MSI K9N6PGM2-V2 User Manual

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MS-7309

FCC -B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable pro-

tection against harmful in-

terference in a residential installation. This equipment

generates, uses and can

radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the measures listed below.

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

Consult the dealer or an experienced radio/ television technician for help.

Notice 1

The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

VOIR LA NOTICE D’NSTALLATION AVANT DE RACCORDER AU RESEAU.

Micro-Star International

MS-7309

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1)this device may not cause harmful interference, and

(2)this device must accept any interference received, including interference that may cause undesired operation.

Part Number

G52-73091X4

The material in this document is the intellectual property of MICRO-STAR INTERNATIONAL. We take every care in the preparation of this document, but no guarantee is given as to the correctness of its contents. Our products are under continual improvement and we reserve the right to make changes without notice.

Trademarks

All trademarks are the properties of their respective owners.

■MSI® is registered trademark of Micro-Star Int’l Co.,Ltd.

■NVIDIA® is registered trademark of NVIDIA Corporation.

■ATI® is registered trademark of ATI Technologies, Inc.

■AMD® is registered trademarks of AMD Corporation.

■Intel® is registered trademarks of Intel Corporation.

■Windows® is registered trademarks of Microsoft Corporation.

■AMI® is registered trademark of American Megatrends Inc.

■Award® is a registered trademark of Phoenix Technologies Ltd.

■Sound Blaster® is registered trademark of Creative Technology Ltd.

■Realtek® is registered trademark of Realtek Semiconductor Corporation.

■JMicron® is registered trademark of JMicron Technology Corporation.

■Netware® is a registered trademark of Novell, Inc.

Revision History

Revision	Revision History	Date
V2.0	Release for PCB 2.X	July 2009
V2.0	Release for PCB 2.X	July 2009

MS-7309

Safety Instructions

■Always read the safety instructions carefully.

■Keep this User Manual for future reference.

■Keep this equipment away from humidity.

■Lay this equipment on a reliable flat surface before setting it up.

■The openings on the enclosure are for air convection hence protects the equipment from overheating. Do not cover the openings.

■Make sure the voltage of the power source and adjust properly 110/220V before connecting the equipment to the power inlet.

■Place the power cord such a way that people can not step on it. Do not place anything over the power cord.

■Always Unplug the Power Cord before inserting any add-on card or module.

■All cautions and warnings on the equipment should be noted.

■Never pour any liquid into the opening that could damage or cause electrical shock.

■If any of the following situations arises, get the equipment checked by a service personnel:

○The power cord or plug is damaged.

○Liquid has penetrated into the equipment.

○The equipment has been exposed to moisture.

○The equipment does not work well or you can not get it work according to User Manual.

○The equipment has dropped and damaged.

○The equipment has obvious sign of breakage.

■Do not leave this equipment in an environment unconditioned, storage temperature above 60°C (140°F), it may damage the equipment.

CAUTION

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.

For better environmental protection, waste batteries should be collected separately for recycling or special disposal.

WEEE Statement

ENGLISH

To protect the global environment and as an environmentalist, MSI

must remind you that... Under the European Union (“EU”) Directive on Waste Electrical and Electronic Equipment, Directive 2002/96/EC, which takes effect on August 13, 2005, products of “electrical and electronic equipment”

cannot be discarded as municipal waste anymore and manufacturers of covered electronic equipment will be obligated to take back

such products at the end of their useful life. MSI will comply with the product take back requirements at the end of life of MSI-branded products that are sold into the

EU. You can return these products to local collection points.

DEUTSCH

Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt

Gemäß der Richtlinie 2002/96/EG über Elektround Elektronik-Altgeräte dürfen Elektround Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden. MSI hat europaweit verschiedene Sammelund Recyclingunternehmen beauftragt, die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.

FRANÇAIS

En tant qu’écologiste et afin de protéger l’environnement, MSI tient à rappeler ceci...

Au sujet de la directive européenne (EU) relative aux déchets des équipement électriques et électroniques, directive 2002/96/EC, prenant effet le 13 août 2005, que les produits électriques et électroniques ne peuvent être déposés dans les décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements seront obligés de récupérer certains produits en fin de vie. MSI prendra en compte cette exigence relative au retour des produits en fin de vie au sein de la communauté européenne. Par conséquent vous pouvez retourner localement ces matériels dans les points de collecte.

РУССКИЙ

Компания MSI предпринимает активные действия по защите окружающей среды, поэтому напоминаем вам, что....

