Datasheet MPC931FA, MPC930FA Datasheet (Motorola)

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SEMICONDUCTOR TECHNICAL DATA
1
REV 3
Motorola, Inc. 1997
1/97
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The MPC930/931 is a 3.3V compatible, PLL based clock driver device targeted for high performance clock applications. With output frequencies of up to 150MHz and output skews of 300ps the MPC930/931 is ideal for the most demanding clock distribution designs. The device employs a fully differential PLL design to minimize cycle to cycle and long term jitter. This parameter is of significant importance when the clock driver is providing the reference clock for PLL’ s on board todays microprocessors and ASiC’s. The device offers 6 low skew outputs, and a choice between internal or external feedback. The feedback option adds to the flexibility of the device, providing numerous input to output frequency relationships.
On–Board Crystal Oscillator (MPC930)
Differential LVPECL Reference Input (MPC931)
Fully Integrated PLL
Output Shut Down Mode
Output Frequency up to 150MHz
Compatible with PowerPC and Intel Microprocessors
32–Lead TQFP Packaging
Power Down Mode
±100ps Typical Cycle–to–Cycle Jitter
The MPC930 and MPC931 are very similar in basic functionality, but there are some minor differences. The MPC931 has been optimized for use as a zero delay buffer . In addition to tighter specification limits on the phase offset of the device, a higher speed VCO has been used on the MPC931. The MPC930, on the other hand, is more optimized for use as a clock generator. When choosing between the 930 and 931, pay special attention to the differences in the AC parameters of each device.
The MPC930/931 offers two power saving features for power conscious portable or “green” designs. The power down pin will seemlessly reduce all of the clock rates by one half so that the system will run at half the potential clock rate to extend battery life. The POWER_DN pin is synchronized internally to the slowest output clock rate. This allows the transition in and out of the power–down mode to be output glitch free. In addition, the shut down control pins will turn off various combinations of clock outputs while leaving a subset active to allow for total processor shut down while maintaining system monitors to “wake up” the system when signaled. During shut down, the PLL will remain locked, if internal feedback is used, so that wake up time will be minimized. The shut down and power down pins can be combined for the ultimate in power savings. The Shut_Dn pins are synchronized to the clock internal to the chip to eliminate the possibility of generating runt pulses.
The MPC930/931 devices offer a great deal of flexibility in what is used as the PLL reference. The MPC930 offers an integrated crystal oscillator that allows for an inexpensive crystal to be used as the frequency reference. For more information on the crystal oscillator please refer to the applications section of this data sheet. In those applications where the 930/931 will be used to regenerate clocks from an existing source or as a zero delay buffer , alternative reference clock inputs are provided. Both devices offer an LVCMOS input that can be used as the PLL reference. In addition the MPC931 replaces the crystal oscillator inputs with a differential PECL reference clock input that allows the device to be used in mixed technology clock distribution trees.
An internal feedback divide by 8 of the VCO frequency is compared with the input reference provided by the on–board crystal oscillator when the internal feedback is selected. The on–board crystal oscillator requires no external components other than a series resonant crystal (see Applications Information section for more on crystals). The internal VCO is running at 8x the input reference clock. The outputs can be configured to run at 4x, 2x, 1.25x or 0.66x the input reference frequency. If the external feedback is selected, one of the MPC931’s outputs must be connected to the Ext_FB pin. Using the external feedback, numerous input/output frequency relationships can be developed.
The MPC930/931 is fully 3.3V compatible and requires no external loop filter components. All control inputs accept LVCMOS or LVTTL compatible levels while the outputs provide LVCMOS levels with the capability to drive terminated 50 transmission lines. For series terminated applications, each output can drive two 50 transmission lines, effectively increasing the fanout to 1:12. The device is packaged in a 32–lead TQFP package to provide the optimum combination of board density and cost.
PowerPC is a trademark of International Business Machines Corporation. Pentium is a trademark of Intel Corporation.
