NSC DS90C387VJDX, DS90C387VJD, DS90C387AVJD Datasheet
DS90C387/DS90CF388
Dual Pixel LVDS Display Interface (LDI)-SVGA/QXGA
General Description
The DS90C387/DS90CF388 transmitter/receiver pair is designed to support dual pixel data transmission between Host
and Flat Panel Display up to QXGA resolutions. The transmitter converts 48bits(DualPixel 24-bit color) of CMOS/TTL
data into 8 LVDS (Low Voltage Differential Signalling) data
streams. Control signals (VSYNC, HSYNC, DE and two
user-defined signals) are sent during blanking intervals. At a
maximum dual pixel rate of 112MHz,LVDSdata line speed is
672Mbps, providing a total throughput of 5.38Gbps (672
Megabytes per second). Two other modes are also supported. 24-bit color data (single pixel) can be clocked into the
transmitter at a maximum rate of 170MHz. In this mode, the
transmitter provides single-to-dual pixel conversion, and the
output LVDS clock rate is 85MHz maximum. The third mode
provides inter-operability with FPD-Link devices.
The LDI chipset is improved over prior generations of
FPD-Link devices and offers higher bandwidth support and
longer cable drive with three areas of enhancement. To increase bandwidth, the maximum pixel clock rate is increased
to 112 (170) MHz and 8 serialized LVDS outputs are provided. Cable drive is enhanced with a user selectable
pre-emphasis feature that provides additional output current
during transitions to counteract cable loading effects. DC
balancing on a cycle-to-cycle basis, is also provided to reduce ISI (Inter-Symbol Interference). With pre-emphasis and
DC balancing, a low distortion eye-pattern is provided at the
receiver end of the cable. A cable deskew capability has
been added to deskew long cables of pair-to-pair skew of up
to +/−1 LVDSdata bit time. These three enhancements allow
cables 5 to 10+ meters in length to be driven.
This chipset is an ideal means to solve EMI and cable size
problems for high-resolution flat panel applications. It pro-
vides a reliable interface based on LVDS technology that delivers the bandwidth needed for high-resolution panels while
maximizing bit times, and keeping clock rates low to reduce
EMI and shielding requirements. For more details, please refer to the “Applications Information” section of this datasheet.
Features
n Complies with OpenLDI specification for digital display
interfaces
n 32.5 to 112/170MHz clock support
n Supports SVGA through QXGA panel resolutions
n Drives long, low cost cables
n Up to 5.38Gbps bandwidth
n Pre-emphasis reduces cable loading effects
n DC balance data transmission provided by transmitter
reduces ISI distortion
n Deskews +/−1 LVDS data bit time of pair-to-pair skew at
receiver inputs; intra-pair skew tolerance of 300ps
n Dual pixel architecture supports interface to GUI and
timing controller; optional single pixel transmitter inputs
support single pixel GUI interface
n Transmitter rejects cycle-to-cycle jitter
n 5V tolerant on data and control input pins
n Programmable transmitter data and control strobe select
(rising or falling edge strobe)
n Backward compatible configuration select with FPD-Link
n Optional second LVDS clock for backward compatibility
w/ FPD-Link
n Support for two additional user-defined control signals in
DC Balanced mode
n Compatible with TIA/EIA - LVDS Standard
Generalized Block Diagram
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
DS100073-1
PRELIMINARY
May 2000
DS90C387/DS90CF388 Dual Pixel LVDS Display Interface (LDI)-SVGA/QXGA
