DATA SHEET
GaAs INTEGRATED CIRCUIT
µµµµ
PG139GV
L-BAND DPDT MMIC SWITCH
DESCRIPTION
The µPG139GV is L-Band Double Pole, Double Throw (DPDT) switch developed for digital cellular or cordless
telephone and PCS applications. This device feature low insertion loss, high handling power with low voltage
operation. It is housed in a very small 8-pin plastic SSOP package available on tape-and-reel and easy to install and
contributes to miniaturizing the systems.
FEATURES
High-Power Switching : Pin(1 dB) = +34 dBm typ. @ANT1, 2-TX, V
{
Pin(0.5 dB) = +36 dBm typ. @ANT1, 2-TX, VDD = 5.0 V, V
Low Insertion Loss : Lins1 = 0.70 dB typ. @ANT1, 2-TX, VDD = 3.0 V, V
{
Lins4 = 0.85 dB typ. @ANT1, 2-RX, VDD = 3.0 V, V
Small 8-pin SSOP (175 mil) Package
{
DD
= 3.0 V, V
CONT
= 3.6 V, f = 100 M to 2 GHz
CONT
= 5.0 V, f = 100 M to 2 GHz
CONT
= 3.6 V, f = 1 GHz
CONT
= 3.6 V, f = 1 GHz
APPLICATION
Digital Cellular: PDC, GSM, IS-95, IS-136 etc.
{
PCS, PHS Base station etc.
{
ORDERING INFORMATION
Part Number Package Packing Form
µ
PG139GV-E1 8-pin SSOP (175 mil) Carrier tape width is 12 mm, Quant i t y is 2 kpcs per reel.
Remark
Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs
For sample order, please contact your local NEC sales office. (Part number for sample order:
MESFET.
PG139GV)
µ
Document No. P13144EJ2V0DS00 (2nd edition)
Date Published July 1998 N CP(K)
Printed in Japan
The information in this document is subject to change without notice.
The mark shows major revised points.
1998©
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameters Symbol Conditions Ratings Unit
µµµµ
PG139GV
Supply Voltage V
Control Voltage 1, 2 V
CONT1, 2
Input Power (ANT1, 2-TX) P
Input Power (ANT1, 2-RX) P
Input Power (ANT1, 2-TX) P
Input Power (ANT1, 2-RX) P
Total Power Dissipat i on P
Operating Temperature T
Storage Temperature T
Notes 1.
2.7 V ≤ | V
Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C
2.
CONT1
– V
CONT2
PIN CONNECTION (Top View)
1
2
3
4
G139
DD
in
in
in
in
tot
A
stg
| ≤ 6.0
CONT
V
(H) V
0.7
Note1
Note 2
–6.0 to +6.0
CONT
V
= +5 V/0 V +36 dBm
CONT
V
= +5 V/0 V +34 dBm
CONT
V
= +3 V/0 V +34 dBm
CONT
V
= +3 V/0 V +32 dBm
–50 to +80 °C
–65 to +150 °C
8
Pin No. Connection Pin No. Connection
1TX5RX
7
6
2VDD6V
3V
CONT2
7GND
4ANT28ANT1
5
V
W
CONT1
SWITCH IC SERIES PRODUCTS
Part Number
PG130G +34 0.5@1G 32@1G –5/0 8-pin SSOP PDC, IS-136, PHS
µ
PG131G +30 0.6@2G 23@2G –4/0
µ
PG132G +30 0.6@2G 22@2G +3/0 PHS, PCS, WLAN
µ
PG133G +25 0.6@2G 20@2G –3/0 DIVERSITY, VCO
µ
PG137GV +34 0.55@1G 25@2G +3/0 PDC, GSM, IS-136
µ
PG138GV +34
µ
Pin (1 dB)
(dBm)
LINS (dB) ISL (dB) V
0.55@1G 30@1G –3/0
+37
PG139GV
µ
+34 1.20@2G 12.5@2G +3.6/0 PDC, IS-95, IS-136
(ANT1, 2-TX)
PG139GV
µ
+30 1.00@2G 14@2G +3.6/0 PDC, IS-95, I S-136
(ANT1, 2-RX)
Remark
As for detail information of series products, please refer to each data sheet.