 
LOW VOLTAGE
PLL CLOCK DRIVER
FA SUFFIX
32–LEAD TQFP PACKAGE
CASE 873A–02
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MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
2
÷2÷4÷2÷4÷4
÷6
FUNCTION TABLES
TCLK_Sel Reference
0 1
xtal (PECL_CLK) TCLK
PLL_En PLL Status
0 1
Test Mode PLL Enabled
ExtFB_Sel Reference
0 1
Int. ÷8 Ext_FB
GNDO
Qa1 Qa0
VCCO
Div_Sela Div_Selb Div_Selc
NC
GNDO Qc1 Qc0 VCCO Ext_FB Shut_Dn1 Shut_Dn0 NC
GNDO
Qb0
Qb1
VCCO
ExtFB_Sel
TCLK_Sel
PLL_En
NC
NC
PLL_VCC
Power_Dn
TCLK
MR/Tristate
xtal1 (930)
xtal2 (930)
GNDI
25 26 27 28 29 30 31 32
15 14 13 12 11 10
9
12345678
24 23 22 21 20 19 18 17
16
MPC930/
MPC931
Power_Dn PLL Status
0 1
VCO/1 VCO/2
Div_Sela,b,c
0 1
Qa Qb Qc
Shut_Dn1
0 0 1 1
Div_Seln
Qb & Qc Low, Qa Toggle Qa & Qb Low, Qc Toggle Qb Low, Qa & Qc Toggle All Toggle
Shut_Dn0
0 1 0 1
Figure 1. 32–Lead Pinout (Top View)
PECL_CLK (931)
PECL_CLK (931)
Figure 2. Logic Diagram
POWER–ON RESET
VCO
PHASE
DETECTOR
LPF
÷
8
MR/Tristate
xtal
OSC
Shut_Dn1
Shut_Dn0
xtal2
xtal1
PLL_En
Qa0
Qb0 Qb1
Power_Dn
÷2/÷
4
÷2/÷
4
÷4/÷
6
Qc0 Qc1
DISABLE
LOGIC
Div_Selb
Div_Sela
Qa1
TCLK
TCLK_Sel
Ext_FB
ExtFB_Sel
Div_Selc
MPC930
PECL_CLK
PECL_CLK
MPC931
MR/Tristate PLL Status
0 1
Disabled Enabled
(Pullup) (Pullup)
(Pulldown) (Pullup)
(Pullup) (Pulldown) (Pulldown)
(Pulldown) (Pullup)
(Pullup) (Pulldown)
(Pullup)
(Pullup) (None)
÷
2
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MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
3 MOTOROLA
Figure 3. Power_Dn Timing Diagram
VCO
Figure 4. Shut_Dn Timing Diagram
Qa
Qb
Qc
SHUT_DN0
SHUT_DN1
Qa (÷2)
Qb (÷4)
Qc (
÷
6)
SHUT_DN0
SHUT_DN1
VCO/2
Power_Dn
Qa (÷2)
Qb (÷4)
Qc (÷6)
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MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
4
ABSOLUTE MAXIMUM RATINGS*
Symbol Parameter Min Max Unit
V
CC
Supply Voltage –0.3 4.6 V
V
I
Input Voltage –0.3 VDD + 0.3 V
I
IN
Input Current ±20 mA
T
Stor
Storage Temperature Range –40 125 °C
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
PLL INPUT REFERENCE CHARACTERISTICS (TA = 0 to 70°C)
Symbol Characteristic Min Max Unit Condition
tr, t
f
TCLK Input Rise/Falls 3.0 ns
f
ref
Reference Input Frequency 10 Note 1. MHz
f
refDC
Reference Input Duty Cycle 25 75 %
1. Maximum input reference frequency is limited by the VCO lock range and the feedback divider.
DC CHARACTERISTICS (TA = 0° to 70°C, VCC = 3.3V ±5%)
Symbol Characteristic Min Typ Max Unit Condition
V
IH
Input HIGH Voltage 2.0 3.6 V
V
IL
Input LOW Voltage 0.8 V
V
OH
Output HIGH Voltage 2.4 V IOH = –20mA (Note 2.)
V
OL
Output LOW Voltage 0.5 V IOL = 20mA (Note 2.)
I
IN
Input Current ±120 µA Note 3.
I
CC
Maximum Core Supply Current 65 85 mA
I
CCPLL
Maximum PLL Supply Current 15 20 mA
C
IN
4 pF
C
pd
25 pF Per Output
2. The MPC930/931 outputs can drive series or parallel terminated 50 (or 50 to VCC/2) transmission lines on the incident edge (see Applications
Info section).
3. Inputs have pull–up/pull–down resistors which affect input current.
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MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
5 MOTOROLA
MPC930 AC CHARACTERISTICS (TA = 0° to 70°C, VCC = 3.3V ±5%)
Symbol Characteristic Min Typ Max Unit Condition
f
xtal
Crystal Oscillator Frequency Range 10 20 MHz Note 5., Note 7.
f
ref
Input Reference Frequency Note 7. Note 7. MHz Ref = TCLK
t
os
Output–to–Output Skew Same Frequency (Note 4.) Diff Frequency
Same Frequency
Diff Frequency
200 300 300 450
300 400 400 600
ps f
max
100MHz
f
max
100MHz
f
max
> 100MHz
f
max
> 100MHz
f
VCO
VCO Lock Range Power_Dn = 0
Power_Dn = 1
100
50
280 140
MHz
f
max
Maximum Output Frequency Qa, Qb (÷2)
Qa, Qb, Qc (÷4)
Qc (÷6)
140
80 47
MHz Note 4.
