Preliminary specification
File under Integrated Circuits, IC01
1997 Mar 13
Page 2
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
FEATURES
• Source selector for two stereo and one mono inputs
• Interface for noise reduction circuits
• Interface for external equalizer
• Volume and balance control
• Bass control with equalizer filters
• Treble control
• Mute control at audio signal zero crossing
• Fast mute control via I2C-bus
• Fast mute control via pin
2
C-bus control for all functions
• I
• Power supply with internal power-on reset.
QUICK REFERENCE DATA
GENERAL DESCRIPTION
The sound control circuit TEA6324T is an I
2
C-bus
controlled stereo preamplifier for car radio hi-fi sound
applications.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC
I
CC
V
o(rms)
G
v
G
step(vol)
G
bass
G
treble
G
step(treble)
(S+N)/Nsignal-plus-noise to noise ratioV
supply voltage7.58.59.5V
supply currentVCC= 8.5 V−26−mA
maximum output voltage levelVCC= 8.5 V; THD ≤ 0.1%−2000−mV
voltage gain−86−+20dB
step resolution (volume)−1−dB
bass control−18−+18dB
treble control−12−+12dB
step resolution (treble)−1.5−dB
= 2.0 V; Gv= 0 dB;
o
−105−dB
unweighted
RR
100
ripple rejectionV
< 200 mV; f = 100 Hz;
r(rms)
−75−dB
Gv=0dB
α
cs
channel separation250 Hz ≤ f ≤ 10 kHz; Gv=0dB9096−dB
ORDERING INFORMATION
TYPE
NUMBER
NAMEDESCRIPTIONVERSION
PACKAGE
TEA6324TSO24plastic small outline package; 24 leads; body width 7.5 mmSOT137-1
1997 Mar 132
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Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
BLOCK DIAGRAM
SDA
MUTE
3
TEA6324T
m
C
MUTE
FUNCTION
DETECTOR
ZERO CROSS
BALANCE
VOLUME II
0 to −55 dB
OUTPUT LEFT
SCL
24
1
C-BUS
2
I
RECEIVER
22
BALANCE
VOLUME II
0 to −55 dB
OUTPUT RIGHT
MGK105
handbook, full pagewidth
5.6 nF10 nF
3.4 kΩ
C
270 nF 270 nF
220 nF
KVL
495678
POWER
SUPPLY
16
23
2
ref
V
CC
V
100 µF
15
47 µF
LEFT
±12 dB
TREBLE
LEFT
BASS
±18 dB
LEFT
VOLUME I
+20 to −31 dB
12
5 × 220 nF
5.6 nF
RIGHT
±12 dB
TREBLE
3.4 kΩ
LOGIC
BASS
RIGHT
±18 dB
270 nF
19
270 nF
Fig.1 Block diagram.
RIGHT
VOLUME I
+20 to −31 dB
17182021
SOURCE
SELECTOR
10
14
11
13
KIN
C
220 nF
KVL
C
left
input
GND
source
1997 Mar 133
input
mono
source
input
right
source
Page 4
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
PINNING
SYMBOLPINDESCRIPTION
2
2
C-bus)
C-bus)
handbook, halfpage
SDA
1
GND
2
OUTL
3
TL
4
B2L
5
B1L
6
IVL
QSL
MUTE
IMO
IBL
IAL
TEA6324T
7
8
9
10
11
12
MGK104
Fig.2 Pin configuration.
SCL
24
V
23
CC
OUTR
22
TR
21
B2R
20
19
B1R
IVR
18
17
QSR
V
16
ref
CAP
15
IBR
14
IAR
13
SDA1serial data input/output (I
GND2ground
OUTL3output left
TL4treble control capacitor left channel
or input from an external equalizer
B2L5bass control left channel or output to
an external equalizer
B1L6bass control, left channel
IVL7input volume I, left control part
QSL8output source selector, left channel
MUTE9mute control
IMO10input mono source
IBL11input B left source
IAL12input A left source
IAR13input A right source
IBR14input B right source
CAP15electronic filtering for supply
V
ref
16reference voltage (0.5VCC)
QSR17output source selector right channel
IVR18input volume I, right control part
B1R19bass control right channel
B2R20bass control right channel or output
to an external equalizer
TR21treble control capacitor right channel
or input from an external equalizer
OUTR22output right
V
CC
23supply voltage
SCL24serial clock input (I
1997 Mar 134
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Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
2
FUNCTIONAL DESCRIPTION
The source selector selects one of 2 stereo inputs or the
mono input. The maximum input signal voltage is
V
= 2 V. The outputs of the source selector and the
i(rms)
inputs of the following volume control parts are available at
pins 7 and 8 for the left channel and pins 17 and 18 for the
right channel. This offers the possibility of interfacing a
noise reduction system.
