NEC NX7700i-5080H-32, TX7-i9610, NX7700i-5040H-32 User Manual

855-900547-200-A

Rev.

TX7/i9610

NX7700i/5080H-64, NX7700i/5040H-32

Operation Manual

CAUTION

Before using the product, be sure to read this manual and strictly adhere to the instructions.

Keep this manual at hand for quick reference as required.

©NEC Corporation 2006

This manual cannot be duplicated or revised without permission from NEC Corp. The contents of this manual may be changed without prior notice.

NEC Corporation

Notes on export

This product (including software) may be classified into the cargo (or service) to which the Foreign Exchange and Foreign Trade Control Law is applied.

If this is the case, an export permit issued by the Government of Japan is required.

If you need materials to help go through the process of applying for an export permit, consult your delivery agent or the nearby NEC branch office.

Compliance with the criteria of Voluntary Control Council for Interference by Information Technology Equipment

This product is class A information technology equipment specified by the Voluntary Control Council for Interference by Information Technology Equipment (VCCI).

Use of this product in home environments may cause interference.

In this case, the user may be asked for taking appropriate preventive actions.

Compliance with the Harmonic Current Emissions Guideline

This product is in compliance with the Harmonic Current Emissions Guideline for home appliance and general purpose appliance notices by METI.

	Disposing of your used NEC product
	Disposing	of	your	used NEC
In the European Union
In the European Union
EU-wide legislation as implemented in each Member State requires that
EU-wide legislation as implemented in each Member State
used electrical and electronic products carrying the mark (left) must be
that used electrical and electronic products carrying theleft)
disposed of separately from normal household waste.
must be disposed of separately from normal household
When you dispose of such products, please follow the agreements made
When	you dispose	of	such	products, please follow the
by between you and NEC.

made by betwe n you and
The mark on the electrical and electronic products only applies to the
currentThe maEuropeank on Unionthe electricalMember Statesand electronic.	products onlyto the
Outsidecurrentthe Europeanpean UnionUnion Member

If you wish to dispose of used electrical and electronic products outside

Outside the European

the European Union, please contact your local authority and ask for the
If you wish to dispose of used electrical and electronics
correct method of disposal.	contact your local
outside the European Union, please
and ask for the correct method	of

■ PL DESCRIPTION FOR OPERATIONAL MANUAL

zINSTRUCTION FOR PRESERVATION OF THIS MANUAL

NOTE:

Read this manual carefully before using the unit. Keep this manual nearby as a handy reference and refer to the “CAUTION” and

“WARNING” statements whenever necessary.

zNOTICE OF REVISION UP

NOTE:

This manual might be revised without any announcement in the near future.

ii

z SAFETY PRECAUTIONS

SAFETY PRECAUTIONS

Before using this unit, read this manual carefully and keep these instructions in order to use this u nit safely and correctly and to avoid injury and damage to properties. Keep this manual handy for easy reference.

The following symbols are used in this manual to help you easily understand how to operate the u nit safely and correctly.

Indicate there is a risk of death or serious

WARNING wound.

CAUTION Indicate there is a risk of burn or injury.

Risks and necessary actions to reduce risks are indicated individually by the following symbols.

Indicates the risk of smoke emission or fire outbreak.

Indicates the risk of explosion.

Indicates the risk of electric shock.

Indicates the danger of an injury due to harmful material.

Indicates prohibition of disassembling or reconfiguring the unit.

Indicates notice of general prohibition.

Indicates required general actions for operators.

Indicates instructions to pull power plug from outlet and to turn Off main circuit breaker.

iii

zCAUTION AND WARNING DESCRIPTION WHEN UNIT IS OPERATING

WARNING

DO NOT TRY TO ACCESS INSIDE THE UNIT.

Only service personnel is allowed to open the door.

Never disassemble, repair or reconfigure the unit yourself. While the door is opened by service personnel for maintenance, do not touch nor access the inside of the unit, otherwise you may suffer an electrical shock or become injured .

DO NOT PUT FOREIGN SUBSTANCES INSIDE THE UNIT.

Do not insert a foreign substance, such as a wire or other metal object through a ventilation opening, or any other openings for that matter.

Foreign substances may cause a fire to break out or cause an electrical shock.

ACTION TO BE TAKEN DURING UNIT MALFUNCTIONIN

In case of malfunctioning, turn off the circuit breaker immediately and contact authorized service personnel.

ACTION TO BE TAKEN IN AN EMERGENCY SITUATION.

The EPO switch can be used in an emergency situation when there is danger present and the main power switch needs to be disconnected immediately. Because data will be lost or damaged when this occurs, employees to be forewarned . For additional details, please contact NEC Sales Personnel.

iv

CAUTION

HANDLING THE LITHIUM BATTERY

A lithium battery is used in this unit. Incorrect exchange of the lithium battery Could result in an explosion. The same type or an equivalent type of the battery is recommended by the manufacturer. Contact beforehand an authorized NEC service personnel before exchanging or disposing of the lithium battery.

HANDLING THE LASER PRODUCTS

Class 1 laser product which is complied with JISC6802 ,EN60825 ,IEC825 and FDA 21CFR chapter1, subchapter J is used in this unit.

NOTE: Class 1 laser product is regarded safety emission lebel for the body, stated in JISC6802 ,EN60825 ,IEC825 and FDA 21CFR .

If there is an adjustment which can affect the laser emission power level, don’t touch or adjust without authorized NEC service personnel’s permission, otherwise harmful laser may be emitted and you will be exposed .

This marking is put on this unit.

1

CLASS 1 LASER PRODUCT PER IEC825

LASER KLASSE 1 NACH IEC825

PRODUCTO LASER DE CLASE 1

Complies with 21CFR chapter 1, Subchapter J

HANDLING THE DAMAGED LIQUID CRYSTAL DISPLAY

A liquid crystal display is used in this unit.

When handling the damaged liquid crystal display, be careful to take care and avoid exposure of the liquid on the inside of the liquid crystal display.

The liquid can cause bodily harm. In the event the liquid is ingested, gargle at once and consult a doctor immediately.

