GSI GS881Z18T-66I, GS881Z18T-66, GS881Z18T-11I, GS881Z18T-11, GS881Z18T-100I Datasheet

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Preliminary
GS881Z18/36T-11/100/80/66
100-Pin TQFP
8Mb Pipelined and Flow Through
Commercial Temp Industrial Temp
Synchronous NBT SRAMs
Features
• 512K x 18 and 256K x 36 configurations
• User-configurable Pipelined and Flow Through mode
• NBT (No Bus Turn Around) functionality allows zero wait
• Read-Write-Read bus utilization
• Fully pin-compatible with both pipelined and flow through NtRAM™, NoBL™ and ZBT™ SRAMs
• IEEE 1149.1 JTAG-compatible Boundary Scan
• On-chip write parity checking; even or odd selectable
• Pin-compatible with 2M, 4M and 16M devices
• 3.3 V +10%/–5% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO
pin for Linear or Interleave Burst mode
• Byte write operation (9-bit Bytes)
• 3 chip enable signals for easy depth expansion
• Clock Control, registered, address, data, and control
• ZZ Pin for automatic power-down
• JEDEC-standard 100-lead TQFP package
-11 -100 -80 -66
t Pipeline 3-1-1-1
Flow Through 2-1-1-1
Cycle
t I
t
t
Cycle
I
KQ DD
KQ
DD
10 ns
4.5 ns
210 mA
11 ns 15 ns
150 mA
10 ns
4.5 ns
210 mA
12 ns 15 ns
150 mA
12.5 ns
4.8 ns
190 mA
14 ns 15 ns
130 mA
15 ns
5 ns
170 mA
18 ns 20 ns
130 mA
100 MHz–66 MHz
2.5 V and 3.3 V V
DD
DDQ
Functional Description
The GS881Z18/36T is an 8Mbit Synchronous Static SRAM. GSI's NBT SRAMs, like ZBT, NtRAM, NoBL or other pipelined read/double late write or flow through read/single late write SRAMs, allow utilization of all available bus bandwidth by eliminating the need to insert deselect cycles when the device is switched from read to write cycles.
Because it is a synchronous device, address, data inputs, and read/ write control inputs are captured on the rising edge of the input clock. Burst order control (LBO) must be tied to a power rail for proper operation. Asynchronous inputs include the Sleep mode enable (ZZ) and Output Enable. Output Enable can be used to override the synchronous control of the output drivers and turn the RAM's output drivers off at any time. Write cycles are internally self-timed and initiated by the rising edge of the clock input. This feature eliminates complex off­chip write pulse generation required by asynchronous SRAMs and simplifies input signal timing.
The GS881Z18/36T may be configured by the user to operate in Pipeline or Flow Through mode. Operating as a pipelined synchronous device, in addition to the rising-edge-triggered registers that capture input signals, the device incorporates a rising-edge-triggered output register. For read cycles, pipelined SRAM output data is temporarily stored by the edge-triggered output register during the access cycle and then released to the output drivers at the next rising edge of clock.
The GS881Z18/36T is implemented with GSI's high performance CMOS technology and is available in a JEDEC­Standard 100-pin TQFP package.
Flow Through and Pipelined NBT SRAM Back-to-Back Read/Write Cycles
Clock
Address
Read/Write
Flow Through
Data I/O
Pipelined
Data I/O
Rev: 1.10 8/2000 1/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
NoBL is a trademark of Cypress Semiconductor Corp.. NtRAM is a trademark of Samsung Electronics Co.. ZBT is a trademark of Integrated Device Technology, Inc.
A B C D E F
R W R W R W
Q
A
D
B
Q
A
Q
C
D
B
D
D
Q
C
Q
E
D
D
Q
E
GS881Z18T Pinout
Preliminary.
GS881Z18/36T-11/100/80/66
DD
SS
A6
E1
A7
E2
NC
NC
E3
BB
V
BA
V
CKE
W
G
CK
ADV
A8
A17
NC
A9
NC NC NC
V
DDQ
V
NC
NC DQB1 DQB2
V
V
DDQ
DQB3 DQB4
V
DP
V DQB5 DQB6
V
DDQ
V DQB7 DQB8 DQB9
NC
V
V
DDQ
NC NC NC
SS
SS
FT
DD
SS
SS
SS
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
512K x 18
Top View
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
A18 NC NC V
DDQ
V
SS
NC DQA9 DQA8 DQA7 V
SS
V
DDQ
DQA6 DQA5 V
SS
QE V
DD
ZZ DQA4 DQA3 V
DDQ
V
SS
DQA2 DQA1 NC NC V
SS
V
DDQ
NC NC NC
SS
A5
A4
A3
A2
A1
LBO
A0
TMS
DD
V
V
TDI
TDO
A11
A10
A12
A13
A14
A16
TCK
A15
Rev: 1.10 8/2000 2/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
GS881Z36T Pinout
Preliminary.
