Datasheet ZXSC100N8, ZXSC100X8 Datasheet (Zetex)

SINGLE CELL DC-DC CONVERTER SOLUTION

DESCRIPTION

The ZXSC100 series is designed for DC-DC
applications where step-up voltage conversion from
very low input voltages is required. These applications
mainly operate from single nickel cadmium or nickel
metal hydride battery cells.

The ZXSC100 devices are non-synchronous PFM,
DC-DC controller ICs which drive an external
transistor. Zetex SuperSOT4
with saturation resistance as low as 13mΩ, are
recommended as the external switching element.
These bipolar transistors are the best switching
devices available for this type of DC-DC conversion,
enabling high efficiency conversion with input
voltages down to below 1 volt.

The circuit can start up under full load with regulation
maintained down to an input voltage of only 0.926
volts. The solution configuration ensures optimum

™

switching transistors,

ZXSC100

efficiency over a wider range of load currents, several
circuit configurations are possible with power
dissipation up to 2W. The step up output voltage is
easily programmed with external resistors, the
non-synchronous architecture and SuperSOT4™
device enabling an output voltage down to the input
voltage level. For best performance the ZXSC100
quiescent current isasmall 150µA ensuring minimum
battery drain in no load conditions.

For the best in space saving theZXSC100 is offered in
the MSOP8 package, however the devices are also
available in SO8 packaging for applications where
space saving is not so critical.

The IC and discrete combination offers the ultimate
cost vs performance solution for single cell DC-DC
conversion.

FEATURES

• SuperSOT4™ switching transistor

ZXT14N20DX:V

45mV max @ 1A load

CE(sat)

• Efficiency maintained over a wide range of input

voltages and load currents
82% efficiency @ V

•

Startup under full load

•

Minimum operating input voltage V

•

Adjustable output voltage down to V

•

Quiescent current typically 150µA referred to
input voltage

•

MSOP8 Package

•

SO8 Package

•

Demonstration boards available

BATT

=1V

BATT

BATT

=0.926V

APPLICATIONS

•

Cordless Telephones

•

MP3 Players

•

PDA

•

Pagers

•

Battery Backup Supplies

•

Electronic toothbrush

•

GPS Receivers

•

Digital Camera

•

Palmtop Computers

APPLICATIONS(continued)

• Hand Held Instruments

• Portable Medical Equipment

• Solar Powered Equipment

• LED Flashlight

•

LED Backlight

TYPICAL APPLICATION CIRCUIT

V

BATT

C1

L1 D1

R1

U1

V

EM

DRIVE

I

BAS

SENSE

RE

FB

V

G

CC

ND

ZXSC100

ZHCS2000

Q1

ZXT14N20DX

R2

3.3V/0.1A

R3

C3

C2

R4

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1

ZXSC100

ABSOLUTE MAXIMUM RATING

Supply Voltage 0.3 to 3.5V
Maximum Voltage Other Pins 0.3 to V

CC

+0.3V
Power Dissipation
MSOP8 500mW
SO8 780mW

ELECTRICAL CHARACTERISTICS TEST CONDITIONS (Unless otherwise stated)

=1.2V, TA= 25°C

V

CC

Symbol Parameter Conditions Min Typ Max Units

I

CC

I

DRIVE

V

DRIVE

V

FB

V

ISENSE

Quiescent current Not switching 150 200 µA

Base drive current VRE=V

V

o/p voltage VRE=VCC,I

DRIVE

Feedback voltage 708 730 752 mV

Output current
reference voltage

Operating Temperature 0 to 70°C
Storage Temperature -55 to 125°C
Junction Temperature 150°C

CC

= 5mA VCC- 0.17 V

DRIVE

510mA

12 17.5 24 mV

T

CVISENSEISENSE

V

DREF

T

CVDREF

V

CC(SRT)

V

CC(min)

V

CC(hys)

I

FB

I

ISENSE

V

O(min)

V

O(max)

