Intel D810EMO, MO810E User Manual

0 (0)

Intel® Desktop Board

D810EMO/MO810E

Technical Product Specification

February 2000

Order Number A00653-001

The Intel® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update.

Revision History

Revision

Revision History

Date

-001

First release of the Intel® Desktop Board D810EMO/MO810E Technical

February 2000

 

Product Specification

 

This product specification applies to only standard D810EMO/MO810E boards with BIOS identifier MO81010A.86A.

Changes to this specification will be published in the Intel Desktop Board D810EMO/MO810E Specification Update before being incorporated into a revision of this document.

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

The D810EMO/MO810E board may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

Intel Corporation

P.O. Box 5937

Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.

All other brands and names are the property of their respective owners.

Copyright © 2000, Intel Corporation. All rights reserved.

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board. It describes the standard product and available manufacturing options.

The D810EMO desktop board is known in some documentation and sales collateral as the MO810E. Both names refer to the same product.

Intended Audience

The TPS is intended to provide detailed, technical information about the board and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1A description of the hardware used on this board

2A map of the resources of the board

3The features supported by the BIOS Setup program

4The contents of the BIOS Setup program’s menus and submenus

5A description of the BIOS error messages, beep codes, and POST codes

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

WARNING

Warnings indicate conditions that, if not observed, can cause personal injury.

iii

Intel Desktop Board D810EMO/MO810E Technical Product Specification

Other Common Notation

#Used after a signal name to identify an active-low signal (such as USBP0#)

(NxnX)

KB

Kbit

MB

Mbit

GB

xxh

x.x V

When used in the description of a component, N indicates component type, xn are the relative coordinates of its location on the board, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in the 5J area.

Kilobyte (1024 bytes)

Kilobit (1024 bits)

Megabyte (1,048,576 bytes)

Megabit (1,048,576 bits)

Gigabyte (1,073,741,824 bytes)

An address or data value ending with a lowercase h indicates a hexadecimal value.

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective owners.

iv

Contents

1 Product Description

1.1

Overview ...................................................................................................................

10

 

1.1.1

Feature Summary .......................................................................................

10

 

1.1.2

Board Layout...............................................................................................

11

 

1.1.3

Block Diagram.............................................................................................

12

1.2

Online Support...........................................................................................................

13

1.3

Design Specifications ................................................................................................

13

1.4

Processor ..................................................................................................................

16

1.5

System Memory.........................................................................................................

17

1.6

Intel® 810E Chipset ...................................................................................................

18

 

1.6.1

Direct AGP ..................................................................................................

19

 

1.6.2

USB.............................................................................................................

19

 

1.6.3

IDE Support.................................................................................................

20

 

1.6.4

Real-Time Clock, CMOS SRAM, and Battery..............................................

20

1.7

I/O Controller .............................................................................................................

21

1.8

Serial Debug Port ......................................................................................................

21

1.9

Graphics Subsystem .................................................................................................

22

1.10 Audio Subsystem.......................................................................................................

23

 

1.10.1 Creative Sound Blaster AudioPCI 128V ......................................................

23

 

1.10.2 Creative ES1373D Digital Audio Controller..................................................

23

 

1.10.3 Crystal Semiconductor CS4297A Analog Codec .........................................

23

 

1.10.4

Audio Connectors........................................................................................

24

1.11 Hardware Monitor Component...................................................................................

24

1.12 LAN Subsystem.........................................................................................................

25

 

1.12.1 Intel® 82559 PCI LAN Controller .................................................................

25

 

1.12.2

LAN Subsystem Software............................................................................

26

 

1.12.3 RJ-45 LAN Connector LEDs........................................................................

26

1.13 Power Management Features....................................................................................

27

 

1.13.1

ACPI............................................................................................................

27

 

1.13.2

Hardware Support .......................................................................................

29

2 Technical Reference

2.1

Introduction................................................................................................................

33

2.2

Memory Map .............................................................................................................

33

2.3

I/O Map

.....................................................................................................................

34

2.4

DMA Channels ..........................................................................................................

35

2.5

PCI Configuration ...................................................................................Space Map

36

2.6

Interrupts ...................................................................................................................

36

2.7

PCI Interrupt .........................................................................................Routing Map

37

2.8

Connectors ................................................................................................................

38

 

2.8.1 .........................................................................

Back Panel I/O Connectors

39

 

2.8.2 ...............................................................................

Internal I/O Connectors

41

 

2.8.3 ..............................................................................

External I/O Connectors

46

v

Intel Desktop Board D810EMO/MO810E Technical Product Specification

2.9

Jumper Block.............................................................................................................

49

2.10

Mechanical Considerations........................................................................................

51

 

2.10.1

FlexATX Form Factor ..................................................................................

51

 

2.10.2

I/O Shield ....................................................................................................

52

2.11

Electrical Considerations ...........................................................................................

53

 

2.11.1

Add-in Board Considerations.......................................................................

53

 

2.11.2

Power Consumption ....................................................................................

53

 

2.11.3

Power Supply Considerations......................................................................

54

 

2.11.4

Fan Power Requirements............................................................................

54

2.12

Thermal Considerations.............................................................................................

55

2.13

Reliability ...................................................................................................................

56

2.14

Environmental............................................................................................................

57

2.15

Regulatory Compliance .............................................................................................

58

 

2.15.1

Safety Regulations ......................................................................................

58

 

2.15.2

EMC Regulations ........................................................................................

58

 

2.15.3

Certification Markings..................................................................................

59

3 Overview of BIOS Features

3.1

Introduction................................................................................................................

