Siemens PEB24902, PEF24902 Datasheet

0 (0)

ICs for Communications

Quad ISDN Echocancellation Circuit Analogue Front End

Quad IEC AFE

PEB 24902 Version 1.1

PEF 24902 Version 1.1

Data Sheet 5.96

T2490-211-D2-7600

PEB 24902 Revision History

5.96

Previous Releases: 2.96

 

p. 21/22

PLL characteristics

 

 

p. 24/25

Description of ADC and table 5, ADC

 

 

p.26

Fig. 10

 

 

p. 28

Description of DAC

 

 

Edition 5.96

This edition was realized using the software system FrameMakerâ.

Published by Siemens AG, Bereich Halbleiter, MarketingKommunikation, Balanstraße 73, 81541 München

© Siemens AG 1995.

All Rights Reserved.

Attention please!

As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies.

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved.

For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list).

Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group.

Siemens AG is an approved CECC manufacturer.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport.

For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express written approval of the Semiconductor Group of Siemens AG.

1A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.

2Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

 

 

PEB 24902

 

 

PEF 24902

Table of Contents

Page

1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . .5

1.1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . .6

1.2

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . .7

1.3

Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . .8

1.4

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . .9

1.5

Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .10

2

System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .15

2.1

Line Card Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .15

2.2

NT Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .18

3

Technical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .19

3.1

Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .19

3.1.1Specification of the PLL and the 15.36 MHz Master Clock (Pin CL15) . . .19

3.1.2

Specification of the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22

3.2

Analogue Line Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

23

3.2.1

Analogue-to-Digital Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

24

3.2.2

Range Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

26

3.2.3

Digital-to-Analogue Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

26

3.2.4

External Hybrid and Transformer Parameters . . . . . . . . . . . . . . . . . . . . . .

29

3.2.5

Analogue Loop-back Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31

3.2.6

Level Detect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

32

3.2.7

Power down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33

3.2.8

Power-on-Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33

3.2.9

Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33

3.3

Digital Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33

3.3.1

Frame structure on the Digital Interface in the 2B1Q Mode . . . . . . . . . . .

35

3.3.2

Frame structure on the Digital Interface in the 4B3T mode . . . . . . . . . . . .

36

3.3.3

Propagation Delay in transmit direction . . . . . . . . . . . . . . . . . . . . . . . . . . .

37

3.4

NT-Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

37

3.5

Boundary Scan Test Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

39

4

Digital Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

42

4.1

Static Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

42

4.2

Dynamic Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

43

4.3

Boundary Scan Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

44

5

Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

46

5.1

Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

46

5.2

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

46

6

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

47

6.1

Line Overload Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

47

Semiconductor Group

3

05.96

 

 

PEB 24902

 

 

PEF 24902

Table of Contents

Page

7

Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . .49

7.1

Storage and Transportation . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . .49

7.2

Operating Ambient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .49

7.3

Thermal Contact Resitance . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .49

8

Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . .50

Semiconductor Group

4

05.96

PEB 24902

PEF 24902

Overview

1 Overview

The PEB 24902 Quad IEC AFE (Quadruple ISDN Echocancellation Circuit Analogue Front End) is part of a 2B1Q or 4B3T ISDN U-transceiver chip set. Up to four lines can be accessed simultaneously by the Quad IEC AFE. The Quad IEC AFE is optimized to work in conjunction with the PEB 24901 Quad IEC DFE-T and the PEB 24911 Quad IEC DFE-Q. An integrated PLL synchronizes the 15.36 MHz Master clock onto the 8 kHz or 2048 kHz PTT Clock. This specification describes the functionality for 2B1Q and 4B3T interfaces.