If the liquid should come in contact with the skin, or get into the eyes, wash the skin with cool running water, or flush the eye with cool running water for at least 15 minutes and consult a doctor.

"HANDLING DISPOSAL OR RECYCLING OF EQUIPMENT

Please let our salesperson or dealer know when discarding or recycling unit."

v

■ PL BESCHREIBUNG FÜR DAS BENUTZERHANDBUCH

zHinweise zur Aufbewahrung dieses Handbuchs

Hinweis:

Lesen Sie dieses Handbuch vor Gebrauch des Gerätes sorgfältig durch. Heben Sie dieses Handbuch an einen sicheren Ort auf, und schlagen - wenn immer nötig - bei den mit "WARNUNG" und "VORSICHT" markierten Hinweisen nach.

zHinweis zur Überarbeitung (des Handbuchs)

Hinweis:

“Änderungen im Benutzerhandbuch bleiben ohne vorherige Ankündigung vorbehalten”

vi

zSicherheitshinweise

Sicherheitshinweise

Vor Ingebrauchnahme des Geräts lesen Sie diese Bedienungsanleitung sorgfältig durch und beachten Sie die Vorsichtsmaßnahmen, um das Gerät sicher und ordnungsgemäß zu benutzen und Schäden an Personen und Eigentum zu vermeiden. Bewahren Sie die Anleitung zur späteren Bezugnahme auf. Die folgenden Symbole werden in dieser Bedienungsanleitung benutzt, so daß Sie leicht verstehen können,

wie das Gerät sicher und ordnungsgemäß zu bedienen ist.

	Warnung	Diese Kennzeichnung verweist auf eine Gefahr, die zu
		schweren Personenschäden oder Tod führen kann.
	Vorsicht	Diese Kennzeichnung verweist auf eine Gefahr, die zur
		Verletzung von Personen und Feuer führen kann.

Gefahren und Vorsichtsmaßnahmen sind durch die folgenden Symbole entsprechend gekennzeichnet

Dieses Zeichen warnt vor Rauch und Feuergefahr.

Dieses Zeichen warnt vor Explosionsgefahr.

Dieses Zeichen warnt vor Stromschlaggefahr.

Dieses Zeichen warnt vor Verletzungsgefahr durch Schadstoffe.

Dieses Zeichen warnt vor verbotener Zerlegung und Zusammenbau des Geräts.

Dieses Zeichen zeigt ein generelles Verbot an.

Dieses Zeichen zeigt grundsätzliche Maßnahmen für den

Benutzer an.

Dieses Zeichen zeigt an, den Netzstecker aus der Steckdose zu ziehen und den Leistungsschalter auszuschalten.

zVorsichtsund Warnhinweise während der Benutzung des Geräts

vii

WARNUNG

Versuchen Sie nicht, sich Zugang zu dem Geräteinneren zu verschaffen

Nur dem Fachpersonal ist es gestattet, die Tür zu öffnen. Das Gerät niemals zerlegen, reparieren oder verändern. Wenn die Tür vom Fachpersonal für Wartungsarbeiten geöffnet wurde, berühren Sie niemals

das Geräteinnere oder verschaffen Sie sich niemals Zugang zum Geräteinneren. Andernfalls können Sie einen elektrischen Stromschlag erleiden oder werden durch unsachgemäßen Betrieb des Geräts verletzt .

Keine Fremdkörper in das Geräteinnere einführen .

Führen Sie keine Fremdkörper wie Draht oder Leitungen durch Lüftungsöffnungen oder durch andere Öffnungen ein. Fremdkörper können Feuer oder elektrischen Schlag verursachen .

Maßnahmen bei Betriebsstörungen des Geräts .

Bei Betriebsstörungen schalten sie sofort den Hauptschalter aus und benachrichtigen Sie den zuständigen Kundendienst.

Maßnahmen bei einem Notfall

Im Notfall den Notausschalter betätigen, wenn eine Gefahr besteht und die Stromversorgung unverzüglich unterbrochen werden muß. Für zusätzliche Informationen kontaktieren Sie bitte

die NEC Vertriebsabteilung.

viii

VORSICHUT

Handhabung der Lithiumbatterie

In diesem Gerät wird eine Lithiumbatterie verwendet. Unsachgemäßer Austausch der Batterie kann zur Explosion führen. Es wird empfohlen, den gleichen oder ähnlichen Typ der Batterie zu verwenden. Vor Austausch und Entsorgung der Lithiumbatterie setzen Sie sich mit dem zuständigen NEC-Kundendienst in Verbindung.

Handhabung von Laserprodukten

Dieses Gerät ist ein Klasse 1 Laserprodukt, das der JISC6802, EN60825, IEC825 und FDA 21CFR Kapitel 1, Unterkapitel J entspricht.

Hinweis:

Laserstrahlung der Klasse 1 gilt als ungefährlich, auch wenn der Benutzer dieser direkt ausgesetzt ist. Falls Sie sich Zugang zu Einstelleinrichtungen verschaffen, die die Laserstrahlung verändern können, berühren oder verstellen

Sie diese Elemente niemals ohne Erlaubnis des zuständigen NEC

Kundendienstes. Veränderungen können zum Austritt gefährlicher Laserstrahlung führen, der Sie ausgesetzt und durch die Sie verletzt werden können.

Dieses Hinweisschild ist auf dem Gerät angebracht:

1

CLASS 1 LASER PRODUCT PER IEC825

LASER KLASSE 1 NACH IEC825

PRODUCTO LASER DE CLASE 1

Complies with 21CFR chapter 1, Subchapter J

ix

Handhabung von beschädigten Flüssigkristallanzeigen (LCD-Anzeige)

Eine Flüssigkristallanzeige wird in diesem Gerät verwendet.

Gehen Sie sorgfältig mit einer beschädigten Flüssigkristallanzeige um und vermeiden Sie den direkten Hautkontakt mit der auslaufenden Flüssigkeit der Flüssigkristallanzeige.

