TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSII)
SSM3J14T
SSM3J14T
Power Management Switch
DC-DC Converters
· Suitable for high-density mounting due to compact package
· Low on Resistance : R
: R
· High-speed switching
Maximum Ratings
Characteristics Symbol Rating Unit
Drain-Source voltage V
Gate-Source voltage V
Drain current
Drain power dissipation
Channel temperature T
Storage temperature range T
= 145 mΩ (max) (@VGS = −4.5 V)
on
= 85 mΩ (max) (@VGS = −10 V)
on
(Ta ==== 25°C)
DC I
Pulse
DS
GSS
D
I
DP
(Note 2)
PD t = 10 s1.25
(Note 1)0.7
ch
stg
-55 to 150 °C
-30
±20
-2.7
-5.4
150 °C
V
V
A
W
Unit: mm
JEDEC ―
JEITA ―
TOSHIBA 2-3S1A
Note 1: Mounted on FR4 board
(25.4 mm ´ 25.4 mm ´ 1.6 t, Cu pad: 645 mm
Note 2: The pulse width limited by maximum channel temperature.
2
)
Weight: 10 mg (typ.)
Marking Equivalent Circuit
3
KDL
1 2
3
12
Handling Precaution
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other
objects that come into direct contact with devices should be made of anti-static materials.
The Channel-to-Ambient thermal resistance R
board material, board area, board thickness and pad area, and are also affected by the environment in which the
product is used. When using this device, please take heat dissipation fully into account
th (ch-a)
and the drain power dissipation PD vary according to the
1
2002-04-17
Page 2
SSM3J14T
V
Electrical Characteristics
Characteristic Symbol Test Condition Min Typ. MaxUnit
Gate leakage current I
Drain-source breakdown voltage
Drain cut-off current I
Gate threshold voltage Vth VDS = -5 V, ID = -0.1 mA -0.8 ¾ -2.0V
Forward transfer admittance |Yfs| VDS = -5 V, ID = -1.35 A (Note 3) 2.0
Drain-source on resistance R
Input capacitance C
Reverse transfer capacitance C
Output capacitance C
Switching time
Turn-on time ton ¾ 29 ¾
Turn-off time t
(Ta ==== 25°C)
V
V
VGS =±16 V, VDS = 0 ¾¾±1 mA
GSS
(BR) DSSID
(BR) DSXID
DSS
DS (ON)
VDS = -15 V, VGS = 0, f = 1 MHz ¾ 413 ¾ pF
iss
VDS = -15 V, VGS = 0, f = 1 MHz ¾ 77 ¾ pF
rss
oss
off
= -1 mA, VGS = 0 -30 ¾ ¾ V
= -1 mA, VGS = 20 V -15 ¾ ¾ V
VDS = -30 V, VGS = 0 ¾ ¾ -1 mA
¾
ID = -1.35 A, VGS = -10 V (Note 3) ¾ 63 85
ID = -1.35 A, VGS = -4.5 V (Note 3) ¾ 106 145
I
= -1.35 A, VGS = -4.0 V (Note 3) ¾ 120 170
D
VDS = -15 V, VGS = 0, f = 1 MHz ¾ 113 ¾ pF
= -15 V, ID = -1 A
V
DD
= 0~-4 V, RG = 10 W
V
GS
¾ 29 ¾
¾ S
Note 3: Pulse test
mW
ns
Switching Time Test Circuit
(a) Test circuit
0
-4
10 ms
IN
VDD = -10 V
OUT
R
= 4.7 W
G
D.U.<1%
V
IN
Common source
Ta = 25°C
G
R
V
DD
: tr, tf < 5 ns
(b) VIN
(c) V
OUT
0 V
-4 V
V
DS (ON)
V
DD
10%
90%
10%
tr t
ton t
Precaution
Vth can be expressed as voltage between gate and source when low operating current value is ID = -100 mA
for this product. For normal switching operation, V
requires lower voltage than V
(relationship can be established as follows: V
th
.
GS (off)
Please take this into consideration for using the device.
V
recommended voltage of -4 V or higher to turn on this product.