61

3.2

BIOS Flash Memory Organization .............................................................................

62

3.3

Resource Configuration .............................................................................................

62

 

3.3.1

PCI Autoconfiguration .................................................................................

62

 

3.3.2

PCI IDE Support..........................................................................................

63

3.4

System Management BIOS (SMBIOS) ......................................................................

64

3.5

BIOS Upgrades .........................................................................................................

65

 

3.5.1

Language Support.......................................................................................

65

 

3.5.2

Custom Splash Screen................................................................................

65

3.6

Recovering BIOS Data ..............................................................................................

66

3.7

Boot Options..............................................................................................................

67

 

3.7.1

CD-ROM and Network Boot ........................................................................

67

 

3.7.2

Booting Without Attached Devices ..............................................................

67

3.8

USB Legacy Support .................................................................................................

68

3.9

BIOS Security Features .............................................................................................

69

4 BIOS Setup Program

4.1

Introduction................................................................................................................

71

4.2

Maintenance Menu ....................................................................................................

72

 

4.2.1

Extended Configuration Submenu...............................................................

73

4.3

Main Menu.................................................................................................................

74

4.4

Advanced Menu.........................................................................................................

75

 

4.4.1

Boot Configuration Submenu ......................................................................

76

 

4.4.2

Peripheral Configuration Submenu..............................................................

77

 

4.4.3

IDE Configuration Submenu........................................................................

78

 

4.4.4

Event Log Configuration..............................................................................

81

 

4.4.5

Video Configuration.....................................................................................

82

vi

Contents

4.5

Security Menu............................................................................................................

83

4.6

Power Menu ..............................................................................................................

84

4.7

Boot Menu .................................................................................................................

85

4.8

Exit Menu ..................................................................................................................

87

5 Error Messages and Beep Codes

 

5.1

BIOS Error Messages................................................................................................

89

5.2

Port 80h POST Codes ...............................................................................................

91

5.3

Bus Initialization Checkpoints ....................................................................................

95

5.4

Speaker .....................................................................................................................

96

5.5

BIOS Beep Codes .....................................................................................................

97

Figures

 

1.

Board Components....................................................................................................

11

2.

Block Diagram ...........................................................................................................

12

3.

Intel 810E Chipset Block Diagram .............................................................................

18

4.

Back Panel I/O Connectors .......................................................................................

39

5.

Internal I/O Connectors .............................................................................................

41

6.

External I/O Connectors ............................................................................................

46

7.

Location of the Jumper Block ....................................................................................

49

8.

Board Dimensions .....................................................................................................

51

9.

I/O Shield Dimensions ...............................................................................................

52

10.

High Temperature Zones...........................................................................................

55

11.

Memory Map of the Flash Memory Device ................................................................

62

Tables

 

 

1.

Feature Summary......................................................................................................

10

2.

Specifications ............................................................................................................

13

3.

Processors Supported by the Board ..........................................................................

16

4.

System Memory Configuration...................................................................................

17

5.

Supported Graphics Refresh Rates ...........................................................................

22

6.

LAN Connector LED States .......................................................................................

26

7.

Effects of Pressing the Power Switch ........................................................................

27

8.

Power States and Targeted System Power ...............................................................

28

9.

Wake Up Devices and Events ...................................................................................

29

10.

Fan Connector Descriptions ......................................................................................

30

11.

System Memory Map.................................................................................................

33

12.

I/O Map .....................................................................................................................

34

13.

DMA Channels ..........................................................................................................

35

14.

PCI Configuration Space Map ...................................................................................

36

15.

Interrupts ...................................................................................................................

36

16.

PCI Interrupt Routing Map .........................................................................................

37

17.

USB Connectors........................................................................................................

40

18.

VGA Port Connector..................................................................................................

40

19.

LAN Connector ..........................................................................................................

40

20.

Audio Line Out Connector .........................................................................................

40

vii

Intel Desktop Board D810EMO/MO810E Technical Product Specification

21.

Mic In Connector .......................................................................................................

40

22.

Chassis Fan Connector (J2J1) ..................................................................................

42

23.

Processor Fan Connector (J7J1) ...............................................................................

42

24.

Primary IDE Connector (J7E1) ..................................................................................

42

25.

Slimline IDE Connector (J8E1) ..................................................................................

43

26.

Serial Debug Port Connector (J7C1) .........................................................................

43

27.

Power Connector (J8B1) ...........................................................................................

44

28.

PCI Bus Connector (J4B1) ........................................................................................

45

29.

ATAPI CD-ROM Connector (J2D1) ...........................................................................

45

30.

USB Port Connector (J7A1).......................................................................................

47

31.

Front Panel Connector (J8C1) ...................................................................................

47

32.

States for a Single-colored Power LED......................................................................

48

33.

States for a Dual-colored Power LED ........................................................................

48

34.

BIOS Setup Configuration Jumper Settings (J8F1)....................................................

50

35.

Power Usage .............................................................................................................

53

36.

Chassis Fan (J3A2) DC Power Requirements ...........................................................

54

37.

Thermal Considerations for Components ..................................................................

56

38.

Board Environmental Specifications ..........................................................................

57

39.

Safety Regulations ....................................................................................................

58

40.

EMC Regulations.......................................................................................................

58

41.

Supervisor and User Password Functions .................................................................

69

42.

BIOS Setup Program Menu Functions.......................................................................

71

43.

BIOS Setup Program Function Keys .........................................................................

72

44.

Maintenance Menu ....................................................................................................

72

45.

Extended Configuration Submenu .............................................................................

73

46.

Main Menu.................................................................................................................

74

47.