Die Flüssigkeit kann Gesundheitsschäden verursachen. Wenn Ihr Mund mit der Flüssigkeit in Berührung kommt, gurgeln Sie

sofort mit frischen Wasser und verständigen Sie umgehend einen Arzt. Wenn Ihre Haut oder Ihre Augen mit der Flüssigkeit in Berührung kommt, waschen Sie die Haut mit kalten fließenden Wasser, spülen Sie die Augen mit kalten fließenden Wasser für mindestens 15 Minuten. Konsultieren Sie umgehend einen Arzt.

" Handhabung des gebrauchten Equipments und Recycling "

Unsere Verkäufer oder Händler müssen über die Entsorgung oder Verwertung des Geräts informiert werden.

x

■ PL DESCRIPTION FOR OPERATIONAL MANUAL FRENCH

z INSTRUCTION FOR PRESERVATION OF THIS MANUAL

NOTE:

Read this manual carefully before using the unit. Keep this manual nearby as a handy reference and refer to the “CAUTION” and

“WARNING” statements whenever necessary.

zNOTICE OF REVISION UP

NOTE:

This manual might be revised without any announcement in the near future.

xi

zMESURES DE SÉCURITÉ

MESURES DE SÉCURITÉ

Avant d’utiliser cette unité, lire attentivement ce manuel et prendre les précautions qui y sont indiquées, afin d’éviter tout risque de dommage physique ou matériel.

Conserver ce manuel afin de pouvoir le consulter chaque fois que cela s’avèrera nécessaire. Les symboles ci-dessous sont utilisés afin

que les interventions soient correctement réalisées dans les meilleures conditions de sécurité.

DANGER

Signale un danger de mort ou de blessure grave.

ATTENTION

Signale un risque de brûlure ou de bless ure.

Chacun des risques et les actions nécessaires visant à diminuer ces mêmes risques sont signalés par les symboles suivants.

Signale un risque d’émission de fumée ou d’un début d’incendie.

Signale un risque d’explosion.

Signale un risque de commotion électrique.

Signale un risque de blessure due à une matière dangereuse.

Signale l’interdiction de démontage ou de reconfiguration de l’unité.

Indique la notification de prohibition générale.

Indique l’action nécessaire d’un opérateur.

xii

Indique qu’il fault débrancher l’unité et éteindre l’interrupteur principal.

DANGER!

Ne pas accéder à l’intérieur de l’unité.

Seul le personnel qualifié est autorisé à ouvrir la porte.

Ne pas désassembler, réparer ni remodeler cette unité. Lorsqu’une personne autorisée à ouvert la porte pour effectuer une opération de maintenance, ne pas toucher ou accéder à l’intérieur de l’unité. Autrement, vous risquez un choc électrique ou autre blessure suite à une opération anormale.

N’introduisez aucun corps étranger à l’intérieur de l’unité.

Ne faîtes passer aucun corps étranger, comme un fil de fer ou autre objet en métal à travers la fenêtre de ventilation ou dans toute autre ouverture.

Un corps étranger peut causer un début d’incendie ou une commotion électrique.

Que faire en cas de mauvais fonctionnement?

En cas de mauvais fonctionnement, actionner l’interrupteur coupe-circu it immédiatement et contacter le service de maintenace.

Que faire en cas d’urgence?

Lorsqu’un danger se présente et nécessite une interruption du courant, utiliser l’interrupteur EPO. Il est possible que cela ait pour effet la perte ou l’endommagement des données. Par conséquence, prévenez vos employés de ce danger.

Pour plus d’informations, contacter le personnel de NEC.

xiii

ATTENTION!

Manipulation de la pile au lithium Cette unité utilise une pile au lithium.

Lorsque la pile est usée, remplacez-la par une autre de même type ou de type équivalent. Autrement, vous risquez de subir une explosion dans l’unité.

Avant de remplacer ou de jeter cette pile, ou bien de jeter l’unité, contacter le service de maintenance.

Manipulation des produits laser

Cette unité contient un produit laser de classe 1, en conformité avec JISC6802,EN60925,IEC825 et FDA 21 CFR chapitre1, section J. La class e 1 signifie que le niveau d’emissions contre le corps humain est conf orme aux règles enonciées dans JISC6802,EN60925,IEC825 et FDA 21 CFR. L’étiquette ci-dessous est affixée à l’unité.

Si un ajustment est nécessaire, seul le personnel de service de NEC est autorsé à controler le niveau d’ émissions laser. Si vous tentez de le faire vous- même, vous risquez de vous exposer à des émissions laser dangereuses.

Cett mention est marquée sur l’unité

CLASS 1 LASER PRODUCT PR IEC825 LASER KLASSE 1 NACH IEC825 PRODUCTO LASER DE CLASE 1

Complies with 21CFR chapter 1, Subchapter J

xiv

Manipulation d’un écran à crystaux liquides déterioré

Cette unité contient un écran à crystaux liquides.

Lors de la manipulation d’un écran à crystaux liquides déterioré, pren ez garde à ne pas être en contact avec le liquide contenu dans l’unité

.

Ce liquide est dangereux pour le corps humain.

En cas d’absoption, effectuer des gargarismes et consulter un docteur. Si le liquide vient en contact avec la peau, ou si le liquide pénètre dans l’oeil, rincer immédiatement et abondamment la peau ou l’oeil pen dant au moins 15 minutes et consulter un docteur.

MANIPULATION ET RECYCLAGE DU MATÉRIEL USAGÉ

Merci d'informer notre commercial ou notre revendeur lors de toute opération de manipulation ou de recyclage de cette pièce.

xv

The labels listed below are attached to the cabinet of this system.

Read the explanation of each label carefully before operating the system.

133–300656–GRP

MARKINGS

001

WARNING:See operation Manual for a List of Equipment to be used with the rack. AVERTISSEMENT:Voyez au mode d'emploi fourni, pour un liste des materiels quels peuvent

utiliser avec l'appareil.

033,

WARNING:Confirm there is sufficient output voltage of power distribution from the outlet box before mounting units.

AVERTISSEMENT:Avant la installation des materiels, confirmez que la tension de sortie au socle de raccordement au reseau est suffisante.