t
pd
TCLK to EXT_FB Delay –600 –100 400 ps f
ref
= 50MHz, FB = ÷4
t
pw
Output Duty Cycle (Note 4.) t
CYCLE
/2
–750
t
CYCLE
/2
±500
t
CYCLE
/2
+750
ps
tr, t
f
Output Rise/Fall Time (Note 4.) 0.1 1.0 ns 0.8 to 2.0V
t
PLZ
, t
PHZ
Output Disable Time 2.0 8.0 ns 50 to VCC/2
t
PZL
Output Enable Time 2.0 10 ns 50 to VCC/2
t
jitter
Cycle–to–Cycle Jitter (Peak–to–Peak) ±100 ps Note 6.
t
lock
Maximum PLL Lock Time 10 ms
4. Measured with 50 to VCC/2 termination.
5. See Applications Info section for more Crystal specifications.
6. See Applications Info section for more jitter information.
7. Input reference frequency is bounded by VCO lock range and feedback divide selection.
MPC931 AC CHARACTERISTICS (TA = 0° to 70°C, VCC = 3.3V ±5%)
Symbol Characteristic Min Typ Max Unit Condition
f
ref
Input Reference Frequency Note 11. Note 11. MHz
t
os
Output–to–Output Skew Same Frequency (Note 8.) Diff Frequency
Same Frequency
Diff Frequency
200 300 300 450
300 400 400 600
ps f
max
100MHz
f
max
100MHz
f
max
> 100MHz
f
max
> 100MHz
f
VCO
VCO Lock Range Power_Dn = 0
Power_Dn = 1
200 100
480 240
MHz
f
max
Maximum Output Frequency Qa, Qb (÷2)
Qa, Qb, Qc (÷4)
Qc (÷6)
150 120
80
MHz Note 9.
t
pd
Reference to EXT_FB Average Delay TCLK
PECL_CLK
–150 –400
0
–250
+150 –100
ps f
ref
= 50MHz; FB = ÷8;
Note 12.
t
pw
Output Duty Cycle (Note 8.) t
CYCLE
/2
–750
t
CYCLE
/2
±500
t
CYCLE
/2
+750
ps
tr, t
f
Output Rise/Fall Time (Note 8.) 0.1 1.0 ns 0.8 to 2.0V
t
PLZ
, t
PHZ
Output Disable Time 2.0 8.0 ns 50 to VCC/2
t
PZL
Output Enable Time 2.0 10 ns 50 to VCC/2
t
jitter
Cycle–to–Cycle Jitter (Peak–to–Peak) ±100 ps Note 10.
t
lock
Maximum PLL Lock Time 10 ms
8. Measured with 50 to VCC/2 termination.
9. f
max
limited by skew spec. Outputs will generate valid CMOS signals up to 180MHz.
10.See Applications Info section for more jitter information.
11.Input reference frequency is bounded by VCO lock range and feedback divide selection.
12.tpd is specified for 50MHz input reference, the window will shrink/grow proportionally from the minimum limit with shorter/linger reference
periods. The tpd does not include jitter.
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MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
6
APPLICATIONS INFORMATION
Programming the MPC930/931
The MPC930/931 clock driver outputs can be configured into several frequency relationships, in addition the external feedback option allows for a great deal of flexibility in establishing unique input to output frequency relationships. The output dividers for the three output groups allows the user to configure the outputs into 1:1, 2:1, 3:1, 3:2 and 3:2:1 frequency ratios. The use of even dividers ensures that the output duty cycle is always 50%. Table 1 illustrates the various output configurations, the table describes the outputs using the VCO frequency as a reference. As an example for a 3:2:1 relationship the Qa outputs would be set at VCO/2, the Qb’s at VCO/4 and the Qc’s at VCO/6. These settings will provide output frequencies with a 3:2:1 relationship.
The division settings establish the output relationship, but one must still ensure that the VCO will be stable given the frequency of the outputs desired. The VCO lock range can be found in the specification tables. The feedback frequency and the Power_Dn pin can be used to situate the VCO into a frequency range in which the PLL will be stable. The design of the PLL is such that for output frequencies between 25 and 180MHz the MPC930/931 can generally be configured into a stable region.
The relationship between the input reference and the output frequency is also very flexible. Table 2 shows the multiplication factors between the inputs and outputs when the internal feedback option is used. For external feedback Table 1 can be used to determine the multiplication factor, there are too many potential combinations to tabularize the external feedback condition. Figure 5 through Figure 10 illustrates several programming possibilities, although not exhaustive it is representative of the potential applications.
