2SK3070(L),2SK3070(S)
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-684G (Z) 8th. Edition February 1999
Features
•Low on-resistance RDS(on) = 4.5 mΩ typ.
•Low drive current
•4 V gate drive device can be driven from 5 V source
Outline
LDPAK
4 |
4 |
|
D |
|
|
|
1 |
2 |
|
|
|
3 |
|
G |
1 2 |
1. |
Gate |
|
3 |
||
|
|
2. |
Drain |
|
|
3. |
Source |
|
|
4. |
Drain |
|
S |
|
|
Datasheet Title
Absolute Maximum Ratings (Ta = 25°C)
Item |
Symbol |
Ratings |
Unit |
Drain to source voltage |
VDSS |
40 |
V |
Gate to source voltage |
VGSS |
±20 |
V |
Drain current |
ID |
75 |
A |
|
|
|
|
Drain peak current |
Note1 |
300 |
A |
ID(pulse) |
|||
Body-drain diode reverse drain current |
IDR |
75 |
A |
Avalanche current |
Note3 |
50 |
A |
IAP |
|||
Avalanche energy |
Note3 |
333 |
mJ |
EAR |
|||
Channel dissipation |
Pch Note2 |
100 |
W |
Channel temperature |
Tch |
150 |
°C |
|
|
|
|
Storage temperature |
Tstg |
–55 to +150 |
°C |
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2.Value at Tc = 25°C
3.Value at Tch = 25°C, Rg ≥ 50 Ω
2
Datasheet Title
Electrical Characteristics (Ta = 25°C)
Item |
Symbol |
Min |
Typ |
Max |
Unit |
|
|
Test Conditions |
||||
Drain to source breakdown voltage |
V(BR)DSS |
40 |
— |
— |
V |
I |
D = 10 mA, VGS = 0 |
|||||
Gate to source leak current |
IGSS |
— |
— |
±0.1 |
µA |
|
|
VGS = ±20 V, VDS = 0 |
||||
Zero gate voltege drain current |
IDSS |
— |
— |
10 |
µA |
|
|
VDS = 40 |
V, VGS = 0 |
|||
Gate to source cutoff voltage |
V |
1.0 |
— |
2.5 |
V |
I |
D |
= 1 mA, V |
DS |
= 10 V Note1 |
||
|
GS(off) |
|
|
|
|
|
|
|
|
|
||
Static drain to source on state |
RDS(on) |
— |
4.5 |
5.8 |
m Ω |
|
|
ID = 40 A, VGS = 10 V Note1 |
||||
resistance |
|
— |
6.5 |
10 |
m Ω |
|
|
ID = 40 A, VGS = 4 V Note1 |
||||
|
|
|
|
|
|
|
|
|||||
Forward transfer admittance |
|yfs| |
50 |
80 |
— |
S |
I D = 40 A, VDS = 10 V Note1 |
||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
Input capacitance |
Ciss |
— |
6800 |
— |
pF |
V |
DS = 10 |
V |
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
Output capacitance |
Coss |
— |
1300 |
— |
pF |
V |
|
GS = 0 |
|
|
|
|
Reverse transfer capacitance |
Crss |
— |
380 |
— |
pF |
f = 1 MHz |
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
||
Total gate charge |
Qg |
— |
130 |
— |
nc |
V |
DD = 25 |
V |
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
Gate to source charge |
Qgs |
— |
25 |
— |
nc |
V |
GS = 10 |
V |
|
|
||
|
|
|
|
|
|
|
|
|
|
|
|
|
Gate to drain charge |
Qgd |
— |
30 |
— |
nc |
I |
D = 75 A |
|
|
|
||
|
|
|
|
|
|
|
|
|
||||
Turn-on delay time |
td(on) |
— |
60 |
— |
ns |
V |
|
GS = 10 |
V, ID = 40 A |
|||
Rise time |
tr |
— |
300 |
— |
ns |
R |
L = 0.75 Ω |
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
Turn-off delay time |
td(off) |
— |
550 |
— |
ns |
|
|
|
|
|
|
|
Fall time |
tf |
— |
400 |
— |
ns |
|
|
|
|
|
|
|
Body–drain diode forward voltage |
VDF |
— |
1.05 |
— |
V |
I |
F = 75 A, VGS = 0 |
|||||
Body–drain diode reverse |
trr |
— |
90 |
— |
ns |
I |
F = 75 A, VGS = 0 |
|||||
recovery time |
|
|
|
|
|
|
|
diF/ dt = 50 A/ µs |
Note: 1. Pulse test
3