Datasheet TDA9859 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA9859

Universal hi-fi audio processor for
TV

Product specification
Supersedes data of 2001 Jul 02
File under Integrated Circuits, IC02

2001 Jul 11

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

FEATURES

• Multi-source selector switches six AF inputs
(three stereo sources or six mono sources)

• Each ofthe input signals can be switched to each of the
outputs (crossbar switch)

• Outputs for loudspeaker channel and peri-TV connector
(SCART)

• Switchable spatial stereo and pseudo stereo effects

• Audio surround decoder can be added externally

• Two general purpose logic output ports

• I2C-bus control of all functions.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

P

I

P

V

i(rms)

V

o(rms)

G

v

positive supply voltage (pin VP) 7.2 8.0 8.8 V
supply current − 25 − mA
input signal levels for 0 dB gain (RMS value) 2 −−V
output signal levels for 0 dB gain (RMS value) 2 −−V
voltage gain in main channel

volume control (in 1 dB steps, balance included) −63 − +15 dB
mute −80 −−dB
bass control (in 1.5 dB steps) −12 − +15 dB

treble control (in 3 dB steps) −12 − +12 dB
THD total harmonic distortion − 0.1 − %
S/N signal-to-noise ratio − 85 − dB
T

amb

ambient temperature 0 − 70 °C

GENERAL DESCRIPTION

The TDA9859 provides control facilities for the main and
the SCART channel of a TV set. Due to extended
switching possibilities, signals from three stereo sources
can be handled.

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA9859 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1
TDA9859H QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);

SOT307-2

body 10 × 10 × 1.75 mm

2001 Jul 11 2

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2001 Jul 11 3

SCART

output

LR

audio

inputs

AUX

SCART

MAIN

L

R

L

R

L

R

470 nF

470 nF

470 nF

470 nF

470 nF

470 nF

+8 V

AIN

L

AIN

R

SCIN

L

SCIN

R

MIN

L

MIN

R

V

P

28 (43)

30 (3)

1 (7)

32 (5)

3 (9)

5 (13)

6 (14)

C

SMO

SCOUTLSCOUT
26 (41) 7 (15)

MULTIPLE

SOURCE
AND MODE
SELECTOR

(CROSSBAR

SWITCH)

REFERENCE

VOLTAGE

(16)

4 (10)

AGND

100
µF

LINE output or optional

surround sound decoder

R

8

24 (38) 9 (18)
MOUT

GND

LR

connection

L

MOUT

TDA9859

(TDA9859H)

23 (37) 10 (19)
LINLLIN

R

ull pagewidth

VOLUME

CONTROL

R

STEREO

SPATIAL
STEREO

PSEUDO
STEREO

FORCED

MONO

29 (2) 27 (42)

C

PS1CPS2

extended bass control

68 nF

33 nF

C

BL1

22 (36) 21 (35)

BASS

CONTROL

11 (20) 12 (21)
C

33 nF

11 (22) 12 (21)

(1)

C

BL2

BR1CBR2

(1)

0.15 µF

5.6 nF

TREBLE

CONTROL

C

TR

(1)

MAD SDA SCL

C

TL

19 (31) 25

INTERFACE

14 (25)

5.6 nF

2

C-bus

I

(40)17(29)

2

I

C-BUS

MUTE

VOLUME

BALANCE

16 (27)

(4) 31

(30) 18

(26) 15

(8) 2

(17)

DGND

LOUT

LOUT

MHB917

P2
P1

L

L

R

R

loudspeaker

channel

outputs

BLOCK DIAGRAM

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

The pin numbers given in parenthesis refer to the TDA9859H version.
(1) For extended bass control, the capacitor between C

BR/L1

and C

Fig.1 Block diagram and application circuit.

13 kΩ

should be replaced by the extended bass control network.

