2SK3081
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-636A (Z) 3rd. Edition Jun 1998
Features
•Low on-resistance RDS(on) = 10mΩ typ.
•4V gate drive devices.
•High speed switching
Outline
TO–220AB
D |
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G |
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1. |
Gate |
1 |
2. |
Drain(Flange) |
2 |
3. |
Source |
3 |
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2SK3081
Absolute Maximum Ratings (Ta = 25°C)
Item |
Symbol |
Ratings |
Unit |
Drain to source voltage |
VDSS |
30 |
V |
Gate to source voltage |
VGSS |
±20 |
V |
Drain current |
ID |
45 |
A |
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Drain peak current |
Note1 |
180 |
A |
ID(pulse) |
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Body-drain diode reverse drain current |
IDR |
45 |
A |
Channel dissipation |
Pch Note2 |
75 |
W |
Channel temperature |
Tch |
150 |
°C |
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Storage temperature |
Tstg |
–55 to +150 |
°C |
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Note: 1. PW ≤ 10µs, duty cycle ≤ 1 % |
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2. Value at Tc = 25°C |
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Electrical Characteristics (Ta = 25°C) |
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Item |
Symbol |
Min |
Typ |
Max |
Unit |
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Test Conditions |
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Drain to source breakdown voltage |
V(BR)DSS |
30 |
— |
— |
V |
I |
D = 10mA, VGS = 0 |
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Gate to source breakdown voltage |
V(BR)GSS |
±20 |
— |
— |
V |
I |
G = ±100µA, VDS = 0 |
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Zero gate voltege drain current |
IDSS |
— |
— |
10 |
µA |
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VDS = 30 V, VGS = 0 |
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Gate to source leak current |
IGSS |
— |
— |
±10 |
µA |
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VGS = ±16V, VDS = 0 |
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Gate to source cutoff voltage |
VGS(off) |
1.0 |
— |
2.0 |
V |
I D |
= 1mA, VDS = 10V |
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Static drain to source on state |
RDS(on) |
— |
10 |
14 |
m Ω |
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ID |
= 20A, VGS = 10V Note3 |
resistance |
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Static drain to source on state |
RDS(on) |
— |
15 |
25 |
m Ω |
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ID |
= 20A, VGS = 4V Note3 |
resistance |
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Forward transfer admittance |
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20 |
30 |
— |
S |
I D |
= 20A, VDS = 10V Note3 |
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Input capacitance |
Ciss |
— |
1570 |
— |
pF |
V |
DS = 10V |
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Output capacitance |
Coss |
— |
1100 |
— |
pF |
V |
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GS = 0 |
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Reverse transfer capacitance |
Crss |
— |
410 |
— |
pF |
f = 1MHz |
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Turn-on delay time |
td(on) |
— |
32 |
— |
ns |
V |
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GS = 10V, ID = 20A |
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Rise time |
tr |
— |
300 |
— |
ns |
R |
L |
= 0.5Ω |
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Turn-off delay time |
td(off) |
— |
180 |
— |
ns |
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Fall time |
tf |
— |
200 |
— |
ns |
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Body–drain diode forward voltage |
VDF |
— |
1.0 |
— |
V |
I |
F = 45A, VGS = 0 |
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Body–drain diode reverse |
trr |
— |
75 |
— |
ns |
I |
F = 45A, VGS = 0 |
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recovery time |
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diF/ dt =50A/µs |
Note: 3. Pulse test
2
2SK3081
Main Characteristics
Channel Dissipation Pch (W)
100 |
Power vs. Temperature Derating |
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1000 |
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Maximum Safe Operation Area |
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(A) |
300 |
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10 µs |
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75 |
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100 |
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100 |
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1 |
µs |
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I |
30 |
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PW |
ms |
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Current |
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DC |
= |
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10 |
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(Tc |
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Operation in |
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50 |
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10 |
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Operation= |
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ms |
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Drain |
3 |
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25°C) |
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25 |
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1 |
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limited by R DS(on) |
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this area is |
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0.3 |
Ta = 25°C |
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0 |
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0.1 |
1 shot pulse |
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50 |
100 |
150 |
200 |
0.1 |
0.3 |
1 |
3 |
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10 |
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30 |
100 |
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Case Temperature |
Tc (°C) |
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Drain to Source Voltage |
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V DS (V) |
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Typical Output Characteristics |
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10 V |
8 V |
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100 |
6 V |
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Pulse Test |
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80 |
5 V |
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(A) |
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4.5 V |
(A) |
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D |
60 |
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4 V |
D |
I |
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I |
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DrainCurrent |
20 |
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3 V |
DrainCurrent |
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40 |
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3.5 V |
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VGS = 2.5 V |
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100
80
60
40
20
Typical Transfer Characteristics
Tc = –25°C |
25°C |
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75°C |
V DS = 10 V
Pulse Test
0 |
2 |
4 |
6 |
8 |
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10 |
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0 |
2 |
4 |
6 |
8 |
10 |
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Drain to Source Voltage |
VDS (V) |
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Gate to Source Voltage |
V GS (V) |
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