103

MASS>	18kg
	40 lbs

CAUTION:For continued protection against risk

of fire, replace only with same type and ratings of fuse. ATTENTION:Pour une protection continue contre l'incendie,remplacer les fusibles par ceux de meme type et de meme amperage.

HAZARD AREA:QUALIFIED SERVICE PERSONNEL

ONLY

DANGER:RESERVE SEULEMENT AU PERSONNEL

163

Install with arrow pointing upwards.

Monter de maniere a orienter la fleche vers le haut.

xvi

CAUTION:HIGH LEAKAGE CURRENT Grounding circuit continuity is vital for safe operation of machine

NEVER OPERATE MACHINE WITH GROUNDING CONDUCTOR DISCONNECTED.(see installation instruction)

ATTENTION:MACHINE a FORT COURANT de FUITE

NE JAMAIS FAIRE FONCTIONNER AVEC FIL DE TERRE DECONNECT.(voir instruction d'installation)

211

217

CAUTION:"Use Copper

Conductors only" ATTENTION:N'utilisez que

les conducteurs de cuivre

243( )

CAUTION:Disconnect input power before removing

this cover.

ATTENTION:Couper l'alimentation electrique avant de demonter ce capot.

416

CAUTION:

PULL OUT STABILIZER WHEN MAINTAINING.

ATTENTION:

TIRER LE STABILISIEREN.

417

xvii

420

422

xviii

133-314121-GRP

MARKINGS

051

WARNING

Do not pull out more than one component at a time as it may cause damege to the rack or allow the rack to tip over.

052
				WARNING
			Always extract and install the stabilizers when pulling
			out ore unloading components from the rack. Operating on
			the rack without the stabilizers in place may cause
			damage to the rack or allow the rack to tip over.
053
				DANGER
			Alwaysinstallthestabilizers whennot boltingto the floor
			forseismic restraint.Operatingontherackor allow
			therack to tipover. Please readthe ServiceManual before
			installation.
055
				CAUTION
			Take care not to pinch your
			finger in the door.

xix

243-304367-GRP	MARKINGS
001

243-306629-GRP	MARKINGS
001

002

Note.

The cables supplied with this product are designed to be used solely for this product. Do not use them for other purposes.

Lithium Battery life is about 5 years. Replacement of the lithium battery (paid) is therefore required once every five years.

xx

Preface

This document explains how to operate the hardware of the basic processing system, the main body of the TX7/i9610, NX7700i/5080H-64, and NX7700i/5040H-32 systems. It is recommended that the related documents be read in order to make the best use of the above-mentioned systems.

Special techniques are necessary for installing and expanding the system. Please consult our sales personnel.

Rev. 1, May 2006

Notes:

(1)All rights reserved. This document cannot be reprinted or reproduced partly or entirely without permission from NEC Corp.

(2)The contents of this document may be changed at any time without prior notice.

xxi

Contents

■ PL DESCRIPTION FOR OPERATIONAL MANUAL....................................................................				ii
■ PL BESCHREIBUNG FÜR DAS BENUTZERHANDBUCH ........................................................				vi
■ PL DESCRIPTION FOR OPERATIONAL MANUAL FRENCH ...........................................				xi
CHAPTER 1			System Overview..................................................................................................	1-1
1.1. Configuration and Specifications of the Base Module ...............................................				1-2
1.2.	Expandability.......................................................................................................................			1-8
1.2.1.		Adding Processors......................................................................................................		1-8
1.2.2.		Expanding Memory Capacity.....................................................................................		1-8
1.2.3.		Adding Cells.................................................................................................................		1-8
1.2.4.		Adding I/O Enclosures ...............................................................................................		1-8
1.2.5.		Adding I/O Modules ....................................................................................................		1-8
1.2.6. Adding iSPs (Service Processors) (Duplicated Configuration) ...........................				1-8
1.2.7.		Adding Peripheral Units.............................................................................................		1-9
CHAPTER 2			BASE MODULE .....................................................................................................	2-1
2.1.	Partition Function...............................................................................................................			2-2
2.2. Name and Function of Components ..............................................................................				2-3
2.2.1.		Main Cabinet (Primary Cabinet)................................................................................		2-3
2.2.2.		Expansion Cabinet (Additional Cabinet) .................................................................		2-3
2.2.3.		Cell	.................................................................................................................................	2-3
2.2.4.		Crossbar Interconnect ................................................................................................		2-3
2.2.5.		CLK Card ......................................................................................................................		2-3
2.2.6.		I/O Enclosure ...............................................................................................................		2-3
2.2.7.		I/O Module ....................................................................................................................		2-7
2.2.8.		Power Bay ....................................................................................................................		2-8
2.2.9.		iSP..................................................................................................................................		2-9
2.2.10.		DVD-ROM Unit ........................................................................................................		2-10
	2.2.10.1.		Loading and Unloading Media .........................................................................	2-10
	2.2.11.		DAT Unit ..............................................................................................................	2-11
	2.2.11.1.		Location of Index Labels..................................................................................	2-11
	2.2.11.2.		Notes on Index Labels......................................................................................	2-11