В соответствии с директивой Европейского Союза (ЕС) по предотвращению загрязнения окружающей среды использованным электрическим и электронным оборудованием (директива WEEE 2002/96/EC), вступающей в силу 13 августа 2005 года, изделия, относящиеся к электрическому и электронному оборудованию, не могут рассматриваться как бытовой мусор, поэтому производители вышеперечисленного электронного оборудования обязаны принимать его для переработки по окончании срока службы. MSI обязуется соблюдать требования по приему продукции, проданной под маркой MSI на территории EC, в переработку по окончании срока службы. Вы можете вернуть эти изделия в специализированные пункты приема.

MS-7309

ESPAÑOL

MSI como empresa comprometida con la protección del medio ambiente, recomienda:

Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/ o equipos electrónicos, con fecha de rigor desde el 13 de agosto de 2005, los productos clasificados como “eléctricos y equipos electrónicos” no pueden ser depositados en los contenedores habituales de su municipio, los fabricantes de equipos electrónicos, están obligados a hacerse cargo de dichos productos al termino de su período de vida. MSI estará comprometido con los términos de recogida de sus productos vendidos en la Unión Europea al final de su periodo de vida. Usted debe depositar estos productos en el punto limpio establecido por el ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida de estos residuos.

NEDERLANDS

Om het milieu te beschermen, wil MSI u eraan herinneren dat….

De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische en Electronische producten (2002/96/EC), die op 13 Augustus 2005 in zal gaan kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort producten worden verplicht om producten retour te nemen aan het eind van hun levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen geretourneerd worden op lokale inzamelingspunten.

SRPSKI

Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj sredini, MSI mora da vas podesti da…

Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi, Direktiva 2002/96/EC, koja stupa na snagu od 13. Avgusta 2005, proizvodi koji spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.

POLSKI

Aby chronić nasze środowisko naturalne oraz jako firma dbająca o ekologię, MSI przypomina, że...

ZgodniezDyrektywąUniiEuropejskiej(“UE”)dotyczącąodpadówproduktówelektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 13 sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w wyznaczonych punktach zbiorczych.

TÜRKÇE

Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:

Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/ EC Kararnamesi altında 13 Ağustos 2005 tarihinden itibaren geçerli olmak üzere, elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır. Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.

ČESKY

Záleží nám na ochraně životního prostředí - společnost MSI upozorňuje...

Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických výrobků 2002/96/EC platné od 13. srpna 2005 je zakázáno likvidovat “elektrické a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto výrobky můžete odevzdat v místních sběrnách.

MAGYAR

Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként fellépve az MSI emlékezteti Önt, hogy ...

Az Európai Unió („EU”) 2005. augusztus 13-án hatályba lépő, az elektromos és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen termékeket a legközelebbi gyűjtőhelyre viheti.

ITALIANO

Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che…. In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 13 Agosto 2005, prodotti appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più essere eliminati come rifiuti municipali: i produttori di detti materiali saranno obbligati a ritirare ogni prodotto alla fine del suo ciclo di vita. MSI si adeguerà a tale Direttiva ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione Europea alla fine del loro ciclo di vita. È possibile portare i prodotti nel più vicino punto di raccolta

MS-7309

Table of Content

English..............................................................................9

Getting start...............................................................................................9

SPECIFICATIONS............................................................................................10

REAR PANEL...................................................................................................12

HARDWARE SETUP........................................................................................12

BIOS Setup....................................................................................................22

.................................................................................27

...........................................................................................................27

..................................................................................................................28

..................................................................................................................30

...................................................................................................30

BIOS .........................................................................................................40

françAIS..........................................................................45

Pour commencer......................................................................................45

SPéCIFICATIONS............................................................................................46

Panneau arrière.......................................................................................48

Installation du matériel......................................................................48

Réglage bios...............................................................................................58

Deutsch..........................................................................63

eINLEITUNG....................................................................................................63

SPEZIFIKATIONEN..........................................................................................64

Hinteres Anschlusspanel.....................................................................66

HARDWARE SETUP........................................................................................66

BIOS Setup....................................................................................................76

русский ..........................................................................81

начало работы..........................................................................................81

Характеристики........................................................................................82

Задняя панель...........................................................................................84

Установка оборудования....................................................................84

настройка BIOS..........................................................................................94

..............................................................................99

..................................................................................................................99

................................................................................................................100

.........................................................................................................102