BR/L2

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

PINNING

PIN

SYMBOL

DESCRIPTION

TDA9859 TDA9859H

SCIN

L

1 7 SCART input;

left channel
P1 2 8 port 1 output
MIN

L

3 9 MAIN input;

left channel
C

SMO

4 10 smoothing

capacitor of

reference voltage
n.c. − 11 not connected
n.c. − 12 not connected
MIN

R

5 13 MAIN input;

right channel
V

P

SCOUT

R

6 14 supply voltage
7 15 SCART output;

right channel
GND 8 − ground
AGND − 16 analog ground
DGND − 17 digital ground
MOUT

R

9 18 MAIN output;

right channel
LIN

R

10 19 input to right

loudspeaker

channel
C

BR1

11 20 bass capacitor

connection 1;

right channel
C

BR2

12 21 bass capacitor

connection 2;

right channel
n.c. − 22 not connected
n.c. − 23 not connected
n.c. 13 24 not connected
C

TR

14 25 treble capacitor

connection;

right channel
LOUT

R

15 26 loudspeaker output;

right channel
SCL 16 27 serial clock input;

2

I

C-bus

n.c. − 28 not connected

SYMBOL

DESCRIPTION

TDA9859 TDA9859H

SDA 17 29 serial data

input/output;
I2C-bus

PIN

LOUT

L

18 30 loudspeaker output;

left channel

C

TL

19 31 treble capacitor

connection;

left channel
n.c. 20 32 not connected
n.c. − 33 not connected
n.c. − 34 not connected
C

BL2

21 35 bass capacitor

connection 2;

left channel
C

BL1

22 36 bass capacitor

connection 1;

left channel
LIN

L

23 37 input to left

loudspeaker

channel
MOUT

L

24 38 MAIN output;

left channel
n.c. − 39 not connected
MAD 25 40 module address

select input
SCOUT

L

26 41 SCART output;

left channel
C

PS2

27 42 pseudo stereo

capacitor 2
AIN

L

28 43 AUX input;

left channel
n.c. − 44 not connected
n.c. − 1 not connected
C

PS1

29 2 pseudo stereo

capacitor 1
AIN

R

30 3 AUX input;

right channel
P2 31 4 port 2 output
SCIN

R

32 5 SCARTinput signal

RIGHT
n.c. − 6 not connected

2001 Jul 11 4

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

handbook, halfpage

SCOUT

SCIN

MIN

C

SMO

MIN

GND

MOUT

LIN

C

BR1

C

BR2

C

LOUT

SCL

P1

V

n.c.

TR

1

L

2
3

L

4
5

R

6

P

7

R

8

TDA9859

9

R

10

R

11
12
13
14
15

R

16

MHA779

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

SCIN
P2
AIN

R

C

PS1

AIN

L

C

PS2

SCOUT

MAD
MOUT

LIN

L

C

BL1

C

BL2

n.c.
C

TL

LOUT

SDA

R

L

L

L

Fig.2 Pin configuration TDA9859 SDIP32 version.

2001 Jul 11 5

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

handbook, full pagewidth

C

PS1

AIN

SCIN

SCIN

MIN

C

SMO

n.c.

P2

n.c.

P1

n.c.

AINLC
43

13

R

MIN

42

14

V

PS2

P

SCOUTLMAD
41

40

TDA9859H

15

16

R

AGND

SCOUT

n.c.
39

17

DGND

MOUTLLINLC
38

18

R

MOUT

n.c.
44

1
2
3

R

4
5

R

6
7

L

8
9

L

10
11

12
n.c.

37

19

R

LIN

BL1CBL2

36

35

20

21

BR1CBR2

C

n.c.
34

22
n.c.

33

n.c.

32

n.c.

31

C

30

LOUT

29

SDA

28

n.c.

27

SCL

26

LOUT

25

C

24

n.c.

23

n.c.

MHB918

TL

L

R

TR

Fig.3 Pin configuration TDA9859H QFP44 version.

2001 Jul 11 6

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

FUNCTIONAL DESCRIPTION

The TDA9859 consists of the following functions:

• Source select switching block

• Loudspeaker channel with effect controls

• Two port outputs for general purpose

• I2C-bus control.

Source select switching block

The TDA9859 selects and switches the input signals from
three stereo or six mono sources MAIN, AUX and SCART
(see Fig.1) to the outputs SCART and loudspeaker
(crossbar-switching; Table 4). The main channel (LINE
outputs) is looped outside the circuit (from pins MOUT

R

and MOUTL to pins LINR and LINL), so signals can be
used as LINE output or a surround sound decoder can be
inserted.