Table 1. Programmable Output Frequency Relationships
(Power_Dn = ‘0’)
INPUTS OUTPUTS
Div_Sela Div_Selb Div_Selc Qa Qb Qc
0 0 0 VCO/2 VCO/2 VCO/4 0 0 1 VCO/2 VCO/2 VCO/6 0 1 0 VCO/2 VCO/4 VCO/4 0 1 1 VCO/2 VCO/4 VCO/6 1 0 0 VCO/4 VCO/2 VCO/4 1 0 1 VCO/4 VCO/2 VCO/6 1 1 0 VCO/4 VCO/4 VCO/4 1 1 1 VCO/4 VCO/4 VCO/6
Table 2. Input Reference/Output Frequency Relationships (Internal Feedback Only)
INPUTS OUTPUTS
Qa Qb Qc
Div_Sela Div_Selb Div_Selc Power_Dn=0 Power_Dn=1 Power_Dn=0 Power_Dn=1 Power_Dn=0 Power_Dn=1
0 0 0 4x 2x 4x 2x 2x x 0 0 1 4x 2x 4x 2x 4/3x 2/3x 0 1 0 4x 2x 2x x 2x x 0 1 1 4x 2x 2x x 4/3x 2/3x 1 0 0 2x x 4x 2x 2x x 1 0 1 2x x 4x 2x 4/3x 2/3x 1 1 0 2x x 2x x 2x x 1 1 1 2x x 2x x 4/3x 2/3x
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MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
7 MOTOROLA
MPC930
Figure 5. Dual Frequency Configuration
Div_Sela‘0’ Div_Selb‘1’ Div_Selc‘0’ ExtFB_Sel‘0’
Input Ref16.66MHz
66.66MHz (Processor)Qa
33.33MHz (PCI)Qb
33.33MHz (PCI)Qc
2
2
2
MPC930
Figure 6. Single Frequency Configuration
Div_Sela‘1’ Div_Selb‘1’ Div_Selc‘0’ ExtFB_Sel‘0’
Input Ref16.66MHz
33.33MHzQa
33.33MHzQb
33.33MHzQc
2
2
2
MPC931
Figure 7. “Zero” Delay Fractional Multiplier
Div_Sela‘1’ Div_Selb‘1’ Div_Selc‘1’ ExtFB_Sel‘1’
Input Ref33.33MHz
50MHzQa
50MHzQb
33.33MHzQc
2
2
2
Figure 8. “Zero” Delay Fractional Divider
Ext_FB
1
MPC931
Div_Sela‘0’ Div_Selb‘1’ Div_Selc‘1’ ExtFB_Sel‘1’
Input Ref50MHz
100MHzQa
50MHzQb
33.33MHzQc
2
2
2
Ext_FB
1
MPC931
Figure 9. “Zero” Delay Multiply by 3 (50% Duty Cycle)
Div_Sela‘0’ Div_Selb‘0’ Div_Selc‘1’ ExtFB_Sel‘1’
Input Ref33.33MHz
100MHzQa
100MHzQb
33.33MHzQc
2
2
2
Figure 10. “Zero” Delay Divide by 3 (50% Duty Cycle)
Ext_FB
1
MPC931
Div_Sela‘0’ Div_Selb‘0’ Div_Selc‘1’ ExtFB_Sel‘1’
Input Ref100MHz
100MHzQa
100MHzQb
33.33MHzQc
2
2
2
Ext_FB
1
Using the MPC930/931 as a Zero Delay Buffer
The external feedback option of the MPC930/931 clock driver allows for its use as a zero delay buffer . By using one of the outputs as a feedback to the PLL the propagation delay through the device is eliminated. The PLL works to align the output edge with the input reference edge thus producing a near zero delay. The Tpd of the device is specified in the specification tables. For zero delay buffer applications, the MPC931 is recommended over the MPC930. The MPC931 has been optimized and specified specifically for use as a zero delay buffer.
When used as a zero delay buffer the MPC930/931 will likely be in a nested clock tree application. For these applications the MPC931 offers a LVPECL clock input as a
PLL reference. This allows the user to use LVPECL as the primary clock distribution device to take advantage of its far superior skew performance. The MPC931 then can lock onto the LVPECL reference and translate with near zero delay to low skew LVCMOS outputs. Clock trees implemented in this fashion will show significantly tighter skews than trees developed from CMOS fanout buffers.
