MOTOROLA J112RLRA, J112RL1, J112 Datasheet

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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by J112/D

JFET Chopper

Transistor

 

 

 

 

N±Channel Ð Depletion

 

 

 

 

 

1 DRAIN

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GATE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2 SOURCE

MAXIMUM RATINGS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rating

Symbol

Value

 

 

 

Unit

 

 

 

 

 

 

 

 

Drain± Gate Voltage

VDG

± 35

 

 

 

Vdc

Gate± Source Voltage

VGS

± 35

 

 

 

Vdc

Gate Current

IG

50

 

 

 

mAdc

Total Device Dissipation @ TA = 25°C

PD

350

 

 

 

mW

Derate above 25°C

 

2.8

 

 

 

mW/°C

 

 

 

 

 

 

 

 

Lead Temperature

TL

300

 

 

 

°C

Operating and Storage Junction

TJ, Tstg

± 65 to +150

 

 

 

°C

Temperature Range

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

J112

1

2 3

CASE 29±04, STYLE 5 TO±92 (TO±226AA)

Characteristic

Symbol

Min

Max

Unit

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

Gate± Source Breakdown Voltage

V(BR)GSS

35

Ð

Vdc

(IG = ±1.0 μAdc)

 

 

 

 

Gate Reverse Current

IGSS

Ð

± 1.0

nAdc

(VGS = ±15 Vdc)

 

 

 

 

Gate Source Cutoff Voltage

VGS(off)

± 1.0

± 5.0

Vdc

(VDS = 5.0 Vdc, ID = 1.0 μAdc)

 

 

 

 

Drain±Cutoff Current

ID(off)

Ð

1.0

nAdc

(VDS = 5.0 Vdc, VGS = ±10 Vdc)

 

 

 

 

ON CHARACTERISTICS

 

 

 

 

 

 

 

 

 

Zero±Gate±Voltage Drain Current(1)

I

5.0

Ð

mAdc

(VDS = 15 Vdc)

DSS

 

 

 

 

 

 

 

Static Drain±Source On Resistance

rDS(on)

Ð

50

Ω

(VDS = 0.1 Vdc)

 

 

 

 

Drain Gate and Source Gate On±Capacitance

Cdg(on)

Ð

28

pF

(VDS = VGS = 0, f = 1.0 MHz)

+

 

 

 

 

Csg(on)

 

 

 

Drain Gate Off±Capacitance

Cdg(off)

Ð

5.0

pF

(VGS = ±10 Vdc, f = 1.0 MHz)

 

 

 

 

Source Gate Off±Capacitance

Csg(off)

Ð

5.0

pF

(VGS = ±10 Vdc, f = 1.0 MHz)

 

 

 

 

1. Pulse Width = 300 μs, Duty Cycle = 3.0%.

 

 

 

 

(Replaces J111/D)

Motorola Small±Signal Transistors, FETs and Diodes Device Data

1

Motorola, Inc. 1997

 

MOTOROLA J112RLRA, J112RL1, J112 Datasheet

J112

TYPICAL SWITCHING CHARACTERISTICS

 

1000

 

 

 

 

 

 

 

 

 

TJ = 25°C

 

 

 

500

 

 

 

 

 

 

 

 

 

 

 

(ns)

 

 

 

 

 

 

 

 

 

 

 

 

200

 

 

 

 

 

 

 

 

VGS(off) = 7.0 V

 

TIME

 

 

 

 

 

 

 

 

 

100

 

 

 

RK = RD

 

 

 

 

 

 

DELAY

 

 

 

 

 

 

 

 

 

50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

, TURN±ON

20

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

5.0

 

 

 

 

 

 

 

 

 

 

 

 

d(on)

 

 

R

 

= 0

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

t

2.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

0.7

1.0

 

 

2.0

3.0

5.0

7.0

10

20

30

50

 

0.5

 

 

 

 

 

 

 

 

ID, DRAIN CURRENT (mA)

 

 

 

Figure 1. Turn±On Delay Time

 

