ON Semiconductor MAC12SM, MAC12SN Technical data

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ON Semiconductor MAC12SM, MAC12SN Technical data

MAC12

MAC12SM, MAC12SN

Preferred Device

Sensitive Gate Triacs

Silicon Bidirectional Thyristors

Designed for industrial and consumer applications for full wave control of ac loads such as appliance controls, heater controls, motor controls, and other power switching applications.

Sensitive Gate Allows Triggering by Microcontrollers and other Logic Circuits

Blocking Voltage to 800 Volts

On-State Current Rating of 12 Amperes RMS at 70°C

High Surge Current Capability - 90 Amperes

Rugged, Economical TO220AB Package

Glass Passivated Junctions for Reliability and Uniformity

Maximum Values of IGT, VGT and IH Specified for Ease of Design

High Commutating di/dt - 8.0 A/ms Minimum at 110°C

Immunity to dV/dt - 15 V/ sec Minimum at 110°C

Operational in Three Quadrants: Q1, Q2, and Q3

Device Marking: Logo, Device Type, e.g., MAC12SM, Date Code

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

 

 

 

 

Peak Repetitive Off-State Voltage (Note 1)

VDRM,

 

V

(T = -40 to 110°C, Sine Wave,

VRRM

 

 

J

 

 

 

50 to 60 Hz, Gate Open)

 

600

 

MAC12SM

 

 

 

800

 

MAC12SN

 

 

 

 

 

 

 

 

 

On-State RMS Current

IT(RMS)

12

A

(All Conduction Angles; TC = 70°C)

 

 

 

Peak Non-Repetitive Surge Current

ITSM

90

A

(One Full Cycle Sine Wave, 60 Hz,

 

 

 

TJ = 110°C)

 

 

 

Circuit Fusing Consideration

I2t

33

A2sec

(t = 8.33 ms)

 

 

 

 

 

 

 

Peak Gate Power

PGM

16

W

(Pulse Width = 1.0 sec, TC = 70°C)

 

 

 

Average Gate Power

PG(AV)

0.35

W

(t = 8.3 msec, TC = 70°C)

 

 

 

Operating Junction Temperature Range

TJ

- 40 to

°C

 

 

110

 

 

 

 

 

Storage Temperature Range

Tstg

- 40 to

°C

 

 

150

 

 

 

 

 

1.(VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.

http://onsemi.com

TRIACS

12 AMPERES RMS

600 thru 800 VOLTS

MT2

MT1

 

G

MARKING

DIAGRAM

 

4

 

 

 

MAC12xx

 

 

ALYWW

1

 

 

2

 

 

3

 

 

TO-220AB

 

 

CASE 221A

 

 

Style 4

xx

= Specific Device Code

 

 

A

= Assembly Location

 

L

= Wafer Lot

 

Y

= Year

 

WW

= Work Week

PIN ASSIGNMENT

 

1

Main Terminal 1

 

 

 

2

Main Terminal 2

 

 

 

3

Gate

 

 

 

4

Main Terminal 2

 

 

 

 

 

 

ORDERING INFORMATION

Device

Package

Shipping

 

 

 

MAC12SM

TO220AB

50 Units/Rail

 

 

 

MAC12SN

TO220AB

50 Units/Rail

 

 

 

 

 

 

Preferred devices are recommended choices for future use and best overall value.

Semiconductor Components Industries, LLC, 2003

1

Publication Order Number:

April, 2003 - Rev. 2

 

MAC12SM/D

MAC12SM, MAC12SN

THERMAL CHARACTERISTICS

 

 

Characteristic

 

 

Symbol

 

Value

Unit

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance -

Junction to Case

 

 

R JC

 

2.2

°C/W

 

-

Junction to Ambient

 

 

R JA

 

62.5

 

 

Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds

 

TL

 

260

°C

 

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted; Electricals apply in both directions)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristic

 

Symbol

Min

 

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak Repetitive Blocking Current

 

IDRM,

 

 

 

 

 

mA

 

(VD = Rated VDRM, VRRM; Gate Open)

TJ = 25°C

IRRM

-

 

-

 

0.01

 

 

 

 

TJ = 110°C

 

-

 

-

 

2.0

 

 

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak On-State Voltage(1)

 

V

-

 

-

 

1.85

V

 

(ITM = ± 17 A)

 

 

TM

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 )

IGT

-

 

1.5

5.0

mA

 

MT2(+), G(+)

 

 

 

 

 

 

MT2(+), G(-)

 

 

 

-

 

2.5

5.0

 

 

MT2(-), G(-)

 

 

 

-

 

2.7

5.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Holding Current

 

 

IH

-

 

2.5

10

mA

 

(VD = 12 V, Gate Open, Initiating Current = ±200 mA)

 

 

 

 

 

 

 

 

 

Latching Current (VD = 12 V, IG = 5 mA)

 

IL

-

 

3.0

15

mA

 

MT2(+), G(+)

 

 

 

 

 

 

MT2(+), G(-)

 

 

 

-

 

5.0

20

 

 

MT2(-), G(-)

 

 

 

-

 

3.0

15

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 )

VGT

0.45

 

0.68

1.5

V

 

MT2(+), G(+)

 

 

 

 

 

 

MT2(+), G(-)

 

 

 

0.45

 

0.62

1.5

 

 

MT2(-), G(-)

 

 

 

0.45

 

0.67

1.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Critical Rate of Change of Commutating Current

 

(di/dt)c

8.0

 

10

-

A/ms

 

(VD = 400 V, ITM = 3.5 A, Commutating dV/dt = 10 V/ s, Gate Open,

 

 

 

 

 

 

 

 

TJ = 110°C, f = 500 Hz, Snubber: Cs = 0.01 f, Rs = 15 )

 

 

 

 

 

 

 

 

Critical Rate of Rise of Off-State Voltage

 

dV/dt

15

 

40

-

V/ s

 

(VD = 67% VDRM, Exponential Waveform, RGK = 1 K ,

 

 

 

 

 

 

 

 

 

TJ = 110°C)

 

 

 

 

 

 

 

 

 

 

Repetitive Critical Rate of Rise of On-State Current

 

di/dt

-

 

-

 

10

A/ s

 

IPK = 50 A; PW = 40 sec; diG/dt = 1 A/ sec; Igt = 100 mA;

 

 

 

 

 

 

 

 

f = 60 Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.

 

 

 

 

 

 

 

 

http://onsemi.com

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