The volume control function is split into two sections:
volume I control block and volume II control block.
The control range of volume I is between +20 dB and
−31 dB in steps of 1 dB. The volume II control range is
between 0 dB and −55 dB in steps of 1 dB.
The recommended control range to be used is 86 dB
(+20 to −66 dB) although in theory, a range of 106 dB
(+20 to −86 dB) can be attained. The gain/attenuation
setting of the volume I control block is common for both
channels.
The volume I control block is followed by the bass control
block. The frequency response of the bass control (see
Fig.3) is provided for each channel by an external filter in
combination with internal resistors. The adjustable range
is between −18 and +18 dB in steps of 1.8 dB at 46 Hz.
The treble control block offers a control range between
−12 and +12 dB in steps of 1.5 dB at 15 kHz. The filter
characteristic is determined by a single capacitor of 5.6 nF
for each channel in combination with internal resistors
(see Fig.4).
The basic step width of treble control is 3 dB.
The intermediate steps are obtained by switching 1.5 dB
boost and 1.5 dB attenuation steps.
The bass and treble control functions can be switched off
2
C-bus. In this event the internal signal flow is
via I
disconnected. The connections B2L and B2R are outputs
and TL and TR are inputs for inserting an external
equalizer.
The last section of the circuit is the volume II block.
The balance function uses the same control block. This is
achieved by 2 independently controllable attenuators, one
for each output. The control range of these attenuators is
55 dB in steps of 1 dB with an additional mute step.
The circuit provides 3 mute modes:
1. Zero crossing mode mute via I2C-bus using
2 independent zero crossing detectors (ZCM,
see Tables 2 and 8 and Fig.15)
2. Fast mute via MUTE pin (see Fig.9)
3. Fast mute via I
see Tables 2 and 8) or volume II block setting
(see Table 4).
The mute function is performed immediately if ZCM is
cleared (ZCM = 0). If the bit is set (ZCM = 1) the mute is
activated after changing the GMU bit. The actual mute
switching is delayed until the next zero crossing of the
audio frequency signal. Two comparators are built-in to
provide independent mute switches to control each of the
audio channels (left and right).
To avoid a large delay of mute switching when very low
frequencies are processed, the maximum delay time is
limited to typically 100 ms by an integrated timing circuit
and an external capacitor (Cm= 10 nF, see Fig.9). This
timing circuit is triggered by reception of a new data word
for the switch function which includes the GMU bit. After a
discharge and charge period of an external capacitor the
muting switch follows the GMU bit, only if no zero crossing
was detected during that time.
The mute function can also be controlled externally (see
Fig.9). If the mute pin is switched to ground all outputs are
muted immediately (hardware mute). This mute request
overwrites all mute controls via the I2C-bus for the time the
pin is held LOW. The hardware mute position is not stored
in the TEA6324T.
Typically, the turn on/off can be used to avoid AF output.
This can be caused by the input signal from preceding
stages, which may produce output during a drop of VCC.
To avoid this, the mute must be set prior to a VCC drop and
can be achieved either by I2C-bus control, or by grounding
the MUTE pin.
In cases where there is no mute in the application before
turn off, a supply voltage drop of more than 1 × VBE will
result in a mute during the voltage drop.
The power supply should include a VCC buffer capacitor,
which provides a discharging time constant. If the input
signal does not disappear after turn off the input will
become audible after a certain time. A 4.7 kΩ resistor
discharges the VCC buffer capacitor, because the internal
current of the IC does not discharge it completely.
The hardware mute function is ideal for use in Radio Data
System (RDS) applications. The zero crossing mute
avoids modulation plops. This feature is an advantage for
mute during changing presets and/or sources (e.g. traffic
announcement during cassette playback).