1

Depends on breakdown voltage of pass device. See ZXT14N20DX data sheet

voltage temp co. 0.4 %/°C

Drive current reference
voltage

V

temp co. 1 %/°C

DREF

Measured with respect
to V

CC

20 30 40 mV

Startup voltage Any output load 1.01 1.06 1.1 V

Minimum operating

0.926 0.98 1 V

input voltage

Supply start up to
shutdown hysteresis

Feedback input current 100 200 nA

I

input current V

SENSE

Minimum Output
Voltage

Maximum Output
Voltage

ZXT14N20DX as pass
element

= 0V 3 4 5.5 µA

ISENSE

V

CC

1

80 mV

V

20 V

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2

ZXSC100

ELECTRICAL CHARACTERISTICS: AC PARAMETERS

2

TEST CONDITIONS (Unless otherwise stated) )
V

=1.2V, TA= 25°C

CC

Symbol Parameter Conditions Min Typ Max Units

T

OFF

F

OSC

2

These parameters guaranteed by Design

3

Operating frequency is application circuit dependant. See applications section

Discharge Pulse Width 1.7 3 4 µs

Recommended operating
frequency

3

200 kHz

ZXT14N20DX

For the circuits described in the applications section, Zetex ZXT14N20DX is the recommended pass transistor.
The following indicatesoutlinedata for the ZXT,moredetailed information can befoundin the Zetex SuperSOT4
data book or at www.zetex.com

ELECTRICAL CHARACTERISTICS (at TA= 25°C unless otherwise stated).

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.

Collector-Emitter Breakdown
Voltage

Collector-Emitter Saturation
Voltage

V

(BR)CEO

V

CE(sat)

20 30 V IC=10mA*

4.5
30
75

45
95

6

mV
mV
mV

IC=0.1A, IB=10mA*
I

=1A, IB=10mA*

C

I

=4A, IB=40mA*

C

*Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤2%

ZHCS2000

For the circuits described in the applications section Zetex ZHCS2000 is the recommended Schottky diode. The
following indicates outline data for the ZHCS, more detailed information is available at www.zetex.com

ELECTRICAL CHARACTERISTICS (at T

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.

Forward Voltage V

Reverse Current I

Reverse Recovery
Time

*Measured under pulsed conditions. Pulse width=300µs. Duty cycle ≤2%

ISSUE 1 - JANUARY 2001

F

R

t

rr

= 25°C unless otherwise stated).

amb

385
500mVmV

300

µA

5.5 ns Switched from IF=

3

3

IF=1A
I

=2A

F

VR=30V

500mA to I
Measured at I

R

= 500mA.

=50mA

R

ZXSC100

TYPICAL CHARACTERISTICS

ISSUE 1 - JANUARY 2001

4

ZXSC100

DEVICE DESCRIPTION

The ZXSC100 is non-synchronous PFM, DC-DC
controller IC which, when combined with a high
performance external transistor, enables the
production ofa high efficiencyboost converter for use
in single cell applications. A block diagram is shown
for the ZXSC100 in Figure 1.

Figure 1
ZXSC100 Block Diagram

A shutdown circuitturnsthe device on oroffat V
with a hysteresis of typically 80mV. At start up,
comparator Comp1 turns the driver circuit and
therefore the external switching transistor on. This
circuit will remain active until the feedback voltage at
the pin FB rises above V

, which is set to 730mV. An

REF

external resistive divider on the FB pin sets the output
voltage level.

Comparator Comp2 forces the driver circuit and the
external switching transistor off, if the voltage at
I

exceeds 25mV. The voltage at I

SENSE

SENSE

from a current sense resistor connected in series with
the emitter of the switching transistor.

A monostable following the output of Comp2 extends
the turn-off time of the output stage by a minimum of
2us. This ensures that there is sufficient time to
discharge the inductor coil before the next on period.
The AND gate between the monostable and Comp1
output ensures that the switching transistor always
remains on until the I

threshold is reached and

SENSE

that the minimum discharge period is always
asserted. The pulse width is constant, the pulse
frequency varies with the output load.