Semiconductor Group

5

05.96

Quad ISDN Echocancellation Circuit Analogue Front End

PEB 24902

Quad IEC AFE

PEF 24902

Version 1.1

CMOS

1.1Features

Digital to Analogue conversion (transmit pulse)

Output buffering

• Analogue to digital conversion

Detection of signal on the line

Master clock generation by PLL

P-MQFP-64 Package

Compliant to ANSI T1.601 (1992), ETSI ETR 080

P-MQFP-64-1

 

(1995)

 

 

JTAG boundary scan path compliant to IEEE 1149.1

 

Semiconductor Group

6

05.96

PEB 24902

PEF 24902

Overview

1.2Logic Symbol

Analog Line Ports

BIN1

AIN1

BOUT1

AOUT1

+5 V V DD d1...2, a1...4 0 V GNDd1...2, a1...4

CODE

Mode Settings ADDR

PLLF

RES

 

 

V REF1

 

 

 

 

Block Capacitors

 

V REF2

 

 

 

100 nF to GND

 

V REF3

CLOCK CL15

 

 

 

V REF4

 

 

 

AOUT2 BOUT2 AIN2 BIN2

AOUT3 BOUT3 AIN3 BIN3

PEB 24902

AOUT4 BOUT4

AIN4 BIN4

 

SDX

 

SDR

XDN1

XDN2

XDN3

XDN4

PDM1

PDM2

PDM3

PDM4

XIN

XOUT

TMS TCK TDI TDO

 

TDISS

 

Boundary Scan Pins

Serial Interface to PEB 24901 or PEB 24911

Transmit Data from PEB 24911 in NT Mode

ADC Outputs

ITL07131

Figure 1

Logic Symbol

Semiconductor Group

7

05.96

Siemens PEB24902, PEF24902 Datasheet

PEB 24902

PEF 24902

Overview

1.3Functional Block Diagram

DFE

Digital

D

 

 

Buffer

Interface

Interface

 

 

A

 

 

 

 

 

 

 

Level

 

A

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Voltage Reference

 

 

Common

 

 

 

 

 

 

PLL

 

 

 

 

 

 

 

D

 

A

Buffer

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Level

 

A

D

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Voltage Reference

 

Trafo Analogue

Hybrid IN/OUT

Trafo Analogue

Hybrid IN/OUT

ITB07132

Figure 2

Block Diagram of the Quad IEC AFE

Semiconductor Group

8

05.96

PEB 24902

PEF 24902

Overview

1.4Pin Configuration

N.C. AOUT3 V

N.C. BOUT3 N.C. V

SDR PDM3 PDM2 PDM1 V

BOUT1 N.C. V

AOUT1

DD

SS

DD

DD

 

VSS

48

47

46

45

44

43

42

41 40

39

38

37

36

35

34

33

49

 

 

 

 

 

 

 

 

 

 

 

 

 

 

32

XDN3

50

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

VREF3

51

 

 

 

 

 

 

 

 

 

 

 

 

 

 

30

AIN3

52

 

 

 

 

 

 

 

 

 

 

 

 

 

 

29

BIN3

53

 

 

 

 

 

 

 

 

 

 

 

 

 

 

28

N.C.

54

 

 

 

 

 

 

 

 

 

 

 

 

 

 

27

TDI

55

 

 

 

 

 

 

 

 

 

 

 

 

 

 

26

TDO

56

 

 

 

 

 

PEB 24902

 

 

 

 

 

25

TCK

57

 

 

 

 

 

 

 

 

 

 

24

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TMS

58

 

 

 

 

 

 

 

 

 

 

 

 

 

 

23

TDISS

59

 

 

 

 

 

 

 

 

 

 

 

 

 

 

22

BIN4

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

21

AIN4

61

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

VREF4

62

 

 

 

 

 

 

 

 

 

 

 

 

 

 

19

XDN4

63

 

 

 

 

 

 

 

 

 

 

 

 

 

 

18

VSS

64

2

3

4

5

6

7

8

9

10

11 12

13

14

15

17

 

1

16

 

N.C.

AOUT4

DD

N.C.

BOUT4

SS

CL15

PDM4

XOUT

XIN

DD

N.C.

BOUT2

N.C.

