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4.Remove the screw from the core module access cover (see Figure 5-7).Lift and remove the cover.

A B

ACover Screw

BAccess Cover

Figure 5-7.Core Module Access Cover Screw

5.Access the board slots:

!Press and release both retaining pins at the ends of the support bracket cover and lift the cover away from the board support bracket (see Figure 5-8).

!Remove the slot cover.

Note: See the previous sections in this chapter to select the correct slot for your board type. Correct slot location can optimize board performance.

A A

B

ARetaining Pin

BSupport Bracket Cover

Figure 5-8.Core Module Bracket Cover

I/O Board Installation 5-9

6.Install the board in the slot.

7.Pivot the support bracket cover back into place and secure the pins in the bracket ends (see Figure 5-8).

8.Replace the access cover.

!Insert the cover tabs into the slots in the chassis frame.

!Press the cover to secure it. Replace the screw (see Figure 5-7).

9.Carefully press all four rail latches (two on each side) and slowly slide the chassis back into the cabinet (see Figure 5-9).Stop sliding if you feel resistance and check for pinched or pulled cabling at the rear of the cabinet.

! WARNING

Take care when releasing the latches and sliding the chassis to avoid pinching your fingers.

A

A Two Rail Latches (right side shown)

Figure 5-9.Main Chassis Rail Latches

10.Carefully and slowly slide the chassis all the way into the cabinet. Replace the six chassis screws (see Figure 5-6).

Note: If you need to connect any cables to the board, do so before sliding the chassis all the way into the cabinet. It might be easier to access board connectors with the chassis forward.

5-10I/O Board Installation

11.Connect any I/O board cable at the rear of the server.

! CAUTION

When connecting a cable to an I/O board, be sure to leave enough cable free for sliding the main chassis out of the cabinet. Route the cable so it does not get pinched or damaged.

12.Shut the front chassis door. Press firmly to secure it to the cabinet.

I/O Board Installation 5-11

Installing a Board in the PCIX Unit

Note: Before you install an I/O board, see the previous sections to choose the correct slot location for your board.

! CAUTION

Electrostatic discharge (ESD) and ESD protection. ESD can damage disk drives, boards, and other parts. We recommend that you wear an antistatic wrist strap attached to chassis ground (any unpainted metal surface) on your system when handling parts.

ESD and handling boards. Always handle boards carefully. They can be extremely sensitive to ESD. Hold boards only by their edges. After removing a board from its protective wrapper or from the system, place itcomponent-sideup on a grounded,static-freesurface. Use a conductive foam pad if available but not the board wrapper. Do not slide board over any surface.

Access covers, proper cooling and airflow. For proper cooling and airflow, always install access covers before turning on the system. Operating it without the covers in place can damage system parts.

Note: I/O boards arehot-pluggable.Installation does not require shutting down the system.

5-12I/O Board Installation

1.Check that the front stabilizer is in the pulled-outposition. If not, remove the screw securing the stabilizer and pull it out (see Figure5-10).

2.Remove the front bezel from the front of the PCIX unit by pulling it first from the bottom and then away from the top of the unit (see Figure 5-10).

B

A

AStabilizer

BPCIX Unit Front Bezel

Figure 5-10.Stabilizer and PCIX Unit Front Bezel

3.Remove the two screws (one on each side) securing the PCIX unit to the front of the cabinet (see Figure 5-11).

A

A Server Screws (2)

Figure 5-11.PCIX Unit Screws

I/O Board Installation 5-13

4.Carefully and slowly pull the PCIX unit out of the cabinet until the side rails lock (click) in place.

! CAUTION

Check that the cables at the rear of the chassis are free from being pinched or damaged when you slide the PCIX unit forward.

5. Lift and swing the PCIX unit PCI slot access cover open (see Figure5-12).

A

B

ACover Handles

BPCIX Unit PCI Slot Cover

Figure 5-12PCIX Unit PCI Slot Access Cover

5-14I/O Board Installation

6. Install the board in the appropriate slot.

Note: See the previous sections in this chapter to select the correct slot for your board type. Correct slot location can optimize board performance.

!Carefully remove the slot cover.

! WARNING

Take care when removing the slot cover. System power is on during this installation. Dropping a slot cover can create a short circuit, causing personal injury and damage to the system if the slot cover makes contact with a connector.

!Insert the board into the slot.

Figure 5-13PCIX Unit PCI Slots

7.Replace the access cover (see Figure 5-12).

!Swing the cover back over the slots.