C-bus either by general mute (GMU,
1997 Mar 135
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Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
CC
V
n
T
amb
T
stg
V
es
Note
1. Human body model: C = 100 pF; R = 1.5 kΩ; V ≥ 2 kV. Machine model: C = 200 pF; R = 0 Ω; V ≥ 500 V.
supply voltage010V
voltage at all pins relative to pin 20V
CC
V
operating ambient temperature−40+85°C
storage temperature−65+150°C
electrostatic handlingnote 1−−
1997 Mar 136
Page 7
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
CHARACTERISTICS
VCC= 8.5 V; RS= 600 Ω; RL=10kΩ; CL= 2.5 nF; AC coupled; f = 1 kHz; T
linear; treble linear; balance in mid position; unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
CC
I
CC
V
DC
supply voltage7.58.59.5V
supply current−2633mA
internal DC voltage at inputs and
outputs
V
G
V
ref
o(rms)
v(max)
internal reference voltage at pin 16−4.25−V
maximum voltage gainRS=0Ω; RL= ∞192021dB
output voltage level (RMS value) for
at the power output stageTHD ≤ 0.1%; see Fig.10−2000−mV
low frequency (−1 dB)60−−Hz
low frequency (−3 dB)30−−Hz
high frequency (−1 dB)20000 −−Hz
= 470 nF;
C
KIN
C
= 100 nF; Zi=Z
KVL
low frequency (−3 dB)
α
cs
channel separationVi= 2 V; frequency range
250 Hz to 10 kHz
THDtotal harmonic distortionfrequency range
20 Hz to 12.5 kHz
= 100 mV; Gv=20dB−0.1−%
V
i
V
= 1 V; Gv=0dB−0.050.15%
i
= 2 V; Gv=0dB−0.1−%
V
i
= 2 V; Gv= −10 dB−0.1−%
V
i
RRripple rejectionV
r(rms)
< 200 mV
f = 100 Hz7076−dB
f = 40 Hz to 12.5 kHz−66−dB
(S+N)/Nsignal-plus-noise to noise ratiounweighted;
20 Hz to 20 kHz RMS;
= 2.0 V; see Figs 5 and 6
V
o
CCIR468-2 weighted; quasi
peak; V
= 2.0 V
o
=0dB−95−dB
G
v
=12dB−88−dB
G
v
=20dB−81−dB
G
v
=25°C; gain control Gv= 0 dB; bass
amb
3.834.254.68V
2000−−mV
i(min)
17−−Hz
i(typ)
9096−dB
−105−dB
1997 Mar 137
Page 8
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
P
no(rms)
α
ct
Source selector
Z
i
α
S
V
i(rms)
V
offset
Z
o
R
L
C
L
G
v
Control part (source selector disconnected; source resistance 600 Ω)
Z
i
Z
o
R
L
C
L
R
DCL
V
i(rms)
V
n(o)
CR
tot
G
step
∆G
a
∆G
t
α
mute
noise output power (RMS value) only
mute position; note 1−− 10nW
contribution of TEA6324T; power
amplifier for 6 W
crosstalk between bus inputs and
signal outputs
20
V
bus p p–()
-------------------------- -log
V
o rms()
note 2−110−dB
input impedance253545kΩ
input isolation of one selected source
to any other input
f = 1 kHz−105−dB
f = 12.5 kHz−95−dB
maximum input voltage (RMS value)THD < 0.5%; VCC= 8.5 V−2.15−V
THD < 0.5%; V
DC offset voltage at source selector
= 7.5 V−1.8−V
CC
−− 10mV
output by selection of any inputs
output impedance−80120Ω
output load resistance10−−kΩ
output load capacity0−2500pF
voltage gain, source selector−0−dB
input impedance volume input100150200kΩ
output impedance−80120Ω
output load resistance2−−kΩ
output load capacity0−10nF
DC load resistance at output to ground4.7−−kΩ
maximum input voltage (RMS value)THD < 0.5%−2.15−V
noise output voltageCCIR468-2 weighted; quasi
peak
=20dB−110220µV
G
v
=0dB−3350µV
G
v
G
= −66 dB−1322µV
v
mute position−10−µV
total continuous control range−106−dB
recommended control range−86−dB
step resolution−1−dB
step error between any adjoining step−− 0.5dB
attenuator set errorGv= +20 to −50 dB−− 2dB
=−51 to −66 dB−− 3dB
G
v
gain tracking errorGv= +20 to −50 dB−− 2dB
mute attenuationsee Fig.9100110−dB
1997 Mar 138
Page 9
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
offset
Volume I control
CR
tot(vol)1
G
v
G
step
Bass control
G
bass
G
step
V
offset
Treble control
G
treble
G
step
V
offset
Volume II and balance control
CR
tot(vol)2
G
step
DC step offset between any adjoining
step