xxii

	2.2.11.3.		Preventing Accidental Erasure of Data ..........................................................	2-11
	2.2.11.4.		Cleaning the DAT Unit ......................................................................................	2-12
	2.2.11.5.		Cleaning Schedule..............................................................................................	2-12
	2.2.11.6.		Cleaning Medium for the DAT Unit ................................................................	2-12
	2.2.11.7.		Life of Data Cartridge (Tape) for the DAT Unit ...........................................	2-13
	2.2.11.8.		Handling of the DAT Unit.................................................................................	2-13
	2.2.11.9.		Location of the DAT Unit .................................................................................	2-13
	2.2.11.10. Loading and Unloading Digital Audio Tapes ..............................................			2-13
2.2.12.			AC SW .....................................................................................................................	2-15
2.3.	Consoles ............................................................................................................................			2-16
2.3.1.		SP Console.................................................................................................................		2-16
2.4.	Service Processor (SP) ...................................................................................................			2-19
2.4.1. Console Connection and Login..............................................................................				2-19
	2.4.1.1.		Type of Console Connections .........................................................................	2-19
	2.4.1.2.		Accessible Console Functions.........................................................................	2-19
	2.4.1.3.		Console Status and Login Authentication.....................................................	2-20
	2.4.1.4.		Login and Main Menu .......................................................................................	2-22
2.4.2.		Note .............................................................................................................................		2-24
2.4.3.		OS (BIOS) Console ...................................................................................................		2-25
2.4.4.		Virtual SOP.................................................................................................................		2-27
	2.4.4.1.		Details of Partition Status Display..................................................................	2-29
2.4.5.		SP Command Console .............................................................................................		2-30
	2.4.5.1.		SP Command Console Buffer ..........................................................................	2-31
	2.4.5.2.		SP Command Prompt ........................................................................................	2-31
	2.4.5.3.		SP Message Header...........................................................................................	2-31
	2.4.5.4.		SP Command List ..............................................................................................	2-32
2.4.6.		SP Command Reference ..........................................................................................		2-35
	2.4.6.1.		DF (Shut down System Power <override>) ...................................................	2-36
	2.4.6.2.		DN (Shut down System Power).......................................................................	2-38
	2.4.6.3.		DP (System Dump).............................................................................................	2-39
	2.4.6.4.		DT (SP Data and Time).....................................................................................	2-40
	2.4.6.5.		EN (Environmental Information).......................................................................	2-41
	2.4.6.6.		FV (Firmware Versions).....................................................................................	2-47
	2.4.6.7.		HC (Hardware Configuration) ...........................................................................	2-48
	2.4.6.8.		HE (Help)..............................................................................................................	2-74
	2.4.6.9.		ML (Message Log)..............................................................................................	2-75
	2.4.6.10.		PC (Power Cycle) ...............................................................................................	2-77
	2.4.6.11.		RS (Cold Reset System) ...................................................................................	2-78
	2.4.6.12.		SG (SP/System Setting).....................................................................................	2-79
	2.4.6.13.		SR (Save System CMOS/NvRAM) ....................................................................	2-90

xxiii

	2.4.6.14.		UB (Bring up BIOS) ...........................................................................................	2-92
	2.4.6.15.		UP (Bring up System) .......................................................................................	2-93
CHAPTER 3			Operation Procedure ............................................................................................	3-1
3.1.	System Startup ...................................................................................................................			3-1
3.1.1.		System Startup Procedure.........................................................................................		3-1
3.1.2.		SP Console Messages................................................................................................		3-6
3.2.	System Shutdown ..............................................................................................................			3-8
3.2.1.		System Shutdown Procedure....................................................................................		3-8
3.2.2.		SP Console Messages..............................................................................................		3-11
3.3. Emergency System Shutdown with AC SW................................................................				3-12
3.4.	AC-LINK (Auto Control)...................................................................................................			3-12
3.5.	OS Boot .............................................................................................................................			3-14
3.5.1. OS Boot with Boot Manager (Before Installing the OS) ...................................				3-14
3.5.2. OS Boot from the EFI (Extensible Firmware Interface) Boot Manager...........				3-15
3.5.3.		EFI Shell .....................................................................................................................		3-16
3.5.4.		EFI Shell Commands ................................................................................................		3-16
3.5.5. OS Boot from EFI Shell...........................................................................................				3-19
3.5.6.		EFI Devices ................................................................................................................		3-21
3.5.7.		EFI Boot Option Maintenance.................................................................................		3-24
	3.5.7.1.		Boot from a File.................................................................................................	3-26
	3.5.7.2.		Add a Boot Option ............................................................................................	3-27
	3.5.7.3.		Add Boot Option(s)............................................................................................	3-28
	3.5.7.4.		Change Boot Order............................................................................................	3-28
	3.5.7.5.		Manage BootNext Setting .................................................................................	3-29
	3.5.7.6.		Set Auto Boot Timeout .....................................................................................	3-30
	3.5.7.7.		Setting the Network Boot .................................................................................	3-31
	3.5.7.8.		Changing BIOS Settings ...................................................................................	3-33
3.6.	System Dump ...................................................................................................................			3-35
CHAPTER 4			Troubleshooting ....................................................................................................	4-1
4.1.	Troubleshooting..................................................................................................................			4-1
CHAPTER 5			Notes on Handling ...............................................................................................	5-1
5.1.	Transportation.....................................................................................................................			5-1

xxiv

5.2. DVD-ROM/CD-ROM .............................................................................................................		5-1
5.3.	Digital Audio Tape .............................................................................................................	5-1
5.4.	Cleaning ...............................................................................................................................	5-2
5.5.	Notes on Installation .........................................................................................................	5-3

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System Overview

CHAPTER 1 System Overview

The TX7/i9610, NX7700i/5080H-64, and NX7700i/5040-32 systems are the servers that implement the following by using the high performance Intel Itanium2 processor:

•High processing capability

•Open system using the industry standard architecture

•Advanced system management and RAS function

•High system expandability with a host of optional products

(a) Perspective View (Front)

(b) Perspective View (Rear)

Figure 1-1 External Views of the Main Cabinet

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System Overview

1.1.Configuration and Specifications of the Base Module

The base module of this system is composed of the following hardware components:

−CELL

Can install one to four Intel Itanium2 processors.

The minimum required memory capacity is 2GB and can be expanded up to 128GB.

−Crossbar Interconnect Contains:

Interface to the cell (3.2Gbps interface) x 8

Interface to other Crossbar Interconnect (3.2Gbps interface) x 4 Interface to each of 2 I/O modules (2.4Gbps interface) x 4

−I/O ENCLOSURE

Can install up to 2 I/O modules.

−I/O MODULE Can contain:

Up to 8 PCI cards A DVD-ROM unit A DAT unit

Up to 4 HDDs (up to two HDDs when DAT is used)

−POWER BAY

Can contain up to 6 DPSs (AC/DC converters).

The iSP of the base module supports the following interfaces as standard equipment:

(1)10/100Base-TX Ethernet interface for the SP console

(2)Serial (RS-232C) interface for the SP console

Figure 1-2 shows the layout of parts in the Main Cabinet, Figure 1-3 the layout of parts in the Expansion Cabinet, and Table 1-1 lists the system specifications.

