2SK3076(L),2SK3076(S)
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-656 (Z) 1st. Edition Jun 1998
Features
•Low on-resistance
•High speed switching
•Low drive current.
•Built-in fast recovery diode (trr=120 ns)
Outline
LDPAK
4 |
4 |
D
G |
1 |
2 |
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3 |
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1 2 |
3 |
1. |
Gate |
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2. |
Drain |
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3. |
Source |
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4. |
Drain |
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2SK3076(L),2SK3076(S)
Absolute Maximum Ratings (Ta = 25°C)
Item |
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Symbol |
Ratings |
Unit |
Drain to source voltage |
VDSS |
500 |
V |
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Gate to source voltage |
VGSS |
±30 |
V |
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Drain current |
ID |
7 |
A |
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Drain peak current |
Note1 |
28 |
A |
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ID(pulse) |
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Body-drain diode reverse drain current |
IDR |
7 |
A |
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Channel dissipation |
Pch Note2 |
60 |
W |
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Channel temperature |
Tch |
150 |
°C |
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Storage temperature |
Tstg |
–55 to +150 |
°C |
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Note: 1. |
PW ≤ 10µs, duty cycle ≤ 1 % |
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2. |
Value at Tc = 25°C |
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Electrical Characteristics (Ta = 25°C)
Item |
Symbol |
Min |
Typ |
Max |
Unit |
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Test Conditions |
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Drain to source breakdown voltage |
V(BR)DSS |
500 |
— |
— |
V |
I |
D = 10mA, VGS = 0 |
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Gate to source breakdown voltage |
V(BR)GSS |
±30 |
— |
— |
V |
I |
G = ±100µA, VDS = 0 |
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Gate to source leak current |
IGSS |
— |
— |
±10 |
µA |
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VGS = ±25V, VDS = 0 |
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Zero gate voltege drain current |
IDSS |
— |
— |
250 |
µA |
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VDS = 400 V, VGS = 0 |
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Gate to source cutoff voltage |
VGS(off) |
2.0 |
— |
3.0 |
V |
I D |
= 1mA, VDS = 10V |
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Static drain to source on state |
RDS(on) |
— |
0.7 |
0.9 |
Ω |
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ID |
= 4A, VGS = 10VNote4 |
resistance |
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Forward transfer admittance |
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3.5 |
6.0 |
— |
S |
I D |
= 4A, VDS = 10V Note4 |
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Input capacitance |
Ciss |
— |
1100 |
— |
pF |
V |
DS = 10V |
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Output capacitance |
Coss |
— |
310 |
— |
pF |
V |
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GS = 0 |
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Reverse transfer capacitance |
Crss |
— |
50 |
— |
pF |
f = 1MHz |
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Turn-on delay time |
td(on) |
— |
15 |
— |
ns |
I |
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D =4A, VGS = 10V |
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Rise time |
tr |
— |
55 |
— |
ns |
R |
L |
= 7.5Ω |
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Turn-off delay time |
td(off) |
— |
100 |
— |
ns |
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Fall time |
tf |
— |
48 |
— |
ns |
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Body–drain diode forward voltage |
VDF |
— |
0.9 |
— |
V |
I |
F = 7A, VGS = 0 |
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Body–drain diode reverse |
trr |
— |
120 |
— |
ns |
I |
F = 7A, VGS = 0 |
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recovery time |
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diF/ dt =100A/µs |
Note: 4. Pulse test
2
2SK3076(L),2SK3076(S)
Main Characteristics
Power vs. Temperature Derating |
Maximum Safe Operation Area |
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80 |
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100 |
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(W) |
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(A) |
30 |
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10 |
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µs |
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60 |
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10 |
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100 |
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Pch |
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PW |
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D |
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1 |
µs |
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DC |
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ms |
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10 |
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3 |
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ms |
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40 |
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1 |
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ChannelDissipation |
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DrainCurrent |
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Operation |
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(1shot) |
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Operation in |
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0.3 |
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this area is |
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(Tc |
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25°C) |
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20 |
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0.1 |
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limited by R DS(on) |
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0.03 |
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Ta = 25 °C |
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0.01 |
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0 |
50 |
100 |
150 |
200 |
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0.1 |
0.3 |
1 |
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3 |
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10 |
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30 |
100 |
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Case Temperature |
Tc (°C) |
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Drain to Source Voltage |
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V DS (V) |
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Drain Current I D (A)
20 |
Typical Output Characteristics |
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20 |
Typical Transfer Characteristics |
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10 V |
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4 V |
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6 V |
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–25°C |
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16 |
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(A) |
16 |
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Ta = 25°C |
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Pulse Test |
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12 |
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D |
12 |
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75°C |
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I |
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4 |
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5 V |
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DrainCurrent |
4 |
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8 |
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VGS = 4 V |
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V DS = 20 V |
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Pulse Test |
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0 |
10 |
20 |
30 |
40 |
50 |
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0 |
2 |
4 |
6 |
8 |
10 |
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Drain to Source Voltage |
VDS (V) |
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Gate to Source Voltage |
V GS (V) |
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3