DD

AOUT2

 

V

V

V

V

VSS

XDN1

VREF1

AIN1

BIN1

ADDR CLOCK

RES

SDX

CODE

PLLF

BIN2

AIN2

VREF2

XDN2

VSS

ITP07133

Figure 3

Pin Configuration

(top view)

Semiconductor Group

9

05.96

PEB 24902

PEF 24902

Overview

1.5Pin Definitions and Functions

The following tables group the pins according to their functions. They include pin name, pin number, type, a brief description of the function and cross-references referring to the sections in which the pin functions are discussed.

Table 1

Pin Definitions and Functions

Pin No.

Symbol

Input (I)

Description

Reference

 

 

Output (O)

 

 

 

 

 

 

 

Power Supply Pins

 

 

 

 

 

 

 

 

37

VDDd1

 

5V +/-5% digital supply voltage

5.1

11

VDDd2

 

 

 

34

VDDa1

 

5V +/-5% analogue supply voltage

5.1

15

VDDa2

 

 

 

46

VDDa3

 

 

 

3

VDDa4

 

 

 

42

GNDd1

 

0V digital

5.1

6

GNDd2

 

 

 

32

GNDa1

 

0V analogue

5.1

17

GNDa2

 

 

 

49

GNDa3

 

 

 

64

GNDa4

 

 

 

30

VREF1

I/O

VREF pin to Buffer internally

2

 

 

 

generated voltage with capacitor

 

 

 

 

100 nF vs. GND

 

 

 

 

 

 

19

VREF2

I/O

VREF pin to Buffer internally

2

 

 

 

generated voltage with capacitor

 

 

 

 

100 nF vs. GND

 

 

 

 

 

 

51

VREF3

I/O

VREF pin to Buffer internally

2

 

 

 

generated voltage with capacitor

 

 

 

 

100 nF vs. GND

 

 

 

 

 

 

Semiconductor Group

10

05.96

PEB 24902

PEF 24902

Overview

Table 1

Pin Definitions and Functions (cont’d)

Pin No.

 

Symbol

Input (I)

Description

Reference

 

 

 

 

Output (O)

 

 

 

 

 

 

 

 

62

 

VREF4

I/O

VREF pin to Buffer internally

2

 

 

 

 

 

generated voltage with capacitor.

 

 

 

 

 

 

100 nF vs. GND

 

 

 

 

 

 

JTAG Boundary Scan

 

 

 

 

 

 

 

 

57

 

TCK

I

Test Clock.

3.5,4.3

 

 

 

 

 

 

58

 

TMS

I

Test Mode Select, internal pullup.

3.5,4.3

 

 

 

 

 

 

55

 

TDI

I

Test Data Input, internal pullup.

3.5,4.3

 

 

 

 

 

 

56

 

TDO

O

Test Data Output.

3.5,4.3

 

 

 

 

 

 

 

59

 

 

 

I

JTAG Boundary Scan Disable, active

3.5

TDISS

 

 

 

 

 

low, internal pullup.

 

 

 

 

 

 

Line Port Pins

 

 

 

 

 

 

 

 

 

29

 

AIN1

I

Differential U interface input.

3.2.1

 

 

 

 

 

Line port 1

 

 

 

 

 

 

 

28

 

BIN1

I

Differential U interface input.

3.2.1

 

 

 

 

 

Line port 1

 

 

 

 

 

 

 

33

 

AOUT1

O

Differential U interface output.

3.2.3

 

 

 

 

 

Line port 1

 

 

 

 

 

 

 

36

 

BOUT1

O

Differential U interface output.

3.2.3

 

 

 

 

 

Line port 1

 

 

 

 

 

 

 

20

 

AIN2

I

Differential U interface input.

3.2.1

 

 

 

 

 

Line port 2

 

 

 

 

 

 

 

21

 

BIN2

I

Differential U interface input.

3.2.1

 

 

 

 

 

Line port 2

 

 

 

 

 

 

 

16

 

AOUT2

O

Differential U interface output.

3.2.3

 

 

 

 

 

Line port 2

 

 

 

 

 

 

 

13

 

BOUT2

O

Differential U interface output.

3.2.3

 

 

 

 

 

Line port 2

 

 

 

 

 

 

 

52

 

AIN3

I

Differential U interface input.

