ON Semiconductor EMG2DXV5T1, EMG2DXV5T1G, EMG5DXV5T1, EMG5DXV5T1G, EMG5DXV5T5G Service Manual

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EMG2DXV5T1,

EMG5DXV5T1

Preferred Devices

Dual Bias Resistor

Transistors

NPN Silicon Surface Mount Transistors with Monolithic Bias Resistor Network

This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base−emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SOT−553 package which is designed for low power surface mount applications.

Features

Simplifies Circuit Design

Reduces Board Space

Reduces Component Count

Moisture Sensitivity Level: 1

Available in 8 mm, 7 inch Tape and Reel

Lead−Free Solder Plating

Pb−Free Packages are Available

MAXIMUM RATINGS (TA = 25°C unless otherwise noted)

Rating

 

Symbol

Value

Unit

 

 

 

 

 

Collector-Base Voltage

 

VCBO

50

Vdc

Collector-Emitter Voltage

 

VCEO

50

Vdc

Collector Current

 

IC

100

mAdc

THERMAL CHARACTERISTICS

 

 

 

Characteristic

Symbol

Max

Unit

 

 

 

 

Total Device Dissipation

PD

230 (Note 1)

mW

TA = 25°C

 

338 (Note 2)

°C/W

Derate above 25°C

 

1.8 (Note 1)

 

 

2.7 (Note 2)

 

 

 

 

 

Thermal Resistance −

RqJA

540 (Note 1)

°C/W

Junction-to-Ambient

 

370 (Note 2)

 

 

 

 

 

Thermal Resistance −

RqJL

264 (Note 1)

°C/W

Junction-to-Lead

 

287 (Note 2)

 

 

 

 

 

Junction and Storage

TJ, Tstg

−55 to +150

°C

Temperature Range

 

 

 

 

 

 

 

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1.FR−4 @ Minimum Pad

2.FR−4 @ 1.0 x 1.0 inch Pad

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NPN SILICON

BIAS RESISTOR

TRANSISTORS

(3)

(2)

(1)

R1

 

R1

R2

R2

 

DTr2

 

DTr1

(4)

 

(5)

5

SOT−553

 

CASE 463B

1

MARKING

DIAGRAM

5

XX M G

G

1

xx= Device Code xx= UF (EMG5)

UP (EMG2)

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.

Preferred devices are recommended choices for future use and best overall value.

Semiconductor Components Industries, LLC, 2005

1

Publication Order Number:

October, 2005 − Rev. 0

 

EMG5DXV5/D

EMG2DXV5T1, EMG5DXV5T1

DEVICE MARKING AND RESISTOR VALUES

Device

 

 

 

 

Package

Marking

 

R1 (K)

 

R2 (K)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EMG2DXV5T1

 

 

 

 

SOT−553

 

UP

 

47

 

47

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

EMG5DXV5T1

 

 

 

 

SOT−553

 

UF

 

10

 

47

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristic

 

Symbol

Min

 

Typ

 

Max

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS (Q1 & Q2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector-Base Cutoff Current (VCB = 50 V, IE = 0)

ICBO

 

 

100

 

 

 

nAdc

 

 

Collector-Emitter Cutoff Current (VCE = 50 V, IB = 0)

ICEO

 

 

500

 

 

 

nAdc

 

 

Emitter-Base Cutoff Current (VEB = 6.0 V, IC = 0)EMG2DXV5T1

IEBO

 

 

0.1

 

 

 

mAdc

 

 

 

EMG5DXV5T1

 

 

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector-Base Breakdown Voltage (IC = 10 mA, IE = 0)

V(BR)CBO

50

 

 

 

 

 

 

Vdc

 

 

Collector-Emitter Breakdown Voltage (Note 3)

 

V(BR)CEO

50

 

 

 

 

 

 

Vdc

 

 

(IC = 2.0 mA, IB = 0)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ON CHARACTERISTICS (Q1 & Q2) (Note 3)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DC Current Gain (VCE = 10 V, IC = 5.0 mA)

EMG2DXV5T1

hFE

80

 

 

140

 

 

 

 

 

 

 

 

EMG5DXV5T1

 

80

 

 

140

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector-Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA)

VCE(sat)

 

 