CONT
(V) Package Application
(175 mil)
PHS, PCS, WLAN
PDC, GSM, IS-136
–5/0
2
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameters Symbol MIN. TYP. MAX. Unit
µµµµ
PG139GV
Control Voltage (High) V
Control Voltage (Low) V
Supply Voltage V
Input Power (ANT1, 2-TX, V
Input Power (ANT1, 2-RX, V
Input Power (ANT1, 2-TX, V
Input Power (ANT1, 2-RX, V
CONT
= +5 V) P
CONT
= +5 V)
CONT
= +3 V) P
CONT
= +3 V)
CONT(H)
CONT(L)
DD
in
in
P
in
in
P
+2.7 +3.6 +5.3 V
–0.2 0 +0.2 V
CONT(H)
V
– 0.7 V
CONT(H)
– 0.6 V
CONT(H)
– 0.5 V
+36 dBm
+33 dBm
+33 dBm
+31 dBm
ELECTRICAL CHARACTERISTICS
A
(Unless otherwise specified, T
= 25°C, V
Parameters Symbol Test Conditions MIN. TYP. MAX. Unit
Insertion Loss 1 L
Insertion Loss 2 L
Insertion Loss 3 L
Insertion Loss 4 L
Insertion Loss 5 L
Insertion Loss 6 L
INS
1 ANT1, 2-TX, f = 100 M to 1 GHz 0.70 0.85 dB
INS
2 ANT1, 2-TX, f = 1.5 GHz 0.90 1.00 dB
INS
3 ANT1, 2-TX, f = 2 GHz 1.20 1.30 dB
INS
4 ANT1, 2-RX, f = 100 M to 1 GHz 0.85 0.95 dB
INS
5 ANT1, 2-RX, f = 1.5 GHz 1.05 1.15 dB
INS
6 ANT1, 2-RX, f = 2 GHz 1.30 1.40 dB
Isolation 1 ISL1
Isolation 2 ISL2 ANT1, 2-TX, f = 2 GHz 10.5 12.5 dB
Isolation 3 ISL3 ANT1, 2-RX, f = 100 M to 1.5 GHz 13.5 15.5 dB
Isolation 4 ISL4 ANT1, 2-RX , f = 2 GHz 10.5 12.5 dB
Input Return Loss RL
Output Return Loss RL
1 dB Compression Point
1 dB Compression Point
Input Power at 0.5 dB
Compression Point
Input Power at 0.5 dB
Compression Point
Note
Note
Note
Note
Control Current I
in
out
in(1 dB)
P
1 ANT1, 2-TX, f = 100 M to 2 GHz +32 +34 dBm
in(1 dB)
P
2 ANT1, 2-RX, f = 100 M to 2 GHz +27 +30 dBm
in(0.5 dB)
P
3 ANT1, 2-TX, f = 100 M to 2 GHz
in(0.5 dB)
P
4 ANT1, 2-RX, f = 100 M to 2 GHz
CONT
Switching Speed tsw 60 nS
CONT
= +3.6 V/0 V, VDD = +3.0 V, ZS = ZL = 50
ANT1, 2-TX, f = 100 M to 1.5 GHz
13.5 15.5 dB
)
ΩΩΩΩ
f = 100 M to 2 GHz 11 15 dB
f = 100 M to 2 GHz 11 15 dB
+36 dBm
CONT
= +5 V/0 V VDD = +5.0 V
V
+33 dBm
CONT
= +5 V/0 V VDD = +5.0 V
V
RF OFF 15 50
A
µ
Pin (1 dB) and Pin (0.5 dB) are measured the input power level when the insertion loss increase more 1 dB
Note
or 0.5 dB than that of linear range. All other characteristics are measured in linear range.
3
EVALUATION CIRCUIT
µµµµ
PG139GV
51 PF
TX
0
= 50 Ω
Z
V
V
DD
CONT2
= 3.0 V
= +3.6 V/0 V
ANT2
Z
0
= 50 Ω
51 PF
SWITCH LOGIC TABLES
CONT1
V
Low High ANT1-RX ON, ANT2-TX ON
High Low ANT1-TX ON, ANT2-RX ON
V
CONT2
Switching Portes
ANT1-TX OFF, ANT2-RX OFF
ANT1-RX OFF, ANT2-TX OFF
51 PF
1
2
3
4
8
0
= 50 Ω
7
Z
GND
6
5
51 PF
Z
0
= 50 Ω
ANT1
CONT1
V
RX
= 0 V/+3.6 V
4
PACKAGE DIMENSIONS
8 PIN PLASTIC SHRINK SOP (175 mil) (Unit: mm)
85
14
Detail of lead end
+7°
–3°
3°
4.94 ± 0.2
µµµµ
PG139GV
1.8 MAX.
0.1 ± 0.1
1.5 ± 0.1
0.575 MAX.
3.0 MAX.
0.65
0.3
+0.10
–0.05
+0.10
–0.05
0.15
0.10
0.5 ± 0.2
M
3.2 ± 0.1
0.87 ± 0.2
0.15
5
µµµµ
PG139GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process Soldering Conditions Symbol
Infrared Ray Reflow Peak package’s surface temperature: 235° C or bel ow
Reflow time: 30 seconds or l ess (at 210°C)
Number of reflow process: 3, Exposure limit
VPS Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or l ess (at 200°C)
Number of reflow process: 3, Exposure limit
Wave Soldering Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limit
Partial Heating Method Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limit
Exposure limit before soldering after dry-pack package is opened.
Note
Note
: None
Note
Note
Note
: None
: None
: None
Storage conditions: 25°C and relative humidity at 65% or less.
Caution Do not apply more than a single process at once, except for “partial heating method”.
IR35-00-3
VP15-00-3
WS60-00-1
6
[MEMO]
µµµµ
PG139GV
7
µµµµ
PG139GV
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
Loading...