=1V

CC

is taken

The driver circuit supplies the external switching
transistor with a defined current, which is
programmed by an external resistor connected
between the RE pin and V
voltage for thecircuitis 25mV below V

. The internal reference

CC

. To maximise

CC

efficiency the external transistor is switched quickly,
typically being forced off within 20ns.

In higher power applications more current can be
supplied to the switching transistor by using a further
external component. Thedriver transistor in theICcan
be bypassedwiththe addition ofa discrete PNP. More
information on this circuit configuration can be found
in the applications section.

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5

ZXSC100

PIN DESCRIPTIONS

Pin

Name Description

No.
1 EM Emitter of internal drive transistor. Connect to RE in lower power applications.

2 BAS Not connected in lower power applications. Connect to base of external drive

3 RE Drive current sense input. Internal threshold voltage set 25mV below V

4V
5I

CC

SENSE

6 FB Feedback sense. Internal threshold set to 730mV. Connect external resistive

7G
8V

DRIVE

Must be unconnected in higher power applications

transistor in higher power applications

Connected external sense resistor. Connect emitter of external drive transistor in
higher power applications

Supply voltage, generally NiMH, NiCd single cell
Inductor current sense input. Internal threshold voltage set to 25mV. Connect

external sense resistor

divider to output voltage
Ground

ND

Drive output for external switching transistor. Connect to base of external
switching transistor. Also connect to collector of external drive transistor in
higher power applications

CC

.

EM

BAS

RE
V

CC

1

2

3

4

V

8

DRIVE

G

7

ND

FB

6

5

I

SENSE

REFERENCE DESIGNS

Three typical DC-DC step-up converter applications
for the ZXSC100 are shown. Firstly with a maximum
output power of 0.33W, secondly with a maximum

Low Power Solution (330mW) Efficiency

output power of1.0Wand finally driving whiteLED’sin
a flashlight application.

ISSUE 1 - JANUARY 2001

6

ZXSC100

Low power solution, V

=3.3V, PL=0.33W

OUT

V

BATT

C1

L1 D1

R1

U1

V

EM

DRIVE

BAS

I

SENSE

RE

FB

V

G

CC

ND

ZXSC100

ZHCS2000

Q1

ZXT14N20DX

R2

R3

R4

Materials list

Ref Value Part Number Manufacturer Comments

U1 N/A ZXSC100X8 Zetex Plc Single cell converter, MSOP8

Q1

20V, 13mΩ,7A

ZXT14N20DX Zetex Plc Low VCE(sat) NPN, MSOP8

D1 0.5V, 2A ZHCS2000 Zetex Plc 2A Shottky diode

R1

R2

0Ω*
33mΩ

Generic Various 0805 Size

Generic Various 0805 Size

3.3V/0.1A

C3

C2

R3

R4

110kΩ
30kΩ

Generic Various 0805 Size

Generic Various 0805 Size

C1 220µF TPSD227M010R0100 AVX Low ESR tantalum capacitor

C2 220µF TPSD227M010R0100 AVX Low ESR tantalum capacitor

C3 1nF Generic Various 0805 Size

L1 22µH D01608C-223

Coilcraft Low profile SMT

D03316P-223

* Note: Refer to External Transistor base drive selection in the Applications Section.

