IS62LV256
IS62LV256
32K x 8 LOW VOLTAGE STATIC RAM
FEATURES |
DESCRIPTION |
|
• Access time: 45, 70, 100 ns |
The ICSI IS62LV256 is a very high-speed, low power, |
|
• Low active power: 70 mW |
32,768-word by 8-bit static RAM. It is fabricated using ICSI's |
|
high-performance CMOS double-metal technology. |
||
• Low standby power |
||
|
||
— 45 µW CMOS standby |
When CE is HIGH (deselected), the device assumes a standby |
|
• Fully static operation: no clock or refresh |
mode at which the power dissipation is reduced to |
|
10 µW (typical) with CMOS input levels. |
||
required |
||
|
||
• TTL compatible inputs and outputs |
Easy memory expansion is provided by using an active LOW |
|
• Single 3.3V power supply |
Chip Enable (CE) input and an active LOW Output Enable (OE) |
|
input. The active LOW Write Enable (WE) controls both writing |
||
|
||
|
and reading of the memory. |
|
|
The IS62LV256 is pin compatible with other 32K x 8 SRAMs |
|
|
in 300mil DIP and SOJ, 330mil SOP, and 8*13.4mm TSOP-1 |
|
|
packages. |
FUNCTIONAL BLOCK DIAGRAM
A0-A14 |
DECODER |
|
256 X 1024 |
|
MEMORY ARRAY |
||
|
|
|
|
|
|
|
|
VCC
GND
I/O
I/O0-I/O7 DATA COLUMN I/O
CIRCUIT
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
CE |
|
CONTROL |
|
||||
|
|
|
||||||
|
|
|
|
|
|
|
||
|
OE |
|
|
|
||||
|
|
CIRCUIT |
|
|||||
|
|
|
|
|
|
|
||
|
WE |
|
|
|
|
|
|
|
|
|
|
|
|
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc. |
1 |
SR006-0B |
|
IS62LV256
PIN CONFIGURATION |
|
|
PIN CONFIGURATION |
|
|
|
|
|
||||||||||||
28-Pin DIP, SOJ and SOP |
|
|
8x13.4mm TSOP-1 |
|
|
|
|
|
||||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
A14 |
|
1 |
28 |
|
|
VCC |
|
|
|
|
|
|
22 |
21 |
|
A10 |
|||
|
|
|
|
|
|
|
|
|
|
|
||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
OE |
|
|
|
|||||
|
A12 |
2 |
27 |
|
|
WE |
|
|
|
|
|
|
||||||||
|
|
|
|
|
|
|
|
|
|
20 |
|
|
|
|
||||||
|
|
|
|
26 |
|
|
A13 |
|
A11 |
23 |
|
CE |
||||||||
|
A7 |
3 |
|
|
|
|
|
|
|
|
|
19 |
|
I/O7 |
||||||
|
A6 |
|
|
25 |
|
|
A8 |
|
|
|
A9 |
24 |
|
|||||||
|
|
4 |
|
|
|
|
|
|
|
|
|
18 |
|
I/O6 |
||||||
|
|
|
|
A8 |
25 |
|
||||||||||||||
|
A5 |
|
|
24 |
|
|
A9 |
|
|
|
|
|||||||||
|
|
|
|
|
A13 |
|
26 |
17 |
|
I/O5 |
||||||||||
|
|
5 |
|
|
|
|
|
|||||||||||||
|
|
|
|
|||||||||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
27 |
16 |
|
I/O4 |
|||
|
A4 |
|
6 |
23 |
|
|
A11 |
|
|
WE |
|
|
|
|||||||
|
A3 |
|
|
22 |
|
|
|
|
|
VCC |
|
28 |
15 |
|
I/O3 |
|||||
|
|
7 |
|
|
OE |
|
|
|
|
|||||||||||
|
|
|
|
|||||||||||||||||
|
A2 |
|
8 |
21 |
|
|
A10 |
|
A14 |
|
1 |
14 |
|
GND |
||||||
|
|
|
|
A12 |
|
2 |
13 |
|
I/O2 |
|||||||||||
|
|
|
|
|
|
|
|
|
|
|
|
|||||||||
|
A1 |
9 |
20 |
|
|
CE |
|
|
|
A7 |
|
3 |
12 |
|
I/O1 |
|||||
|
A0 |
|
10 |
19 |
|
|
I/O7 |
|
|
|
|
|
||||||||
|
|
|
|
|
|
|
A6 |
|
4 |
11 |
|
I/O0 |
||||||||
|
|
|
|
|
|
|||||||||||||||
|
I/O0 |
|
11 |
18 |
|
|
I/O6 |
|
|
|
|
|
||||||||
|
|
|
|
|
|
|
A5 |
|
5 |
10 |
|
A0 |
||||||||
|
|
|
|
|
|
|||||||||||||||
|
|
|
|
|
|
|
|
|
||||||||||||
|
I/O1 |
|
17 |
|
|
I/O5 |
|
|
|
A4 |
|
6 |
9 |
|
A1 |
|||||
|
|
12 |
|
|
|
|
|
|
|
|||||||||||
|
I/O2 |
|
|
16 |
|
|
I/O4 |
|
|
|
A3 |
|
7 |
8 |
|
A2 |
||||
|
|
13 |
|
|
|
|
|
|
|
|||||||||||
|
|
|
|
|||||||||||||||||
|
GND |
|
15 |
|
|
I/O3 |
|
|
|
|
|
|
|
|
|
|
|
|
||
|
|
14 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