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System Overview

		AC SW
	iSP CARD
	CLK CARD	Crossbar
CPU CAGE		Interconnect
	CELL

I/O

ENCLOSURE

I/O MODULE

I/O

ENCLOSURE

POWER BAY	DPS
POWER BAY

(Front)

(Rear)

Figure 1-2 Layout of Parts in the Main Cabinet

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System Overview

I/O

ENCLOSURE I/O MODULE

I/O

ENCLOSURE

POWER BAY

DPS

POWER BAY

(Front)

Figure 1-3 Layout of Parts in the Expansion Cabinet

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System Overview

Table 1-1 Base Module Specifications

Main Cabinet

CPU CAGE

CELL (up to 8 cells can be installed in the cabinet)

	CPU
	Processor	Itanium2 processor (1.6GHz, 533MHz)
	Max. No. of processors	32 (up to 4 in one cell)
	Main memory
	Unit of expansion	2GB/4GB/8GB
	Capacity	2GB to 1TB

Crossbar Interconnect (up to 4 crossbar interconnects can be installed in the cabinet)

	Methodology	Crossbar switching
	Max. bandwidth	204.8GB/s (25.6GB/s per cell)

I/O ENCLOSURE (up to 2 I/O enclosures can be installed in the cabinet)

	I/O MODULE (up to 4 I/O modules can be installed in the cabinet)
		Max. No. of PCI slots	64 slots (133MHz)
		Max. I/O bandwidth	67GB/s
			One unit can be installed in each I/O module (up to 4 units in
		DVD-ROM unit	the cabinet)
			DVD-ROM/CD-ROM mode selection
			One unit can be installed in each I/O module (up to 4 units in
		DAT unit	the cabinet)
			DDS-4 4mm DAT unit
			Up to 4 units can be installed in each I/O module (two units
		Magnetic disk unit	when DAT is used)
			(Up to 16 units can be installed in the cabinet.)
			Selection from 73GB/146GB/300GB
POWER BAY (up to 2 units can be installed in the cabinet)
	DPS (up to 6 units can be installed)

*In NX7700i/5040H-32, the maximum number of processors defined is 16, and consequently up to 4 cells can be installed. According to this configuration, the number of I/O modules is also halved. Namely, it is a half system of NX7700i/5080H-64. Since the figures in the specifications are based on the maximum system configuration, those for NX7700i/5040-32 are not indicated.

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System Overview

	Table 1-1 Base Module Specifications (Cont’d)
Main Cabinet
Cabinet size/weight
	Width	600mm
	Height	1800mm
	Depth	1050mm (1070mm including the back door handle)
	Weight (in max. configuration)	545Kg
Power supply
	Voltage	Single-phase, 200 to 240V±10%
	Frequency	50/60Hz±1Hz
	Power consumption (in max.	13.2kVA
	configuration)
Environmental conditions
	Temperature
	Operating	+5°C to +32°C
	Storage	+5°C to +45°C
	Humidity
	Operating	20% to 80% (no condensation)
	Storage	8% to 80% (no condensation)

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System Overview

Table 1-1 Base Module Specifications (Cont’d)

Expansion Cabinet

I/O ENCLOSURE (up to 2 I/O enclosures can be installed in the cabinet)

I/O MODULE (up to 4 I/O modules can be installed in the cabinet)

	Max. No. of PCI slots	64 slots (133MHz)
	Max. I/O bandwidth	67GB/s
		One unit can be installed in each I/O module (up to 4 units in
	DVD-ROM unit	the cabinet)
		DVD-ROM/CD-ROM mode selection
		One unit can be installed in each I/O module (up to 4 units in
	DAT unit	the cabinet)
		DDS-4 4mm DAT unit
		Up to 4 units can be installed in each I/O module (two units
	Magnetic disk unit	when DAT is used)
		(Up to 16 units can be installed in the cabinet.)
		Selection from 73GB/146GB/300GB

POWER BAY (up to 2 units can be installed in the cabinet) * The power bay is not installed in some expansion cabinet.

DPS (up to 6 units can be installed)

Expansion Cabinet

Cabinet size/weight

	Width	600mm
	Height	1800mm
	Depth	1050mm (1070mm including the rear door handle)
	Weight (in max. configuration)	330kg
Power supply
	Voltage	Single-phase, 200 to 240V±10%
	Frequency	50/60Hz±1Hz
	Power consumption	1.9kVA
Environmental conditions
	Temperature
	Operating	+5°C to +32°C
	Storage	+5°C to +45°C
	Humidity
	Operating	20% to 80% (no condensation)
	Storage	8% to 80% (no condensation)

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System Overview

1.2.Expandability

This section explains the expandability of this system and available configurations.

CAUTION Contact the maintenance personnel of NEC to replace or upgrade the system.

1.2.1.Adding Processors

At least one processor is required in the main cabinet. Using the CPU expansion feature, the Itanium2 processor can be added one by one. Up to four processors can be installed for each cell. To install more than four processors, the cell must be added first using the cell expansion feature. A maximum of 32 processors can be installed in the main cabinet.

1.2.2.Expanding Memory Capacity

The minimum required memory capacity in the main cabinet is 2GB. This memory capacity can be expanded up to 128GB for each cell. This means a maximum of 1TB of memory can be installed in the main cabinet.

2GB, 4GB and 8GB memories are supported at present. For other memories, inquire the sales personnel of NEC.

1.2.3.Adding Cells

At least one cell is required in the main cabinet. For system expansion, such as the addition of processors, the cell must be added first using the cell expansion feature. Up to 8 cells can be installed in the main cabinet.

1.2.4.Adding I/O Enclosures

At least one I/O enclosure is required in the main cabinet. A maximum of two enclosures can be installed in the main and expansion cabinets, respectively.

1.2.5.Adding I/O Modules

At least one I/O module is required in the main cabinet. It is contained in the I/O enclosure. A maximum of four I/O modules can be installed in the main and expansion cabinets, respectively.

The device bay contained in the I/O module is able to accommodate up to four magnetic disk units. 73GB, 146GB and 300GB HDD units are supported at present. For other HDD units, inquire the sales personnel of NEC.

