GE
Intelligent Platforms
XCR15
3rd Generation Intel® Core™ i7 Based Rugged CPCI Single Board Computer
Features
•Single slot 6U CPCI universal System/Peripheral board
•Support for Hot Swap
•3rd Generation Intel Core i7 dual and quad core processors
•Integrated two channels up to 16 GB soldered DDR3 SDRAM with ECC
•Up to 6 MB shared cache
•Up to 8 GB Solid State Disk Drive
•Dual on-board Expansion Sites: two PCI-X PMC and one x4, one x8 PCIe XMC
•Front I/O:
-2x Gigabit Ethernet ports
-1x VGA
-1x USB
-1x COM port
-1 x eSATA (optional)
-1 x USB 3.0 (optional)
•Rear IO:
-2x Gigabit Ethernet ports (PICMG 2.16)
-1x VGA (2 ports possible if front IO not required)
-2x DVI
-Up to 4x SATA ports
-2x COM ports
-4x USB ports (1 upgradable to USB3.0 in place of 1 SATA port)
-1x Audio
-13x GPIO
-2x PMC rear I/O
-2X XMC rear I/O
•BIOS backup Flash
•Optional on-board SATA HDD
•Optional conduction cooling
•Optional extended operating temperature range
•Deployed Test Software
•Windows®, Linux® and Real-Time OS support
The XCR15 Rugged Single Board Computer (SBC) from GE Intelligent Platforms features the high performance, highly integrated 3rd Generation Core i7 processor platform from Intel.
3rd Generation Core i7 offers integrated graphics and memory controller plus dual and quad core processing up to 2.5 GHz all in one device. Coupled with the Mobile Intel QM77 Express Chipset this provides an unmatched level of I/O bandwidth for both on-board and off-board functions.
Features of the 3rd Gen. Core i7 processor
•Up to 15% (compute) and 50% (3D graphics) performance improvement over previous generation
•Advanced Vector Extensions (AVX) signal processing
•Intelligent performance on-demand with Intel Turbo Boost Technology
•PCIe GEN 3 (8 GT/sec) and USB 3.0 (10x the Bandwidth of 2.0) data transfer capability
•Hyper-Thread Technology – 2 threads per core
In addition to a comprehensive range of onboard I/O features, the XCR15 also offers two on-board mezzanine expansion sites for enhanced system flexibility, both of which offer PMC and XMC capability. Memory resources include up to 16 GB DDR3 SDRAM, 8 GB Solid State Disk Drive, optional SATA hard drive, BIOS Flash and BIOS backup Flash.
The XCR15 is designed to meet the requirements of a wide range of applications from industrial through to fully rugged Defense and Aerospace programs. It offers extended temperature capability and a range of air and conduction cooled build levels.
A rich software choice is planned for the XCR15, including comprehensive Deployed Test Software (BIT and BCS) plus OS support for Windows 7, Open Linux, Wind River Linux, VxWorks®.
Specifications
Processor
•Intel 3rd Gen. Core i7 Processor, options include but are not limited to:
-i7-3615QE (Quad Core) @ 2.3 GHz (45W)
-i7-3555LE (Dual Core) @ 2.5 GHz (25W)
-i7-3517UE (Dual Core) @ 1.7 GHz (17W)
(Actual speed/power is dependent on environment)
•22nm monolithic die processing technology
•Last Level Cache
-6 MB (Quad i7)
-4 MB (Dual i7)
SDRAM
•Maximum memory configuration of dual channels up to 16 GB DDR3 SDRAM soldered with ECC
Flash Memory
• Soldered Solid State Disk Drive up to 8 GB
BIOS
•1x 16 Mb for BIT and BIOS plus 1x 16 Mb for redundancy
Ethernet
•Dual Gigabit Ethernet interface via two Intel 82574 Gigabit Ethernet controllers – routed to front panel
•Dual Gigabit Ethernet interface via two Intel 82574 Gigabit Ethernet controllers – routed to rear (PICMG® 2.16 compliant)
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