To minimize part–to–part skew the external feedback option again should be used. The PLL in the MPC931 decouples the delay of the device from the propagation delay variations of the internal gates. From the specification table one sees a Tpd variation of only ±150ps, thus for multiple devices under identical configurations the part–to–part skew will be around 850ps (300ps for Tpd variation plus 300ps
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MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
8
output–to–output skew plus 250ps jitter). For devices that are configured differently the differences between the nominal delays must also be accounted for.
When using the MPC931 as a zero delay buffer there is more information which can help minimize the overall timing uncertainty. To fully minimize the specified uncertainty, it is crucial that the relative position of the outputs be known. It is recommended that if all of the outputs are going to be used that the Qc0 output be used as the feedback reference. The Qc0 output lies in the middle of the other outputs with respect to output skew. Therefore it can be assumed that the output to output skew of the device is ±150ps with respect to output Qc0.
There will be some cases where only a subset of the outputs of the MPC931 are required. There is significantly tighter skew performance between outputs on a common bank (i.e., Qa0 to Qa1). The skews between these common bank outputs are outlined in the table below. In general the skews between outputs on a given bank is about a third of the skew between all banks, reducing the skew to a value of 100ps.
Table 3. Within–Bank Skews
Outputs Relative Skews
Qa0 Qa1 +35ps, ±50ps Qb0 Qb1 –30ps, ±50ps Qc0 Qc1 20ps, ±50ps
Jitter Performance of the MPC930/931
With the clock rates of today’s digital systems continuing to increase more emphasis is being placed on clock distribution design and management. Among the issues being addressed is system clock jitter and how that affects the overall system timing budget. The MPC930/931 was designed to minimize clock jitter by employing a differential bipolar PLL as well as incorporating numerous power and ground pins in the design. The following few paragraphs will outline the jitter performance of the MPC930/931, illustrate the measurement limitations and provide guidelines to minimize the jitter of the device.
The most commonly specified jitter parameter is cycle–to–cycle jitter. Unfortunately with today’s high performance measurement equipment there is no way to measure this parameter for jitter performance in the class demonstrated by the MPC930/931. As a result different methods are used which approximate cycle–to–cycle jitter. The typical method of measuring the jitter is to accumulate a large number of cycles, create a histogram of the edge placements and record peak–to–peak as well as standard deviations of the jitter. Care must be taken that the measured edge is the edge immediately following the trigger edge. If this is not the case the measurement inaccuracy will add significantly to the measured jitter. The oscilloscope cannot collect adjacent pulses, rather it collects data from a very large sample of pulses. It is safe to assume that collecting pulse information in this mode will produce jitter values somewhat larger than if consecutive cycles were measured, therefore, this measurement will represent an upper bound of cycle–to–cycle jitter. Most likely, this is a conservative estimate of the cycle–to–cycle jitter.
1212
12
Peak–to–Peak PLL Jitter
Peak–to–Peak Period Jitter
Figure 11. PLL Jitter and Edge Displacement
1232
12
123
3
Peak–to–Peak PLL Jitter
Peak–to–Peak Period Jitter
There are two sources of jitter in a PLL based clock driver, the commonly known random jitter of the PLL and the less intuitive jitter caused by synchronous, different frequency outputs switching. For the case where all of the outputs are switching at the same frequency the total jitter is exactly equal to the PLL jitter. In a device, like the MPC930/931, where a number of the outputs can be switching synchronously but at different frequencies a “multi–modal” jitter distribution can be seen on the highest frequency outputs. Because the output being monitored is affected by the activity on the other outputs it is important to consider what is happening on those other outputs. From Figure 11, one can see for each rising edge on the higher frequency signal the activity on the lower frequency signal is not constant. The activity on the other outputs tends to alter the internal thresholds of the device such that the placement of the edge being monitored is displaced in time. Because the signals are synchronous the relationship is periodic and the resulting jitter is a compilation of the PLL jitter superimposed on the displaced edges. When histograms are plotted the jitter looks like a “multi–modal” distribution as pictured in Figure 11 on page 8. Depending on the size of the PLL jitter and the relative displacement of the edges the “multi–modal” distribution will appear truly “multi–modal” or simply like a “fat” Gaussian distribution. Again note that in the case where
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MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
9 MOTOROLA
all the outputs are switching at the same frequency there is no edge displacement and the jitter is reduced to that of the PLL.
Figure 12 graphically represents the PLL jitter of the MPC930/931. The data was taken for several different output configurations. Because of the relatively few outputs on the MPC930/931, the multimodal distribution is of a second order affect on the 930/931 and can be ignored. As one can see in the figure the PLL jitter is much less dependent on output configuration than on internal VCO frequency . However , for a given VCO frequency, a lower output frequency produces more jitter.