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7

ZXSC100

Higher power solution, V

V

BATT

R1

C1

L1 D1

U1

V

EM

DRIVE

I

BAS

SENSE

FB

RE

V

G

CC

ND

ZXSC100

OUT

Q2

=3.3V, PL=1W

3.3V/0.33A

ZHCS2000

Q1

ZXT14N20DX

R2

C3

R3

R4

C2

Materials list

Ref Value Part Number Manufacturer Comments

U1 N/A ZXSC100X8 Zetex Plc Single cell converter, MSOP8

Q1

20V, 13mΩ,7A

ZXT14N20DX Zetex Plc Low VCE(SAT) NPN, MSOP8

Q2 N/A 2N2907 Various Small signal transistor

D1 0.5V, 2A ZHCS2000 Zetex Plc 2A Shottky diode

R1

R2

R3

R4

3.3Ω*
33mΩ
110kΩ
30kΩ

Generic Various 0805 Size

Generic Various 0805 Size

Generic Various 0805 Size

Generic Various 0805 Size

C1 220µF TPSD227M010R0100 AVX Low ESR tantalum capacitor

C2 220µF TPSD227M010R0100 AVX Low ESR tantalum capacitor

C3 1nF Generic Various 0805 Size

L1 22µH D01608C-223

Coilcraft Low profile SMT

D03316P-223

* Note: Refer to External Transistor base drive selection in the Applications Section.

ISSUE 1 - JANUARY 2001

8

ZXSC100

OTHER APPLICATIONS

Driving white LED’s in a flashlight application

U1

EM

BAS

RE

V

CC

ZXSC100

L1

100µH

V

DRIVE

I

SENSE

Q1

ZXT13N15

FB

G

ND

R2

0.22R

D1

WHITE LED

V

BATT

The ZXSC100 solution is ideal for LED lamp driving
applications operating from a single cell. In principal
conversion from 1.2V to the 3.6V, typically required by
white LEDs, is necessary. Load currents in the region of
20mA to 50mA being required for a singleLEDelement.

To minimise size, weight and cost, single cell operation
is anadvantage. The ZXSC is well matched to singlecell
NiCd and NiMHcharacteristics.Thecircuitwillturn on at

1.06V, to maximise the life the battery can offer, the
converter does not turn off until the batteryvoltage falls
to 0.93V.

The circuit itself is very simple, a minimum number of
components are used and they are all small size. The

ZXSC uses the very smallMSOP8 package, the pass
transistor is SOT23. No capacitors are required as
the circuit is stable under all conditions. The inductor
recommended is a low cost miniature component.

No compromise is made on efficiency however. In a
standard configuration efficiency well over 80% can
be achieved. With careful inductor selection
efficiency over 90% is possible.

The inherent flexibility of the ZXSC circuit means
that parallel or series LEDs can be driven depending
on application needs. A simple modification to the
application circuit means that the maximum pulse
current can be programmed to match the
characteristics ofthe chosen LED load,pulse current
in the range 10mA to 3A and beyond can be easily
achieved.

An application note (AN33) is available describing
various circuits for driving white LEDs. This
application note includes details of circuits that
optimise battery life, maximise brightness and can
be constructed for minimal cost. Contact your local
Zetex office for further details.

ISSUE 1 - JANUARY 2001

9

ZXSC100

APPLICATIONS INFORMATION

The following section is a design guide for optimum
converter performance.

Switching transistor selection

The choice of switching transistor has a major impact
on the DC-DC converter efficiency. For optimum
performance, a bipolar transistor with low V
and highgain is required.The majority oflosses in the
transistor are, ‘on-state’ and can be calculated by
using the formula below:

((I xV I x V ))xT

AV CE(SAT) B BE(SAT) ON

P

=

Q1

where

I

=

AV

I

2

PK

++)(

(T T

ON OFF)

)

From the calculations above the impact on converter
efficiency can be seen.

The Zetex ZXT14N20DX is an ideal choice of
transistor, having the lowest saturation voltage in its
class. A datasheetfortheZXT14N20DX is available on
the Zetex web site or through your local Zetex sales
office. Outline information is included in the
characteristics section of this data sheet.

ZXT14N20DX Saturation Characteristic.

CE(SAT)

ZXT14N20DX Saturation Characteristic.

External drive transistor selection

For higherpower applications anexternal transistor is
required to provide the additional base drive current
to the main switching transistor. For this, any small
signal PNP transistor is sufficient. Please seereference
designs for recommended part numbers.