BIOS .......................................................................................................112

............................................................................	117
................................................................................................................	117
................................................................................................................	118
................................................................................................................	120
.........................................................................................................	120
BIOS .......................................................................................................	130
...............................................................................	135
.........................................................................................................	135
.......................................................................................	136
......................................................................................................	138
............................................................................	138
BIOS ....................................................................................................	148

MS-7309

EngLisH

Getting start

Thank you for choosing the K9N6PGM2-V2 series (MS-7309 v2.x) Micro-ATX mainboard. The K9N6PGM2-V2 series are design based on NVIDIA® GeForce 6150SE & nForce 430 chipset for optimal system efficiency. Designed to fit the advanced AMD® AM2/ AM2+/ AM3 processor, the K9N6PGM2-V2 series deliver a high performance and professional desktop platform solution.

Layout

SPECIFICATIONS

Processor Support

■Supports AMD® Sempron™ , Athlon™ 64 and Athlon™ 64 X2 processors in the AM2/ AM2+ package, and supports AMD® Phenom™ II/ Athlon™ II processor in the AM3 package

■Supports 95W processor only

(For the latest information about CPU, please visit http://www.msi.com/index.php?func=cpuform2)

HyperTransport

■ HyperTransport 1.0

Chipset

■ NVIDIA® GeForce 6150SE & nForce 430 chipset Memory Support

■DDR2 800/ 667 SDRAM (total Max. 8GB)

■2 DDR2 DIMMs (240pin/ 1.8V)

(For more information on compatible components, please visit http://www.msi. com/index.php?func=testreport)

LAN

■Supports 10/100/1000 LAN by Realtek® RTL8211CL

■Or supports 10/100 LAN by Realtek® RTL8201EL

1394 (optional)

■ Chip integrated by VIA® VT6315N Audio

■Chip integrated by Realtek® ALC888/ ALC888S

■Supports 7.1 channels audio out (by 6 audio-jacks)

■Compliant with Azalia 1.0 Spec

IDE

■1 IDE port

■Supports Ultra DMA 66/100/133, PIO & Bus Master operation mode

SATA

■4 SATAII ports support 4 SATAII devices (SATA3_4 are optional)

■Supports storage and data transfers at up to 3.0 Gb/s

RAID

■ SATA1~4 support RAID 0/ 1/ 5/ 0+1 Floppy

■1 floppy port

■Supports 1 FDD with 360 KB, 720 KB, 1.2 MB, 1.44 MB and 2.88 MB

MS-7309

Connectors

■Back panel

1 PS/2 mouse port

1 PS/2 keyboard port

1 Serial port

1 VGA port

1 1394 port (optional)

1 LAN jack

4 USB 2.0 Ports

3/6 (optional) flexible audio jacks

■On-Board Connectors

2 USB 2.0 connectors

1 Parallel port connector

1 IEEE1394 connector (optional)

1 SPDIF-Out connector

1 Front Panel Audio connector

1 CD-In connector

1 TPM connector (optional)

1 Chassis Intrusion Connector

1 Overclock FSB switch (optional)

Slots

■1 PCI Express 1.0 x16 slot

■1 PCI Express 1.0 x1 slot

■2 PCI slots, support 3.3V/ 5V PCI bus Interface

Form Factor

■ Micro-ATX (24.4cm X 20.0 cm)

Mounting

■ 6 mounting holes

If you need to purchase accessories and request the part numbers, you could search the product web page and find details on our web address below http://www.msi.com/index.php

REAR PANEL

The rear panel provides the following connectors:

PS/2 mouse			(optional)	LAN
PS/2 mouse			1394
					Line-In RS-Out
					Line-Out CS-Out
PS/2 keyboard	Serial port	VGA port	USB ports		MIC	SS-Out
						(optional)

HARDWARE SETUP

This chapter provides you with the information about hardware

While doing the installation, be careful in holding the components and follow the installation procedures. For some components, if you install in the wrong orientation, the components will not work properly. Use a grounded wrist strap before handling computer components. Static electricity may damage the components.

CPU & Cooler Installation for AM2/ AM2+/ AM3

When you are installing the CPU, make sure the CPU has a cooler attached on the top to prevent overheating. Meanwhile, do not forget to apply some thermal paste on CPU before installing the heat sink/cooler fan for better heat dispersion.

Follow the steps below to install the CPU & cooler correctly. Wrong installation will cause the damage of your CPU & mainboard.

