Page 1
DATA SHEET
GaAs INTEGRATED CIRCUIT
PPPP
PG138GV
L-BAND SPDT SWITCH
DESCRIPTION
The PPG138GV is L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
mobile communication system.
It housed in an very small 8-pin SSOP that is smaller than usual 8-pin SOP and easy to install and contributes to
miniaturizing the system.
FEATURES
• Maximum transmission power : +35 dBm min. (@ V
+34 dBm typ. (@ V
• Low insertion loss : 0.55 dB typ. (@ 1 GHz)
0.65 dB typ. (@ 2 GHz)
CONT
= ð5 V/0 V: PPG138GV
CONT
= ð3 V/0 V: PPG138GV)
)
APPLICATION
• Digital Cellular : GSM, PDC, PCN etc.
• PHS Base Station, PCS etc.
ORDERING INFORMATION
PART NUMBER PACKAGE PACKING FORM
P
PG138GV-E1 8-pin plastic SSOP (175 mil) Carrier tape width 12 mm Qty 2 kp/Reel.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
PARAMETERS SYMBOL RATINGS UNIT
Control Voltage 1, 2 V
Input Power (V
Input Power (V
Total Power Dissipation P
Operating Temperature T
Storage Temperature T
CONT
= ð5 V) P
CONT
= ð3 V) P
CONT1, 2
in
in
tot
opt
stg
ð
6.0 to +0.6 V
+36 dBm
+34 dBm
0.7 W
ð
50 to +80 °C
ð
65 to +150 °C
Document No. P13058EJ2V0DS00 (2nd edition)
(Previous No. P11508EJ1V0DS00)
Date Published December 1997 N CP(K)
Printed in Japan
1996©
Page 2
PIN CONNECTION DIAGRAM (Top View)
PPPP
PG138GV
1
2
3
4
G138
8
7
6
5
CONT2
1. V
2. OUT2
3. GND
4. GND
5. IN
6. GND
7. OUT1
CONT1
8. V
SPDT SWITCH IC SERIES PRODUCTS
PART
NUMBER
PG130G +34 0.5 @ 1 G 32 @ 1 G
P
PG131G +30 0.6 @ 2 G 23 @ 2 G
P
PG132G +30 0.6 @ 2 G 22 @ 2 G +3/0 PHS, DIVERSITY
P
PG133G +25 0.6 @ 2 G 20 @ 2 G
P
PG137GV +34 0.55 @ 1 G 25 @ 2 G +3/0 PDC, GSM, IS-136
P
PG138GV +34
P
PIN (1 dB)
(dBm)
+38
LINS (dB) ISL (dB) VCONT (V) PACKAGE APPLICATIONS
5/0 PDC, IS-54, PHS
ð
4/0 PHS, DIVERSITY
ð
8 pins SSOP
3/0 DIVERSITY, VCO
0.55 @ 1 G 30 @ 1 G
ð
3/0
ð
5/0
ð
(175 mil)
PDC, GSM, IS-136
Remark
As for detail information of series products, please refer to each data sheet.
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[
PG138GV]
PPPP
RECOMMENDED OPERATION CONDITIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
PPPP
PG138GV
Control Voltage (ON) V
Control Voltage (OFF) V
Input Power (V
Input Power (V
CONT
= ð5 V) P
CONT
= ð3 V) P
CONT
CONT
in
in
0.2 0 +0.2 V
ð
5.3
ð
3.0
ð
2.7 V
ð
+35 dBm
+33 dBm
ELECTRICAL CHARACTERISTICS
(UNLESS OTHERWISE SPECIFIED TA = 25
CHARACTERISTICS SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT
Insertion Loss 1 L
Insertion Loss 2 L
Insertion Loss 3 L
Isolation 1 I
Isolation 2 I
Input Return Loss RL
Output Return Loss RL
Input Power at 1 dB Pin (1 dB) f = 500 M to 2 GHz +32 +34 dBm
Compression Point
Switching Speed t
Control Current I
INS1
INS2
INS3
SL1
SL2
in
out
Note 2
SW
CONT
f = 2.0 GHz 0.65 0.90 dB
f = 2.5 GHz
f = 2.0 GHz 18 20 dB
f = 100 M to 2 GHz 11 dB
f = 500 M to 2 GHz,
CONT
V
CONT
V
CONT
C, V
qqqq
=
3 V/0 V, f = 100 MHz to 1 GHz)
ðððð
0.55 0.75 dB
Note 1
0.8
25 30 dB
11 dB
+34 +38 dBm
= ð5 V/0 V
10 ns
= ð5 V/0 V 5
dB
P
A
Notes 1.