Effect controls

‘Linear stereo’, ‘stereo with spatial effect (30% or 52%
anti-phase crosstalk)’ and ‘forced mono with or without
pseudo-stereoeffect’arecontrolledbythreebits.Amuting
of 85 dB is provided.

Loudspeaker channel

Volumecontrol is divided into volume control common and
volume control left/right. The common part
(−40 to +15 dB) controls the left and right channels
simultaneously;theleft/rightpart (−23 to 0 dB) controlsthe
volume of left and right channels independently. Treble
control provides a control range from −12 to +12 dB and
bass control from −12 to +15 dB. Extended bass control
can be provided by an external T-network (see Fig.1) from

−15 to +19 dB (in 2 dB steps).

2

C-bus control

I

All control settings are stored in subaddress registers.
Data transmission is simplified by auto-incrementing the
subaddresses. The on-chip Power-on reset sets the mute
bit to active, so both the SCART and the loudspeaker
outputs are muted.

Themutingcanbeswitchedoff by writing a ‘0’(non-muted)
into the mute control bits.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

n

I

O

supply voltage (pin VP) − 010V
voltage on all pins, ground excluded − 0V

P

V

output current

at LOUT and SCOUT pins −−2.5 mA
at port output pins −−1.5 mA

P

tot

T

amb

T

stg

V

es

total power dissipation −−850 mW
ambient temperature − 070°C
storage temperature −−25 +150 °C
electrostatic handling voltage all pins; note 1 −±300 V

all pins; note 2 −±2000 V

Notes

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor (machine model).

2. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor (human body model).

2001 Jul 11 7

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

CHARACTERISTICS

V

=8V; T

P

pseudo-stereo function and forced-mono function in off position and measurements taken in Fig.1; unless otherwise
specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

P

V

ref

V

SMO

DC voltage on pins

V

I

V

O

V

C

Audio select switch; line and SCART outputs (controlled via I

V

i(rms)

R

i

B

−0.5 dB

V

o(rms)

R

L

G

v

α

cr

thermal resistance from junction to ambient in free air

TDA9859 (SDIP32) 60 K/W
TDA9859H (QFP44) 65 K/W

=25°C; treble and bass in linear positions (0 dB); volume control left/right 0 dB; spatial function,

amb

supply voltage (pin VP) 7.2 8.0 8.8 V
supply current (pin VP) − 25 − mA
internal reference voltage − 0.5V
voltage at pin C

SMO

DC input voltage at pins SCIN, MIN,

− VP− 0.1 − V

− 0.5V

P

P

− V

− V

LIN and AIN
DC output voltage at pins SCOUT,

− 0.5V

P

− V

MOUT and LOUT
DC voltage on capacitors (pins C

C

, CTR, CTL, C

BR2

and C

PS1

)

BL2

, C

BL1

, C

maximum AF input signal on
pins SCIN, MIN and AIN (RMS value)

input resistance at pins SCIN, MIN and

PS2

BR1

,

2

THD ≤ 0.5% on output
pins

− 0.5V

C-bus); see Table 4

2 −−V

20 30 40 kΩ

P

− V

AIN

−0.5 dB bandwidth for pins SCOUT,

20 − 20000 Hz

MOUT and LOUT
maximum AF output signal on

THD ≤ 0.5% 2 −−V

pins SCOUT and MOUT (RMS value)
allowed external load resistance

on output pins MOUT 10 −−kΩ
on output pins SCOUT 5 −−kΩ

voltage gain from any input to SCART

− 0 − dB

and MAIN outputs
switch crosstalk on outputs between

AF inputs

f = 10 kHz; unused inputs
connected to ground

− 90 − dB

2001 Jul 11 8

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Volume control common (f = 1 kHz, 55 steps)

V

i(rms)

maximum input signal on pins LIN
(RMS value)

R

i

G

v

input resistance on pins LIN 7.5 10 − kΩ
volume control common voltage gain

nominal −40 − +15 dB
minimum −38 − +14 dB

∆G

v

volume control common voltage
gain step width

volume control common voltage
gain set error

Volume control left/right (f = 1 kHz, 24 steps)