1.2.6.Adding iSPs (Service Processors) (Duplicated Configuration)

An iSP (service processor) is installed in the main cabinet as standard equipment. A maximum of two iSPs can be installed in the main cabinet.

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System Overview

1.2.7.Adding Peripheral Units

The iSP is installed in the base module to satisfy various customer’s requirements for system configurations. The system is designed to connect a wide variety of peripheral units through this iSP. Peripheral units can also be connected through various types of PCI cards available on the I/O module.

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System Overview

Main Cabinet

	Memory can be increased
	from 2GB up to 128GB per
	cell.
Itanium2
		SP Console
CELL	RS232C(Console)	(Standard)
		LAN for server
I/O ENCLOSURE	Ethernet cable	management
		Interface

		10/100Base - TX
			Expansion Cabinet
	DVD-ROM UNIT		I/O ENCLOSURE
		2.4G Interface
	N
	E
	C
	DAT UNIT
I/O MODULE
			DVD-ROM UNIT
I/O ENCLOSURE			N
			E
			C
			DAT UNIT
			I/O MODULE
		2.4G Interface	I/O ENCLOSURE
	DVD-ROM UNIT
	N
	E
	C
	DAT UNIT
I/O MODULE			DVD-ROM UNIT
			N
			E
			C
			DAT UNIT
			I/O MODULE
POWER BAY
			POWER BAY

Figure 1-4 System Configuration Diagram

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Base Module

CHAPTER 2 BASE MODULE

This chapter covers operations required on the base module of this system.

Locking/unlocking the cabinet

Front door

Back door

Figure 2-1 Doors of System Cabinet

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Base Module

2.1.Partition Function

The base module of this system has the partition function which enables the system to operate as if multiple units are present on one unit.

The system is capable of partitioning in units of the cell or I/O module within the same base module. For example, in a system consisting of four cells and three I/O modules, partitioning shown in Figure 2-2 is possible.

Note that each partition should contain at least one cell card and one I/O module (including the core module).

The partition structure in the base module can be changed with the “hc” command of the SP command. (For details of the SP command, see 2.4.6 SP Command Reference.)

		Partition #0
	CELL	CELL
		8-CPU SMP
		configuration
	Itanium2	under the
		same OS.*1

I/O MODULE

Partition #1	Partition #2
CELL	CELL

Under OS#0 Under OS#1 Under OS#2

*1: SMP stands for Symmetric Multi-Processors.

Figure 2-2 Image of Partitions

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Base Module

2.2.Name and Function of Components

2.2.1.Main Cabinet (Primary Cabinet)

The main cabinet contains the cells, crossbar interconnects, iSP cards, CLK cards, I/O enclosures, I/O modules, power bays, and DPSs. For the mounting location of these components, see Figure 1-2 in Section 1.1.

2.2.2.Expansion Cabinet (Additional Cabinet)

The expansion cabinet contains the I/O enclosures, I/O modules, power bays, and DPSs. For the mounting location of these components, see Figure 1-3 in Section 1.1. Some expansion cabinets do not contain the power bay. Peripheral units are installed in such cabinets.

Mount the expansion cabinet containing the power bay at the left side of the main cabinet viewed from the front. The expansion cabinet which does not contain the power bay can be installed in either the left or right side of the main cabinet.

2.2.3.Cell

A cell consists of up to four processors, a CPU node controller, a memory controller, and main memory. The minimum 2GB to maximum 128GB can be installed for the main memory by combining the MEM cards. At least one cell is required in the main cabinet. A maximum of eight cells can be installed.

2.2.4.Crossbar Interconnect

The crossbar interconnect is connected to other crossbar interconnect for data transmission between cells. It can connect to one to four I/O modules for data transmission between the cell and I/O modules. A maximum of four crossbar interconnects can be installed in the main cabinet.

2.2.5.CLK Card

The CLK card supplies the clock to the system. A system having high reliability can be constructed by duplicating the CLK card.

2.2.6.I/O Enclosure

The I/O enclosure contains two PCI bays each mounting one I/O module. Up to two I/O enclosures can be installed in the main and expansion cabinets, respectively.

Figure 2-3 shows the external view of the I/O enclosure, and Figure 2-4 the look of the I/O enclosure with the filter cover removed. PCIBAY numbers in the main cabinet are shown in Figure 2-5, and those in the expansion cabinet in Figure 2-6.

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Base Module

Filter cover

Hand screw

Figure 2-3 I/O Enclosure

I/O modules are mounted.

DAT

DVD

PCIBAY

PCIBAY

Figure 2-4 I/O Enclosure (A View without the Filter Cover)

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Base Module

PCIBAY2	PCIBAY3
PCIBAY0	PCIBAY1

Figure 2-5 PCIBAY Numbers in the Main Cabinet

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Base Module

PCIBAY6		PCIBAY7
PCIBAY4		PCIBAY5

Figure 2-6 PCIBAY Numbers in the Expansion Cabinet

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2-6

Base Module

2.2.7.I/O Module

The I/O module is connected to the crossbar interconnect via two 2.4Gbps interface cables. It has eight PCI slots compatible with 133MHz PCI-X bus, allowing up to eight PCI cards to be mounted. To support standard option I/O interface, one base IO card can be mounted.

The PCI card can be inserted or taken out in online mode (hereafter called the “hot swap”) with some exceptions. Consequently, the base module need not be shut down or rebooted each time the PCI card is added or replaced. High availability is achieved with this implementation (note that the OS that supports this implementation is required).

One core module or HDD module is mounted on the I/O module. At least one core module is required for each partition.

A DVD-ROM unit is installed in the I/O module as standard equipment. In addition, a DAT unit and up to four 73GB/146GB/300GB magnetic disk units can be installed as optional units.

At least one I/O module is required for the main cabinet. A maximum of four I/O modules can be installed in the main and expansion cabinets, respectively.

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Base Module

2.2.8.Power Bay

The power bay supplies power to the system. A power bay can contain up to six DPSs (device power supplies with a fan). Figure 2-7 shows the power bay, and Figure 2-8 the DPSs.