Schottky diode selection

As with the switching transistor the Schottky rectifier
diode has a major impact on the DC-DC converter
efficiency. A Schottky diode with a low forward
voltage and fast recovery time should be used for this
application. The majority of losses in the diode are,
‘on-state’ and can be calculated by using the formula
below:

IxV xT

AV F(MAX) DIS

P

=

D1

(T T

+ )

On OFF

I

where

PK

I

=

AV

2

The diode should be selected so that the maximum
forward current is greater or equal to the maximum
peak current in the inductor, and the maximum
reverse voltage is greater or equal to the output
voltage.

The Zetex ZHCS2000 meets these needs. A data sheet
for the ZHCS2000 is available on the Zetex web site or
through your local Zetex sales office. Outline
information is included in the characteristics section of
this data sheet.

10

ISSUE 1 - JANUARY 2001

ZXSC100

Inductor selection

The inductor value must be chosen to satisfy
performance, cost and size requirements of theoverall
solution. Forthe referencedesigns we recommend an
inductor value of 22µH with a core saturation current
rating greater than the converter peak current value.

Inductor selection has a significant impact on the
converter efficiency.For applications where efficiency
is critical, a 5% improvement can be achieved with a
high performance inductor. This should be selected
with acore saturation current ratingmuch higher than
the peak current of the converter, say 3 times greater.
The resultant reductionincore losses brings about the
efficiency improvement.

Peak current definition

The peak current rating is a design parameter whose
value is dependent upon the overall application. For
the reference designs, a peak current of 1.2A was
chosen to ensure that the converter could provide the
required output power.

In general,the I

value mustbe chosento ensure that

PK

the switching transistor, Q1, is in full saturation with
maximum output power conditions, assuming
worse-case input voltage and transistor gain under all
operating temperature extremes.

Once I

is decided the value of R

PK

SENSE

can be

determined by:

V

R

SENSE

ISENSE

=

I

PK

Output power definition

By making the above assumptions for the inductor and

the output power can be determined by:

I

PK

(V V x I x T

−+)

Output Power

OUT IN PK DIS

=

2x(T T

On OFF

)

where

IxL

PK

T

=

ON

V

IN

and

IxL

T

DIS

Note: V

PK

=

VV

−()

OUT IN

= output voltage + rectifier diode VF

OUT

Figure 3 shows the discontinuous inductor current and
the relationship between output power, T
T

.

OFF

Figure 3
Discontinuous inductor current

ON,TDIS

and

Output capacitors

Output capacitors are a critical choice in the overall
performance of thesolution.They are required to filter
the output and supply load transient currents. There
are three parameters which are paramount in the
selection of the output capacitors; their capacitance
value, I

and ESR. The capacitance value is

RIPPLE

selected to meet theload transient requirements. The
capacitors I

rating must meet or exceed the

RIPPLE

current ripple of the solution.

The ESR of the output capacitor can also affect loop
stability and transient performance. The capacitors
selected for the solution, and indicated in the
reference designs, are optimised to provide the best
overall performance.

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11

ZXSC100

Input capacitors

The input capacitor is chosen for its voltage and RMS
current rating. The use of low ESR electrolytic or
tantalum capacitors is recommended. Capacitor
values foroptimum performanceare suggested in the
reference design section.

Also note that the ESR of the input capacitor is
effectively in series with the input and hence
contributes to efficiency losses in the order of I

RMS

2

ESR.

Output voltage adjustment

The ZXSC100 is an adjustable converter allowing the
end user the maximum flexibility in output voltage
selection. For adjustable operation a potential divider
network is connected as indicated in the diagram.

The output voltage is determined by the equation:

V

= VFB(1 + RA / RB),

OUT

where V

=730mV

FB

The resistor values, RA and RB, should be maximised
to improve efficiency and decrease battery drain.
Optimisation can be achieved by providing a
minimum current of I
The output is adjustable from V

=200nA to the V

FB(MAX)

to the (BR)V

FB

BATT

CEO

pin.

of

the switching transistor, Q1.

Note: For the reference designs, RA is assigned the
label R3 and RB the label R4.

