LD L1750S Schematic

Service Guide Specification

담 당 관리자

Model Description

MODEL

SUFFIX

L1750S-SNN L1950S-SNN

ANUSQG

Printing Specification

1. Trim Size (Format) : 215mm x 280 mm

2. Printing Colors

• Cover : LG COLORS

• Inside : Black

3. Stock (Paper)

• Cover : Snow White 150 g/㎡

• Inside : Snow White 100 g/㎡

4. Printing Method :

5. Bindery : Saddle stitch

6. Language : English

7. Number of pages : 28 ( Including blank 1page)

BRAND

Product Name

FLATRON L1750S FLATRON L1950S

LEE H.J

05.01.06

Part No.

KIM J.O

05.01.06

3828TSL096P

Special Instructions3.

(1) Origin Notification

* LGEDI : Printed in Indonesia * LGEWA : Printed in U.K. * LGESP : Printed in Brazil * LGEMX : Printed in Mexico * LGENT : Printed in China * LGEIL : Printed in India

Changes

7 6

5 4 3 2

REV.

MM/DD/YY

NO.

SIGNATURE

CHANGE NO.

CHANGE CONTENTS

Pagination sheet

P/NO.3828TSL096P Total pages : 28pages

Cover

Front cover

Inside

blank

English….English

English

….

English25Rear cover

English

…..

Inside

Rear

Cover

COLOR MONITOR

SERVICE MANUAL

Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

CAUTION

BEFORE SERVICING THE UNIT, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS NO. : CL-82

MODEL: L1750S (L1750S-SNN.AN**QF)

L1950S (L1950S-SNN.AN**QF)

( ) **Same model for Service

*To apply the Genesis ZAN3SL Chip.

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CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ....................................................... 7

DISASSEMBLY ....................................................... 8

BLOCK DIAGRAM ................................................... 9

DESCRIPTION OF BLOCK DIAGRAM...................10

ADJUSTMENT ...................................................... 12

SPECIFICATIONS

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module Active Display Area : 17 inch diagonal-L1750S

: 19 inch diagonal-L1950S

Pixel Pitch : 0.264 (H) x 0.264 (V)-L1750S

: 0.294 (H) x 0.294 (V)-L1950S

Size : Color Depth : 16.2M colors

Electrical Interface : LVDS Surface Treatment : Hard-coating(3H), Anti-Glare Operating Mode : Backlight Unit :

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio ≥ 10

L1750S

Left : -60° min., -70°(Typ) Right : +60° min., +70°(Typ) Top :+45° min., +60°(Typ) Bottom : -50°min., -60°(Typ)

L1950S

Left : -70° min., -80°(Typ) Right : +70° min., +80°(Typ) Top :+75° min., +85°(Typ) Bottom : -75°min., -85°(Typ)

2-2. Luminance : 185(min), 250(Typ) 2-3. Contrast Ratio : 300(min), 450(Typ)-L1750S

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate Sync, SOG (Sync On Green)

3-2. Video Input Signal

1) Type : R, G, B Analog

2) Voltage Level : 0~0.71 V a) Color 0, 0 : 0 Vp-p b) Color 7, 0 : 0.467 Vp-p c) Color 15, 0 : 0.714 Vp-p

3) Input Impedance : 75 Ω

358.5 (W) x 296.5 (H) x 17.0 (D)-L1750S

404.2 (W) x 330 (H) x 22.0 (D)-L1950S

Normally White, 4-CCFL(Cold Cathode Fluorescent Lamp)

: 300(min), 500(Typ)-L1950S

Transmissive mode

SERVICE OSD ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 14

WIRING DIAGRAM ............................................... 18

EXPLODED VIEW...................................................19

REPLACEMENT PARTS LIST ...............................21

SCHEMATIC DIAGRAM......................................... 23

5. POWER SUPPLY

5-1. Power 5-2. Power Consumption

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

6. ENVIRONMENT

6-1. Operating Temperature: 10°C~35°C (50°F~95°F) 6-2. Relative Humidity : 10%~80% 6-3. MTBF :

7. DIMENSIONS (with TILT/SWIVEL) L1750S

Width : 368 mm (14.49'') Depth : 230.5 mm (9.07'') Height : 389.2 mm (15.32'')

L1950S

Width : 413 mm (16.26'') Depth : 230.5 mm (9.07'') Height : 421.4 mm (16.59'')

8. WEIGHT (with TILT/SWIVEL) L1750S

Net. Weight : 4.9 kg (10.80 lbs) Gross Weight : 6.5 kg (14.33 lbs)

: AC 100~240V, 50/60Hz , 1.0A

MODE

Lamp Life :

H/V SYNC

ON/ON

OFF/ON ON/OFF

OFF/OFF

VIDEO

ACTIVE

OFF OFF OFF

50,000 HRS wiht 90% Confidence level 50,000 Hours (min)

POWER CONSUMPTION

less than 43 W-L1750S less than 45 W-L1950S

less than 1 W less than 1 W

less than 1 W

(Ambient)

(Non-condensing)

LED COLOR

GREEN

AMBER AMBER AMBER

3-3. Operating Frequency

Horizontal : 30 ~ 83kHz Vertical : 56 ~ 75Hz

. Max. Resolution

Analog : 1280 x 1024 / 75Hz

L1950S

Net. Weight : 5.7 kg (12.57 lbs) Gross Weight : 7.9 kg (17.42 lbs)

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PRECAUTION

1.5 Kohm/10W

To Instrument's exposed METALLIC PARTS

Good Earth Ground such as WATER PIPE, CONDUIT etc.

AC Volt-meter

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the replacement parts list. It is essential that these critical

parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

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General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip

temperature within the range or 500。F to 600。F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal

temperature.

(500。F to 600。F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal

temperature (500。F to 600。F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

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Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

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