Figure 12. RMS Jitter versus VCO Frequency
(Qa0 Output)
10
15
20
25
30
35
40
45
80 120 160 200 240 280
Conf 1 Conf 2
Conf 1 = Qa=÷2, Qb=Qc=÷4 Conf 2 = Qa=
÷
2, Qb=Qc=Shut Down
Conf 3 = Qa=
÷
4, Qb=Qc=Shut Down
VCO Frequency (MHz)
RMS Jitter (ps)
Figure 13. RMS Jitter versus Output Frequency
(Qa0 Output)
10
15
20
25
30
35
20 40 60 80 100 120 140
Frequency Output (MHz)
RMS Jitter (ps)
Conf 2 = Qa=÷2, Qb=Qc=Shut Down Conf 3 = Qa=
÷
4, Qb=Qc=Shut Down
Conf 3
Conf 2 Conf 3
Finally from the data there are some general guidelines that, if followed, will minimize the output jitter of the device. First and foremost always configure the device such that the VCO runs as fast as possible. This is by far the most critical parameter in minimizing jitter. Second keep the reference frequency as high as possible. More frequent updates at the phase detector will help to reduce jitter. Note that if there is a tradeoff between higher reference frequencies and higher
VCO frequency always chose the higher VCO frequency to minimize jitter. The third guideline is to try to shut down outputs that are unused. Minimizing the number of switching outputs will minimize output jitter.
Power Supply Filtering
The MPC930/931 is a mixed analog/digital product and as such it exhibits some sensitivities that would not necessarily be seen on a fully digital product. Analog circuitry is naturally susceptible to random noise, especially if this noise is seen on the power supply pins. The MPC930/931 provides separate power supplies for the output buffers (V
CCO
) and the internal PLL (PLL_VCC) of the device. The purpose of this design technique is to try and isolate the high switching noise digital outputs from the relatively sensitive internal analog phase–locked loop. In a controlled environment such as an evaluation board this level of isolation is sufficient. However, in a digital system environment where it is more difficult to minimize noise on the power supplies a second level of isolation may be required. The simplest form of isolation is a power supply filter on the PLL_VCC pin for the MPC930/931.
Figure 14. Power Supply Filter
PLL_VCC
VCC
MPC930/931
0.01µF
22
µ
F
0.01
µ
F
3.3V
RS=10–15
Figure 14 illustrates a typical power supply filter scheme. The MPC930/931 is most susceptible to noise with spectral content in the 1KHz to 1MHz range. Therefore the filter should be designed to target this range. The key parameter that needs to be met in the final filter design is the DC voltage drop that will be seen between the VCC supply and the PLL_VCC pin of the MPC930/931. From the data sheet the I
PLL_VCC
current (the current sourced through the PLL_VCC pin) is typically 15mA (20mA maximum), assuming that a minimum of 3.0V must be maintained on the PLL_VCC pin very little DC voltage drop can be tolerated when a 3.3V V
CC
supply is used. The resistor shown in Figure 14 must have a resistance of 10–15 to meet the voltage drop criteria. The RC filter pictured will provide a broadband filter with approximately 100:1 attenuation for noise whose spectral content is above 20KHz. As the noise frequency crosses the series resonant point of an individual capacitor it’s overall impedance begins to look inductive and thus increases with increasing frequency. The parallel capacitor combination shown ensures that a low impedance path to ground exists for frequencies well above the bandwidth of the PLL.
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MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
10
Although the MPC930/931 has several design features to minimize the susceptibility to power supply noise (isolated power and grounds and fully differential PLL) there still may be applications in which overall performance is being degraded due to system power supply noise. The power supply filter schemes discussed in this section should be adequate to eliminate power supply noise related problems in most designs.
Using the Power Management Features of the MPC930/931
The MPC930/931 clock driver offers two different features that designers can take advantage of for managing power dissipation in their designs. The first feature allows the user to turn off outputs which drive portions of the system which may go idle in a sleep mode. The Shut_Dn pins allow for three different combinations of output shut down schemes. The schemes are summarized in the function tables in the data sheet. The MPC930/931 synchronizes the shut down signals internal to the chip and applies them in a manner which eliminates the possibility of creating runt pulse on the outputs. The device waits for the output to go into the “LOW” state prior to disabling. When the outputs are re–enabled the device waits and re–enables the output such that the transition is synchronous and in the proper phase relationship to the outputs which remained active.