© 2000 National Semiconductor Corporation DS100073 www.national.com
Transmitter Block Diagram
Receiver Block Diagram
DS100073-2
DS100073-3
DS90C387/DS90CF388
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
CMOS/TTL Input Voltage −0.3V to +5.5V
CMOS/TTL Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input
Voltage −0.3V to +3.6V
LVDS Driver Output
Voltage −0.3V to +3.6V
LVDS Output Short Circuit
Duration Continuous
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec.) +260˚C
Maximum Package Power Dissipation Capacity
@
25˚C
100 TQFP Package:
DS90C387 2.8W
DS90CF388 2.8W
Package Derating:
DS90C387 18.2mW/˚C above +25˚C
DS90CF388 18.2mW/˚C above +25˚C
ESD Rating:
DS90C387
(HBM, 1.5kΩ, 100pF)
>
6kV
(EIAJ, 0Ω, 200pF)
>
300 V
DS90CF388
(HBM, 1.5kΩ, 100pF)
>
2kV
(EIAJ, 0Ω, 200pF)
>
200 V
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Operating Free Air
Temperature (T
A)
−10 +25 +70 ˚C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (V
CC
) 100 mV
p-p
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
CMOS/TTL DC SPECIFICATIONS (Tx inputs, Rx outputs, control inputs and outputs)
V
IH
High Level Input Voltage 2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
V
OH
High Level Output Voltage IOH= −0.4 mA 2.7 2.9 V
I
OH
= −2 mA 2.7 2.85 V
V
OL
Low Level Output Voltage IOL= 2 mA 0.1 0.3 V
V
CL
Input Clamp Voltage ICL= −18 mA −0.79 −1.5 V
I
IN
Input Current VIN= 0.4V, 2.5V or V
CC
+1.8 +15 µA
V
IN
= GND −15 0 µA
I
OS
Output Short Circuit Current V
OUT
= 0V −120 mA
LVDS DRIVER DC SPECIFICATIONS
V
OD
Differential Output Voltage RL= 100Ω 250 345 450 mV
∆V
OD
Change in VODbetween
Complimentary Output States
35 mV
V
OS
Offset Voltage 1.125 1.25 1.375 V
∆V
OS
Change in VOSbetween
Complimentary Output States
35 mV
I
OS
Output Short Circuit Current V
OUT
= 0V, RL= 100Ω −3.5 −10 mA
I
OZ
Output TRI-STATE®Current PD = 0V, V
OUT
=0VorV
CC
±
1
±
10 µA
LVDS RECEIVER DC SPECIFICATIONS
V
TH
Differential Input High
Threshold
VCM= +1.2V +100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current VIN= +2.4V, VCC= 3.6V
±
10 µA
V
IN
= 0V, VCC= 3.6V
±
10 µA
DS90C387/DS90CF388
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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current
Worst Case
R
L
= 100Ω,CL=
5 pF,
Worst Case
Pattern
(
Figures 1, 3
),
DUAL=High
(48-bit RGB),
BAL=High
(enabled)
f = 32.5 MHz 91.4 140 mA
f = 65 MHz 106 160 mA
f = 85 MHz 135 170 mA
f = 112 MHz 155 190 mA
ICCTG Transmitter Supply Current
16 Grayscale
R
L
= 100Ω,CL=
5 pF,
16 Grayscale
Pattern
(
Figures 2, 3
),
DUAL=High
(48-bit RGB),
BAL=High
(enabled)
f = 32.5 MHz 62.6 120 mA
f = 65 MHz 84.4 130 mA
f = 85 MHz 89.0 145 mA
f = 112 MHz 94.5 155 mA
ICCTZ Transmitter Supply Current
Power Down
PD = Low
4.8 50 µA
Driver Outputs in TRI-STATE under
Powerdown Mode
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current
Worst Case
C
L
= 8 pF,
Worst Case
Pattern
(
Figures 1, 4
),
DUAL (48-bit
RGB), BAL=High
(enabled)
f = 32.5 MHz 115 150 mA
f = 65 MHz 200 250 mA
f = 85 MHz 240 275 mA
f = 112 MHz 250 300 mA
ICCRG Receiver Support Current
16 Grayscale
C
L
= 8 pF,
16 Grayscale
Pattern
(
Figures 2, 4
),
DUAL (48-bit
RGB), BAL=High
(enabled)
f = 32.5 MHz 60 95 mA
f = 65 MHz 95 125 mA
f = 85 MHz 115 150 mA
f = 112 MHz 150 270 mA
ICCRZ Receiver Supply Current
Power Down
PD = Low
Receiver Outputs stay low
during Powerdown mode.
255 300 µA
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for V
CC
= 3.3V and TA= +25˚C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except V
OD
and ∆VOD).