Advanced Menu.........................................................................................................

75

48.

Boot Configuration Submenu.....................................................................................

76

49.

Peripheral Configuration Submenu ............................................................................

77

50.

IDE Configuration Submenu ......................................................................................

78

51.

Primary/Secondary IDE Master/Slave Submenus......................................................

79

52.

Event Log Configuration Submenu ............................................................................

81

53.

Video Configuration Submenu ...................................................................................

82

54.

Security Menu............................................................................................................

83

55.

Power Menu ..............................................................................................................

84

56.

Boot Menu .................................................................................................................

85

57.

Exit Menu ..................................................................................................................

87

58.

BIOS Error Messages................................................................................................

89

59.

Uncompressed INIT Code Checkpoints.....................................................................

91

60.

Boot Block Recovery Code Checkpoints ...................................................................

91

61.

Runtime Code Uncompressed in F000 Shadow RAM ...............................................

92

62.

Bus Initialization Checkpoints ....................................................................................

95

63.

Upper Nibble High Byte Functions .............................................................................

95

64.

Lower Nibble High Byte Functions .............................................................................

96

65.

Beep Codes...............................................................................................................

97

viii

1 Product Description

What This Chapter Contains

 

1.1

Overview ...................................................................................................................

10

1.2

Online Support...........................................................................................................

13

1.3

Design Specifications ................................................................................................

13

1.4

Processor ..................................................................................................................

16

1.5

System Memory.........................................................................................................

17

1.6

Intel® 810E Chipset ...................................................................................................

18

1.7

I/O Controller .............................................................................................................

21

1.8

Serial Debug Port ......................................................................................................

21

1.9

Graphics Subsystem .................................................................................................

22

1.10 Audio Subsystem.......................................................................................................

23

1.11 Hardware Monitor Component...................................................................................

24

1.12 LAN Subsystem.........................................................................................................

25

1.13 Power Management Features....................................................................................

27

9

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.1 Overview

1.1.1Feature Summary

Table 1 summarizes the D810EMO/MO810E board’s major features.

Table 1. Feature Summary

Form Factor

Processor

Memory

Chipset

Direct AGP Video

Audio

I/O Controller

Peripheral

Interfaces

Serial Debug

Port

Expansion capabilities

Management

Level 4 Support

Instantly

Available PC

BIOS

FlexATX (9.0 inches by 7.5 inches)

Support for either an Intel®Pentium®III processor in a Flip Chip Pin Grid Array (FC-PGA) package or an Intel®Celeronprocessor in an FCPGA package or a PPGA package

One 168-pin dual inline memory module (DIMM) socket

Supports up to 256 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)

Support for serial presence detect (SPD) and non-SPD DIMMs

Intel®810E chipset, consisting of:

Intel®82810E DC-133 Graphics/Memory Controller Hub (GMCH)

Intel®82801AA I/O Controller Hub (ICH)

Intel®82802AB 4 Mbit Firmware Hub (FWH)

Intel 82810E DC-133 GMCH

4 MB of display cache

VGA port connector on back panel

Audio Codec ’97 (AC ’97) compatible audio subsystem, consisting of the following:

Creative Sound BlasterAudioPCI 128V digital audio controller (ES1373D)

Crystal Semiconductor CS4297A analog codec

SMSC LPC47M102 SIO low pin count (LPC) interface I/O controller

Up to four universal serial bus (USB) ports

Two IDE interfaces with Ultra DMA support One 9-pin stake-pin serial debug port connector

One PCI bus connector at PCI slot 5 location

Intel®82559 local area network (LAN) controller

Hardware monitor

Support for PCI Local Bus Specification, Revision 2.2

Suspend-to-RAM support

Wake on USB ports

Intel®/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS

NOTE

The D810EMO/MO810E board is designed to support only USB-aware operating systems.

10

Product Description

For information about

Refer to

The board’s compliance level with ACPI, Plug and Play, and SMBIOS

Table 2, page 13

 

 

1.1.2Board Layout

Figure 1 shows the location of the major components on the board.

A B

 

C

D

Q

 

 

 

P

 

 

E

 

 

 

O

 

 

 

N

 

 

F

M

 

 

 

L

 

 

G

 

 

 

K

J

I

H

 

 

 

OM08923

A

Crystal Semiconductor CS4297A codec

J

Front panel connector

B

Creative ES1373D digital audio controller

K

Power connector

C

4 MB display cache

L

SMSC LPC47M102 I/O controller

D

Back panel I/O connectors

M

Intel 82801AA ICH

E

Intel 82810E DC-133 GMCH

N

Intel 82559 PCI LAN Controller

F

Processor socket

O

Speaker

G

DIMM socket

P

Battery

H

Primary IDE connector

Q

PCI bus connector

I

Slimline Secondary IDE connector

 

 

Figure 1. Board Components

11

Intel D810EMO, MO810E User Manual

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.1.3Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

 

 

 

Primary/

 

 

 

 

 

 

 

 

USB

 

 

 

 

Port 0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Secondary IDE

 

ATA33/66

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Interface

 

 

 

 

 

 

 

 

USB

 

 

 

 

Port 1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PPGA370

 

 

 

 

 

 

 

 

 

 

 

 

Hub

 

 

 

 

Port 2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

66/100/133

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Processor

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Port 3

 

MHz Host Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Socket

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

810E Chipset

 

100 MHz

82810E

 

 

82802AB

Graphics Memory

AHA

82801AA I/O Controller Hub

SDRAM

Firmware Hub

Controller Hub

Bus

(ICH)

Bus

(FWH)

(GMCH)

 

 

 

 

 

 

