Datasheet TDA2653A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA2653A

Vertical deflection circuit

Product specification
File under Integrated Circuits, IC02

January 1991

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

DESCRIPTION

The TDA2653A is a monolithic integrated circuit for vertical deflection in large screen colour television receivers.
The circuit incorporates the following functions:

• Oscillator; switch capability for 50 Hz/60 Hz operation

• Synchronization circuit

• Blanking pulse generator with guard circuit

• Sawtooth generator with buffer stage

• Preamplifier with fed-out inputs

• Output stage with thermal and short-circuit protection

• Flyback generator

• Voltage stabilizers

QUICK REFERENCE DATA

Supply voltage (pin 9) V
Supply current (pin 5 + pin 9)
Output current (peak-to-peak value)

(1)

(1)

Maximum output current (peak-to-peak value) I

9-8=VS

I5+ I9=I
I

6(p-p)
6(p-p)

S

typ. 26 V
typ. 325 mA
typ. 1,7 A

max. 2,6 A
Picture frequency f 50 Hz/60 Hz
Sync input pulse (peak-to-peak value) V
Thermal resistance from junction to mounting base R

2-8(p-p)
th j-mb

≥ 1 V

≤ 5 K/W

Note

1. for 45 AX systems

PACKAGE OUTLINE

13-lead SIL; plastic power (SOT141RGA); SOT141-6; 1996 November 19.

January 1991 2

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

(1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz.

Fig.1 Block diagram.

January 1991 3

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 9) V
Supply voltage output stage (pin 5) V

Voltages

Pin 3 V
Pin 13 V
Pins 4 and 10 V
Pin 6 v

Pins 7 and 11 V

Currents

Pin 1 I

Pin 2 ±I
Pin 3 I

Pin 7 I

Pin 11 I

Pin 12 I

Pins 5, 6 and 8: internally limited by the short-circuit protection circuit.
Total power dissipation: internally limited by the thermal protection circuit.
Storage temperature range T
Operating ambient temperature range T

9−8
5-8

3−11
13-8
4; 10-8

6-8

−V

7; 11−8

1

−I

1
2

3

−I

3

7

−I

7

11

−I

11

12

−I

12

stg
amb

6−8

= V

S

max. 40 V
max. 60 V

max. 7 V
max. 7 V
max. 24 V
max. 60 V
max. 0 V
max. 40 V

max. 0 mA
max. 1 mA
max. 10 mA
max. 0 mA
max. 5 mA
max. 1,3 A
max. 1,5 A
max. 50 mA
max. 1 mA
max. 3 mA
max. 0 mA

−25 to + 150 °C

0 °C to limiting value

January 1991 4

Fig.2 Total power dissipation.

R

includes R

th h-a

th mb-h

which is expected when heat­sink compound is used.
R

th j−mb

≤ 5 K/W.

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

CHARACTERISTICS

= 25 °C unless otherwise specified.

T

amb

Supply voltage/output stage

Supply voltage V

9-8

= V

S

Output voltage

at −I6 = 1,1 A

at I

= 1,1 A

6

Flyback generator output voltage at −I7 = 1,1 A V
Peak output current ±I
Flyback generator peak current ±I

V

6-8

V

6-8

7-8

6
7

≥ V
typ. V
typ. 1,3 V
≤ 1,6 V
typ. VS− 2,2 V

≤ 1,3 A
≤ 1,3 A

Feedback

Input quiescent current −I

4; 10

typ. 0,1 µA

Synchronization

Sync input pulse V

2-8

Tracking range typ. 28 %

9 to 30 V

− 2,2 V

5-8

− 1,9 V

5-8

1 to 12 V

Oscillator/sawtooth generator

Oscillator frequency control input voltage V
Sawtooth generator output voltage V

Sawtooth generator output current −I

Oscillator temperature dependency

T

= 20 to 100 °C(∆f/f)/∆T

case

Oscillator voltage dependency

V

= 10 to 30 V (∆f/f)/∆V

S

Blanking pulse generator

Output voltage

at V

= 24 V; I2= 1 mA V

S

Output current −I
Output resistance R
Blanking pulse duration at 50 Hz sync t

50 Hz/60 Hz switch capability

Saturation voltage; LOW voltage level V
Output leakage current I

Thermal resistance/junction temperature

From junction to mounting base R
Junction temperature; switching point thermal protection T