1000

 

 

 

 

 

 

 

TJ = 25°C

 

(ns)

500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VGS(off) = 7.0 V

 

TIME

200

 

 

 

 

 

 

 

 

100

 

 

 

 

 

 

 

 

 

 

DELAY

 

 

 

 

 

 

 

 

 

 

50

 

 

 

RK = RD

 

 

 

 

 

TURN±OFF

20

 

 

 

 

 

 

 

 

 

 

10

 

RK = 0

 

 

 

 

 

 

 

 

,

5.0

 

 

 

 

 

 

 

 

 

 

d(off)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

2.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

 

0.5

 

 

 

 

ID, DRAIN CURRENT (mA)

 

 

Figure 3. Turn±Off Delay Time

+VDD

 

 

 

RD

 

 

 

SET VDS(off) = 10 V

 

 

INPUT

RK

 

RT

 

 

 

RGEN

 

 

OUTPUT

50

Ω

 

RGG

 

 

 

50 Ω

Ω

 

 

50

VGEN

 

V

 

 

 

 

GG

 

INPUT PULSE

RGG & RK

 

 

 

 

tr 0.25 ns

 

RD(RT ) 50)

tf 0.5 ns

RD +

PULSE WIDTH = 2.0 μs

R

R

T )

50

 

DUTY CYCLE 2.0%

 

D )

 

 

 

 

 

 

 

 

 

Figure 5. Switching Time Test Circuit

 

1000

 

 

 

 

 

 

 

 

TJ = 25°C

 

 

500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

200

 

RK

= RD

 

 

 

VGS(off) = 7.0 V

 

(ns)

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TIME

50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

, RISE

20

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

r

 

 

 

 

 

 

 

 

 

 

t

 

 

 

 

 

 

 

 

 

 

 

5.0

 

RK = 0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

1.0

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

 

0.5

 

 

 

 

ID, DRAIN CURRENT (mA)

 

 

Figure 2. Rise Time

 

1000

 

 

 

 

 

 

 

 

TJ = 25°C

 

 

500

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

200

 

 

RK = RD

 

 

 

 

VGS(off) = 7.0 V

 

(ns)

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TIME

50

 

 

 

 

 

 

 

 

 

 

 

 

 

RK = 0

 

 

 

 

 

 

 

, FALL

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

f

 

 

 

 

 

 

 

 

 

 

t

 

 

 

 

 

 

 

 

 

 

 

5.0

 

 

 

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

1.0

0.7

1.0

2.0

3.0

5.0

7.0

10

20

30

50

 

0.5

 

 

 

 

ID, DRAIN CURRENT (mA)

 

 

Figure 4. Fall Time

NOTE 1

The switching characteristics shown above were measured using a test circuit similar to Figure 5. At the beginning of the switching interval, the gate voltage is at Gate Supply Voltage (±VGG). The

Drain±Source Voltage (VDS) is slightly lower than Drain Supply

Voltage (VDD) due to the voltage divider. Thus Reverse Transfer

Capacitance (Crss) or Gate±Drain Capacitance (Cgd) is charged to

VGG + VDS.

During the turn±on interval, Gate±Source Capacitance (Cgs) discharges through the series combination of RGen and RK. Cgd

must discharge to VDS(on) through RG and RK in series with the parallel combination of effective load impedance (R′D) and

Drain±Source Resistance (rds). During the turn±off, this charge flow is reversed.

Predicting turn±on time is somewhat difficult as the channel resistance rds is a function of the gate±source voltage. While Cgs discharges, VGS approaches zero and rds decreases. Since Cgd discharges through rds, turn±on time is non±linear. During turn±off, the situation is reversed with rds increasing as Cgd charges.

The above switching curves show two impedance conditions; 1) RK is equal to RD, which simulates the switching behavior of cascaded stages where the driving source impedance is normally the load impedance of the previous stage, and 2) RK = 0 (low impedance) the driving source impedance is that of the generator.

2

Motorola Small±Signal Transistors, FETs and Diodes Device Data

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