed Electron : After seed electron generated in

discharge space,it is accelerated by Electric field

Seed Electron : After seed electron generated in

discharge space,it is accelerated by Electric field

－

＋

Electron and Ion are generated by collision

Between accelerated Electron and neutrality particle.

Electron and Ion are generated by collision

Between accelerated Electron and neutrality particle.

＋

－

＋

－

＋

Many Electrons and Ions are generated continuously

by collision.

It is end of first Discharge.

Many Electrons and Ions are generated continuously

by collision.

It is end of first Discharge.

4-4 Discharge Mechanism - Process

4-4 Samsung Electronics

Introduction PDP

secondary electron

E-Field

－

＋

When Ion conflict with Cathode, it is generate

Electron.

(A coefficient of 2

electron emission)

When Ion conflict with Cathode, it is generate

Electron.

(A coefficient of 2

electron emission)

Electron and ion are generated from 2

electron’s

acceleration and confliction.

Electron and ion are generated from 2

electron’s

acceleration and confliction.

Many Electrons and Ions are generated

Continuously by collision.

Many Electrons and Ions are generated

Continuously by collision.

＋

－

＋

－

＋

－

＋

－

＋

－

＋

4-5 Discharge Mechanism - Process

Samsung Electronics

4-5

Introduction PDP

Repeat of α-process and β-process

→ Space insulation break down by

increasing current

→ Discharge

Self-sustained discharge

Paschen Curve

- Start voltage of Discharge

(Vf : Minimum voltage for discharge)

display a curve line of pressure

* A function of an electrode distance.

* Discharge Mechanism & Delay

Repeat of α-process and β-process

→ Space insulation break down by

increasing current

→ Discharge

Self-sustained discharge

Paschen Curve

- Start voltage of Discharge

(Vf : Minimum voltage for discharge)

display a curve line of pressure

* A function of an electrode distance.

* Discharge Mechanism & Delay

4-6 Paschen Curve

4-6

Samsung Electronics

Introduction PDP

Samsung Electronics 4-7

4-7 Wall Charge

Vw1+Vex

Vw1

X Y

Discharge

Start

Discharge

Start

Vex

XY XY

It is displayed differential discharge characteristics about same pulse by Wall Charge. : enable a picture

Discharge

Vex -Vw2

Vw2

XY XY

+++

---

+++

---

+++

---

+++

---

4-8 Samsung Electronics

4-8 Process of sustain discharge

Vex

X Y

Vex

X Y

Vw1+Vex

X Y

Vw1

Vex

X Y

Vex-Vw2

Vw2

X Y

Vw2+Vex

Vex

X Y

Make wall charge

Input electric field

Discharge

Sustain discharge

Extinction of discharge

(Wall charge Shield)

Make wall charge

Extinction of discharge

(Wall charge Shield)

Make wall charge

Input electric field

Discharge

Sustain discharge

+++

---

+++

---

+++

---

Introduction PDP

Samsung Electronics 4-9

4-9 1Sub-field Image Process - ADS

Reset

Address

Sustain

Function

Sustain Erase

W all Charge Set

Issue

Operation margi n Contrast Short Time

Function

us tain Erase

Wall Charge Set

Issue

Operation margin Contrast Short Time

Function

Select On Cell

Issue

High Speed

Low Voltage

Low Failure

Function

Select On Cell

Issue

High Speed

ow Voltage

Low Failure

Function

Discharge On Cell

Issue

H igh Efficiency

Low V oltage

ERC Performance

Function

Discharge On Cell

Issue

High Efficiency

Low Voltage

ERC Performance

. .

4-10 1 Sub-field Precess - Reset

4-10 Samsung Electronics

4-11 1Sub-field Process - Address 1

4-12 1Sub-field Process - Address 2

Introduction PDP

Samsung Electronics 4-11

4-13 1Sub-field Process - Address 3

4-14 1Sub-field Process - Address 4

Introduction PDP

4-12 Samsung Electronics

4-15 1Sub-field Process - Address 5

4-16 1Sub-field Process - Address 6

Introduction PDP

Samsung Electronics 4-13

4-17 1Sub-field Process - Address 7

4-18 1Sub-field Process - Address 8

Introduction PDP

4-14 Samsung Electronics

4-20 1Sub-field Process - Sustain

4-19 1Sub-field Process - Address 9

Introduction PDP

Samsung Electronics 4-15

4-21 Frame Structure - ADS

SF1 SF2 SF3 SF4 SF5 SF6 SF7 SF8

1 ..

...

480

128T64T32T16T8T4T2T1T

1TV field (time)

scan line

address sustain

sub-field

Reset

Period

Address

Period

Sustain

Period

X Y1

Y2 Yn

SF1 SF2 SF3 SF4 SF5 SF6 SF7 SF8

...

480

128T64T32T16T8T4T2T1T

1TV field (time)

scan line

address

sustain

sub-field

Introduction PDP

4-22 Picture Structure by 8 sub-field

4-16

Samsung Electronics

Introduction PDP

Samsung Electronics 4-17

Reset Period

Sustain elimination discharge

a. Very thin Pulse elimination method b. full width Pulse elimination method c. Self-erase elimination method d. Infirm discharge elimination method

Wall Charge Set-up for Address

: Actually, made wall charge profit of Ramp or RC pulse by infirm discharge

Contrast

: To make Back Ground bright interference Contrast

Drive Margin

Address Period

Based action : An address electrode and with a Y-electrode between generate discharge,

Selected cell and not selected cell by Sustain Pulse have different characteristic with wall charge

Write Address / Erase Address

Non Address Failure

: Address Pulse -Scan Pulse potential difference & Scan width a design

High speed Addressing

: It is important technique for high resolution, high brightness, low cost

Discharge delay reduction by discharge condition improvement and drive waveform

Low voltage Address

: It is profitable of cost down by reduce resisting pressure Driver IC.

Sustain Period

Pulse form

: Input alternation pulse to X-electrode and Y-electrode

Reality picture realizable sustain discharge

: It is decide sustain discharge of wall charge difference separated with a cell between

by address discharge

Sustain drive Margin

a. Drive of sustain discharge : decided by Panel s Vs value b. The first stage drive : Reset discharge / Made Wall Charge selectivity by Address

discharge and panel s Vf

Efficiency improve

: It is many power consumption and need efficiency improve in Sustain discharge

Introduction PDP

4-18 Samsung Electronics

4-23 PDP Drive Set

Address Buffer Board

Y Driver

Board

Power

Supply

Board

Logic

Board

Image

Processing

Board

Scan Buffer Board

Image signal source

X, Y Control signal

Address Data signal

RGB & Sync & Clock

Y-output

Scan power

Scan signal

Y-output

Scan P

ulse

X-output

Address

output

Port of Pa nel Electrode

Port of Panel Electrode

X Driver

Board

Input : AC Power common in use

Output : All voltages of each B’ds

Introduction PDP

Samsung Electronics 4-19

SMPS

X-BOARD

PCB-CONTROL

Y-BOARD

DIGITAL BOARD

LOGIC-BOARD

ANALOG BOARD

4-24 PCB

4-20 Samsung Electronics

MEMO

+ 86 hidden pages

Samsung D61B Training Manual

Specifications and Main Features

Frequently Asked Questions

User Manual