The Power_Dn pin offers another means of implementing power management schemes into a design. To use this feature the device must be set up in its normal operating mode with the Power_Dn pin “LOW”, in addition the user must use the internal feedback option. If the external feedback option were used the output frequency reduction would change the feedback frequency and the PLL will lose lock. When the Power_Dn pin is driven “HIGH” the MPC930/931 synchronizes the signal to the internal clock and then seemlessly reduces the frequency of the outputs by one half. The Power_Dn signal is synchronized to the slowest internal VCO clock. It waits until both VCO clocks are in the “LOW” state and then switches from the nominal speed VCO clock to the half speed VCO clock. This will in turn cause the current output pulse to stretch to reflect the reduction in output frequency. When the Power_Dn pin is brought back “LOW” the device will again wait until both of the VCO clocks are “LOW” and then switch to the nominal VCO clock. This will cause the current output pulses, and all successive pulses, to shrink to match the higher output frequency. Both the power up and power down features are illustrated in the timing diagrams of in this data sheet.
Timing diagrams for both of the power management features are shown in Figure 3 and Figure 4 on page 3.
Using the On–Board Crystal Oscillator
The MPC930 features an on–board crystal oscillator to allow for seed clock generation as well as final distribution. The on–board oscillator is completely self contained so that the only external component required is the crystal. As the oscillator is somewhat sensitive to loading on its inputs the
user is advised to mount the crystal as close to the MPC930/931 as possible to avoid any board level parasitics. To facilitate co–location surface mount crystals are recommended, but not required.
The oscillator circuit is a series resonant circuit as opposed to the more common parallel resonant circuit, this eliminates the need for large on–board capacitors. Because the design is a series resonant design for the optimum frequency accuracy a series resonant crystal should be used (see specification table below). Unfortunately most off the shelf crystals are characterized in a parallel resonant mode. However a parallel resonant crystal is physically no different than a series resonant crystal, a parallel resonant crystal is simply a crystal which has been characterized in its parallel resonant mode. Therefore in the majority of cases a parallel specified crystal can be used with the MPC930 with just a minor frequency error due to the actual series resonant frequency of the parallel resonant specified crystal. Typically a parallel specified crystal used in a series resonant mode will exhibit an oscillatory frequency a few hundred ppm lower than the specified value. For most processor implement– ations a few hundred ppm translates into kHz inaccuracies, a level which does not represent a major issue.
Table 4. Crystal Specifications
Parameter Value
Crystal Cut Fundamental AT Cut Resonance Series Resonance* Frequency Tolerance ±75ppm at 25°C Frequency/Temperature Stability ±150pm 0 to 70°C Operating Range 0 to 70°C Shunt Capacitance 5–7pF Equivalent Series Resistance (ESR) 50 to 80 Max Correlation Drive Level 100µW Aging 5ppm/Yr (First 3 Y ears)
* See accompanying text for series versus parallel resonant
discussion.
The MPC930 is a clock driver which was designed to generate outputs with programmable frequency relationships and not a synthesizer with a fixed input frequency. As a result the crystal input frequency is a function of the desired output frequency. For a design which utilizes the external feedback to the PLL the selection of the crystal frequency is straight forward; simply chose a crystal which is equal in frequency to the fed back signal. To determine the crystal required to produce the desired output frequency for an application which utilizes internal feedback the block diagram of Figure 15 should be used. The P and the M values for the MPC930/931 are also included in Figure 15. The M values can be found in the configuration tables included in this applications section.
Page 11
MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
11 MOTOROLA
Figure 15. PLL Block Diagram
f
ref
Phase
Detector
QnVCO
LPF
÷
P
÷
N
÷
m
N
f
ref
+
fQn · N · P
m
f
ref
+
f
VCO
m
,f
VCO
+
fQn·N·P
m = 8 P = 1 (Power_Dn=‘0’), 2 (Power_Dn=‘1’)
For the MPC930 clock driver, the following will provide an example of how to determine the crystal frequency required for a given design.
Given:
Qa = 66.6MHz Qb = 33.3MHz Qc = 22.2MHz Power_Dn = ‘0’
f
ref
+
fQn · N · P
m
From Table 4
fQc = VCO/6 then N = 6
From Figure 15
m = 8 and P = 1
f
ref
+
22.22 · 6 · 1 8
+
16.66MHz
Driving Transmission Lines
The MPC930/931 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum flexibility to the user the output drivers were designed to exhibit the lowest impedance possible. With an output impedance of less than 10 the drivers can drive either parallel or series terminated transmission lines. For more information on transmission lines the reader is referred to application note AN1091 in the Timing Solutions brochure (BR1333/D).
In most high performance clock networks point–to–point distribution of signals is the method of choice. In a point–to–point scheme either series terminated or parallel terminated transmission lines can be used. The parallel technique terminates the signal at the end of the line with a 50 resistance to VCC/2. This technique draws a fairly high level of DC current and thus only a single terminated line can
be driven by each output of the MPC930/931 clock driver. For the series terminated case however there is no DC current draw, thus the outputs can drive multiple series terminated lines. Figure 16 illustrates an output driving a single series terminated line vs two series terminated lines in parallel. When taken to its extreme the fanout of the MPC930/931 clock driver is effectively doubled due to its capability to drive multiple lines.
