LITTELFUSE SMTBJ120A, SMTBJ120B, SMTBJ170A, SMTBJ170B, SMTBJ200A Datasheet

FEATURES

●Bi-directional transient voltage protection

●Glass passivated junction

●Nano second clamping response

●Surge capability up to 250 (Amps)

●No performance degradation under service life

●Industry standard DO-2144AA Jedec outline

●Available on tape (12mm)

●UL recognised

SMTBJ SiBOD™ series

2.16	2.74			2.16

2.26

Solder Pads

All dimensions in mm

MECHANICAL CHARACTERISTICS

●Transfer molded, void free epoxy body

●Terminals: modified ‘J’ bend for large contact area

●Tin/Lead plated leads

●Maximum case temperature for soldering purposes: 230°C for 10 seconds

●Standard packaging: 12mm tape (meets EIA 481-1)

●Device marking, device code, logo

2.0

B

A

5.21/5.59

4.06/4.57

3.

2.18/2

SEATING PLANE

.102

.203

0.76/1.27

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