G

v

volume control left/right voltage gain

nominal −24 − 0dB
minimum −23 −−1dB
mute position −80 −85 − dB

∆G

v

volume control left/right voltage
gain step width

volume control left/right voltage
gain tracking error

Bass control

G

v

bass control voltage gain CB= 33 nF; f = 40 Hz

maximum boost 14 15 16 dB
maximum attenuation 11 12 13 dB

∆G

v

G

v(extended)

bass control voltage gain step width 1 1.5 2 dB
extended bass control voltage gain see Fig.1; f = 60 Hz

maximum boost 18 19 20 dB
maximum attenuation 14 15 16 dB

∆G

v(extended)

extendedbasscontrol voltage gain step
width

Treble control

G

v

treble control voltage gain f = 15 kHz

maximum boost 11 12 13 dB
maximum attenuation 11 12 13 dB

∆G

v

treble control voltage gain step width 2.5 3 3.5 dB

Effect controls

α

ct(spat1)

α

ct(spat2)

anti-phase crosstalk by spatial effect 1 − 52 − %
anti-phase crosstalk by spatial effect 2 − 30 − %

ϕ phase shift by pseudo-stereo see Fig.4

Gv= 0; THD ≤ 0.5% on

2 −−V

output pins LOUT

Gv= −32 to +15 dB 0.5 1.0 1.5 dB
G

= −40 to −33 dB 0.25 1.0 1.75 dB

v

= −32 to +15 dB −− 1dB

G

v

G

=−40 to −33 dB −− 2dB

v

0.5 1.0 1.5 dB

−− 2dB

123dB

2001 Jul 11 9

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Loudspeaker channel outputs (pins LOUTRand LOUTL)

V

o(max)(rms)

maximum output signal (RMS value) THD ≤ 0.5%; RL>10kΩ;

CL< 1.5 nF

∆V

DC(max)

maximum DC offset voltage between
adjoining step and any step to mute

R

o

R

o(L)

C

o(L)

V

no(W)

B

−1dB

for volume control G

for bass control G

for treble control G
output resistance −− 100 Ω
allowed output load resistor 10 −−kΩ
allowed output load capacitor −− 1.5 nF
weighted noise voltage at output

(quasi-peak level)

−1 dB bandwidth for loudspeaker

= 0 to +15 dB/mute − 215mV

v

G

=−64 to 0 dB/mute − 0.5 10 mV

v

= 0 to +15 dB/mute − 215mV

v

=−12 to 0 dB/mute − 0.5 10 mV

G

v

= −12 to +12 dB/mute − 0.5 10 mV

v

CCIR 468-3 weighted

G

= +15 dB − 102 −µV

v

G

=0dB − 32 −µV

v

=−40 dB − 27 −µV

G

v

G

=−80 dB (mute) − 20 −µV

v

channel

THD total harmonic distortion f = 20 to 12500 Hz

α

cs(l-r)

for V

for V

for V
stereo channel separation f = 10 kHz; Gv= 0 dB;

= 0.2 V Gv= −30 to +15 dB − 0.1 0.3 %

i(rms)

=1V Gv=−30 to 0 dB − 0.1 0.3 %

i(rms)

=2V Gv=−30 to −6dB − 0.1 0.3 %

i(rms)

opposite input grounded
by 1 kΩ resistor

G

α

ct(bus)

crosstalk from I2C-bus to AF outputs

V

α

bus

=

20 log

bus(p-p)

-------------------- ­V

o(rms)

=0dB − 100 − dB

v

2 −−V

20 − 20000 Hz

− 75 − dB

(V

= spurious I2C-bus signal voltage

bus

on AF output)

PSRR

100

power supply ripple rejection with
100 Hz ripple

Gv= 0 dB;
V

ripple(rms)

SCART output (pins SCOUTRand SCOUTL)

V

o(max)(rms)

R

o(L)

maximum output signal (RMS value) THD ≤ 0.5%; RL>5kΩ 2 −−V
output load resistor 5 −−kΩ

Power-on reset

V

PONR

increasing supply voltage start of reset −− 2.5 V

end of reset 5.2 6.0 6.8 V

decreasing supply voltage start of reset 4.4 5.2 6.0 V

2001 Jul 11 10

− 55 − dB

< 200 mV

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I2C-bus (pins SCL and SDA)