MS-7309

. Pull the lever sideways away from the socket. Make sure to raise the lever up to a 90-degree angle.

2.Look for the gold arrow of the CPU. The gold arrow should point as shown in the picture. The CPU can only fit in the correct orientation.

3.If the CPU is correctly installed, the pins should be completely embedded into the socket and can not be seen. Please note that any violation of the correct installation procedures may cause permanent damages to your mainboard.

4.Press the CPU down firmly into the socket and close the lever. As the CPU is likely to move while the lever is being closed, always close the lever with your fingers pressing tightly on top of the CPU to make sure the CPU is properly and completely embedded into the socket.

5.Position the cooling set onto the retention mechanism. Hook one end of the clip to hook first.

6.Then press down the other end of the clip to fasten the cooling set on the top of the retention mechanism. Locate the Fix Lever and lift up it .

7.Fasten down the lever.

8.Attach the CPU Fan cable to the CPU fan connector on the mainboard.

Important

*Mainboard photos shown in this section are for demonstration only. The appearance of your mainboard may vary depending on the model you purchase.

*While disconnecting the Safety Hook from the fixed bolt, it is necessary to keep an eye on your fingers, because once the Safety Hook is disconnected from the fixed bolt, the fixed lever will spring back instantly.

Installing Memory Modules

. The memory module has only one notch on the center and will only fit in the right orientation.

2.Insert the memory module vertically into the DIMM slot. Then push it in until the golden finger on the memory module is deeply inserted in the DIMM slot.

You can barely see the golden finger if the memory module is properly in- serted in the DIMM slot.

3.The plastic clip at each side of the DIMM slot will automatically close.

Notch

Volt

Important

*DDR2 memory modules are not interchangeable with DDR and the DDR2 standard is not backwards compatible. You should always install DDR2 memory modules in the DDR2 DIMM slots.

*In Dual-Channel mode, make sure that you install memory modules of the same type and density in different channel DIMM slots.

*To enable successful system boot-up, always insert the memory modules into the DIMM1 first.

MS-7309

ATX 24-Pin Power Connector: JPWR1

This connector allows you to connect an ATX 24-pin power supply. To connect the ATX 24-pin power supply, make sure the plug of the power supply is inserted in the proper orientation and the pins are aligned. Then push down the power supply firmly into the connector.

						12
					11				.
				7	10		. +3.
				7				+12V
				9 .							3V
				8	.						3V
					.
				6 .
	3		5 .
	3	.		+5V
1	4 .
1	.			Ground
	.		+5V
2 .													24
+3.Ground													24
. +3		.													.
		3V													.
	3V												23.
													+5VGround
													.	+5V
													+5V
												.Ground
								13			.		-
								13				-	ON#
										+3 12V			ON#
										.		3V
												3V

ATX 4-Pin Power Connector: JPWR2

This 12V power connector is used to provide power to the CPU.

	1
	.
2	Ground
.
Ground
		3
		.
	4	+12V
	.
	+12V

Important

*Make sure that all the connectors are connected to proper ATX power supplies to ensure stable operation of the mainboard.

*Power supply of 350 watts (and above) is highly recommended for system stability.

Floppy Disk Drive Connector: FDD1

This connector supports 360 KB, 720 KB, 1.2 MB, 1.44 MB or 2.88 MB floppy disk drive.

IDE Connector: IDE1

This connector supports IDE hard disk drives, optical disk drives and other IDE devices.

Important

If you install two IDE devices on the same cable, you must configure the drives to cable select mode or separately to master / slave mode by setting jumpers. Refer to IDE device documentation supplied by the vendors for jumper setting instructions.

Serial ATA Connector: SATA1_2/ SATA3_4 (optional)

This connector is a high-speed Serial ATA interface port. Each connector can connect to one Serial ATA device.

Important

Please do not fold the Serial ATA cable into 90-degree angle. Otherwise, data loss

may occur during transmission.

Fan Power Connectors: CPUFAN, SYSFAN1

The fan power connectors support system cooling fan with +12V. When connecting the wire to the connectors, always note that the red wire is the positive and should be connected to the +12V; the black wire is Ground and should be connected to GND. If the mainboard has a System Hardware Monitor chipset onboard, you must use a specially designed fan with speed sensor to take advantage of the CPU fan control.

CPUFAN SYSFAN1

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MS-7309

IEEE1394 Connector: J1394_1 (optional)

This connector allows you to connect the IEEE1394 device via an optional IEEE1394 bracket.