!Press the cover down and check that the cover latches are secured.

! CAUTION

To prevent damage to the cover and chassis, check that the cover is secured and can clear the chassis when you slide the unit into the server.

I/O Board Installation 5-15

8.Carefully press two rail latches (one on each side) and slowly slide the PCIX unit back into the cabinet. Stop sliding if you feel resistance and check for pinched or pulled cabling at the rear of the cabinet.

! WARNING

Take care when releasing the latches and sliding the chassis to avoid pinching your fingers.

A

A Right Rail Latch

Figure 5-14PCIX Unit Rail Latches (right side shown)

9.Carefully and slowly slide the chassis all the way into the cabinet. Replace the two chassis screws (see Figure 5-11).

10.Connect any I/O board cable at the rear of the server.

! CAUTION

When connecting a cable to an I/O board, be sure to leave enough cable free for sliding the PCIX unit chassis out of the cabinet. Route the cable so it does not get pinched or damaged.

11.Replace the front bezel by first aligning it at the top of the unit and then pressing the bezel firmly against the unit to secure it.

5-16I/O Board Installation

6

Problem Solving

!Solving Simple Problems

!Troubleshooting the System

Solving Simple Problems

Some system problems are simple ones and easy to solve. Check the corrective actions to the general problems in the following table. If you still have a problem, record the conditions of the problem and contact your system administrator or NEC support personnel.

! WARNING

Some locations within the server have high voltage and therefore are very dangerous. To avoid risk of electric shock, turn off all server power and disconnect power cables.

The main power of your server is turned off by turning off the power distribution board or removing the power cable.

Before touching the parts in the server, wait for at least 10 to 15 seconds until residual voltage is discharged.

! CAUTION

An electrostatic discharge (ESD) can damage disk drives, option boards, and other components. You can provide some ESD protection by wearing an antistatic wrist strap attached to chassis ground when handling system components.

Electronic devices can be easily damaged by static electricity. To prevent damage, keep them in their protective packaging when they are not installed in your system.

Table 6-1.Checklist for Solving General Problems

Symptom

Corrective Action

AC power LED is not on.

Check that there is AC power coming into the AC power

You turned on the AC power breaker at the

connection box at the rear of the cabinet.

rear of the cabinet.

Check that power is on to the main AC power source.

 

 

Check that the AC power cable is connected to the

 

server AC connection box.

 

Check that the AC power cable is connected between

 

the AC connection box and the server.

 

 

Nothing is displayed on the console.

Check that the console power is on.

 

Check that the Service Processor Board in the Main

 

Chassis and the console are properly connected.

 

Are the cables correct?

 

Are the connectors fully inserted?

 

Check whether the screen display is suppressed by any

 

software by moving the mouse or pressing the Shift key.

 

Check if the console brightness setting needs

 

adjustment.

 

 

6-2Problem Solving

Table 6-1.Checklist for Solving General Problems (cont’d)

Symptom

Corrective Action

Nothing is displayed on the console.

Check that the Core Module VGA card and the console

(cont’d)

are connected properly.

 

 

Cannot enter commands on the console.

Check that the keyboard and mouse are connected

 

properly.

 

Check that the Basic I/O Board in the Core Module and

 

the keyboard and/or mouse are connected properly.

 

Are the cables correct?

 

Are the connectors fully inserted?

 

 

Operating system doesn’t start up.

Check that power LEDs on installed boards are on.

 

If you started up the system from the DVD-ROMdrive in

 

the Main Chassis, check that the DVD/CD-ROMdisc is

 

inserted correctly.

 

If you started up the system from the DAT drive in the

 

Main Chassis, check that the tape cartridge is inserted

 

correctly.

 

 

Cannot read a DVD/CD-ROMdisc.

Check that the DVD-ROMdrive LED is on (green).

 

Check that the data is properly recorded on the

 

DVD/CD-ROMdisc. Prepare severalDVD-ROMsand

 

repeat the operation with these discs.

 

Check that the DVD-ROMdrive is operating correctly.

 

Load the DVD-ROMin theDVD-ROMdrive and execute

 

T&D to check the operation of the DVD.

 

 

Cannot read a digital audiotape.

Check that the DAT drive LED is on (green).

 

Check that the data is properly recorded on the digital

 

audiotape. Prepare several tapes and repeat the

 

operation with these tapes.

 

Check that the DAT drive is operating correctly. Load the

 

tape in the DAT drive and execute T&D to check the

 

operation of the DAT.

