NJL6163R
HIGH SPEED PIN PHOTO DIODE
GENERAL DESCRIPTION ■ OUTLINE (typ.)
■
The NJL6163R is the PIN photo diode, which
attain high speed (fc : 200MHz) and high
sensitivity (S : 0.65A/W).
2.5
①
It shrinks the outline by COBP(Chip on Board
Package), and attain under half package
volume compared with lead frame type.
FEATURES
■
High speed, high sensitivity
•
Super miniature, super thin type
•
(2.5mmX4.9mmX1.16mm)
②
APPL ICATIONS
■
Laser monitor for CD-R/RW etc.
•
Reading the signal for optical communication
•
etc.
ABSOL UT E MAXIMUM RA T IN GS
■
(Ta=25°C)
PARAMETER SYMBOL RATINGS UNIT
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
V
T
T
T
R
opr
stg
sol
35
-30
~
-40
+100
~
260 (10sec.)
ELECTRO-OPTICAL CHARACTERISTICS
■
(Ta=25°C)
PARAMETER SYMBOL TEST CONDITION MIN TYP MAX UNIT
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
Cut off Frequency
I
D
V
Ct
λ
S
fc
(-3dB)
F
P
V
=10V
R
I
=1mA
F
V
=2.0V, f=1MHz
R
—
=2.0V, λ=780nm
V
R
V
=0.7V, λ=780nm, RL=50Ω
R
V
=2.0V, λ=780nm, RL=50Ω
R
+85
Unit : mm
2.5
4.9
①
anode
②
cathode
1.16
—
—
—
—
0.50
—
—
2.0
1.0
—
—
—
—
—
1.0
1.0
0.3
0.3
1.35
0.7
1.35
(2x)R0.3
nA
V
pF
nm
A/W
MHz
MHz
0.5
0.1
—
10
800
V
C
°
C
°
C
°
0.65
150
200
- 1 -
)
)
NJL6163R
TYPICAL CHA RACTERISTICS
■
Relative Sensitivity vs. Illuminance (Ta=25°C) Spectral Response (Ta=25°C)
1.00E-02
1.00E-03
1.00E-04
1.00E-05
1.00E-06
Light Current IL (A)
1.00E-07
1.00E-08
VR=2.0V, λ=780nm
0.01 0.1 1 10 100
Illuninance (mW/cm )
100%
80%
60%
40%
Relative Sensitivity (%)
20%
0%
2
500 600 700 800 900 1000 1100
Wavelength λ (nm)
Dark Current vs. Temperature Relative Sensitivity vs. Temperature
1.0E-08
VR=2.0V
1.0E-09
110%
108%
106%
104%
VR=2.0V, λ=780nm
1.0E-10
1.0E-11
Dark Current ID (A)
1.0E-12
1.0E-13
-40-200 20406080100
Ambient Temperature Ta (°C)
102%
100%
98%
96%
Relative Sensitivity (%)
94%
92%
90%
-40-200 20406080100
Ambient Temperature Ta (°C)
Rise Time vs. Reverse Voltage (Ta=25°C) Fall Time vs. Reverse Voltage (Ta=25°C)
20
=780nm, RL=50
15
λ
Ω
20
15
=780nm, RL=50
λ
Ω
10
Rise Time tr (ns
5
10
Fall Time tf (ns
5
0
012345
Reverse Voltage V R (V)
0
012345
Reverse Voltage VR (V)
- 2 -
)
NJL6163R
Relative Sensitivity vs. Frequency (Ta=25°C) Capacitance vs. Reverse Voltage (Ta=25°C)
MEASURING CIRCUIT FOR RESPONSE TIME
■
0
-1
-2
-3
-4
Relative Sensitivity (dB)
VR=2.0V, λ=780nm,
-5
RL= 50
Ω
-6
1 10 100 1000
Frequency f (MHz)
P. G .
Laser
NJL6163R
OSC
15
14
13
12
11
Capasitance Cj (pF
10
9
8
012345
50
Ω
Reverse Voltage VR (V)
Input
Output
tr
tf
90%
10%
- 3 -
NJL6163R
PRECAUTION FOR HA NDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 240°C of maximum surface temperature, less than 30 seconds of time kept higher than 200°C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
(°C) 3
240°C max.
Time
2) Reflow Method (In case of infrared heating
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method (VPS
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
①
Preparatory heating condition : 120 ~ 150°C about 60 sec.
②
Recommended soldering temperature : 230 ~ 240°C about 3 ~ 5 sec.
③
Slowly cool down right after soldering.
④
Soldering to be done within twice under this condition.
Preparatory heating Less than
60
temperature will be higher than lead itself.
250
200
150
100
50
0
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
5 sec.
~
120 sec. 30 sec.
~
)
).
- 4 -
NJL6163R
NJL6163R Taping Specification
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
Pull out direction of tape
2. Taping Strength
Pullup the cover tape from the carrier tape, and when the opening angle comes around 10 ~ 15°, and the peeling-off
strength is to be within the power of 20
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
①
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags).
Start Rolling : Carrier tape open space more than 20 Pieces.
②
End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
φ
2.0
5.4
2.9
4.0
4.0
1.5
Carrier tape
1.75
5.5
12.0
Cover tape
0.3
1.5
70g.
~
13
Label
13
φ
60
180
φ
φ
(TE1)
- 5 -
NJL6163R
MEMO
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
- 6 -
Loading...