Characteristic for reference at 2.0 to 2.5 GHz.
in
P
(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of
2.
linear range.
All other characteristics are measured in linear range.
NOTE ON CORRECT USE
• Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to
same side of No. 5 pin (IN).
• The distance between IC’s GND pins and ground pattarn of substrate should be as shorter as possible to avoid
parasitic parameters.
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[
PG138GV]
PPPP
TEST BOARD
IN 0.9 mm width
NEC
0.4 mm
thickness
teflon glass
R = 50 Ω
PPPP
PG138GV
TEST CIRCUIT
V
CONT2
= 0 V/–3 V
OUT1 V
1000 pF
OUT2
G130/131
R R
CONT1
V
CONT2
50 Ω 50 Ω
Z
O
= 50 Ω
OUT2
1
2
3
4
8
7
6
5
Using the same board that of PG130/131G
O
= 50 Ω
Z
O
= 50 Ω
Z
µ
1000 pF
OUT1
IN
V
CONT1
= –3 V/0 V
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[
PG138GV]
PPPP
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
CONT1
V
0 V
CONT2
V
ð
0 V
3 V
IN
IN
OUT1
OUT2
OUT1
OUT2
IN
IN
PACKGE DIMENSIONS
8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm)
ð
3 V
PPPP
PG138GV
OUT1
OUT2
OUT1
OUT2
1.5 ± 0.1
1.8 MAX
0.575 MAX
0.1 ± 0.1
85
14
3.0 MAX
0.65
+0.10
0.3
–0.05
+0.10
–0.05
0.15
0.5 ± 0.2
0.10
Detail of lead end
4.94 ± 0.2
M
+7˚
3.2 ± 0.1
–3˚
3˚
0.87 ± 0.2
0.15
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PPPP
PG138GV
Floating the
It is possible to use the
PG138GV
PPPP
PG138GV with only a single +3 V supply by employing a technique known as “floating”.
P
When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground
by +3 V.
When the PPG138GV is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4)
capacitors. This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking
capacitors should be chosen to accommodate the frequency of operation. Grounding capacitors are required to float
the IC above ground. The value for grounding capacitor should be chosen to accommodate the frequency of
operation.
It is not recommended to float the PPG138GV for wide band application.
(Floating the PPG138GV with +3 V/0 V supply at 2 GHz-band, BW d 50 MHz)
GND
C1
C2
OUT2
IN
C1, C4 = 10 pF below
C2, C3, C5 = 100 pF
41
58
C3
C4
GND
: Grounding capacitor
: DC blocking capacitor
C5
V
CONT2
PIN CONNECTIONS
1. V
V
CONT1
OUT1
2. OUT2
3. GND
4. GND
5. IN
6. GND
7. OUT1
8. V
CONT2
CONT1
The distance between grounding capacitor and IC’s GND pins, grounding capacitor and ground of the substrate
should be as shorter as possible to avoid the parasitic parameters. IC’s GND pin, No. 3, No. 4 and No. 6 are
connected inside of the IC.
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PPPP
PG138GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
[
PG138GV]
PPPP
Soldering process Soldering conditions Recommended condition symbol
Infrared ray reflow Package peak temperature: 235 qC
Hour: within 30 s. (more than 210 qC)
Time: 3 times, Limited days: no.
VPS Package peak temperature: 215 qC
Hour: within 40 s. (more than 200 qC)
Time: 3 times, Limited days: no.
Wave soldering Soldering tub temperature: less than 260 qC, Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin part heating Pin area temperature: less than 300 qC, Hour: within 10 s.
Limited days: no.
It is storage days after opening a dry pack, the storage conditions are 25 qC, less than 65 %, RH.
Note
Note
Note
Note
Note
IR35-00-3
VP15-00-3
WS60-00-1
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
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PPPP
PG138GV
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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