ON Semiconductor C106M1, C106M, C106D1, C106D, C106B Datasheet

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C106 Series

Preferred Devices

Sensitive Gate

Silicon Controlled Rectifiers

Reverse Blocking Thyristors

Glassivated PNPN devices designed for high volume consumer applications such as temperature, light, and speed control; process and remote control, and warning systems where reliability of operation is important.

Glassivated Surface for Reliability and Uniformity

Power Rated at Economical Prices

Practical Level Triggering and Holding Characteristics

Flat, Rugged, Thermopad Construction for Low Thermal Resistance, High Heat Dissipation and Durability

Sensitive Gate Triggering

Device Marking: Device Type, e.g., C106B, Date Code

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

Value

Unit

 

 

 

 

Peak Repetitive Off±State Voltage (Note 1)

VDRM,

 

Volts

(Sine Wave, 50±60 Hz, RGK = 1 kΩ,

VRRM

 

 

TC = ±40° to 110°C)

 

 

 

C106B

 

200

 

C106D, C106D1

 

400

 

C106M, C106M1

 

600

 

 

 

 

 

On-State RMS Current

IT(RMS)

4.0

Amps

(180° Conduction Angles, TC = 80°C)

 

 

 

Average On±State Current

IT(AV)

2.55

Amps

(180° Conduction Angles, TC = 80°C)

 

 

 

Peak Non-Repetitive Surge Current

ITSM

20

Amps

(1/2 Cycle, Sine Wave, 60 Hz,

 

 

 

TJ = +110°C)

 

 

 

Circuit Fusing Considerations (t = 8.3 ms)

I2t

1.65

A2s

Forward Peak Gate Power

PGM

0.5

Watt

(Pulse Width 1.0 μsec, TC = 80°C)

 

 

 

Forward Average Gate Power

PG(AV)

0.1

Watt

(Pulse Width 1.0 μsec, TC = 80°C)

 

 

 

Forward Peak Gate Current

IGM

0.2

Amp

(Pulse Width 1.0 μsec, TC = 80°C)

 

 

 

Operating Junction Temperature Range

TJ

±40 to

°C

 

 

+110

 

 

 

 

 

Storage Temperature Range

Tstg

±40 to

°C

 

 

+150

 

 

 

 

 

Mounting Torque (Note 2)

±

6.0

in. lb.

 

 

 

 

1.VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.

2.Torque rating applies with use of compression washer (B52200F006).

Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heatsink contact pad are common.

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SCRs

4 AMPERES RMS

200 thru 600 VOLTS

G

A K

3 2

1

 

TO±225AA

(formerly TO±126)

 

CASE 077

 

STYLE 2

 

PIN ASSIGNMENT

 

 

1

Cathode

 

 

2

Anode

 

 

3

Gate

 

 

 

 

ORDERING INFORMATION

Device

Package

Shipping

 

 

 

C106B

TO225AA

500/Box

 

 

 

C106D

TO225AA

500/Box

 

 

 

C106D1

TO225AA

500/Box

C106M

TO225AA

500/Box

 

 

 

C106M1

TO225AA

500/Box

 

 

 

 

 

 

Preferred devices are recommended choices for future use and best overall value.

Semiconductor Components Industries, LLC, 2002

1

Publication Order Number:

March, 2002 ± Rev. 4

 

C106/D

C106 Series

THERMAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)

Characteristic

 

 

 

 

Symbol

 

Max

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance, Junction to Case

 

 

 

 

RθJC

3.0

 

 

°C/W

Thermal Resistance, Junction to Ambient

 

 

 

 

RθJA

75

 

 

°C/W

Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds

 

TL

260

 

 

 

°C

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Characteristic

 

 

Symbol

 

Min

 

Typ

Max

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak Repetitive Forward or Reverse Blocking Current

TJ = 25°C

 

IDRM, IRRM

 

 

 

 

 

 

mA

(VAK = Rated VDRM or VRRM, RGK = 1000 Ohms)

 

 

 

 

±

 

±

10

 

 

TJ = 110°C

 

 

 

 

±

 

±

100

 

mA

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peak Forward On±State Voltage (Note 3)