DIMM

 

 

 

LPC

 

 

 

Bus

Socket

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

4 MB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VGA

 

 

 

Display

 

 

 

 

 

 

 

 

 

 

 

 

LPC I/O

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Display

 

 

 

 

 

 

 

 

 

 

 

 

Serial Port

 

 

 

 

 

 

Port

 

 

Interface

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Controller

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cache

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PCI Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Hardware

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Digital

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SMBus

 

 

 

 

 

 

 

 

 

PCI Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Monitor

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Controller

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC ’97 Link

 

 

 

 

 

 

 

 

 

 

 

 

 

10/100

 

 

 

 

 

LAN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mbps

 

 

 

 

 

 

 

 

 

 

PCI Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CD-ROM

 

 

 

 

 

 

 

Subsystem

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Analog

 

 

 

 

 

 

 

Ethernet

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Line Out

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Codec

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PCI Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mic In

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Connector

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OM09093

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Figure 2. Block Diagram

12

Product Description

1.2 Online Support

Find information about Intel®desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites:

http://www.intel.com/design/motherbd

http://support.intel.com/support/motherboards/desktop

1.3 Design Specifications

Table 2 lists the specifications applicable to the D810EMO/MO810E board.

Table 2.

Specifications

 

 

 

 

 

 

 

Reference

 

Specification

Version, Revision Date,

This specification is

Name

 

Title

and Ownership

available at:

AC ‘97

 

Audio Codec ‘97

Version 2.1,

ftp://download.intel.com/

 

 

 

May 1998,

pc-supp/platform/ac97

 

 

 

Intel Corporation.

 

ACPI

 

Advanced Configuration

Version 1.0,

http://www.teleport.com/~acpi/

 

 

and Power Interface

July 1, 1998,

 

 

 

Specification (2X only)

Intel Corporation,

 

 

 

 

Microsoft Corporation,

 

 

 

 

and Toshiba Corporation.

 

AGP

 

Accelerated Graphics Port

Version 2.0,

the Accelerated Graphics

 

 

Interface Specification

May 4, 1998,

Implementers Forum at:

 

 

 

Intel Corporation.

http://www.agpforum.org/

AMI BIOS

 

American Megatrends

AMIBIOS 99,

http://www.ami.com/amibios/

 

 

BIOS Specification

June 1999,

bios.platforms.desktop.html

 

 

 

American Megatrends, Inc.

 

ATA-3

 

Information Technology -

Version 6

ATA Anonymous FTP Site:

 

 

AT Attachment-3 Interface,

 

ftp://fission.dt.wdc.com

 

 

X3T10/2008D

 

 

ATAPI

 

Information Technology

Version 18

T13 Anonymous FTP Site:

 

 

AT Attachment with Packet

August 13, 1998,

ftp://fission.dt.wdc.com/

 

 

Interface Extensions

Contact: T13 Chair,

x3t13/project/d1153r18.pdf

 

 

T13/1153D

Seagate Technology

 

ATX

 

ATX Specification

Version 2.01,

http://download.intel.com/

 

 

 

February 1997,

design/motherbd/atx.htm

 

 

 

Intel Corporation.

 

El Torito

 

Bootable CD-ROM format

Version 1.0,

the Phoenix Technologies web

 

 

specification

January 25, 1995,

site at:

 

 

 

Phoenix Technologies Ltd.,

http://www.ptltd.com/techs/

 

 

 

and IBM Corporation.

specs.html

FlexATX

 

FlexATX Addendum to the

Version 1.0

http://www.teleport.com/~ffsupprt

 

 

microATX Specification

 

/spec/FlexATXaddn1_01.pdf

 

 

 

 

continued

13

Intel Desktop Board D810EMO/MO810E Technical Product Specification

Table 2.

Specifications (continued)

 

 

 

 

 

 

 

Reference

 

Specification

Version, Revision Date, and

This specification is

Name

 

Title

Ownership

available at:

IrDA

 

Serial Infrared Physical

Version 1.1, October 17, 1995

E-mail: irda@netcom.com

 

 

Layer Link Specification

Infrared Data Association

 

 

 

 

Phone: (510) 943-6546

 

 

 

 

Fax: (510) 943-5600

 

LPC

 

Low Pin Count Interface

Version 1.0,

http://www.intel.com/

 

 

Specification

September 29, 1997,

design/chipsets/industry/

 

 

 

Intel Corporation.

lpc.htm

MicroATX

 

microATX Motherboard

Version 1.0,

http://www/teleport.com/

 

 

Interface Specification

December 1997

~ffsupprt/spec/

 

 

 

Intel Corporation

microatxspecs.htm

 

 

SFX Power Supply

Version 1.1,

http://www/teleport.com/

 

 

Design Guide

February 1998

~ffsupprt/spec/

 

 

 

microatxspecs.htm

 

 

 

Intel Corporation

 

 

 

 

PCI

 

PCI Local Bus

Version 2.2,

http://www.pcisig.com/

 

 

Specification

December 18, 1998,

 

 

 

 

PCI Special Interest Group.

 

 

 

PCI Bus Power

Version 1.1,

http://www.pcisig.com/

 

 

Management Interface

December 18, 1998,

 

 

 

Specification

PCI Special Interest Group.

 

Plug and

 

Plug and Play BIOS

Version 1.0a,

ftp://download.intel.com/

Play

 

Specification

May 5, 1994,

ial/wfm/bio10a.pdf

 

 

 

Compaq Computer Corp.,

 

 

 

 

Phoenix Technologies Ltd.,

 

 

 

 

and Intel Corporation.