DC step offset between any step to
Gv=0to−66 dB−0.210mV
=20to0dB−215mV
G
v
=0to−66 dB−− 10mV
G
v
mute
continuous volume control range−51−dB
voltage gain−31−+20dB
step resolution−1−dB
bass control, maximum boostf = 46 Hz161819dB
maximum attenuationf = 46 Hz161819dB
step resolution (toggle switching)f = 46 Hz−1.8−dB
step error between any adjoining stepf = 46 Hz−− 0.5dB
DC step offset in any bass position−− 25mV
treble control, maximum boostf = 15 kHz111213dB
maximum attenuationf = 15 kHz111213dB
maximum boostf > 15 kHz−− 15dB
step resolution (toggle switching)f = 15 kHz−1.5−dB
step error between any adjoining stepf = 15 kHz−− 0.5dB
DC step offset in any treble position−− 10mV
continuous attenuation of volume
53.55556.5dB
control range
step resolution−12dB
attenuation set error−− 1.5dB
Mute function (see Fig.9)
HARDWARE MUTE
V
sw
mute switch level (2 × VBE)−1.45−V
mute active
V
swLOW
I
i
input level−− 1.0V
input currentV
swLOW
mute passive: level internally defined
V
swHIGH
t
d(mute)
saturation voltage−− VCCV
delay until mute passive−− 0.5ms
Power-on reset when reset is active the GMU-bit (general mute) is set and the I
position
V
CC
Digital part (I
V
IH
V
IL
I
IH
I
IL
V
OL
Notes to the characteristics
1. The indicated values for output power assume a 6 W power amplifier at 4 Ω with 20 dB gain and a fixed attenuator
of 12 dB in front of it. Signal-to-noise ratios exclude noise contribution of the power amplifier.
2. The transmission contains: total initialization with MAD and subaddress for volume and 8 data words, see also
definition of characteristics, clock frequency = 50 kHz, repetition burst rate = 400 Hz, maximum bus signal
amplitude = 5 V (p-p).
3. The AC characteristics are in accordance with the I2C-bus specification. This specification,
use it”
delay timeCm=10nF−100−ms
window for audio signal zero crossing
−3040mV
detection
supply drop for mute active−V23− 0.7 −V
2
C-bus receiver is in reset
increasing supply voltage start of reset−− 2.5V
end of reset5.26.57.2V
decreasing supply voltage start of
3. The last eight treble control data words select treble output.
4. The last treble control and bass control data words (00000) enable the external equalizer connection.
1997 Mar 1318
Page 19
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
Table 7 Selected input
FUNCTION
SC2SC1SC0
Stereo inputs IAL and IAR111
Stereo inputs IBL and IBR110
No function101
No function100
Mono input IMO0X
Note
1. X = don’t care bits (logic 1 during testing).
DATA
(1)
Table 8 Mute mode
FUNCTION
Direct mute off00
Mute off delayed until the next zero
crossing
Direct mute10
(1)
X
Mute delayed until the next zero
crossing
DATA
GMUZCM
01
11
1997 Mar 1319
Page 20
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
20
handbook, full pagewidth
G
bass
(dB)
10
0
−10
−20
10
MED840
2
10
3
10
f (Hz)
4
10
Fig.3 Bass control.
15
handbook, full pagewidth
G
treble
(dB)
10
5
0
−5
−10
−15
10
32
10
Fig.4 Treble control.
1997 Mar 1320
MED424
4
10
f (Hz)
5
10
Page 21
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
100
handbook, full pagewidth
S/N
(dB)
90
80
70
60
50
−4
10
(1) Vi= 2.0V.
(2) Vi= 0.5V.
(3) Vi= 0.2V.
−3
10
−2
10
−1
10
1
Fig.5 Signal-to-noise ratio; noise weighted: CCIR468-2, quasi peak.
MED426
(1)
(2)
(3)
Po (W)
10
110
handbook, full pagewidth
S/N
(dB)
100
90
80
70
60
−4
10
(1) Unweighted RMS.
(2) CCIR468-2 RMS.
(3) CCIR468-2 quasi peak.
−3
10
−2
10
Fig.6 Signal-to-noise ratio; Vi= 2 V; P
MED427
(1)
(2)
(3)
−1
10
=6W.
max
1
Po (W)
10
1997 Mar 1321
Page 22
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
200
handbook, full pagewidth
noise
(µV)
150
100
50
0
−70−50−30−1010
Stereo/mono inputs.