PIN DESCRIPTIONS
A0-A14 |
Address Inputs |
CE |
Chip Enable Input |
|
|
OE |
Output Enable Input |
|
|
WE |
Write Enable Input |
|
|
I/O0-I/O7 |
Input/Output |
|
|
Vcc |
Power |
|
|
GND |
Ground |
|
|
TRUTH TABLE
Mode |
WE |
CE |
OE |
I/O Operation |
Vcc Current |
Not Selected |
X |
H |
X |
High-Z |
ISB1, ISB2 |
(Power-down) |
|
|
|
|
|
Output Disabled |
H |
L |
H |
High-Z |
ICC1, ICC2 |
|
|
|
|
|
|
Read |
H |
L |
L |
DOUT |
ICC1, ICC2 |
|
|
|
|
|
|
Write |
L |
L |
X |
DIN |
ICC1, ICC2 |
|
|
|
|
|
|
ABSOLUTE MAXIMUM RATINGS(1)
Symbol |
Parameter |
Value |
Unit |
VTERM |
Terminal Voltage with Respect to GND |
–0.5 to +4.6 |
V |
|
|
|
|
TBIAS |
Temperature Under Bias |
–55 to +125 |
°C |
|
|
|
|
TSTG |
Storage Temperature |
–65 to +150 |
°C |
|
|
|
|
PT |
Power Dissipation |
0.5 |
W |
|
|
|
|
IOUT |
DC Output Current (LOW) |
20 |
mA |
|
|
|
|
Notes:
1.Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2 |
Integrated Circuit Solution Inc. |
|
SR006-0B |
IS62LV256
OPERATING RANGE
Range |
Ambient Temperature |
VCC |
Commercial |
0°C to +70°C |
3.3V ± 5% |
Industrial |
–40°C to +85°C |
3.3V ± 5% |
|
|
|
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol |
Parameter |
Test Conditions |
|
Min. |
Max. |
Unit |
VOH |
Output HIGH Voltage |
VCC = Min., IOH = –1.0 mA |
|
2.4 |
— |
V |
|
|
|
|
|
|
|
VOL |
Output LOW Voltage |
VCC = Min., IOL = 2.1 mA |
|
— |
0.4 |
V |
|
|
|
|
|
|
|
VIH |
Input HIGH Voltage |
|
|
2.2 |
VCC + 0.3 |
V |
|
|
|
|
|
|
|
VIL |
Input LOW Voltage(1) |
|
|
–0.3 |
0.8 |
V |
|
|
|
|
|
|
|
ILI |
Input Leakage |
GND < VIN < VCC |
Com. |
–2 |
2 |
µA |
|
|
|
Ind. |
–5 |
5 |
|
|
|
|
|
|
|
|
ILO |
Output Leakage |
GND < VOUT < VCC, Outputs Disabled |
Com. |
–2 |
2 |
µA |
|
|
|
Ind. |
–5 |
5 |
|
Notes:
1.VIL = –3.0V for pulse width less than 10 ns.
2.Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
POWER SUPPLY CHARACTERISTICS(1) |
(Over Operating Range) |
|
|
|
|
|
||||
|
|
|
|
-45 ns |
-70 ns |
-100 ns |
|
|||
Symbol |
Parameter |
Test Conditions |
|
Min. |
Max. |
Min. |
Max. |
Min. |
Max. |
Unit |
ICC1 |
Vcc Operating |
VCC = Max., CE = VIL |
Com. |
— |
20 |
— |
20 |
— |
20 |
mA |
|
Supply Current |
IOUT = 0 mA, f = 0 |
Ind. |
— |
30 |
— |
30 |
— |
30 |
|
|
|
|
|
|
|
|
|
|
|
|
ICC2 |
Vcc Dynamic Operating |
VCC = Max., CE = VIL |
Com. |
— |
35 |
— |
30 |
— |
30 |
mA |
|
Supply Current |
IOUT = 0 mA, f = fMAX |
Ind. |
— |
45 |
— |
40 |
— |
40 |
|
|
|
|
|
|
|
|
|
|
|
|
ISB1 |
TTL Standby Current |
VCC = Max., |
Com. |
— |
2 |
— |
2 |
— |
2 |
mA |
|
(TTL Inputs) |
VIN = VIH or VIL |
Ind. |
— |
5 |
— |
5 |
— |
5 |
|
|
|
CE > VIH, f = 0 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
ISB2 |
CMOS Standby |
VCC = Max., |
Com. |
— |
90 |
— |
90 |
— |
90 |
µA |
|
Current (CMOS Inputs) |
CE > VCC – 0.2V, |
Ind. |
— |
200 |
— |
200 |
— |
200 |
|
VIN > VCC – 0.2V, or
VIN < 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
CAPACITANCE(1,2) |
|
|
|
|
Symbol |
Parameter |
Conditions |
Max. |
Unit |
|
|
|
|
|
CIN |
Input Capacitance |
VIN = 0V |
6 |
pF |
|
|
|
|
|
COUT |
Output Capacitance |
VOUT = 0V |
5 |
pF |
|
|
|
|
|
Notes: |
|
|
|
|
1.Tested initially and after any design or process changes that may affect these parameters.
2.Test conditions: TA = 25°C, f = 1 MHz, Vcc =3.3V.
Integrated Circuit Solution Inc. |
3 |
SR006-0B |
|