 

SDRAM

 

PC SDRAM Unbuffered

Revision 1.0,

http://www.intel.com/

DIMMs

 

DIMM Specification

February 1998,

design/chipsets/memory/

(64-and

 

 

Intel Corporation.

sdram.htm#S1

72-bit)

 

PC Serial Presence

Revision 1.2A,

http://www.intel.com/

 

 

 

 

Detect (SPD)

December 1997,

design/chipsets/memory/

 

 

Specification

Intel Corporation

sdram.htm#S1

SMBIOS

 

System Management

Version 2.3,

http://developer.intel.com/

 

 

BIOS

August 12, 1998,

ial/wfm/design/smbios

 

 

 

Award Software International Inc.,

 

 

 

 

Dell Computer Corporation,

 

 

 

 

Hewlett-Packard Company,

 

 

 

 

Intel Corporation,

 

 

 

 

International Business Machines

 

 

 

 

Corporation,

 

 

 

 

Phoenix Technologies Limited,

 

 

 

 

American Megatrends Inc.,

 

 

 

 

and SystemSoft Corporation.

 

 

 

 

 

continued

14

Product Description

Table 2.

Specifications (continued)

 

 

 

 

 

 

 

Reference

 

Specification

Version, Revision Date, and

This specification is

Name

 

Title

Ownership

available at:

UHCI

 

Universal Host Controller

Version 1.1,

This guide is available at:

 

 

Interface Design Guide

March 1996,

http://www.usb.org/

 

 

 

Intel Corporation.

developers

USB

 

Universal Serial Bus

Version 1.1,

http://www.usb.org/

 

 

Specification

September 23, 1998,

developers/docs.html

 

 

 

Compaq Computer Corporation,

 

 

 

 

Intel Corporation, Microsoft

 

 

 

 

Corporation, and NEC.

 

WfM

 

Wired for Management

Version 2.0,

http://developer.intel.com/

 

 

Baseline

December 18, 1998,

ial/WfM/wfmspecs.htm

 

 

 

Intel Corporation

 

15

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.4 Processor

CAUTION

The board supports processors that draw a maximum of 22 amps. Using a processor that draws more than 22 amps can damage the processor, the board, and the power supply. See the processor’s data sheet for current usage requirements.

The board supports the processors listed in Table 3. The host bus frequency is automatically selected.

Table 3. Processors Supported by the Board

Processor Type

Processor Speed

Host Bus Frequency

L2 Cache Size

Pentium III processor

600EB MHz

133 MHz

256 KB

 

600E MHz

100 MHz

256 KB

 

550E MHz

100 MHz

256 KB

 

500E MHz

100 MHz

256 KB

Celeron processor

533 MHz

66 MHz

128 KB

 

500 MHz

66 MHz

128 KB

 

466 MHz

66 MHz

128 KB

 

433 MHz

66 MHz

128 KB

 

400 MHz

66 MHz

128 KB

 

366 MHz

66 MHz

128 KB

All supported onboard memory can be cached, up to the cachability limit of the processor.

For information about

Processor support for the D810EMO/MO810E board

Processor data sheets

Refer to

http://support.intel.com/support/motherboards/desktop

http://www.intel.com/design/litcentr

16

Product Description

1.5 System Memory

CAUTION

To be fully compliant with all applicable Intel®SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your memory modules do not support SPD, you will see a notification to this effect on the screen at power up. The BIOS will attempt to configure the memory controller for normal operation; however, DIMMs may not function at the determined frequency.

CAUTION

Because the main system memory is also used as video memory, the board requires a 100 MHz SDRAM DIMM even though the host bus frequency is 66 MHz. It is highly recommended that an SPD DIMM be used, since this allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted.

The board has one DIMM socket. The minimum memory size is 32 MB and the maximum memory size is 256 MB. The BIOS automatically detects memory type, size, and frequency.

The board supports the following memory features:

3.3 V, 168-pin DIMM with gold-plated contacts

100 MHz SDRAM

Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires an SPD DIMM)

Non-ECC (64-bit) memory

Unbuffered singleor double-sided DIMM

The board is designed to support the DIMM configurations listed in Table 4 below.

Table 4. System Memory Configuration

DIMM Size

32 MB

64 MB

128 MB

256 MB (Note)

Non-ECC Configuration

4 Mbit x 64

8 Mbit x 64

16 Mbit x 64

32 Mbit x 64

Note:

A 256 MB DIMM used with this board must be built with 128 Mbit device technology.

For information about

The PC Serial Presence Detect Specification

Obtaining copies of PC SDRAM specifications

Refer to

Table 2, page 13

http://www.intel.com/design/pcisets/memory

17

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.6 Intel® 810E Chipset

The Intel 810E chipset consists of the following devices:

82810E DC-133 Graphics Memory Controller Hub (GMCH) with accelerated hub architecture (AHA) bus

82801AA I/O Controller Hub (ICH) with AHA bus

82802AB Firmware Hub (FWH)

The chipset provides the host, memory, display, and I/O interfaces shown in Figure 3.

