MCC S2J, S2D, S2B, S2A, S2G Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Extremely Low Thermal Resistance

∙Easy Pick And Place

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

Maximum Ratings

∙Operating Temperature: -55°C to +150°C

∙Storage Temperature: -55°C to +150°C

∙Maximum Thermal Resistance; 16 °C/W Junction To Lead

MCC	Device	Maximum	Maximum	Maximum
Catalog	Marking	Recurrent	RMS	DC
Number		Peak Reverse	Voltage	Blocking
		Voltage		Voltage
S2A	S2A	50V	35V	50V
S2B	S2B	100V	70V	100V
S2D	S2D	200V	140V	200V
S2G	S2G	400V	280V	400V
S2J	S2J	600V	420V	600V
S2K	S2K	800V	560V	800V
S2M	S2M	1000V	700V	1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward	IF(AV)	2.0A	TJ = 75°C
current
Peak Forward Surge	IFSM	50A	8.3ms, half sine,
Current			°
			TJ = 150 C
Maximum		1.15V	IFM = 2.0A;
Instantaneous	VF		TJ = 25°C*
Forward Voltage
Maximum DC
Reverse Current At	IR	10μA	TJ = 25°C
Rated DC Blocking		μ	°
Voltage		50 A	TJ = 125 C
Maximum Reverse	Trr	2.0μs	IF=0.5A, IR=1.0A,
Recovery Time			Irr=0.25A
Typical Junction	CJ	30pF	Measured at
Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 300 μsec, Duty cycle 2%

S2A

THRU

S2M

2 Amp

Silicon Rectifier 50 to 1000 Volts

DO-214AA

(SMBJ) (Round Lead)

H

Cathode Band

J

																		A											C
											E								D						B
					F
					G
															DIMENSIONS
					INCHES														MM
	DIM					MIN						MAX						MIN						MAX		NOTE
	A			.078							.116						1.98				2.95
	B			.075							.089						1.90				2.25
	C			.002							.008						.05				.20
	D			-----							.02						-----				.51
	E			.035							.055						.90				1.40
	F			.065							.091						1.65				2.32
	G			.205							.224						5.21				5.69
	H			.160							.180						4.06				4.57
	J			.130							.155						3.30				3.94

SUGGESTED SOLDER

PAD LAYOUT

0.090"

0.085”

0.070”

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