 

 

Problem Solving 6-3

Troubleshooting the System

Your server provides several methods for detecting problems in the system:

!LED status indicators on hardware components, such as boards and drives

!Error messages, logs, and status displayed on a monitor from the integrated iSP Service Processor.

Hardware diagnostics from LED status requires accessing boards integrated in the server. Hardware diagnostics should be done by trained NEC Support personnel. Record any error messages displayed on the console and provide the information to the NEC Support technician.

The service processor provides the following functions for system status and diagnostics:

!Virtual SOP – displays the system operating state for each partition with periodic updates. It displays partition configuration information and failure information (see “Virtual SOP” in Chapter 3.

!OS Console – redirects the serial input/output for the operating system (including BIOS).

!SP Command Console – allows you to monitor service processor output messages required for system operation and maintenance and to enter commands for the service processor. The SP Command Console lets you run commands required for system operation.

From the iSP Main Menu, you can switch the SP Command Console from normal operation to maintenance mode by entering the change command mode “CM” command at the iSP prompt.

Some of the commands you can use for troubleshooting include:

!HC command to display and/or modify hardware configuration, including partitions.

!DL to display the logs stored in iSP.

!DT to display the SP RTC and to set it.

!EN to display environmental information such as power state and temperature status.

See Chapter 3, “Service Processor” for detailed information for using the iSP service processor functions.

6-4Problem Solving

A

Technical

Specifications

!Main Chassis

!DVD-ROMDrive

!Tape Drive

!FDD

This appendix provides the technical specifications for your server.

Main Chassis

Table A-1lists the technical specifications for the Main Chassis.

Table A-1.Main Chassis Technical Specifications

Item

Specification

 

 

CELLV Board

 

 

 

Number of CELLV Boards

Up to 2 boards (one board required)

 

 

CPU

Intel® Itanium® 21.5-GHzor1.3-GHzprocessor

Number of Processors

Up to 4 processors per CELLV board, 8 processors per system

 

 

Cache

L1 — Instruction 16KB + Data 16KB

 

L2 — 256 KB

 

L3 — 6 MB/1.5GHz processor; 3 MB/1.3-GHzprocessor

 

 

Main Memory

Type — 1-GBDDR DIMM

 

Number of DIMM Slots — 16 per CELLV Board

 

Expansion — 4-GB;installed in units of 4 DIMMs

 

Minimum Memory — 4 GB

 

Maximum Memory — 16 GB per CELLV Board, 32 GB per system using

 

1-GBDIMMs

 

 

I/O Processing

Interface — one 1.6-GBInterface in Core Module

 

 

 

Maximum Number of PCI Slots

 

12 slots in Core Module

 

14 slots in Base PCIX Unit

 

(26 slots in system)

 

 

 

Maximum I/O Bandwidth — 6.4GB/s per CELLV Board

 

 

 

Core Module Slots

 

8 slots supporting 66-MHzPCI bus

 

4 slots supporting 133-MHzPCI bus

 

 

 

Base PCIX Unit Slots

 

8 slots supporting 66-MHzPCI bus

 

6 slots supporting 133-MHzPCI bus

 

 

Interconnection between CELLV Boards

Method — Crossbar switch

Max. Operating Frequency — 400MHz

Max. Bandwidth — 25.6GB/s

A-2Technical Specifications

Table A-1.Main Chassis Technical Specifications (cont’d)

Item

Specification

Built-inPeripherals

 

 

 

DVD-ROMDrive Unit

Standard in Core Module, optional in Base PCIX unit;

 

DVD-ROM/CD-ROMmode

 

 

Magnetic Tape Unit

Optional; slot available in Core Module and in optional PCIX unit

 

DDS-44mm DAT device

 

 

FDD

Optional; slot available in Core Module and in optional PCIX unit

 

USB interface.

 

 

Weight

Up to 220.5lbs (100 kg)

 

 

Environment

 

Operating

Temperature: 41° to 89.6°F (5° to 32°C)

 

Relative Humidity: 20% to 80% (non-condensing)

Non-operating

Temperature: 41° to 113°F (5° to 45°C)

 

Relative Humidity: 20% to 80% (non-condensing)

 

 

Power Supply

Voltage — Single phase, 200-240V+10%

 

Frequency — 50/60Hz +1Hz

 

Power Consumption — 5.3KVA (for maximum configuration)

 

 

DVD-ROMDrive

Table A-2lists the technical specifications for theDVD-ROMdrive in the Main Chassis.