66/100/133 MHz

 

 

 

 

 

 

 

 

ATA33/66

 

 

 

USB

Host Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

810E Chipset

 

100 MHz

82810E

 

 

82802AB

Graphics Memory

AHA

82801AA I/O Controller Hub

SDRAM

Firmware Hub

Controller Hub

Bus

(ICH)

Bus

(FWH)

(GMCH)

 

 

 

 

 

 

 

 

 

SMBus

 

PCI Bus

LPC Bus

Display

AC Link

Interface

OM09130

Figure 3. Intel 810E Chipset Block Diagram

For information about

The Intel 810E chipset

The resources used by the chipset

The chipset’s compliance with ACPI and AC ‘97

Refer to

http://developer.intel.com

Chapter 2

Table 2, page 13

18

Product Description

1.6.1Direct AGP

Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-intensive applications, such as 3-D applications. AGP overcomes certain limitations of the PCI bus related to handling large amount of graphics data with the following features:

Pipelined memory read and write operations that hide memory access latency

Demultiplexing of address and data on the bus for nearly 100 percent bus efficiency

For information about

The location of the VGA port connector

Obtaining the Accelerated Graphics Port Interface Specification

Refer to

Figure 4, page 39

Table 2, page 13

1.6.2USB

The board supports up to four USB ports; one USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to any of the ports. Two USB ports are implemented with stacked back panel connectors. The other two ports can be routed from the connector at location J7A1 via a cable to the front panel. The board fully supports UHCI and uses UHCI-compatible software drivers. USB features include:

Support for self-identifying peripherals that can be connected or disconnected while the computer is running

Automatic mapping of function to driver and configuration

Support for isochronous and asynchronous transfer types over the same set of wires

Support for up to 127 physical devices

Guaranteed bandwidth and low latencies appropriate for telephony, audio, and other applications

Error-handling and fault-recovery mechanisms built into the protocol

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device or a low-speed USB device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.

For information about

The location of the USB connectors on the back panel

The signal names of the USB connectors

The location of the USB port connector for the front panel

The signal names for the USB port connector for the front panel

The USB and UHCI specifications

Refer to

Figure 4, page 39

Table 17, page 40

Figure 6, page 46

Table 30, page 47

Table 2, page 13

19

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.6.3IDE Support

The board has two independent bus-mastering IDE interfaces. These interfaces support:

ATAPI devices (such as CD-ROM drives)

ATA devices using the transfer modes listed in Table 51 on page 79

The BIOS supports logical block addressing (LBA) and extended cylinder head sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.

The board supports laser servo (LS-120) diskette technology through its IDE interfaces. The LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:

ARMD-FDD (ATAPI removable media device – floppy disk drive)

ARMD-HDD (ATAPI removable media device – hard disk drive)

The board has two IDE interface connectors. The primary IDE connector is a standard 40-pin IDE interface. The secondary IDE connector is a 50-pin Slimline IDE connector, intended for use with devices such as 2.5-inch hard disk drives and mobile CD-ROM drives. The Slimline IDE connector has the standard IDE interface pins but also includes audio and power signals.

For information about

The location of the IDE connectors

The signal names of the primary IDE connector

The signal names of the Slimline secondary IDE connector

BIOS Setup program’s Boot menu

Refer to

Figure 5, page 41

Table 24, page 42

Table 25, page 43

Table 56, page 85

1.6.4Real-Time Clock, CMOS SRAM, and Battery

The real-time clock is compatible with DS1287 and MC146818 components. The clock provides a time-of-day clock and a multicentury calendar with alarm features and century rollover. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.

A coin-cell battery powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the 3.3 V standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.

NOTE

If the battery and AC power fail, standard defaults, not custom defaults, will be loaded into CMOS RAM at power on.

20

Product Description

NOTE

The recommended method of accessing the date in systems with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIOS on Intel desktop boards contains a century checking and maintenance feature. This feature checks the two least significant digits of the year stored in the RTC during each BIOS request (INT 1Ah) to read the date and, if less than 80 (i.e., 1980 is the first year supported by the PC), updates the century byte to 20. This feature enables operating systems and applications using the BIOS date/time services to reliably manipulate the year as a four-digit value.

For information about

Refer to

Proper date access in systems with Intel desktop boards

http://support.intel.com/support/year2000/

 

 

1.7 I/O Controller

The SMSC LPC47M102 I/O controller provides the following features:

·Low pin count (LPC) interface

·One serial port

·Infrared (IrDA) interface

·Intelligent power management, including a programmable wake up event interface

·Fan control:

¾One pulse width modulation (PWM) fan speed control output

¾One fan tachometer input

The BIOS Setup program provides configuration options for the I/O controller.

For information about

SMSC LPC47M102 I/O controller

The IrDA interface

Refer to

http://www.smsc.com

Section 2.8.3, page 46

1.8 Serial Debug Port

The board has one 9-pin serial debug port connector. The serial debug port’s NS16C550-compatible UART supports data transfers at rates of up to 115.2 kbits/sec with BIOS support. The serial debug port can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).

For information about

The location of the serial debug port connector

The signal names of the serial debug port connector

Refer to

Figure 5, page 41

Table 26, page 43

21

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.9 Graphics Subsystem

The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics support features:

Integrated 2-D and 3-D graphics engines

Integrated hardware motion compression engine

Integrated 230 MHz DAC

Table 5 lists the refresh rates supported by graphics subsystem.

Table 5.