V
V
I
V

IH
IL

I

ACK

HIGH-level input voltage 3 − V
LOW-level input voltage 0 − 1.5 V
input current −− ±10 µA
output voltage with acknowledge at

pin SDA

Module address (pin MAD)

V

IL

V

IH

LOW-level input voltage 0 − 1.5 V
HIGH-level input voltage 3 − V

Port outputs (open-collector outputs pins P1 and P2)

V

OL

I

O(sink)

LOW-level output voltage I
port output sink current −− 1mA

I

= −3mA −− 0.4 V

SDA

=1mA −− 0.3 V

O(sink)

P

P

V

V

2001 Jul 11 11

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

I2C-BUS PROTOCOL

This circuit operates as a slave receiver only. For more information about the I2C-bus, see

it”

, order number 9398 393 40011.

2

C-bus format

I

S SLAVE ADDRESS

W A SUBADDRESS A DATA

“The I2C-bus and how to use

(1)

(1)

A

Note

1. Multiple DATA-A (acknowledge) sequences may occur.

2

Table 1 Explanation of I

C-bus format

NAME DESCRIPTION

S START condition (SCL HIGH, SDA HIGH-to-LOW)
SLAVE ADDRESS 100 0000 (MAD = LOW) or 100 0001 (MAD = HIGH)
W0
A acknowledge (SDA = LOW); generated by the device
SUBADDRESS subaddress (byte); see Table 2

(1)

DATA

data byte; see Table 2

P STOP condition (SCL = HIGH, SDA = LOW-to-HIGH)

Note

1. If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed by the device.

P

2

Table 2 I

C-bus transmission

SUBADDRESS DATA BITS

FUNCTION

BINARY HEX D7 D6 D5 D4 D3 D2 D1 D0

Loudspeaker channel

Volume control common 0000 0000 00 0 0 V05 V04 V03 V02 V01 V00
Volume control left 0000 0001 01 0 0 0 VL4 VL3 VL2 VL1 VL0
Volume control right 0000 0010 02 0 0 0 VR4 VR3 VR2 VR1 VR0
Bass control 0000 0011 03 0 0 0 BA4 BA3 BA2 BA1 BA0
Treble control 0000 0100 04 0 0 0 0 TR3 TR2 TR1 TR0

Switching control byte

SCART output

(1)

0000 1000 08 0 MU1 P1 P2 I13 I12 I11 I10

Loudspeaker output 0000 1001 09 EF2 MU2 EF1 ST I23 I22 I21 I20

Note

1. If auto-increment of the subaddress is used, it is necessary to insert three dummy data words between the treble
control byte and the switching control bytes.

2001 Jul 11 12

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

Table 3 Function of the bits in Table 2

BITS FUNCTION

V00 to V05 volume control common for loudspeaker channel; see Table 9
VL0 to VL4 volume control for left loudspeaker channel; see Table 6
VR0 to VR4 volume control for right loudspeaker channel; see Table 6
BA0 to BA4 bass control for left and right loudspeaker channels; see Table 7
TR0 to TR3 treble control for left and right loudspeaker channels; see Table 8
I10 to I13 input selection for SCART channels; see Table 4
I20 to I23 input selection for loudspeaker channels; see Table 4
MU1 and MU2 mute control bits (MU1 for SCART channel, MU2 for loudspeaker channel)

0 = channel not muted

1 = channel muted
EF1, EF2 and ST effect control bits for loudspeaker channel; see Table 5
P1 and P2 control bits for ports P1 and P2

control bit = 0: port output = LOW-level

control bit = 1: port output = HIGH-level

Table 4 Input selection

BITS OF DATA BYTE 8 AND 9

INPUT

HEX D7 D6 D5 D4 D3 D2 D1 D0

AUX LEFT XB
AUX RIGHT X9
AUX STEREO X7
SCART LEFT XA
SCART RIGHT X5
SCART STEREO X6
MAIN LEFT XC
MAIN RIGHT XD
MAIN STEREO X8

(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)

(1) (1)
(1) (1)

(1) (1)

MU
MU
MU
MU
MU
MU
MU
MU
MU

(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)
(1) (1)

1011
1001
0111
1010
0101
0110
1100
1101
1000

Note

1. Byte 8 (SCART channels): The value of X depends on MU1 and control bits P1 and P2.
Byte 9 (loudspeaker channels): see Table 5 for the programming of these bits. The value of X depends on the
selected effects and MU2.