3.2.1

 

 

 

 

 

Line port 3

 

 

 

 

 

 

 

 

Semiconductor Group

11

05.96

PEB 24902

PEF 24902

Overview

Table 1

Pin Definitions and Functions (cont’d)

Pin No.

Symbol

Input (I)

Description

Reference

 

 

Output (O)

 

 

 

 

 

 

 

53

BIN3

I

Differential U interface input.

3.2.1

 

 

 

Line port 3

 

 

 

 

 

 

47

AOUT3

O

Differential U interface output.

3.2.3

 

 

 

Line port 3

 

 

 

 

 

 

44

BOUT3

O

Differential U interface output.

3.2.3

 

 

 

Line port 3

 

 

 

 

 

 

61

AIN4

I

Differential U interface input.

3.2.1

 

 

 

Line port 4

 

 

 

 

 

 

60

BIN4

I

Differential U interface input.

3.2.1

 

 

 

Line port 4

 

 

 

 

 

 

2

AOUT4

O

Differential U interface output.

3.2.3

 

 

 

Line port 4

 

 

 

 

 

 

5

BOUT4

O

Differential U interface output.

3.2.3

 

 

 

Line port 4

 

 

 

 

 

 

Digital Interface

 

 

 

 

 

 

 

 

7

CL15

I/O

Master Clock 15.36 MHz. All

3.1.1, 4.2

 

 

 

operations and the data exchange on

 

 

 

 

the digital interface are based on this

 

 

 

 

clock. If a 15.36 MHz clock is

 

 

 

 

generated by the internal PLL/

 

 

 

 

oscillator or if an external clock is

 

 

 

 

provided at XIN then CL15 issues this

 

 

 

 

clock. If the pin XIN is clamped to low

 

 

 

 

or high then CL15 is input and an

 

 

 

 

other device has to provide the 15.36

 

 

 

 

MHz clock.

 

 

 

 

 

 

38

PDM1

O

Pulse density modulated output of the

3.2.1, 4.2

 

 

 

second-order sigma-delta ADC of line

 

 

 

 

port 1

 

 

 

 

 

 

39

PDM2

O

Pulse density modulated output of the

3.2.1, 4.2

 

 

 

second-order sigma-delta ADC of line

 

 

 

 

port 2

 

 

 

 

 

 

Semiconductor Group

12

05.96

PEB 24902

PEF 24902

Overview

Table 1

Pin Definitions and Functions (cont’d)

Pin No.

Symbol

Input (I)

Description

Reference

 

 

Output (O)

 

 

 

 

 

 

 

40

PDM3

O

Pulse density modulated output of the

3.2.1, 4.2

 

 

 

second-order sigma-delta ADC of line

 

 

 

 

port 3

 

 

 

 

 

 

8

PDM4

O

Pulse density modulated output of the

3.2.1, 4.2

 

 

 

second-order sigma-delta ADC of line

 

 

 

 

port 4.

 

 

 

 

 

 

31

XDN1

I

Input for Transmit data in NT mode.

3.4

 

 

 

Not used in LT-Mode. Internal

 

 

 

 

pulldown.

 

 

 

 

 

 

18

XDN2

I

Input for Transmit data in NT mode.

3.4

 

 

 

Not used in LT-Mode. Internal

 

 

 

 

pulldown.

 

 

 

 

 

 

50

XDN3

I

Input for Transmit data in NT mode.

3.4

 

 

 

Not used in LT-Mode. Internal

 

 

 

 

pulldown.

 

 

 

 

 

 

63

XDN4

I

Input for Transmit data in NT mode.

3.4

 

 

 

Not used in LT-Mode. Internal

 

 

 

 

pulldown.