CB for AC power

For AC SW

DPS	For CPU CAGE power For I/O ENCLOSURE power

Figure 2-7 Power Bay

Figure 2-8 DPS (Perspective Views)

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Base Module

2.2.9.iSP

One iSP-M card is mounted on the base module of the system as standard equipment. It contains the following interfaces:

1)10/100Base-TX Ethernet interface (x1) for SP console

2)Serial (RS-232C) interface (x1) for SP console

Up to two iSP-M cards can be mounted on the main cabinet, but in this case, they are used in the duplicated configuration for increasing the reliability. Figure 2-9 shows the iSP-M card.

The iSP-D card is required when five or more I/O modules are used.

iSP POWER switch

iSP RESET button

iSP HALT button

LED

RS232C port (for SP console)

LED(100TX/ACT/LINK)

ETHER port

PCIBAY3 (I/O MODULE) port

PCIBAY2 (I/O MODULE) port

PCIBAY1 (I/O MODULE) port

PCIBAY0 (I/O MODULE) port

Figure 2-9 iSP-M Card (Side View)

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Base Module

2.2.10.DVD-ROM Unit

One DVD-ROM unit can be installed for each I/O module. A DVD-ROM unit is mounted on each I/O module in the main cabinet as standard equipment. The DVD-ROM and CD-ROM media can be used on the DVD-ROM unit.

2.2.10.1. Loading and Unloading Media

(1)Loading DVD-ROM/CD-ROM

1)Remove the front filter cover of the I/O enclosure (loosen the hand screw).

2)Push the Eject button lightly, and the tray pops out.

3)Place DVD-ROM/CD-ROM securely on the tray.

4)Push the Eject button lightly, and the tray goes back in the drive.

(2)Unloading DVD-ROM/CD-ROM

1)Be sure that the DVD-ROM drive access indicator LED (orange) goes off.

2)Push the Eject button lightly, and the tray pops out.

3)Take out DVD-ROM/CD-ROM.

CAUTION	Be careful not to touch the tray while it recesses in the drive
	unit to prevent hand injury.

Figure 2-10 Loading and Unloading DVD-ROM/CD-ROM

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Base Module

2.2.11.DAT Unit

A DAT unit can be mounted on the I/O module in the main or expansion cabinet as optional equipment.

2.2.11.1. Location of Index Labels

Figure 2-11 shows the location of index labels attached to the digital audio tape.

OFD!

Figure 2-11 Index Labels on the Digital Audio Tape

2.2.11.2. Notes on Index Labels

(1)Attach index labels properly as shown in 2.2.11.1. Be sure to write the start date on these labels.

(2)Change the labels when the DAT is used for other purpose. Remove the old labels before attaching the new labels.

(3)When using index labels other than those supplied by NEC, make sure that they are in the right size and easy to remove without remnant paste.

2.2.11.3. Preventing Accidental Erasure of Data

As shown in Figure 2-12, open the write protect slider next to the side label of the cartridge to prevent data on the DAT from being erased by accident. Write on the DAT is permitted by closing the write protect slider.

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Figure 2-12 Preventing Accidental Erasure of Data on DAT (Write Protect)

2.2.11.4. Cleaning the DAT Unit

Wipe off the dusts on the DAT unit. See 2.2.11.5 to 2.2.11.7 for how to clean the DAT unit.

2.2.11.5. Cleaning Schedule

How often the DAT unit should be cleaned depends on the operating environment. The table below will be of some help.

Frequency of using data cartridge	Cleaning schedule
Use of one cartridge per day	Once a week
Use of 2 to 3 cartridges per day	Twice a week
Use of more than 3 cartridges per day	Everyday

Cleaning is important to remove accumulated dust on the magnetic head caused by running tapes and surrounding environment. Periodic cleaning is recommended.

2.2.11.6. Cleaning Medium for the DAT Unit

The cleaning cartridge can be used approximately 50 times.

Clean the drive head with this cartridge before using the new data cartridge. It is recommended to clean the head prior to writing or reading the DAT. Clean the head once a month even though the DAT unit is not used.

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Base Module

2.2.11.7. Life of Data Cartridge (Tape) for the DAT Unit

The life of data cartridge according to the frequency of use is shown below. It may be shortened depending on the operating environment (temperature, humidity, dust, etc.).

Frequency of using data cartridge	Life
Once a week/volume	Approx. one year
Three times a week/volume	Approx. half a year
Everyday	Approx. three months

The data cartridge is worn out every time it is read or written. It should be noted that using the worn-out cartridge will cause trouble. To prevent trouble caused by aged deterioration, storage of the data cartridge should not exceed five years.

2.2.11.8. Handling of the DAT Unit

Keep the following in mind for proper operation of the DAT unit:

•Do not move the DAT unit with the cleaning or data cartridge loaded.

•Take out the cleaning or data cartridge before turning off the DAT unit.

•Do not leave the DAT unit for a prolonged period of time with the cleaning or data cartridge loaded.

2.2.11.9. Location of the DAT Unit

Avoid placing the DAT unit in the following locations as much as possible to prevent trouble in the DAT unit:

•Near the printer (to prevent toner or paper powder dusts)

•By the window or near the passage way (to prevent soil dusts)

•On the carpet (to prevent dust generation)

2.2.11.10. Loading and Unloading Digital Audio Tapes

How to load and unload a digital audio tape is explained below.

(1)Loading a digital audio tape

1)Remove the front filter cover of the I/O enclosure (loosen the hand screw).

2)Hold the DAT lengthwise with the DAT label oriented to the left, and insert it into the drive vertically and slowly.

3)Keep pushing the tape slowly until you feel it touching the stopper inside the drive and being locked in the drive. When the tape is locked, a clicking sound is heard.

(2)Unloading a digital audio tape

1)Be sure that the DAT drive access indicator LED (green) goes off.

2)Push the Eject button at the lower part of the DAT unit lightly.

3)The DAT slides out from the drive.

4)Take out the DAT from the drive vertically and slowly.

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Base Module

I/O MODULE

DAT slot

Main Cabinet

Figure 2-13 Loading and Unloading DAT

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