2001 Jul 11 13

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

Table 5 Effect controls

SETTING SPECIAL EFFECTS

DATA BYTE TO SUBADDRESS 09

HEX EF2 MU2 EF1 ST I23 I22 I21 I20

Stereo with spatial effect 1 (52%) BX
Stereo with spatial effect 2 (30%) 3X
Stereo without spatial effect 1X
Forced mono with pseudo stereo 2X
Forced mono without pseudo stereo 0X

(1)
(1)
(1)
(1)
(1)

1011
0011
0001
0010
0000

Note

1. The value of X depends on the selected input (see Table 4).

Table 6 Volume control left/right Table 7 Bass control

DATA BITS

G

v

(dB)

HEX

VL4 VL3 VL2 VL1 VL0
VR4 VR3 VR2 VR1 VR0

01F1 1 1 1 1

−11E 1 1 1 1 0

−21D 1 1 1 0 1

−31C 1 1 1 0 0

−41B 1 1 0 1 1

−51A 1 1 0 1 0

−619 1 1 0 0 1

−718 1 1 0 0 0

−817 1 0 1 1 1

−916 1 0 1 1 0

−10 15 1 0 1 0 1

−11 14 1 0 1 0 0

−12 13 1 0 0 1 1

−13 12 1 0 0 1 0

−14 11 1 0 0 0 1

−15 10 1 0 0 0 0

−16 0F 0 1 1 1 1

−17 0E 0 1 1 1 0

−18 0D 0 1 1 0 1

G

v

(dB)

HEX BA4 BA3 BA2 BA1 BA0

[phone]

+13.5 18 1 1 0 0 0

[phone]

+10.5 16 1 0 1 1 0

[phone]

+7.5 14 1 0 1 0 0

[phone]

+4.5 12 1 0 0 1 0

[phone]

+1.5 10 1 0 0 0 0

00F0 1 1 1 1
00E0 1 1 1 0

−1.5 0D 0 1 1 0 1

−30C 0 1 1 0 0

−4.5 0B 0 1 0 1 1

−60A 0 1 0 1 0

−7.5 09 0 1 0 0 1

−908 0 1 0 0 0

−10.5 07 0 0 1 1 1

−12 06 0 0 1 1 0

−19 0C 0 1 1 0 0

−20 0B 0 1 0 1 1

−21 0A 0 1 0 1 0

−22 09 0 1 0 0 1

−23 08 0 1 0 0 0

Mute 07 0 0 1 1 1

(1) (1) (1) (1)
(1) (1) (1) (1)
(1) (1) (1) (1)
(1) (1) (1) (1)
(1) (1) (1) (1)

DATA BITS

2001 Jul 11 14

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

Table 8 Treble control

G

v

(dB)

HEX 0 TR3 TR2 TR1 TR0

DATA BITS

+12 0A 0 1 0 1 0

[phone]
[phone]
[phone]

0060 0 1 1 0

−305 0 0 1 0 1

−604 0 0 1 0 0

−903 0 0 0 1 1

−12 02 0 0 0 1 0

Table 9 Volume control common

G

v

(dB)

HEX V05 V04 V03 V02 V01 V00

DATA BITS

+153F111111
+143E111110
+133D111101
+123C111100
+113B111011
+103A111010

[phone]
[phone]
[phone]
[phone]
[phone]
[phone]
[phone]
[phone]
[phone]

030110000

−12F101111

−22E101110

−32D101101

−42C101100

−52B101011

−62A101010

G

v

(dB)

HEX V05 V04 V03 V02 V01 V00

DATA BITS

−729101001

−828101000

−927100111

−1026100110

−1125100101

−1224100100

−1323100011

−1422100010

−1521100001

−1620100000

−171F011111

−181E011110

−191D011101

−201C011100

−211B011011

−221A011010

−2319011001

−2418011000

−2517010111

−2616010110

−2715010101

−2814010100

−2913010011

−3012010010

−3111010001

−3210010000

−330F001111

−340E001110

−350D001101

−360C001100

−370B001011

−380A001010

−3909001001

−4008001000

2001 Jul 11 15

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

phase

(degree)

0

handbook, full pagewidth

−100

−200

−300

−400

10

(1) Normal effect; C
(2) Intensified effect; C
(3) More intensified effect; C

PS1=CPS2

= 47 nF; C

PS1

=15nF.