GS881Z18/36T-11/100/80/66
DD
SS
A6
E1
A7
E2
BC
BD
E3
BB
V
BA
V
CKE
W
G
CK
ADV
A8
A17
NC
A9
DQC9 DQC8 DQC7
V
DDQ
V DQC6 DQC5 DQC4 DQC3
V
V
DDQ
DQC2 DQC1
V
DP
V DQD1 DQD2
V
DDQ
V DQD3 DQD4 DQD5 DQD6
V
V
DDQ
DQD7 DQD8 DQD9
SS
SS
FT
DD
SS
SS
SS
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
256K x 36
Top View
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
DQB9 DQB8 DQB7 V
DDQ
V
SS
DQB6 DQB5 DQB4 DQB3 V
SS
V
DDQ
DQB2 DQB1 V
SS
QE V
DD
ZZ DQA1 DQA2 V
DDQ
V
SS
DQA3 DQA4 DQA5 DQA6 V
SS
V
DDQ
DQA7 DQA8 DQA9
SS
A5
A4
A3
A2
A1
LBO
A0
TMS
DD
V
V
TDI
TDO
A11
A10
A12
A13
A14
A16
TCK
A15
Rev: 1.10 8/2000 3/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
GS881Z18/36T-11/100/80/66
100-Pin TQFP Pin Descriptions
Pin Location Symbol Type Description
37, 36 A0, A1 In Burst Address Inputs—Preload the burst counter
35, 34, 33, 32, 100, 99, 83, 82,
81, 50, 49, 48, 47, 46, 45, 44
80 A18 In Address Input (x18 Version Only) 89 CK In Clock Input Signal 93 BA In Byte Write signal for data inputs DQA1–DQA9; active low 94 BB In Byte Write signal for data inputs DQB1–DQB9; active low 95 BC In Byte Write signal for data inputs DQC1–DQC9; active low (x36 Version Only) 96 BD In Byte Write signal for data inputs DQD1–DQD9; active low (x36 Version Only) 88 W In Write Enable; active low 98 E1 In Chip Enable; active low 97 E2 In Chip Enable; active high; for self decoded depth expansion 92 E3 In Chip Enable; active low; for self decoded depth expansion 86 G In Output Enable; active low 85 ADV In Advance/Load—Burst address counter control pin 87 CKE In Clock Input Buffer Enable; active low
58, 59, 62,63, 68, 69, 72, 73, 74 DQA1–DQA9 I/O Byte A Data Input and Output pins (x18 Version Only)
8, 9, 12, 13, 18, 19, 22, 23, 24 DQB1–DQB9 I/O Byte B Data Input and Output pins (x18 Version Only)
51, 52, 53, 56, 57, 75, 78, 79,
1, 2, 3, 6, 7, 25, 28, 29, 30
51, 52, 53, 56, 57, 58, 59, 62,63 DQA1–DQA9 I/O Byte A Data Input and Output pins (x36 Versions Only)
68, 69, 72, 73, 74, 75, 78, 79, 80 DQB1–DQB9 I/O Byte B Data Input and Output pins (x36 Versions Only)
1, 2, 3, 6, 7, 8, 9, 12, 13 DQC1–DQC9 I/O Byte C Data Input and Output pins (x36 Versions Only)
18, 19, 22, 23, 24, 25, 28, 29, 30 DQD1–DQD9 I/O Byte D Data Input and Output pins (x36 Versions Only)
64 ZZ In Power down control; active high 14 FT In Pipeline/Flow Through Mode Control; active low 31 LBO In Linear Burst Order; active low
A2–A17 In Address Inputs
NC No Connect (x18 Version Only)
Preliminary.
