General Semiconductor SMAJ530, SMAJ550 Datasheet

SMAJ530 AND SMAJ550

SURFACE MOUNT TRANSZORB™ TRANSIENT VOLTAGE SUPPRESSOR

Steady State Power - 1Watt Reverse Voltage - 530, 550 Volts

FEATURES

♦ Plastic package has Underwriters Laboratory

Flammability Classification 94V-0

♦ Protects TOPSwitch



♦ Glass Passivated Junction ♦ High temperature soldering guaranteed:

250°C/10 seconds at terminals

♦ Exellent Clamping capability ♦ Available in unidirectional only

MECHANICAL DATA

Case: JEDEC DO-214AC molded plastic body over

passivated chip Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: The color band denotes the cathode, which is positive with respect to the anode under normal TVS operation

Mounting Position: Any Weight: 0.002 ounces, 0.064 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

SYMBOLS SMAJ530 SMAJ550 UNITS

Device marking code HD SB Steady state power dissipation

(NOTE 3)

M(AV)

1.0 Watts

Peak pulse power dissipation

(NOTE 1,2,5, FIG.1)

PPM

Minimum 300 Watts

Minimum breakdown voltage at 100µAV

(BR)

530 550 Volts

Maximum clamping voltage at 300mA, 10/1000 µs

waveform Vc 660 Volts

Stand-off voltage V

477 495 Volts

Maximum DC reverse leakage current at V

5.0 µA

Typical thermal resistance R

ΘJL

27 °C/W

Typical thermal resistance R

ΘJA

75 °C/W

Typical temperature coefficient of V

(BR)

650 mV°C

Typical capacitance

(NOTE 4)

at 0V

at 200V 45

Operating junction and storage temperature range T

, T

STG

-55 to +150 °C

NOTES: (1) Non-repetitive current pulse, per Fig.3 and derated above 25°C per - Fig. 2 (2) Mounted on 5.0mm2copper pads to each terminal (3) Lead temperature at 75°C=TLper Fig. 5 (4) Measured at 1MHz (5) Peak pulse power waveform is 10/100µS

1/4/99

DO-214AC

Dimensions in inches and (millimeters)

ADVANCED INFORMATION

0.065 (1.65)

0.049 (1.25)

0.090 (2.29)

0.078 (1.98)

0.060 (1.52)

0.030 (0.76)

0.177 (4.50)

0.157 (3.99)

0.008 (0.203)

0.208 (5.28)

0.194 (4.93)

MAX.

0.110 (2.79)

0.100 (2.54)

0.012 (0.305)

0.006 (0.152)

MAXIMUM RATINGS AND CHARACTERISTIC CURVES SMAJ530 AND SMAJ550

FIG. 1 - PEAK PULSE POWER RATING CURVE

PPM

, PEAK PULSE POWER, kW

td, PULSE WIDTH, sec.

TA, AMBIENT TEMPERATURE, °C

FIG. 3 - PULSE WAVEFORM

t, TIME, ms

PPM,

PEAK PULSE CURRENT, %

PEAK PULSE POWER (Ppp) or CURRENT (

IPPM

)

DERATING IN PERCENTAGE, %

NON-REPETITIVE PULSE WAVEFORM SHOWN in FIG. 3 TA=25°C

PULSE WIDTH (td) is DEFINED as the POINT WHERE the PEAK CURRENT DECAYS to 50% of I

PPM

tr=10µsec.

PEAK VALUE I

PPM

HALF VALUE - I

PPM

10/1000µsec. WAVEFORM as DEFINED by R.E.A.

FIG. 2 - PULSE DERATING CURVE

RECOMMENDED PAD LAYOUT

The pad dimensions should be 0.010” (2.5mm) longer than the contact size in the lead axis. This allows a solder fillet to form, see figure below. Contact factory for soldering methods.

MODIFIED J-BEND

(

)

Dimensions in inches and (millimeters

)

•

Respect Thermal Resistance (PCB Layout) - as the temperature coefficient also contributes to the clamping voltage.

•

Select minimum breakdown voltage, so you get acceptable power dissipation and PCB tie point temperature. Devices with higher breakdown voltage will have a shorter conduction time and will dissipate less power.

•

Clamping voltage is influenced by internal resistance - design approximation is 7V per 100mA slope.

•

Keep temperature of TVS lower than TOPSwitchas a recommendation.

•

Maximum current is determined by the maximum TJand can be higher than 300mA. Contact supplier for different clamping voltage / current arrangements.

•

Minimum breakdown voltage can be customized for other applications. Contact supplier.

APPLICATION NOTES

100

1.0

0.1

1.0

150

100

1.0

100

2.0

1.0ms 10ms

3.0

4.0

10,000

100

1,000

100

125

150

175

0.060 MIN (1.52 MIN)

0.050 MIN (1.27 MIN)

0.220 REF

5.58

0.094 MAX (2.38 MAX)