4
µ
PD75116H,75117H
CONTENTS
1. PIN CONFIGURATION (TOP VIEW) ...................................................................................................... 6
2. BLOCK DIAGRAM ................................................................................................................................... 8
3. PIN FUNCTIONS ..................................................................................................................................... 9
3.1 PORT PINS ....................................................................................................................................................... 9
3.2 OTHER PINS ..................................................................................................................................................... 10
3.3 PIN INPUT/OUTPUT CIRCUITS ..................................................................................................................... 11
3.4 RECOMMENDED CONNECTION OF UNUSED PINS ................................................................................... 12
4. MEMORY CONFIGURATION ................................................................................................................. 13
5. PERIPHERAL HARDWARE FUNCTIONS ............................................................................................... 18
5.1 PORT ................................................................................................................................................................. 18
5.2 CLOCK GENERATOR ....................................................................................................................................... 19
5.3 CLOCK OUTPUT CIRCUIT ............................................................................................................................... 20
5.4 BASIC INTERVAL TIMER ................................................................................................................................ 21
5.5 TIMER/EVENT COUNTER ............................................................................................................................... 21
5.6 SERIAL INTERFACE ......................................................................................................................................... 23
5.7 PROGRAMMABLE THRESHOLD PORT (ANALOG INPUT PORT) .............................................................. 25
5.8 BIT SEQUENTIAL BUFFER ............................................................................................................................. 26
6. INTERRUPT FUNCTION ........................................................................................................................ 27
7. STANDBY FUNCTION ............................................................................................................................ 29
8. RESET FUNCTION .................................................................................................................................. 30
9. INSTRUCTION SET ................................................................................................................................. 33
10. APPLICATION EXAMPLE ....................................................................................................................... 43
10.1 CORDLESS TELEPHONE (SUBSET) .............................................................................................................. 43
10.2 DISPLAY PAGER .............................................................................................................................................. 44
11. MASK OPTION SELECTION................................................................................................................... 45
12. ELECTRICAL SPECIFICATIONS ............................................................................................................. 46
13. PACKAGE INFORMATION ..................................................................................................................... 57
14. RECOMMENDED SOLDERING CONDITIONS ...................................................................................... 59
APPENDIX A. FUNCTIONAL DIFFERENCES AMONG µPD751×× SERIES PRODUCTS ......................... 60