= 68 nF; C

PS1

10

PS2

(1)

(2)

(3)

2

= 5.6 nF.

= 5.6 nF.

PS2

MHA311

3

10

4

10

f (Hz)

5

10

Fig.4 Pseudo stereo effect (phase) as a function of frequency.

2001 Jul 11 16

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

PACKAGE OUTLINES

SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)

SOT232-1

seating plane

L

Z

32

1

pin 1 index

D

A

2

A

A

1

e

b

w M

b

1

17

E

16

c

M

(e )

M

E

1

H

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

mm

OUTLINE
VERSION

SOT232-1

max.

4.7 0.51 3.8

12

min.

max.

IEC JEDEC EIAJ

1.3

0.8

b

1

0.53

0.40

REFERENCES

0.32

0.23

cEe M

(1) (1)

D

29.4

28.5

2001 Jul 11 17

9.1

8.7

L

3.2

2.8

EUROPEAN

PROJECTION

M

10.7

10.2

E

12.2

10.5

e

1

w

H

0.181.778 10.16

ISSUE DATE

92-11-17
95-02-04

max.

1.6

(1)

Z

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

c

y

X

A

33 23

34

pin 1 index

44

1

22

Z

E

e

H

E

E

w M

b

p

12

11

A

2

A

A

1

detail X

SOT307-2

(A )

3

θ

L

p

L

w M

b

e

p

D

H

D

Z

D

B

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.10

0.25

0.05

1.85

1.65

0.25

0.40

0.20

0.25

0.14

UNIT A1A2A3bpcE

(1)

(1) (1)(1)

D

10.1

9.9

eH

10.1

9.9

12.9

0.8 1.3

12.3

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT307-2

2001 Jul 11 18

v M

H

v M

D

A

B

E

12.9

12.3

LL

p

0.95

0.55

0.15 0.10.15

EUROPEAN

PROJECTION

Z

D

1.2

0.8

Zywv θ

E

1.2

0.8

o

10

o

0

ISSUE DATE

95-02-04
97-08-01

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

SOLDERING
Introduction

Thistextgivesaverybriefinsighttoa complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-holeandsurfacemount components are mixedon
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

stg(max)

). If the

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.

WAVE SOLDERING
Conventional single wave soldering is not recommended

forsurfacemountdevices(SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackageswithleadsonfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

MANUAL SOLDERING
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.

2001 Jul 11 19

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable

WAVE REFLOW

(2)

− suitable

(1)

DIPPING

Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

not suitable

(3)

suitable −

HTSSOP, HVQFN, SMS

(4)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

, SO, SOJ suitable suitable −

(4)(5)

suitable −

(6)

suitable −

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2001 Jul 11 20

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective specification Development This data sheet contains data from the objective specification for product

Preliminary specification Qualification This data sheet contains data from the preliminary specification.

Product specification Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyotherconditionsabovethosegiveninthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyoftheseproducts, conveys no licence or title
under any patent, copyright, or mask work right to these
products,andmakesnorepresentationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2001 Jul 11 21

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

PURCHASE OF PHILIPS I2C COMPONENTS

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C components conveys a license under the Philips’ I2C patent to use the

2001 Jul 11 22

Philips Semiconductors Product specification

Universal hi-fi audio processor for TV TDA9859

NOTES

2001 Jul 11 23

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,

Tel: [phone], Fax: [phone]
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PTPhilips DevelopmentCorporation, SemiconductorsDivision,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS,Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable andmaybechanged
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2001

Internet: http://www.semiconductors.philips.com

72

Printed in The Netherlands 753504/03/pp24 Date of release: 2001 Jul 11 Document order number: 9397 750 08551