Rev: 1.10 8/2000 4/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Pin Location Symbol Type Description
38 TMS Scan Test Mode Select 39 TDI Scan Test Data In 42 TDO Scan Test Data Out 43 TCK Scan Test Clock
15, 41, 65, 91
5,10, 17, 21, 26, 40, 55, 60, 67,
71, 76, 90
4, 11, 20, 27, 54, 61, 70, 77
16 DP In Parity Input—1 = Even, 0 = Odd 66 QE Out Parity Error Out—Open Drain Output
42, 43,, 84 NC No Connect
V
DD
V
SS
V
DDQ
In 3.3 V power supply In Ground In 3.3 V output power supply for noise reduction
Preliminary.
GS881Z18/36T-11/100/80/66
Rev: 1.10 8/2000 5/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
GS881Z18/36 ByteSafe NBT SRAM Functional Block Diagram
A
Preliminary.
GS881Z18/36T-11/100/80/66
QE
DP
DQa–DQn
Parity
Check
FT
D Q
K
Sense Amps
Array
Memory
Write Drivers
D Q
K
Write Data
Write Data
K
Register 1
K
Register 2
FT
SA1’
SA0’
Burst
Counter
SA1
SA0
18
Register 2
Write Address
K
K
Register 1
D Q
K
LBO
0–An
ADV
Write Address
K
Match
Read, Write and
W
BA
Control Logic
Data Coherency
K
E3
E2
BB
BC
E1
BD
CK
G
CKE
Rev: 1.10 8/2000 6/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Preliminary.
GS881Z18/36T-11/100/80/66
Functional Details
Clocking
Deassertion of the Clock Enable (CKE) input blocks the Clock input from reaching the RAM's internal circuits. It may be used to suspend RAM operations. Failure to observe Clock Enable set-up or hold requirements will result in erratic operation.
Pipeline Mode Read and Write Operations
All inputs (with the exception of Output Enable, Linear Burst Order and Sleep) are synchronized to rising clock edges. Single cycle read and write operations must be initiated with the Advance/Load pin (ADV) held low, in order to load the new address. Device activation is accomplished by asserting all three of the Chip Enable inputs (E1, E2, and E3). Deassertion of any one of the Enable inputs will deactivate the device.
Function W BA BB BC BD
Read H X X X X Write Byte “a” L L H H H Write Byte “b” L H L H H Write Byte “c” L H H L H Write Byte “d” L H H H L
Write all Bytes L L L L L
Write Abort/NOP L H H H H
Read operation is initiated when the following conditions are satisfied at the rising edge of clock: CKE is asserted Low, all three chip enables (E1, E2, and E3) are active, the write enable input signals W is deasserted high, and ADV is asserted low. The address presented to the address inputs is latched in to address register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the next rising edge of clock the read data is allowed to propagate through the output register and onto the Output pins.
Write operation occurs when the RAM is selected, CKE is active and the Write input is sampled low at the rising edge of clock. The Byte Write Enable inputs (BA, BB, BC, and BD) determine which bytes will be written. All or none may be activated. A Write Cycle with no Byte Write inputs active is a no-op cycle. The pipelined NBT SRAM provides double late write functionality, matching the write command versus data pipeline length (2 cycles) to the read command versus data pipeline length (2 cycles). At the first rising edge of clock, Enable, Write, Byte Write(s), and Address are registered. The Data In associated with that address is required at the third rising edge of clock.
Flow Through Mode Read and Write Operations
Operation of the RAM in Flow Through mode is very similar to operations in Pipeline mode. Activation of a Read Cycle and the use of the Burst Address Counter is identical. In Flow Through mode the device may begin driving out new data immediately after new address are clocked into the RAM, rather than holding new data until the following (second) clock edge. Therefore, in Flow Through mode the read pipeline is one cycle shorter than in Pipeline mode.
Write operations are initiated in the same way as well, but differ in that the write pipeline is one cycle shorter, preserving the ability to turn the bus from reads to writes without inserting any dead cycles. While the pipelined NBT RAMs implement a double late write protocol, in Flow Through mode a single late write protocol mode is observed. Therefore, in Flow Through mode, address and control are registered on the first rising edge of clock and data in is required at the data input pins at the second rising edge of clock.
Rev: 1.10 8/2000 7/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Preliminary.