GS
requires higher voltage than Vth and V
GS (on)
< Vth < V
GS (on)
)
90%
f
off
GS (off)
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2002-04-17
Page 3
SSM3J14T
-6
-5 V -10 V
-4
(A)
D
-2
Drain current I
0
0 -0.5 -1 -1.5 -2
Drain-source voltage VDS (V)
300
Drain-Source on resistance
Common source
Ta = 25°C
250
200
(mW)
150
DS (ON)
100
R
50
0
0 -1 -2 -3 -4 -5 -6 -7
Drain current ID (A)
300
(mW)
DS (ON)
R
Common source
ID = -1.35 A
250
200
150
100
50
0
-25
0 25 15050 75 100 125
Ambient temperature Ta (°C)
Drain-Source on resistance
I
D
R
DS (ON)
R
DS (ON)
– VDS
-3.5 V -4 V
–ID
VGS = -4 V
– Ta
VGS = -4 V
Common source
Ta = 25°C
-3 V
VGS = -2.5V
-4.5 V
-10 V
-4.5 V
-10 V
– VGS
I
100°C
D
-25°C
Ta = 25°C
-3 -4 -2
-10000
Common source
VDS = -5 V
-1000
-100
(mA)
D
-10
-1
Drain current I
-0.1
-0.01
0
-1
Gate-source voltage VGS (V)
1000
R
(mW)
100
DS (ON)
R
Drain-Source on resistance
10
0 -5
Gate-source voltage VGS (V)
– VGS
DS (ON)
Common source
ID = -1.35 A
25°C
-10 -15 -20
Ta = 100°C
-25°C
|Y
| – ID
fs
10
3
1
| (S)
fs
0.3
|Y
0.1
Forward transfer admittance
0.03
-0.01
Drain current ID (A)
Common source
VDS = -5 V
Ta = 25°C
-10-1 -0.1
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2002-04-17
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SSM3J14T
-1.8
-1.6
-1.4
(V)
th
-1.2
-1.0
-0.8
-0.6
-0.4
Gate threshold voltage V
-0.2
0
-25 1500
25 50 75 100 125
Ambient temperature Ta (°C)
V
– Ta
th
Common source
VDS = -5 V
ID = -0.1 mA
1000
300
100
30
Switching time t (ns)
10
tf
ton
3
-0.01 -10-1 -0.1
Drain current ID (A)
t – I
D
Common source
VDD = -15 V
VGS = 0~-4 V
Ta = 25°C
RG = 10 W
t
off
tr
-10
-8
(V)
GS
-6
-4
Dynamic input characteristic
Common source
ID = -2.7 A
Ta = 25°C
-12 V
VDD = -24 V
-2
Gate-source voltage V
0
0 2 4 6 10 12 8
Total gate charge Qg (nC)
DS
Common source
VGS = 0
f = 1 MHz
Ta = 25°C
Capacitance C (pF)
700
600
500
400
300
200
100
C – V
0
0
-5-15-25
Drain-source voltage VDS (V)
– VDS
I
DR
D
(A)
DR
-3
Common source
VGS = 0
Ta = 25°C
-2
G
S
-1
Drain reverse current I
0
0 0.2 0.4 0.6 0.8 1
Drain-source voltage VDS (V)
– Ta
P
1.5
t = 10 s
(W)
D
1
DC
0.5
Drain power dissipation P
0
0 50 100 150 200
Ambient temperature Ta (°C)
D
Mounted on FR4 board
(25.4 mm ´ 25.4 mm ´ 1.6 t,
Cu Pad: 645 mm2)
Ciss
Coss
Crss
-35-10-20 -30
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2002-04-17
Page 5
SSM3J14T
300
Single pulse
Mounted on FR4 board
100
(25.4 mm ´ 25.4 mm ´ 1.6 t,
Cu Pad: 645 mm2)
30
(°C /W)
10
th
r
3
Transient thermal impedance
1
Pulse width tw (s)
r
th
– tw
1000 0.001 0.01 0.1 1 100 10
-10
ID max (pulse)
ID max (continuous)
-3
Safe operating area
-1
(A)
D
Drain current I
DC operation
Ta = 25°C
-0.3
Mounted on FR4 board
(25.4 mm ´ 25.4 mm ´ 1.6 t,
-0.1
Cu Pad: 645 mm2)
*: Single pulse
Ta = 25°C
-0.03
Curves must be derated
linearly with increase in
temperature.
-0.01
-0.1
-0.3 -1 -3 -10 -30 -100
Drain-source voltage VDS (V)
10 s*
10 ms*
1 ms*
V
DSS
max
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SSM3J14T
A
RESTRICTIONS ON PRODUCT USE
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
· The information contained herein is subject to change without notice.
000707EA
6
2002-04-17
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