Fig.7 Noise output voltage; CCIR468-2, quasi peak.
gain (dB)
MHA594
30
−60
handbook, full pagewidth
(dB)
−80
−100
−120
−140
MED429
2
10
3
10
2 x 10
3
5 x 10
3
4
10
f (Hz)
2 x 10
45020500200
Fig.8 Muting.
1997 Mar 1322
Page 23
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
handbook, full pagewidth
delay switch
mute switch
level
level
hardware mute switchMUTE (pin 9)
Ich = −150 µA
TEA6324T
U
(V)
V
CC
8.5
(1)
2.2
(2)
1.45
zero crossing
mute start
t
d(mute) = 0.5 ms delay until
100 ms
I
= 0.6 µA
dch
mute passive
end of delayhard muteonhard mute
Cm = 10 nF
off
I
(µA)
0
−150
MHA595
t (ms)
(1) Typically 2.2 V; referenced to 3 × VBE.
(2) Typically 1.5 V; referenced to 2 × VBE.
Fig.9 Mute function diagram.
1997 Mar 1323
Page 24
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
In cases where at the maximum volume position the 20 dB gain is not needed, it is recommended that the maximum
boost gain should be used. This coupled with increased attenuation in the last section (volume II), results in a lower noise
and offset voltage.
handbook, halfpage
= 200 mV
i(min)
handbook, halfpage
= 200 mV
i(min)
TEA6324T
TEA6324T
Vo = 2 V for P
a.
Vo = 1 V for P
POWER STAGE
G = 20 dB
P
= 100 W at 4 ΩV
(max)
(max)
POWER STAGE
G = 26 dB
P
= 100 W at 4 ΩV
(max)
(max)
MHA596
MHA597
b.
a. Gain volume I = 20 dB (G
b. Gain volume I = 20 dB (G
); gain volume II = 0 dB; control range = 55 dB.
v(max)
); gain volume II = −6 dB global setting; control range now 49 dB, previously 55 dB.
v(max)
Fig.10 Level diagram.
1997 Mar 1324
Page 25
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
V
handbook, full pagewidth
P
V
CC
4.7 kΩ
8.5 V
inputs
5 × 220 nF2 × 4.7 µF
5 × 600 Ω
470 µF
13
11
14
TEA6324T
10
12
21516
µF
23
3
22
47
100
µF
+8.5 V to
oscilloscope
outputs to
oscilloscope
2 × 10 kΩ
MHA598
10
handbook, full pagewidth
(V)
8
6
4
2
0
01234
(1) VCC.
(2) VO.
Fig.11 Turn-on/off power supply circuit diagram.
(1)
(2)
t (s)
MED433
5
Fig.12 Turn-on/off behaviour.
1997 Mar 1325
Page 26
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
3.4 kΩ
handbook, full pagewidth
10 kΩ
V
P
VCC = 8.5 V
1000
µF
0.2 V
(RMS)
600 Ω
100 µF
0.1 µF
47 µF
220 nF
220 nF
8
16
23
2
15
input A and B
left and right
and input mono
1718 192021
270 nF
765
270 nF
TEA6324T
5.6
nF
49
output right
output left
24
1
10
nF
MHA599
4.7 µF
SCL
SDA
V
O
handbook, full pagewidth
5.6 nF
220 nF
270 nF
270 nF
3.4 kΩ
Fig.13 Test circuit for power supply ripple rejection (RR).
3.4 kΩ
270 nF
765
270 nF
5.6
TEA6324T
nF
49
output right
output left
24
VCC = 8.5 V
470
µF
V
P
V
i
600 Ω
100 µF
0.1 µF
47 µF
220 nF
220 nF
220 nF
8
16
23
2
15
input A and B
right and left
input A and B
left and right
and input mono
1718 192021
10
nF
1
4.7 µF
MHA600
SCL
SDA
V
O
220 nF
270 nF
Fig.14 Test circuit for channel separation (αcs).
1997 Mar 1326
5.6 nF
270 nF
3.4 kΩ
Page 27
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
Selection of input signals by using the zero crossing
mute mode
The zero cross mute mode provides for a selection of input
sources (A and B) for both left and right channels.
The following example (see Fig.15), shows a typical
selection for the left input source signals IAL and IBL.
The initial selection of these channels produces a
modulation click. The click is determined by the difference
of the signal values at the time of switching.
At t
the maximum possible difference between signals is
1
7 V (p-p) (see Fig.15) and gives a large click. Using the
cross detector no modulation click is audible.