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		6		. G
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S/PDIF-Out Connector: JSP1

This connector is used to connect S/PDIF (Sony & Philips Digital Interconnect Format) interface for digital audio transmission.

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1	.				r
1		S				o
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CD-In Connector: JCD1

This connector is provided for external audio input.

					1
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Front Panel Audio Connector: JAUD1

This connector allows you to connect the front panel audio and is compliant with Intel® Front Panel I/O Connectivity Design Guide.

8 .

Front USB Connector: JUSB1/ JUSB2

This connector, compliant with Intel® I/O Connectivity Design Guide, is ideal for connecting high-speed USB interface peripherals such as USB HDD, digital cameras, MP3 players, printers, modems and the like.

TPM Module Connector: JTPM1 (optional)

This connector connects to a TPM (Trusted Platform Module) module. Please refer to the TPM security platform manual for more details and usages.

1 .

. G

2 .

1 .

P C

MS-7309

Chassis Intrusion Connector: JCI1

This connector connects to the chassis intrusion switch cable. If the chassis is opened, the chassis intrusion mechanism will be activated. The system will record this status and show a warning message on the screen. To clear the warning, you must enter the BIOS utility and clear the record.

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					R
					U

Parallel Port Connector: JLPT1

This connector is used to connect an optional parallel port bracket. The parallel port is a standard printer port that supports Enhanced Parallel Port (EPP) and Extended Capabilities Parallel Port (ECP) mode.

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Front Panel Connectors: JFP1, JFP2

These connectors are for electrical connection to the front panel switches and LEDs. The JFP1 is compliant with Intel® Front Panel I/O Connectivity Design Guide.

Power	Switch
	Switch					No		-
PowerLED				6				-
		10			.
						8Pin
	4					.	.
	4					+
	2	.
	2		-
	.
	+

JFP1

								9
.									.
.					7					Reserved
			5			.
			5				+
	3		.
	3			-
		.
1		-								ResetSwitch
+										ResetSwitch
+						HDD
						HDD					LED
											LED

Speaker			6
Buzzer			6		8
					.
	4		.			+
	4			-
2	.
2		+
.
-

JFP2

			7
	3		5 .
	3		. No
.		SuspendPowerLED
1		.
Ground				LED
				LED

Clear CMOS Jumper: JBAT1

There is a CMOS RAM onboard that has a power supply from an external battery to keep the data of system configuration. With the CMOS RAM, the system can automatically boot OS every time it is turned on. If you want to clear the system configuration, set the jumper to clear data.

JBAT1

1	1	1
	Keep Data	Clear Data

Important

You can clear CMOS by shorting 2-3 pin while the system is off. Then return to 1-2 pin position. Avoid clearing the CMOS while the system is on; it will damage the mainboard.

Overclock FSB Switch: OC_SW1 (optional)

You can overclock the FSB to increase the processor frequency by changing the switch. Follow the instructions below to set the FSB.

Default

Increase 10%

Increase 15%

Increase 20%

speed of FSB

Important

*Make sure that you power off the system before setting the switch.

*When overclocking cause system instability or crash during boot. Please set the switch to default setting.

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PCI Express Slot

The PCI Express slot supports the PCI Express interface expansion card.

The PCI Express 1.0 x16 slot

The PCI Express 1.0 x1 slot

PCI Slot

The PCI slot supports LAN card, SCSI card, USB card, and other add-on cards that comply with PCI specifications.

Important

Make sure that you unplug the power supply first. Meanwhile, read the documentation for the expansion card to configure any necessary hardware or software settings for the expansion card, such as jumpers, switches or BIOS configuration.

PCI Interrupt Request Routing

When adding or removing expansion cards, make the IRQ, acronym of interrupt request line and pronounced I-R-Q, are hardware lines over which devices can send interrupt signals to the microprocessor. The PCI IRQ pins are typically connected to the PCI bus pins as follows:

Order	1		2		3		4
Slot	1		2		3		4
Slot
PCI 1		C#		D#		A#		B#
PCI 1		C#		D#		A#		B#

PCI 2		B#		C#		D#		A#

BIOS Setup

Power on the computer and the system will start POST (Power On Self Test) process. When the message below appears on the screen, press <DEL> key to enter Setup.

Press DEL to enter SETUP

If the message disappears before you respond and you still wish to enter Setup, restart the system by turning it OFF and On or pressing the RESET button. You may also restart the system by simultaneously pressing <Ctrl>, <Alt>, and <Delete> keys.