V

OUT

RA

V

x

FB

RB

0V

External Transistor base drive selection

Optimisation of the external switching transistor base
drive may be necessaryfor improved efficiency in low
power applications. This can be achieved by
introducing an external resistor between the supply
and the RE pin of the ZXSC100. The resistor value can
be determined by:

V

DREF

R

=

1

I

B

1212

ISSUE 1 - JANUARY 2001

ZXSC100

Layout issues

Layout is critical for the circuit tofunction optimally in
terms of electrical efficiency, thermal considerations
and noise.

For ‘step-up converters’ there are four main current
loops, the inputloop,power-switch loop, rectifier loop
and output loop. The supply charging the input
capacitor forms theinputloop. The power-switch loop
is defined when Q1 is‘on’,currentflowsfromtheinput
through theinductor,Q1, R
Q1 is ‘off’, the energy stored in the inductor is
transferred to the output capacitor and load via D1,
forming the rectifier loop. The output loop is formed
by the output capacitor supplying the load when Q1 is
switched back off.

To optimise for best performance each of these loops
should be kept separate from each other and
interconnections made with short, thick traces thus

and toground.When

SENSE

minimising parasitic inductance, capacitance and
resistance. Also the sense resistor R2 should be
connected, with minimum trace length, between
emitter leadof Q1 and ground,again minimising stray
parasitics.

The layout for the 0.33W solution is shown below.

Demonstration board

A demonstration board for the 0.33W solution, is
available upon request. These can be obtained
through your local Zetex office or through Zetex web
pages. For all reference designs, Gerber files and bill
of materials can be supplied.

Actual Size

Top Silk

Top Copper

0.33W solution demo board layout

ISSUE 1 - JANUARY 2001

Drill Holes

Bottom Copper

13

ZXSC100

Designing with the ZXSC100.

Introduction

This section refers to the ZXSC100, 3.3V/100mA
output reference design and demonstrates the
dynamic performance of the solution.

Figure 1.
ZXSC100 low power solution, 3.3V/100mA output.

Efficiency

Efficiency is oftenquotedasone of the key parameters
of a DC-DC converter. Not only does it give an
instantaneous idea of heat dissipation, but also an
idea as to the extent battery life can be extended.
Figure 2. Shows the efficiency of the ZXSC100 low
power solution. Efficiency v Output current is shown
for a 3.3V output at various input voltages.

Main switching waveforms

Steady state operation under constant load gives an
excellent indication of ZXSC100 performance.
Represented in Figure 3. is the main switching
waveform, measured at the collectorof Q1, indicating
the transistor on-state and the diode energy transferto
the output.

Figure 3.
Switching waveform

The peak switching current is derived from the
threshold of theI
(see Applications section for calculations). Figure 4.
shows the switching waveform associated with the
I

pin

SENSE

pin and thesenseresistor value

SENSE

Figure 2.
ZXSC100 efficiency v output current

Figure 4.
I

14

SENSE

threshold

ISSUE 1 - JANUARY 2001

Shown in Figure 5. is the discontinuous inductor
current. The ramp-up current stores energy in the
inductor. The switching transistor,Q1,isonduringthis
time andhas an equivalent currentramp-up, shown in
Figure 6. The ramp-down current is associated with
the energy being delivered to the output via the
Schottky diode, D1. The diode current is equivalent to
this ramp-down current and is shown in figure 7.

Figure 5.
Inductor current (200mA/div)

Figure 7.
Diode current (200mA/div)

ZXSC100

Figure 6.
Transistor current (200mA/div)

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15

ZXSC100

Output Voltage Ripple

Output voltage ripple is shown in Figure 8. The circuit
is operated with a 1.2V input voltage, 3.3V output
voltage and 100mA load current. Output voltageripple
will be dependent, to a large extent, on the output
capacitor ESR. (see Applications section for
recommended capacitors).

Figure 8. Output voltage ripple for 3.3V/100mA
output.

Transient response

Transient response to step changes in load is a critical
feature in many converter circuits. The ZXSC100
operates a pulse by pulse regulation scheme and
therefore corrects for changes in the output every
pulse cycle, giving excellent response characteristic.