 

Table A-2.DVD-ROMDrive Technical Specifications

 

 

 

 

 

 

Item

Specification

 

 

 

 

 

 

Media

CD-ROM

 

 

 

Mode 1, 656 MB

 

 

 

Mode 2, 748 MB

 

 

 

DVD-ROM

 

 

 

Singe-sided,4.7 GB

 

 

 

Double-sided,8.54 GB

 

 

 

 

 

 

Data Transmission Rate

CD-ROM:Max 7.2 MB/s

 

 

 

DVD-ROM:Max 21.1 MB/s

 

 

 

 

 

 

 

Interface

ATAPI

 

 

 

 

 

 

 

 

Data Buffer

256 KB

 

 

 

 

 

 

 

MTBF

125000H

 

 

 

 

 

 

 

Dimensions

Width:

5.75 inches (146 +0.4 mm)

 

 

 

Height:

1.63 inches (41.3 +0.4 mm)

 

 

 

Depth:

7.48 inches (190 +0.4 mm)

 

 

 

 

 

 

 

Environment

 

 

 

 

Operating

Temperature: 41° to 122°F (5° to 50°C)

 

 

 

Relative Humidity: 5% to 90% (non-condensing)

 

 

Non-operating

Temperature: -22°to 149°F(-30°to 65°C)

 

 

 

Relative Humidity: 5% to 95% (non-condensing)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Technical Specifications A-3

 

Tape Drive

Table A-3lists the technical specifications for the optional tape drive in the Main Chassis.

Table A-3.Optional Tape Drive Technical Specifications

Item

Specification

 

 

 

 

 

Corresponding standard and

DDS4

150m

40GB

memory capacity

DDS3

125m

24GB

 

DDS2

120m

8GB

 

DDS1

90m

4GB (Supports read-only)

 

 

 

Average Transmission Rate

Non-compression:3 MB/s

 

 

Compression (2:1): 6 MB/s

 

 

 

 

Interface

SCSI-2

 

 

 

 

 

 

Memory Buffer

8 MB

 

 

 

 

 

MTBF

400,000H

 

 

 

 

Life Time

Tape Access 6000H

 

 

 

 

Dimensions

Width:

4 inches (101.6 mm)

 

Height: 1.6 inches (41.3 mm)

 

Depth:

5.9 inches (150 mm)

 

 

 

 

Environment

 

 

 

Operating

Temperature: 41° to 104°F (5° to 40°C)

 

Relative Humidity: 20% to 80% (non-condensing)

Non-operating

Temperature: -40°to 158°F(-40°to 70°C)

 

Relative Humidity: 5% to 95% (non-condensing)

 

 

 

 

A-4Technical Specifications

FDD

Table A-4lists the technical specifications for the optional FDD drive in the Main Chassis.

Table A-4.Optional FDD Technical Specifications

Item

Specification

 

 

 

 

Media

2HD:

2.0 MB or 1.6 MB

 

2DD:

1.0 MB

 

 

 

Data

2HD:

500 kbits/s

 

2DD:

250 kbits/s

 

 

 

 

Interface

USB

 

 

 

 

 

Dimensions

Width:

4.1 inches (103.5 mm)

 

Height: .67 inches (17 mm)

 

Depth:

5.6 inches (142 mm)

 

 

 

 

Environment

 

 

 

Operating

Temperature:

41° to 104°F (5° to 40°C)

 

Relative Humidity: 30% to 80% (non-condensing)

Non-operating

Temperature:

-40°to 140°F(-40°to 60°C)

 

Relative Humidity: 5% to 95% (non-condensing)

 

 

 

 

Technical Specifications A-5

B

Memory Upgrades

!Memory Configurations

!DIMM Installation

This appendix provides the memory configuration and installation information for your server.

! CAUTION

Memory upgrades for your server require installation and configuration by trained NEC personnel.

Memory Configurations

Each CELLV Board supports up to 16 DIMMs in the following configurations:

!Memory must be installed in groups of 4 DIMMs of the same capacity.

!Memory capacity can vary between different groups

!At least one group of four DIMMs is required in the system.

!Each CELLV Board supports up to 4 groups of 4 DIMMs.

!A memory group includes a group of four 1-GBDDR DIMMs for total capacity of 4 GB in a group.

!Maximum memory capacity using 1-GBDIMMs is 16 GB per CELLV board or 32 GB on two CELLV boards.

B-2Memory Upgrade