1-8
3-8

V

11-8

3

I

11

2−8

2

2−8

b

12−8

12

th j-mb
j

case

S

6 to 9 V
0 to VS− 1V
0 to VS− 2V
0 to 4 mA

≥−2µA
≤+30 mA

typ. 10

-4

typ. 4 x 10

-4

-1

K

-1

V

typ. 18,5 V
≤ 3mA
typ. 410 Ω
typ. 1,4 ± 0,07 ms

typ. 1 V
typ. 1 µA

≤ 5 K/W
typ. 150 ± 8 °C

January 1991 5

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

PINNING

1. Oscillator adjustment

2. Synchronization input/blanking output

3. Sawtooth generator output

4. Preamplifier input

5. Positive supply of output stage

6. Output

7. Flyback generator output

8. Ground

9. Positive supply (VS)

10. Reference voltage

11. Sawtooth capacitor

12. 50 Hz/ 60 Hz switching voltage

13. Oscillator capacitor

January 1991 6

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

APPLICATION INFORMATION
The function is described against the corresponding pin number

1, 13. Oscillator

The oscillator frequency is determined by a potentiometer at pin 1 and a capacitor at pin 13.

2. Sync input/blanking output

Combination of sync input and blanking output. The oscillator has to be synchronized by a positive-going
pulse between 1 and 12 V. The integrated frequency detector delivers a switching level at pin 12.
The blanking pulse amplitude is 20 V with a load of 1 mA.

3. Sawtooth generator output

The sawtooth signal is fed via a buffer stage to pin 3. It delivers the signal which is used for linearity control,
and drive of the preamplifier. The sawtooth is applied via a shaping network to pin 11 (linearity) and via a
resistor to pin 4 (preamplifier).

4. Preamplifier input

The DC voltage is proportional to the output voltage (DC feedback). The AC voltage is proportional to the
sum of the buffered sawtooth voltage at pin 3 and the voltage, with opposite polarity, at the feedback
resistor (AC feedback).

5. Positive supply of output stage

This supply is obtained from the flyback generator. An electrolytic capacitor between pins 7 and 5, and a
diode between pins 5 and 9 have to be connected for proper operation of the flyback generator.

6. Output of class-B power stage

The vertical deflection coil is connected to this pin, via a series connection of a coupling capacitor and a
feedback resistor, to ground.

7. Flyback generator output

An electrolytic capacitor has to be connected between pins 7 and 5 to complete the flyback generator.

8. Negative supply (ground)

Negative supply of output stage and small signal part.

9. Positive supply

The supply voltage at this pin is used to supply the flyback generator, voltage stabilizer, blanking pulse
generator and buffer stage.

10. Reference voltage of preamplifier

External adjustment and decoupling of reference voltage of the preamplifier.

11. Sawtooth capacitor

This sawtooth capacitor has been split to realize linearity control.

12. 50 Hz/60 Hz switching level

This pin delivers a LOW voltage level for 50 Hz and a HIGH voltage level for 60 Hz. The amplitudes of the
sawtooth signals can be made equal for 50 Hz and 60 Hz with these levels.

January 1991 7

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

(1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz.

Fig.3 Typical vertical deflection circuit for 45AX system (26 V).

January 1991 8

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

(1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz.

Fig.4 Typical vertical deflection circuit for 45 AX system (VS1= 26 V, VS2= 12 V) in quasi-bridge connection.

January 1991 9

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

PACKAGE OUTLINE

DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)

non-concave

x

D

E

h

view B: mounting base side

d

B

j

A

SOT141-6

D

h

2

E

A

113

e

Z

DIMENSIONS (mm are the original dimensions)

UNIT A e

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

SOT141-6

A2bpcD

17.0

4.6

4.2

0.75

0.60

15.5

1

e

(1)

deD

0.48

24.0

23.6

20.0

19.6

0.38

IEC JEDEC EIAJ

b

p

h

10 3.4

w M

0 5 10 mm

(1)

E

12.2

11.8

REFERENCES

scale

1

1.7

e

5.08

L

3

L

E

2

h

6

Q

c

m

LL3m

3.4

12.4

3.1

11.0

e

2

2.4

1.6

PROJECTION

Qj

2.1

4.3

1.8

EUROPEAN

v M

v

0.8

x

0.25w0.03

ISSUE DATE

92-11-17
95-03-11

(1)

Z

2.00

1.45

January 1991 10

Philips Semiconductors Product specification

Vertical deflection circuit TDA2653A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

January 1991 11