Supported Graphics Refresh Rates

 

 

 

 

 

 

Resolution

 

Color Palette

Available Refresh Frequencies (Hz)

640 x 480

 

16 colors

60, 70, 72, 75, 85

 

 

 

256 colors

60, 70, 72, 75, 85

 

 

 

64

K colors

60, 70, 72, 75, 85

 

 

 

16

M colors

60, 70, 72, 75, 85

 

720 x 480

 

256 colors

75, 85

 

 

 

 

64

K colors

75, 85

 

 

 

 

16

M colors

75, 85

 

 

720 x 576

 

256 colors

60, 75, 85

 

 

 

 

64

K colors

60, 75, 85

 

 

 

 

16

M colors

60, 75, 85

 

 

800 x 600

 

256 colors

60, 70, 72, 75, 85

 

 

 

64

K colors

60, 70, 72, 75, 85

 

 

 

16

M colors

60, 70, 72, 75, 85

 

1024 x 768

 

256 colors

60, 70, 72, 75, 85

 

 

 

64

K colors

60, 70, 72, 75, 85

 

 

 

16

M colors

60, 70, 72, 75, 85

 

1152 x 864

 

256 colors

60, 70, 72, 75, 85

 

 

 

64

K colors

60, 70, 72, 75, 85

 

 

 

16

M colors

60, 70, 72, 75, 85

 

1280 x 1024

256 colors

60, 70, 72, 75, 85

 

 

 

64

K colors

60, 70, 72, 75, 85

 

 

 

16

M colors

60, 70, 75, 85

 

 

1600 x 1200

256 colors

60, 70, 72, 75, 85

 

For information about

 

Refer to

 

 

Obtaining graphics software and utilities

http://support.intel.com/support/motherboards/desktop

 

 

 

 

 

 

 

22

Product Description

1.10 Audio Subsystem

The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features:

·Split digital/analog architecture for improved signal-to-noise ratio (³ 85 dB) measured at line out, from any analog input, including line in, and CD-ROM

·3-D stereo enhancement

·Power management support for ACPI 1.0a

The audio subsystem consists of these devices:

· Creative Sound Blaster AudioPCI 128V

· Crystal Semiconductor CS4297A stereo audio codec · Audio connectors

For information about

Refer to

Obtaining audio software and utilities

Section 1.2, page 13

 

 

1.10.1Creative Sound Blaster AudioPCI 128V

The Creative Sound Blaster AudioPCI 128V features:

·Creative ES1373D digital audio controller

·Interfaces to the PCI bus as a Plug and Play device

·100% DOS legacy compatible

·Access to main memory (through the PCI bus) for wavetable synthesis support – does not require a separate wavetable ROM device

·Conforms to the PC 98 and PC 99 design guides

For information about

Refer to

Creative Sound Blaster AudioPCI 128V

http://www.soundblaster.com

 

 

1.10.2Creative ES1373D Digital Audio Controller

The Creative ES1373D digital audio controller’s features include:

·PCI 2.1 compliant

·PCI bus master for PCI audio

·128-voice wavetable synthesizer

·Aureal A3DAPI, Sound Blaster Pro, Roland MPU-401 MIDI, joystick compatible

·Ensoniq 3D positional audio and Microsoft DirectSound3D support

1.10.3Crystal Semiconductor CS4297A Analog Codec

The Crystal Semiconductor CS4297A is a fully AC ’97 compliant codec. The codec's features include:

·18-bit stereo full-duplex operation

·Up to 48 kHz sampling rate

·Connects to ES1373D digital controller using a five-wire digital interface

23

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.10.4Audio Connectors

The audio connectors include the following:

Line out (back panel)

Mic in (back panel)

ATAPI CD-ROM (connects an internal ATAPI CD-ROM drive to the audio mixer)

For information about

The back panel audio connectors

The location of the ATAPI CD-ROM connector

The signal names of the ATAPI CD-ROM connector

Refer to

Section 2.8.1, page 39

Figure 5, page 41

Table 29, page 45

1.11 Hardware Monitor Component

The hardware monitor component provides low-cost instrumentation capabilities. The features of the component include:

Internal ambient temperature sensing

Remote thermal diode sensing for direct monitoring of processor temperature

Power supply monitoring (+12, +5, +3.3, +2.5, VCCP) to detect levels above or below acceptable values

SMBus interface

The hardware monitor component enables the board to be compatible with the Wired for Management (WfM) specification.

For information about

Refer to

The board’s compatibility with the WfM specification

Table 2, page 13

 

 

24

Product Description

1.12 LAN Subsystem

The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity. Features include:

·32-bit, 33 MHz direct bus mastering on the PCI bus

·10Base-T and 100Base-TX capability using a single RJ-45 connector with connection and activity status LEDs

·IEEE 802.3u Auto-Negotiation for the fastest available connection

·Jumperless configuration; the LAN subsystem is completely software-configurable

For information about

Refer to

The WfM specification

Table 2, page 13

 

 

1.12.1Intel®82559 PCI LAN Controller

The Intel 82559 PCI LAN controller’s features include:

·CSMA/CD Protocol Engine

·PCI bus interface

·DMA engine for movement of commands, status, and network data across the PCI bus

·Integrated physical layer interface, including:

¾Complete functionality necessary for the 10Base-T and 100Base-TX network interfaces; when in 10 Mbit/sec mode, the interface drives the cable directly

¾A complete set of Media Independent Interface (MII) management registers for control and status reporting

¾IEEE 802.3u Auto-Negotiation for automatically establishing the best operating mode when connected to other 10Base-T or 100Base-TX devices, whether halfor full-duplex capable

·Integrated power management features, including support for wake on network event (from an ACPI S3 state using the PCI bus PME# signal)

For information about

Refer to

The LAN subsystem’s PCI specification compliance

Table 2, page 13

 

 

25

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.12.2LAN Subsystem Software

The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site.

For information about

Refer to

Obtaining LAN software and drivers

Section 1.2, page 13

 

 

1.12.3RJ-45 LAN Connector LEDs

Two LEDs are built into the RJ-45 LAN connector. Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 6.

LAN Connector LED States

 

 

 

 

LED Color

 

LED State

Condition

Green

 

Off

10 Mbit/sec data rate is selected.

 

 

On

100 Mbit/sec date rate is selected.

Yellow

 

Off

LAN link is not established.