With the selection enabled at t1, the microcontroller sets
the zero cross bit (ZCM = 1) and then the mute bit
(GMU = 1) via the I2C-bus. The output signal follows the
input A signal from −4 V, until the next zero crossing
occurs and then activates mute.
handbook, full pagewidth
V
4
3
After a fixed delay time at t
, the microcontroller sends the
2
bits for input switching and mute inactive.
The output signal remains muted until the next signal zero
crossing of input B (IBL) occurs, and then follows that
signal up to 3 V.
With a delay time of 40 ms (t2− t1), the external capacitor
Cm= 3.3 nF. This results with the zero cross function
operating at the lowest frequency of 40 Hz determined by
the Cm capacitor.
MED436
(1)
(1) Input A (IAL).
(2) Output.
(3) Input B (IBL).
2
1
0
−1
−2
−3
−4
t
1
t
(2)
2
(3)
t
Fig.15 Zero cross function; only one channel shown.
1997 Mar 1327
Page 28
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
INTERNAL PIN CONFIGURATIONS
Values shown in Figs 16 to 27 are typical DC values; VCC= 8.5 V.
3
+
1
5 V
1.8 kΩ
80 Ω
MBE911
4.25 V
Fig.16 Pin 1: SDA (I2C-bus data).
4
4.25 V
+
2.4 kΩ
MHA601
MBE912
Fig.17 Pins 3 and 22: output signals.
+
5
4.25 V
80 Ω
MHA602
Fig.18 Pins 4 and 21: treble control capacitors.
1997 Mar 1328
Fig.19 Pins 5 and 20: bass control capacitor
outputs.
Page 29
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
6
4.25 V
3.52
kΩ
+
MHA603
Fig.20 Pins 6 and 19: bass control capacitor
inputs.
+
8
4.25 V
7
4.25 V
+
150 kΩ
4.25 V
MHA604
Fig.21 Pins 7 and 18: input volume 1, control part.
+
1.3 kΩ
9
8.5 V
80 Ω
MHA605
Fig.22 Pins 8 and 17: output source selector.
1997 Mar 1329
maximum
200 µA
0.6 µA
constant
4.5 kΩ
Fig.23 Pin 9: mute control.
MHA606
constant
2.2 V
Page 30
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
+
10
4.25 V
+
35 kΩ
4.25 V
Fig.24 Pins 10 to 14: inputs.
MHA607
4.25 V
16
4.7 kΩ
300 Ω
+
3.4
kΩ
3.4
kΩ
MHA608
15
5 kΩ
8.5 V
Fig.25 Pin 15: filtering for supply; pin 16: reference
voltage.
apply +8.5 V
23
to this pin
MHA609
Fig.26 Pin 23: supply voltage.
1997 Mar 1330
24
5 V
1.8 kΩ
MHA610
Fig.27 Pin 24: SCL (I2C-bus clock).
Page 31
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
PACKAGE OUTLINE
SO24: plastic small outline package; 24 leads; body width 7.5 mm
D
c
y
Z
24
pin 1 index
1
e
13
12
w M
b
p
SOT137-1
E
H
E
Q
A
2
A
1
L
p
L
detail X
(A )
A
X
v M
A
A
3
θ
0510 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
OUTLINE
VERSION
SOT137-1
A
max.
2.65
0.10
A1A2A
0.30
2.45
0.10
2.25
0.012
0.096
0.004
0.089
IEC JEDEC EIAJ
075E05 MS-013AD
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
(1)E(1)(1)
cD
15.6
7.6
7.4
0.30
0.29
1.27
0.050
15.2
0.61
0.60
REFERENCES
1997 Mar 1331
eHELLpQ
10.65
10.00
0.42
0.39
1.4
0.055
1.1
0.4
0.043
0.016
1.1
1.0
0.043
0.039
PROJECTION
0.25
0.250.1
0.01
0.01
EUROPEAN
ywvθ
Z
0.9
0.4
8
0.004
ISSUE DATE
0.035
0.016
92-11-17
95-01-24
0
o
o
Page 32
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Mar 1332
Page 33
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
2
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
1997 Mar 1333
Page 34
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
NOTES
1997 Mar 1334
Page 35
Philips SemiconductorsPreliminary specification
Sound control circuitTEA6324T
NOTES
1997 Mar 1335
Page 36
Philips Semiconductors – a worldwide company
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands547027/1200/01/pp36 Date of release: 1997 Mar 13Document order number: 9397 750 01599
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