0.25

 

 

 

Vdc

 

 

Output Voltage (on)

 

VOL

 

 

0.2

 

 

 

 

Vdc

 

 

(VCC = 5.0 V, VB = 3.5 V, RL = 1.0 kW)

EMG2DXV5T1

 

 

 

 

 

 

 

 

 

 

(VCC = 5.0 V, VB = 2.5 V, RL = 1.0 kW)

EMG5DXV5T1

 

 

 

0.2

 

 

 

 

 

 

 

Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 kW)

VOH

4.9

 

 

 

 

 

Vdc

 

 

Input Resistor

EMG2DXV5T1

R1

32.9

 

47

 

61.1

 

 

 

kW

 

 

 

EMG5DXV5T1

 

7.0

 

10

 

13

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Resistor Ratio

EMG2DXV5T1

R1/R2

0.8

 

1.0

 

1.2

 

 

 

 

 

 

 

 

EMG5DXV5T1

 

0.17

 

0.21

 

0.25

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%

 

350

 

 

 

 

(mW)

300

 

 

 

 

 

 

 

 

 

DISSIPATION

250

 

 

 

 

200

 

 

 

 

150

 

 

 

 

, POWER

 

 

 

 

100

 

 

 

 

50

 

RqJA = 370°C/W

 

 

D

 

 

 

P

 

 

 

 

 

 

0

0

50

100

150

 

−50

 

 

TA, AMBIENT TEMPERATURE (°C)

 

Figure 1. Derating Curve

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ON Semiconductor EMG2DXV5T1, EMG2DXV5T1G, EMG5DXV5T1, EMG5DXV5T1G, EMG5DXV5T5G Service Manual

EMG2DXV5T1, EMG5DXV5T1

TYPICAL ELECTRICAL CHARACTERISTICS — EMG2DXV5T1

(VOLTS

10

 

 

 

 

IC/IB = 10

 

 

VOLTAGE

 

 

 

1

 

 

 

COLLECTOR

 

 

 

 

 

TA = −25°C

25°C

 

 

 

 

 

 

75°C

, MAXIMUM

0.1

 

 

 

 

 

 

 

 

 

CE(sat)

0.01

 

 

 

0

20

40

50

V

IC, COLLECTOR CURRENT (mA)

 

 

 

 

Figure 2. VCE(sat) versus IC

 

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

f = 1 MHz

 

 

 

 

 

 

IE = 0 V

 

 

0.8

 

 

 

 

TA

= 25

°

C

 

 

 

 

 

 

 

(pF)

 

 

 

 

 

 

 

 

 

, CAPACITANCE

0.6

 

 

 

 

 

 

 

 

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ob

 

 

 

 

 

 

 

 

 

C

0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

0

10

20

30

40

 

 

50

VR, REVERSE BIAS VOLTAGE (VOLTS)

Figure 4. Output Capacitance

(NORMALIZED)

1000

 

 

 

 

VCE = 10 V

 

 

TA = 75°C

 

 

25°C

 

 

−25°C

GAIN

 

 

100

 

 

, DC CURRENT

 

 

 

 

 

FE

 

 

h

 

 

 

 

10 1

10

100

IC, COLLECTOR CURRENT (mA)

Figure 3. DC Current Gain

 

100

 

25°C

 

 

 

 

 

75°C

 

 

 

 

 

 

 

 

 

(mA)

10

 

 

TA = −25°C

 

 

 

 

 

 

 

 

CURRENT

1

 

 

 

 

 

 

 

 

 

 

 

COLLECTOR

0.1

 

 

 

 

 

0.01

 

 

 

 

 

,

 

 

 

 

 

 

C

 

 

 

 

 

 

I

 

 

 

VO = 5 V

 

 

 

 

 

 

 

 

0.001

 

 

 

 

 

 

0

2

4

6

8

10

 

 

 

Vin, INPUT VOLTAGE (VOLTS)

 

 

Figure 5. Output Current versus Input Voltage

Vin, INPUT VOLTAGE (VOLTS)

100

VO = 0.2 V

TA = −25°C 25°C

10

75°C

1

0.1

0

10

20

30

40

50

IC, COLLECTOR CURRENT (mA)

Figure 6. Input Voltage versus Output Current

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