2SK3142
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-681A (Z)
2nd. Edition
February 1999
Features
• Low on-resistance
R
DS(on)
= 4 mΩ typ.
• Low drive current
• 4 V gate drive device can be driven from 5 V source
Outline
1
2
3
TO–220CFM
D
G
S
1. Gate
2. Drain
3. Source
2SK3142
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
30 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
60 A
Drain peak current I
D(pulse)
Note 1
240 A
Body-drain diode reverse drain current I
DR
60 A
Avalanche current I
AP
Note 3
35 A
Avalanche energy E
AR
Note 3
122 mJ
Channel dissipation Pch
Note 2
35 W
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
2SK3142
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
30——V I
D
= 10 mA, V
GS
= 0
Gate to source leak current I
GSS
——±0.1 µAV
GS
= ±20 V, V
DS
= 0
Zero gate voltege drain current I
DSS
——10µAV
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage V
GS(off)
1.0 — 2.5 V I
D
= 1 mA, V
DS
= 10 V
Note 1
Static drain to source on state R
DS(on)
— 4.0 5.0 mΩ I
D
= 30 A, V
GS
= 10 V
Note 1
resistance — 5.5 8.5 mΩ I
D
= 30 A, V
GS
= 4 V
Note 1
Forward transfer admittance |y
fs
|4575—S I
D
= 30 A, V
DS
= 10 V
Note 1
Input capacitance Ciss — 6800 — pF V
DS
= 10 V
Output capacitance Coss — 1550 — pF V
GS
= 0
Reverse transfer capacitance Crss — 500 — pF f = 1MHz
Total gate charge Qg — 130 — nc V
DD
= 10 V
Gate to source charge Qgs — 16 — nc V
GS
= 10 V
Gate to drain charge Qgd — 30 — nc I
D
= 60 A
Turn-on delay time t
d(on)
— 50 — ns V
GS
= 10 V, I
D
= 30 A
Rise time t
r
— 340 — ns R
L
= 0.33 Ω
Turn-off delay time t
d(off)
— 560 — ns
Fall time t
f
— 350 — ns
Body–drain diode forward voltage V
DF
— 1.0 — V I
F
= 60 A, V
GS
= 0
Body–drain diode reverse
recovery time
t
rr
— 70 — ns I
F
= 60 A, V
= 0
diF/ dt = 50 A/ µs
Note: 1. Pulse test