GS881Z18/36T-11/100/80/66
Synchronous Truth Table
Operation Type Address E1 E2 E3 ZZ ADV W Bx G CKE CK DQ Notes
Deselect Cycle, Power Down D None H X X L L X X X L L-H High-Z Deselect Cycle, Power Down D None X X H L L X X X L L-H High-Z Deselect Cycle, Power Down D None X L X L L X X X L L-H High-Z Deselect Cycle, Continue D None X X X L H X X X L L-H High-Z 1 Read Cycle, Begin Burst R External L H L L L H X L L L-H Q Read Cycle, Continue Burst B Next X X X L H X X L L L-H Q 1,10 NOP/Read, Begin Burst R External L H L L L H X H L L-H High-Z 2 Dummy Read, Continue Burst B Next X X X L H X X H L L-H High-Z 1,2,10 Write Cycle, Begin Burst W External L H L L L L L X L L-H D 3 Write Cycle, Continue Burst B Next X X X L H X L X L L-H D 1,3,10 NOP/Write Abort, Begin Burst W None L H L L L L H X L L-H High-Z 2,3 Write Abort, Continue Burst B Next X X X L H X H X L L-H High-Z 1,2,3,10 Clock Edge Ignore, Stall Current X X X L X X X X H L-H - 4 Sleep Mode None X X X H X X X X X X High-Z Notes:
1. Continue Burst cycles, whether read or write, use the same control inputs; a Deselect continue cycle can only be entered into if a Deselect cycle is executed first
2. Dummy read and write abort can be considered NOPs because the SRAM performs no operation. A Write abort occurs when the W pin is sampled low but no Byte Write pins are active, so no Write operation is performed.
3. G can be wired low to minimize the number of control signals provided to the SRAM. Output drivers will automatically turn off during Write cycles.
4. If CKE High occurs during a pipelined read cycle, the DQ bus will remain active (Low Z). If CKE High occurs during a write cycle, the bus will remain in High Z.
5. X = Don’t Care; H = Logic High; L = Logic Low; Bx = High = All Byte Write signals are high; Bx = Low = One or more Byte/Write signals are Low
6. All inputs, except G and ZZ must meet setup and hold times of rising clock edge.
7. Wait states can be inserted by setting CKE high.
8. This device contains circuitry that ensures all outputs are in High Z during power-up.
9. A 2-bit burst counter is incorporated.
10. The address counter is incriminated for all Burst continue cycles.
Rev: 1.10 8/2000 8/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Pipeline and Flow Through Read-Write Control State Diagram
Preliminary.
GS881Z18/36T-11/100/80/66
D
B
Deselect
R
D
W
New Read New Write
R
B
R
W
W
R
R
Burst Read Burst Write
B
Key Notes
ƒ
Current State (n)
Input Command Code
Transition
Next State (n+1)
1. The Hold command (CKE Low) is not shown because it prevents any state change.
2. W, R, B and D represent input command codes, as indicated in the Synchronous Truth Table.
D
W
B
W
B
DD
n n+1 n+2 n+3
Clock (CK)
Command
Current State Next State
ƒ
ƒ ƒ ƒ
Current State and Next State Definition for Pipelined and Flow Through Read/Write Control State Diagram
Rev: 1.10 8/2000 9/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Pipeline Mode Data I/O State Diagram
Preliminary.
GS881Z18/36T-11/100/80/66
Intermediate Intermediate
Key
ƒ
Transition
Current State (n) Next State (n+2)
W
B
High Z (Data In)
Input Command Code
Intermediate State (N+1)
R
D
Transition
Intermediate
Intermediate
W
High Z
B
D
Intermediate
R
B
Data Out
W
(Q Valid)
Intermediate
R
Notes
1. The Hold command (CKE Low) is not shown because it prevents any state change.
2. W, R, B, and D represent input command
codes as indicated in the Truth Tables.
D
n n+1 n+2 n+3
Clock (CK)
Command
Current State
ƒ
ƒ ƒ ƒ
Intermediate
State
Next State
Current State and Next State Definition for Pipeline Mode Data I/O State Diagram
Rev: 1.10 8/2000 10/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
Flow Through Mode Data I/O State Diagram
Preliminary.
GS881Z18/36T-11/100/80/66
W
B
High Z (Data In)
Key Notes
Current State (n)
Input Command Code
ƒ
Transition
R
D
Next State (n+1)
W
R
High Z
B
D
1. The Hold command (CKE Low) is not shown because it prevents any state change.
2. W, R, B, and D represent input command
codes as indicated in the Truth Tables.
R
B
Data Out
W
(Q Valid)
D
n n+1 n+2 n+3
Clock (CK)
Command
Current State Next State
ƒ
ƒ ƒ ƒ
Current State and Next State Definition for: Pipeline and Flow Through Read Write Control State Diagram
Rev: 1.10 8/2000 11/34 © 1998, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
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