 

 

VTM

 

±

 

±

2.2

 

Volts

(ITM = 4 A)

 

 

 

 

 

 

 

 

 

 

 

 

Gate Trigger Current (Continuous dc) (Note 4)

TJ = 25°C

 

IGT

 

 

 

 

 

 

 

mA

(VAK = 6 Vdc, RL = 100 Ohms)

 

 

 

 

±

 

15

200

 

 

 

TJ = ±40°C

 

 

 

 

±

 

35

500

 

 

Peak Reverse Gate Voltage (IGR = 10 mA)

 

 

VGRM

 

±

 

±

6.0

 

Volts

Gate Trigger Voltage (Continuous dc) (Note 4)

TJ = 25°C

 

VGT

 

 

 

 

 

 

 

Volts

(VAK = 6 Vdc, RL = 100 Ohms)

 

 

 

 

0.4

 

0.60

0.8

 

 

 

TJ = ±40°C

 

 

 

 

0.5

 

0.75

1.0

 

 

Gate Non±Trigger Voltage (Continuous dc) (Note 4)

 

 

VGD

 

0.2

 

±

±

 

Volts

(VAK = 12 V, RL = 100 Ohms, TJ = 110°C)

 

 

 

 

 

 

 

 

 

 

 

 

Latching Current

TJ = 25°C

 

IL

 

 

 

 

 

 

 

mA

(VAK = 12 V, IG = 20 mA)

 

 

 

 

±

 

0.20

5.0

 

 

 

TJ = ±40°C

 

 

 

 

±

 

0.35

7.0

 

 

Holding Current (VD = 12 Vdc)

TJ = 25°C

 

IH

 

 

 

 

 

 

 

mA

(Initiating Current = 20 mA, Gate Open)

 

 

 

 

±

 

0.19

3.0

 

 

 

TJ = ±40°C

 

 

 

 

±

 

0.33

6.0

 

 

 

TJ = +110°C

 

 

 

 

±

 

0.07

2.0

 

 

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Critical Rate±of±Rise of Off±State Voltage

 

 

dv/dt

±

8.0

±

 

V/ms

(VAK = Rated VDRM, Exponential Waveform, RGK = 1000 Ohms, TJ = 110°C)

3.Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.

4.RGK is not included in measurement.

http://onsemi.com

2

ON Semiconductor C106M1, C106M, C106D1, C106D, C106B Datasheet

C106 Series

Voltage Current Characteristic of SCR

Symbol

Parameter

 

 

VDRM

Peak Repetitive Off State Forward Voltage

IDRM

Peak Forward Blocking Current

VRRM

Peak Repetitive Off State Reverse Voltage

IRRM

Peak Reverse Blocking Current

VTM

Peak On State Voltage

IH

Holding Current

+ Current

Anode +

 

VTM

on state

 

IRRM at VRRM

IH

 

+ Voltage

Reverse Blocking Region

IDRM at VDRM

(off state)

Forward Blocking Region

 

Reverse Avalanche Region

(off state)

 

Anode ±

 

 

110

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C)(°

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

90

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TEMPERATURE

 

 

 

 

 

 

 

 

 

 

DC

 

 

 

 

50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

70

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CASE

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

40

 

HALF SINE WAVE

 

 

 

 

 

 

 

RESISTIVE OR INDUCTIVE LOAD.

 

 

 

 

 

 

C

30

 

50 to 400 Hz

 

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

T

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

.4

.8

1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0

 

 

 

 

 

IT(AV) AVERAGE ON STATE CURRENT (AMPERES)

Figure 1. Average Current Derating

P(AV), AVERAGE ONSTATE POWER DISSIPATION (WATTS)

10 JUNCTION TEMPERATURE 110°C

8

HALF SINE WAVE

RESISTIVE OR INDUCTIVE LOAD

650 TO 400Hz.

DC

4

2

0

0

.4

.8

1.2

1.6

2.0

2.4

2.6

3.2

3.6

4.0

IT(AV) AVERAGE ON STATE CURRENT (AMPERES)

Figure 2. Maximum On±State Power Dissipation

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