Main Page

Standard CMOS Features

Use this menu for basic system configurations, such as time, date etc.

Advanced BIOS Features

Use this menu to setup the items of special enhanced features.

Integrated Peripherals

Use this menu to specify your settings for integrated peripherals.

Power Management Setup

Use this menu to specify your settings for power management.

H/W Monitor

This entry shows the status of your CPU, fan, warning for overall system status.

Green Power

Use this menu to specify the power phase.

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Cell Menu

Use this menu to specify your settings for frequency/voltage control.

BIOS Setting Password

Use this menu to set BIOS setting Password.

Load Fail-Safe Defaults

Use this menu to load the BIOS default values that are factory settings for system operations.

Load Optimized Defaults

Use this menu to load factory default settings into the BIOS for stable system performance operations.

Save & Exit Setup

Save changes to CMOS and exit setup.

Exit Without Saving

Abandon all changes and exit setup.

Cell Menu

Current CPU/ DRAM Frequency

It shows the current frequency of CPU/ Memory. Read-only.

AMD Cool’n’Quiet

The Cool’n’Quiet technology can effectively and dynamically lower CPU speed and power consumption.

Important

To ensure that Cool’n’Quiet function is activated and will be working properly, it is required to double confirm that:

*Run BIOS Setup, and select Cell Menu.

Under Cell Menu, find AMD Cool’n’Quiet, and set this item to “Enabled”.

*Enter Windows, and select [Start]->[Set- tings]->[Control Panel]->[Power Options]. Enter Power Options Properties tag, and

select Minimal Power Managementunder Power schemes.

CPU Specifications

Press <Enter> to enter the sub-menu. This submenu shows the information of installed CPU.

CPU Technology Support

Press <Enter> to enter the sub-menu. This sub-menu shows the technologies that the installed CPU supported.

Adjust CPU FSB Frequency (MHz)

This item allows you to adjust the CPU FSB frequency.

Adjust CPU Ratio

This item is used to adjust CPU clock multiplier (ratio). It is available only when the processor supports this function.

Memory-Z

Press <Enter> to enter the sub-menu.

DIMM1~2 Memory SPD Information

Press <Enter> to enter the sub-menu. This sub-menu displays the information of installed memory.

Advance DRAM Configuration Press <Enter> to enter the sub-menu.

DRAM Timing Mode

Selects whether DRAM timing is controlled by the SPD (Serial Presence Detect) EEPROM on the DRAM module. Setting to [Auto] enables DRAM timings and the following related items to be determined by BIOS based on the configurations on the SPD. Selecting [Manual] allows users to configure the DRAM timings and the following related items manually.

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1T/2T Memory Timing

When the DRAM Timing Mode is set to [Manual], the field is adjustable. This field controls the command rate. Selecting [1T] makes DRAM signal controller to run at 1 clock cycle rate. Selecting [2T] makes DRAM signal controller run at 2 clock cycles rate.

Bank Interleaving

Bank Interleaving is an important parameter for improving overclocking capability of memory. It allows system to access multiple banks simultaneously.

FSB/DRAM Ratio

This item will allow you to adjust the ratio of FSB to memory.

Adjusted DRAM Frequency (MHz)

It shows the adjusted memory frequency. Read-only.

Adjust PCI-E Frequency (MHz)

This item allows you to adjust the PCI-E frequency.

HT Link Speed Auto

Setting to [Enabled], the system will detect the HT link speed automatically.

HT Link Speed

This item allows you to set the Hyper-Transport Link speed.

HT Link Width

This item allows you to set the Hyper-Transport Link width.

CPU VDD Voltage (V)/ Adjust CPU Voltage Offset/ DRAM Voltage (V)/ NB Voltage (V)/ HT Link Voltage (V)

These items are used to adjust the voltage of CPU, Memory and chipset.

CPU Spread Spectrum

This setting is used to enable or disable the CPU Spread Spectrum feature.

Important

*If you do not have any EMI problem, leave the setting at [Disabled] for optimal system stability and performance. But if you are plagued by EMI, select the value of Spread Spectrum for EMI reduction.

*The greater the Spread Spectrum value is, the greater the EMI is reduced, and the system will become less stable. For the most suitable Spread Spectrum value, please consult your local EMI regulation.

*Remember to disable Spread Spectrum if you are overclocking because even a slight jitter can introduce a temporary boost in clock speed which may just cause your overclocked processor to lock up.