DS90C387/DS90CF388
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Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Min Typ Max Units
TCIT TxCLK IN Transition Time (
Figure 5
) DUAL=Gnd or Vcc 1.0 2.0 3.0 ns
DUAL=1/2Vcc 1.0 1.5 1.7 ns
TCIP TxCLK IN Period (
Figure 6
) DUAL=Gnd or Vcc 8.928 T 30.77 ns
DUAL=1/2Vcc 5.88 15.38 ns
TCIH TxCLK in High Time (
Figure 6
) 0.35T 0.5T 0.65T ns
TCIL TxCLK in Low Time (
Figure 6
) 0.35T 0.5T 0.65T ns
TXIT TxIN Transition Time 1.5 6.0 ns
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time (
Figure 3
), PRE = 0.75V
(disabled)
0.14 0.7 ns
LVDS Low-to-High Transition Time (
Figure 3
), PRE = Vcc (max) 0.11 0.6 ns
LHLT LVDS High-to-Low Transition Time (
Figure 3
), PRE = 0.75V
(disabled)
0.16 0.8 ns
LVDS High-to-Low Transition Time (
Figure 3
), PRE = Vcc (max) 0.11 0.7 ns
TBIT Transmitter Output Bit Width DUAL=Gnd or Vcc 1/7 TCIP ns
DUAL=1/2Vcc 2/7 TCIP ns
TCCS TxOUT Channel to Channel Skew 100 ps
TSTC TxIN Setup to TxCLK IN (
Figure 6
) 2.7 ns
THTC TxIN Hold to TxCLK IN (
Figure 6
)0ns
TJCC Transmitter Jitter Cycle-to-cycle (
Figures
13, 14
) (Note 5), DUAL=Vcc
f = 112 MHz 85 100 ps
f = 85 MHz 60 75 ps
f = 65 MHz 70 80 ps
f = 56 MHz 100 120 ps
f = 32.5 MHz 75 110 ps
TPLLS Transmitter Phase Lock Loop Set (
Figure 8
)10ms
TPDD Transmitter Powerdown Delay (
Figure 10
) 100 ns
DS90C387/DS90CF388
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Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time (
Figure 4
), Rx data out 1.52 2.0 ns
CMOS/TTL Low-to-High Transition Time (
Figure 4
), Rx clock out 0.5 1.0 ns
CHLT CMOS/TTL High-to-Low Transition Time (
Figure 4
), Rx data out 1.7 2.0 ns
CMOS/TTL High-to-Low Transition Time (
Figure 4
), Rx clock out 0.5 1.0 ns
RCOP RxCLK OUT Period (
Figure 7
) 8.928 T 30.77 ns
RCOH RxCLK OUT High Time (
Figure 7
)(Note 4) f = 112 MHz 3.5 ns
f = 85 MHz 4.5 ns
RCOL RxCLK OUT Low Time (
Figure 7
)(Note 4) f = 112 MHz 3.5 ns
f = 85 MHz 4.5 ns
RSRC RxOUT Setup to RxCLK OUT (
Figure 7
)(Note 4) f = 112 MHz 2.4 ns
f = 85 MHz 3.0 ns
RHRC RxOUT Hold to RxCLK OUT (
Figure 7
)(Note 4) f = 112 MHz 3.4 ns
f = 85 MHz 4.75 ns
RPLLS Receiver Phase Lock Loop Set (
Figure 9
)10ms
RPDD Receiver Powerdown Delay (
Figure 11
)1µs
RSKM Receiver Skew Margin without Deskew (
Figure
12
) (Notes 4, 6)
f = 112 MHz 170 ps
Receiver Skew Margin with Deskew (Note 7) 1.27 ns
Receiver Skew Margin without Deskew (
Figure
12
) (Notes 4, 6)
f = 85 MHz 160 ps
Receiver Skew Margin with Deskew (Note 7) 1.68 ns
Note 4: TheMinimum and Maximum Limits are based on statistical analysis of the device performance over voltage and temperature ranges. This parameter is functionally tested on Automatic TestEquipment (ATE).ATE is limited to 85MHz. Asample of characterization parts have been bench tested at 112MHzto verify functional
performance.
Note 5: The limits are based on bench characterization of the device’s jitter response over the power supply voltage range. Output clock jitter is measured with a
cycle-to-cycle jitter of
±
3ns applied to the input clock signal while data inputs are switching (see figures 15 and 16). A jitter event of 3ns, represents worse case jump
in the clock edge from most graphics VGA chips currently available. This parameter is used when calculating system margin as described in AN-1059.
Note 6: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account transmitter output pulse positions
(min and max) and the receiver input setup and hold time (internal data sampling window - RSPOS). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable) and clock jitter.
RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle).
Note 7: This limit is based on the capability of deskew circuitry. This margin allows for LVDS interconnect skew, inter-symbol interference (both dependent on type/
length of cable) and clock jitter. RSKM with deskew is
±
1 LVDS bit time (1/7th clock period) data to clock skew.
DS90C387/DS90CF388
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AC Timing Diagrams
Note 8: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 9: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 10:
Figures 1, 2
show a falling edge data strobe (TxCLK IN/RxCLK OUT).
DS100073-10
FIGURE 1. “Worst Case” Test Pattern
DS100073-11
FIGURE 2. “16 Grayscale” Test Pattern (Notes 8, 9, 10)
DS90C387/DS90CF388
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AC Timing Diagrams (Continued)
DS100073-12
FIGURE 3. DS90C387 (Transmitter) LVDS Output Load and Transition Times
DS100073-13
FIGURE 4. DS90CF388 (Receiver) CMOS/TTL Output Load and Transition Times
DS100073-14
FIGURE 5. DS90C387 (Transmitter) Input Clock Transition Time
DS100073-15
FIGURE 6. DS90C387 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
DS100073-16
FIGURE 7. DS90CF388 (Receiver) Setup/Hold and High/Low Times
DS90C387/DS90CF388
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