 

 

 

 

 

 

24

SDX

I

Interface for the transmit and control

3.3, 4.2

 

 

 

data. Up to eight lines can be

 

 

 

 

multiplexed on SDX. Transmission

 

 

 

 

and sampling is based on clock CL15

 

 

 

 

(15,36 MBit/sec):

 

 

 

 

For each line port the following bits

 

 

 

 

are exchanged:

 

 

 

 

TD0, TD1, TD2: Transmit data

 

 

 

 

RANGE: Range select

 

 

 

 

LOOP: Analogue loop back switch

 

 

 

 

PDOW: Power down/power up

 

 

 

 

NT: NT-Mode or LT-Mode

 

 

 

 

Synchronization information

 

 

 

 

 

 

41

SDR

O

Level information for the detection of

3.3, 4.2

 

 

 

the awake tone. The four lines are

 

 

 

 

multiplexed on SDR.

 

 

 

 

 

 

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PEB 24902

PEF 24902

Overview

Table 1

Pin Definitions and Functions (cont’d)

Pin No.

Symbol

Input (I)

Description

Reference

 

 

 

 

Output (O)

 

 

 

 

 

 

 

27

ADDR

I

Select the assignment of time slots

3.3

 

 

 

 

 

and line ports.

 

 

 

 

 

 

 

23

 

CODE

I

Select 2B1Q or 4B3T code. Code =

3.3, 3.2.3

 

 

 

 

 

low sets 2B1Q Code.

 

 

 

 

 

 

 

 

25

 

 

 

I

Reset and power down of the entire

3.2.9

RES

 

 

 

 

 

IEC Quad AFE including PLL and all

 

 

 

 

 

 

four line ports. Asynchronous signal,

 

 

 

 

 

 

active low.

 

 

 

 

 

 

 

 

PLL

 

 

 

 

 

 

 

 

 

 

 

9

XOUT

O

Crystal out. 15.36 MHz crystal is

3.1.2

 

 

 

 

 

connected. Leave open if not used.

 

 

 

 

 

 

10

XIN

I

Crystal in. External 15.36 MHz clock

3.1, 3.1.2

 

 

 

 

 

signal or 15.36 MHz crystal is

 

 

 

 

 

 

connected. Clamping XIN to either low

 

 

 

 

 

 

or high sets CL15 to Input.

 

 

 

 

 

 

26

CLOCK

I

8 kHz or 2048 kHz clock as a time

3.1

 

 

 

 

 

base of the 15.36 MHz clock.Connect

 

 

 

 

 

 

to GND if not used.

 

 

 

 

 

 

 

22

 

PLLF

I

Select corner frequency of PLL Jitter

3.1

 

 

 

 

 

Transfer function. Internal pullup

 

 

 

 

 

 

resistor.

 

 

 

 

 

 

 

 

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PEB 24902

PEF 24902

System Integration

2 System Integration

The Quad IEC AFE is optimized for line modules in the central office or access networks (LT function) together with the PEB 24901 Quad IEC DFE-T for 4B3T code or the PEB 24911 Quad IEC DFE-Q for 2B1Q code. Application in the multi channel NT function together with the PEB 24911 Quad IEC DFE-Q V2.1 is supported. The PEB 24911 Quad IEC DFE-Q is footprint compatible to the PEB 24901 Quad IEC DFE-T. This way, one board layout can be used for both line codes simply by putting the appropriate DFE.

2.1Line Card Application

The Quad IEC AFE is controlled via the signal at pin SDX. The transmit data is transferred the same way. Data on SDX is organized such that two Quad IEC AFE devices can share the same signal.

The Quad IEC AFE can transmit either 2B1Q-data or 4B3T-data. Setting the pin CODE to low will result in 2B1Q code. For 4B3T code the pin CODE has to be tied to VDD.

Each of the four line ports is biased by a separate voltage reference. This internal reference voltage has to be decoupled by a capacitor of 100 nF connected to the VREFx pin and GND.

The 15.36 MHz master clock is generated with a crystal oscillator and synchronized onto the PTT clock with an integrated PLL. Fig. 4 shows a 4 channel LT application for 2B1Q line code. Note, that the PEB 24911 Quad IEC DFE-Q is footprint compatible to the PEB 24901 Quad IEC DFE-T. This way, one board layout can be used for both linecodes simply by putting the appropriate DFE.

Figure 4

4 channel LT application

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