Datasheet HSC2240 Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

HSC2240

NPN EPITAXIAL PLANAR TRANSISTOR

Description

Low noise audio amplifier applications

Spec. No. : HE6529
Issued Date : 1992.12.16
Revised Date : 2002.10.09
Page No. : 1/4

Absolute Maximum Ratings

• Maximum Temperatures

Stor age Temperature............................................................................................ -55 ~ +150 °C

Junction Temperature...................................................................................... 150 °C Maximum

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)................................................................................ 625 mW

• Maximum Voltages and Currents (Ta=25°C)

VCBO Collector to Base Voltage....................................................................................... 150 V

VCEO Collector to Emitter Voltage.................................................................................... 150 V

BVEBO Emitter to Base Voltage............................................................................................ 5 V

IC Collector Current ....................................................................................................... 100 mA

TO-92

Characteristics (Ta=25°C)

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO 150 - - V IC=100uA, IE=0
BVCEO 150 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0

ICBO - - 100 nA VCB=120V, IE=0
IEBO - - 100 nA VEB=5V, IC=0

*VCE(sat) - - 300 mV IB=1mA, IC=10mA

VBE(on) 500 - 800 mV IC=2mA, VCE=6V

*hFE 120 - 400 VCE=6V, IC=2mA

fT - 100 - MHz VCE=6V, IC=1mA, f=100MHz

Cob - 3 - pF VCB=10V , f=1M H z

*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%

Classification of hFE

Rank Y GR

Range 120-240 200-400

HSC2240 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : HE6529
Issued Date : 1992.12.16
Revised Date : 2002.10.09
Page No. : 2/4

1000

125oC

25oC

75oC

100

hFE

hFE @ VCE=6V

10

1 10 100 1000

Collector Current- IC (mA)

ON Voltage & C ollector Current

1000

25oC

Current Gain & Collector Current

1000

Sat urati on Voltage & Collector Curren t

75oC

100

Satur ation Voltage ( m V)

10

0.1 1 10 100 1000

1000

125oC

25oC

Collector Current- IC (mA)

Cutoff Frequency & IC

CE(sat)

V

@ IC=10I

B

125oC

ON Voltage ( m V)

100

0.1 1 10 100 1000

Collector Current- IC (mA)

75oC

BE(ON)

V

@ VCE=6V

Capacitance & Rev erse-Biased Voltage

100

10

Capacitance (pF)

Cob

100

Cutoff Frequency (MHz)...

10

1 10 100 1000

10000

1000

(mA)

C

Collector Curr ent - I

PT=1ms
PT=100ms

PT=1s

100

10

VCE=6V

Collector Current (mA)

Sa fe Op erating Area

1

0.1 1 10 100 1000

Reverse Biased Volt age (V)

1

1 10 100 1000

Forwar d Voltage-VCE (V)

HSC2240 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6529
Issued Date : 1992.12.16
Revised Date : 2002.10.09
Page No. : 3/4

700

600

500

400

300

200

Power Dissipation-PD (mW)

100

0

0 50 100 150 200

Ambient Temper ature- Ta (oC)

PD-Ta

HSC2240 HSMC Product Specification

HI-SINCERITY

g

A

MICROELECTRONICS CORP.

TO-92 Dimension

Spec. No. : HE6529
Issued Date : 1992.12.16
Revised Date : 2002.10.09
Page No. : 4/4

A

α2

B

31

2

Marking:

HC

S

224

0

Date Code Control Code

Rank

α3

C

D

H

I

α1

G

Style: Pin 1.Emitter 2.Collector 3.Base

E

DIM

F

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.

3-Lead TO-92 Plastic Package

HSMC Packa

e Code:

DIM

*: Typical

Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54

C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56

E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

α1
α2
α3

-

-

-

*5°
*2°
*2°

-

-

-

*5°
*2°
*2°

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

HSC2240 HSMC Product Specification