 

 

On (steady state)

LAN link is established.

 

 

On (brighter and pulsing)

The computer is communicating with another computer on

 

 

 

the LAN.

26

Product Description

1.13 Power Management Features

Power management is implemented at several levels, including:

·Advanced Configuration and Power Interface (ACPI)

·Hardware support:

¾Power connector

¾Wake on network event

¾Instantly Available technology

¾Wake on Ring

¾Resume on Ring

1.13.1ACPI

If the board is used with an ACPI-aware operating system, the BIOS can provide ACPI support. ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires the support of an operating system that provides full ACPI functionality. ACPI features include:

·Plug and Play (including bus and device enumeration)

·Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives

·Methods for achieving less than 30-watt system operation in the Power On Suspend sleeping state, and less than 5-watt system operation in the Suspend to RAM sleeping state

·A Soft-off feature that enables the operating system to power off the computer

·Support for multiple wake up events (see Table 9 on page 29)

·Support for a front panel power and sleep mode switch. Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

If the system is in this state…

Off

(ACPI G2/S5 state)

On

(ACPI G0 state)

On

(ACPI G0 state)

Sleep

(ACPI G1 state)

Sleep

(ACPI G1 state)

…and the power switch is pressed for

Less than four seconds

Less than four seconds

More than four seconds

Less than four seconds

More than four seconds

…the system enters this state

Power on

Soft off/Suspend

Fail safe power off

Wake up

Power off

For information about

Refer to

The board’s compliance level with ACPI

Section 1.3, page 13

 

 

27

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.13.1.1System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Global States

G0 – working state

G1 – sleeping state

G1 – sleeping state

G2/S5

G3 – mechanical off.

AC power is disconnected from the computer.

Sleeping States

CPU States

Device States

Targeted System Power*

S0 – working

C0 – working

D0 – working

Full power > 30 W

 

 

state

 

S1 – CPU stopped

C1 – stop

D1, D2, D3 –

5 W < power < 30 W

 

grant

device

 

 

 

specification

 

 

 

specific.

 

S3 – Suspend-to-

No power

D3 – no power

Power < 5 W **

RAM. Context

 

except for wake

 

saved to RAM.

 

up logic.

 

S5 – Soft off.

No power

D3 – no power

Power < 5 W **

Context not saved.

 

except for wake

 

Cold boot is

 

up logic.

 

required.

 

 

 

No power to the

No power

D3 – no power for

No power to the system so

system.

 

wake up logic,

that service can be

 

 

except when

performed.

 

 

provided by

 

 

 

battery or external

 

 

 

source.

 

 

 

 

 

*Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

**Dependent on the standby power consumption of wake up devices used in the system.

28

Product Description

1.13.1.2Wake Up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake Up Devices and Events

These devices/events can wake up the computer…

…from this state

Power switch

RTC alarm

LAN

Modem

USB

PCI bus PME#

S1, S3, S5

S1, S3, S5

S1, S3

S1, S3

S1, S3

S3

1.13.1.3Plug and Play

In addition to power management, ACPI provides controls and information so that the operating system can facilitate Plug and Play device enumeration and configuration. ACPI is used only to enumerate and configure devices that do not have other hardware standards for enumeration and configuration. PCI devices on a desktop board, for example, are not enumerated by ACPI.

1.13.2Hardware Support

CAUTION

If Wake on network event and Instantly Available technology features are used, the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Refer to Section 2.11.3 on page 54 for additional information.

The board provides several hardware features that support power management, including:

Power connector

Wake on network event

Instantly Available technology

Wake on Ring

Resume on Ring

Wake on network event and Instantly Available technology require power from the +5 V standby line. The sections discussing these features describe the incremental standby power requirements for each.

Wake on Ring and Resume on Ring enable telephony devices to access the computer when it is in a power-managed state. The method used depends on the type of telephony device (external or internal) and the power management mode being used (ACPI).

NOTE

The use of Wake on Ring and Resume on Ring technologies from an ACPI state require the support of an operating system that provides full ACPI functionality.

29

Intel Desktop Board D810EMO/MO810E Technical Product Specification

1.13.2.1Power Connector

When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control. To enable soft-off control in software, advanced power management must be enabled in the BIOS Setup program and in the operating system. When the system BIOS receives the correct power management command from the operating system, the BIOS turns off power to the computer.

With soft-off enabled, if power to the computer is interrupted by a power outage or a disconnected power cord, when power resumes, the computer returns to the power state it was in before power was interrupted (on or off).

For information about

The location of the power connector

The signal names of the power connector

The ATX specification

Refer to

Figure 5, page 41

Table 27, page 44

Section 1.3, page 13

1.13.2.2Fan Connectors

The board has two fan connectors. The functions of these connectors are described in Table 10.

Table 10. Fan Connector Descriptions

Connector

Chassis fan

Processor fan

Function

Provides +12 V DC for a system or chassis fan.

Provides +12 V DC for a processor fan or active fan heatsink.

For information about

The location of the fan connectors

The signal names of the chassis fan connector

The signal names of the processor fan connector

Refer to

Figure 5, page 41

Table 22, page 42

Table 23, page 42

1.13.2.3Wake on Network Event

CAUTION

For Wake on network event, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Wake on network event can damage the power supply. Refer to Section 2.11.3 on page 54 for additional information.

Wake on network event enables remote wakeup of the computer through a network. The LAN subsystem, whether onboard or as a PCI bus network adapter, monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet, the LAN subsystem asserts a wakeup signal that powers up the computer. The board supports Wake on network event through the PCI bus PME# signal.

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