Figure 16. Single versus Dual Transmission Lines
7
IN
MPC930/931
OUTPUT BUFFER
RS = 43
ZO = 50
OutA
7
IN
MPC930/931
OUTPUT
BUFFER
RS = 43
ZO = 50
OutB0
RS = 43
ZO = 50
OutB1
The waveform plots of Figure 17 show the simulation results of an output driving a single line vs two lines. In both cases the drive capability of the MPC930/931 output buffers is more than sufficient to drive 50 transmission lines on the incident edge. Note from the delay measurements in the simulations a delta of only 43ps exists between the two differently loaded outputs. This suggests that the dual line driving need not be used exclusively to maintain the tight output–to–output skew of the MPC930/931. The output waveform in Figure 17 shows a step in the waveform, this step is caused by the impedance mismatch seen looking into the driver. The parallel combination of the 43 series resistor plus the output impedance does not match the parallel combination of the line impedances. The voltage wave launched down the two lines will equal:
VL = VS ( Zo / (Rs + Ro +Zo))
Zo = 50 || 50 Rs = 43 || 43 Ro = 7
VL = 3.0 (25 / (21.5 + 7 + 25) = 3.0 (25 / 53.5) = 1.40V
At the load end the voltage will double, due to the near unity reflection coefficient, to 2.8V. It will then increment towards the quiescent 3.0V in steps separated by one round trip delay (in this case 4.0ns).
Page 12
MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
12
Figure 17. Single versus Dual Waveforms
TIME (nS)
VOLTAGE (V)
3.0
2.5
2.0
1.5
1.0
0.5
0
2 4 6 8 10 12 14
OutB
tD = 3.9386
OutA
tD = 3.8956
In
Since this step is well above the threshold region it will not cause any false clock triggering, however designers may be uncomfortable with unwanted reflections on the line. To
better match the impedances when driving multiple lines the situation in Figure 18 should be used. In this case the series terminating resistors are reduced such that when the parallel combination is added to the output buffer impedance the line impedance is perfectly matched.
Figure 18. Optimized Dual Line Termination
7
MPC930/931
OUTPUT BUFFER
RS = 36
ZO = 50
RS = 36
ZO = 50
7 + 36 k 36 = 50 k 50
25 = 25
SPICE level output buffer models are available for engineers who want to simulate their specific interconnect schemes. In addition IV characteristics are in the process of being generated to support the other board level simulators in general use.
Page 13
MPC930 MPC931
TIMING SOLUTIONS BR1333 — Rev 6
13 MOTOROLA
OUTLINE DIMENSIONS
FA SUFFIX
TQFP PACKAGE
CASE 873A–02
ISSUE A
DETAIL Y
A
S1
VB
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
N
J
DF
METAL
SECTION AE–AE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250 (0.010)
GAUGE PLANE
E
C
H
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION.
DIMAMIN MAX MIN MAX
INCHES
7.000 BSC 0.276 BSC
MILLIMETERS
B 7.000 BSC 0.276 BSC C 1.400 1.600 0.055 0.063
D 0.300 0.450 0.012 0.018 E 1.350 1.450 0.053 0.057 F 0.300 0.400 0.012 0.016 G 0.800 BSC 0.031 BSC H 0.050 0.150 0.002 0.006 J 0.090 0.200 0.004 0.008 K 0.500 0.700 0.020 0.028 M 12 REF 12 REF N 0.090 0.160 0.004 0.006 P 0.400 BSC 0.016 BSC Q 1 5 1 5 R 0.150 0.250 0.006 0.010
V 9.000 BSC 0.354 BSC
V1 4.500 BSC 0.177 BSC
__
____
DETAIL AD
A1
B1
V1
4X
S
4X
B1 3.500 BSC 0.138 BSC
A1 3.500 BSC 0.138 BSC
S 9.000 BSC 0.354 BSC
S1 4.500 BSC 0.177 BSC
W 0.200 REF 0.008 REF
X 1.000 REF 0.039 REF
9
–T–
–Z–
–U–
T–U0.20 (0.008) ZAC
T–U0.20 (0.008) ZAB
0.10 (0.004) AC
–AC–
–AB–
M
_
8X
–T–, –U–, –Z–
T–U
M
0.20 (0.008) ZAC
Page 14
MPC930 MPC931
MOTOROLA TIMING SOLUTIONS
BR1333 — Rev 6
14
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MPC930/D
*MPC930/D*
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