Measurement with a power supply

When measuring with a power supply it is important
to realise thattheimpedanceis much greater than that
of a secondary battery (NiCd or NiMH). To simulatethe
lower impedance of the battery x10 low ESR 1000uF
capacitors where placed in parallel at the input of the
converter. All the dynamic performance
measurements were taken using this technique.

ISSUE 1 - JANUARY 2001

16

Supplier Listing

Zetex

AVX

Coilcraft

Sanyo Electronic
Comp. (OS-CON)

ZXSC100

GERMANY ASIA USA UK

Zetex GmbH
Munich

(49) 894549490 (852) 2610 0611 (1) 631 543 7100 (44) 161 622 4444
http://www.zetex.com

http://www.avxcorp.com

http://www.coilcraft.com
Sanyo Europe

Munich
(49) 89 457693 16

http://www.sanyovideo.com

Zetex Asia
Hong Kong

AVX Asia
Singapore
(65) 258 2833

SANYO
Electronics Ltd.
Hong Kong
(852) 21936888
Singapore
(65) 281 3226
Japan
(81) 720 70 6306

Zetex Inc
Long Island NY

AVX USA
(1) 843 448 9411

Coilcraft Inc
(1) 847 639 6400

SANYO
Electronics Ltd.
Forrest City, AR
870 633 5030
San Diego, CA
619 661 6835
Rochelle Pk, NJ
201 843 8100

Zetex PLC
Chadderton,
Oldham

AVX UK
(44) 1252 770000

Coilcraft Europe
(44) 1236 730595

Semicon UK Ltd
(44) 1279 422224

ISSUE 1 - JANUARY 2001

17

ZXSC100

CONNECTION DIAGRAMS

EM
BAS

RE
V

CC

1

2

3

4

V

8

7

6

5

DRIVE

G

ND

FB
I

SENSE

MSOP8

DIM Millimetres Inches

MIN MAX MIN MAX
A 0.91 1.11 0.036 0.044
A1 0.10 0.20 0.004 0.008
B 0.25 0.36 0.010 0.014
C 0.13 0.18 0.005 0.007
D 2.95 3.05 0.116 0.120
e 0.65 NOM 0.0256 NOM
e1 0.33 NOM 0.0128 NOM
E 2.95 3.05 0.116 0.120
H 4.78 5.03 0.188 0.198
L 0.41 0.66 0.016 0.026

θ°

0° 6° 0° 6°

SO8

DIM Millimetres Inches

Min Max Min Max
A 4.80 4.98 0.189 0.196
B 1.27 BSC 0.05 BSC
C 0.53 REF 0.02 REF
D 0.36 0.46 0.014 0.018
E 3.81 3.99 0.15 0.157
F 1.35 1.75 0.05 0.07
G 0.10 0.25 0.004 0.010
J 5.80 6.20 0.23 0.24
K0° 8° 0° 8°
L 0.41 1.27 0.016 0.050

ISSUE 1 - JANUARY 2001

18

ZXSC100

ORDERING INFORMATION

DEVICE Package Partmarking

ZXSC100X8 MSOP8 ZXSC100
ZXSC100N8 SO8 ZXSC100

Zetex plc.
Fields New Road, Chadderton, Oldham, OL9-8NP, United Kingdom.
Telephone: [phone] (Sales), (44)161 622 4444 (General Enquiries)
Fax: [phone]

Zetex GmbH Zetex Inc. Zetex (Asia) Ltd. These are supported by
Streitfeldstraße 19 47 Mall Drive, Unit 4 3701-04 Metroplaza, Tower 1 agents and distributors in
D-81673 München Commack NY 11725 Hing Fong Road, major countries world-wide
Germany USA Kwai Fong, Hong Kong © Zetex plc 2001
Telefon: [phone] Telephone: [phone] Telephone:[phone]
Fax: [phone] Fax: [phone] Fax: [phone] www.zetex.com

This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services
concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or
service.

ISSUE 1 - JANUARY 2001

20