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HIN202
Datasheet (Intersil Corporation)
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Datasheet (intersil)
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Datasheet HIN202, HIN206, HIN207, HIN208, HIN211 Datasheet (intersil)

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Page 1
查询HIN202CB供应商
®
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Data Sheet September 2003
+5V Powered RS-232 Transmitters/Receivers with
0.1Microfarad External Capacitors
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply The family of devices offers a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table).
The HIN206, HIN211 and HIN213 feature a low power shutdown mode to conserve energy in battery powered applications. In addition, the HIN213 provides two active receivers in shutdown mode allowing for easy “wakeup” capability.
The drivers feature true TTL /CMOS input compatibility, slew rate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V input, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection.
Applications
FN3980.15
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1µF or Greater External Capacitors
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
- ±10V Output Swing for +5V lnput
-300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
-30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Improve Noise Rejection
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
NUMBER OF
NUMBER OF
PART
NUMBER
HIN202 +5V 2 2 4 Capacitors No/No 0 HIN206 +5V 4 3 4 Capacitors Yes/Yes 0 HIN207 +5V 5 3 4 Capacitors No/No 0 HIN208 5V 4 4 4 Capacitors No/No 0 HIN211 +5V 4 5 4 Capacitors Yes/Yes 0 HIN213 +5V 4 5 4 Capacitors Yes/Yes 2
POWER SUPPLY
VOLTAGE
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
0.1µF
EXTERNAL
CAPACITORS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
RECEIVERS
ACTIVE IN
SHUTDOWN
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved.
Page 2
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Ordering Information
TEMP.
PART NO.
HIN202CB 0 to 70 16 Ld SOIC (W) M16.3 HIN202CB-T 0 to 70 16 Ld SOIC (W)
HIN202CBN 0 to 70 16 Ld SOIC (N) M16.15 HIN202CBN-T 0 to 70 16 Ld SOIC (N)
HIN202CP 0 to 70 16 Ld PDIP E16.3 HIN202IB -40 to 85 16 Ld SOIC (W) M16.3 HIN202IBN -40 to 85 16 Ld SOIC (N) M16.15 HIN206CB 0 to 70 24 Ld SOIC M24.3 HIN207CA 0 to 70 24 Ld SSOP M24.209 HIN207CB 0 to 70 24 Ld SOIC M24.3
RANGE (oC) PACKAGE
Tape and Reel
Tape and Reel
PKG.
DWG. #
M16.3
M16.15
Ordering Information (Continued)
TEMP.
o
PART NO.
HIN207CB-T 0 to 70 24 Ld SOIC
HIN208CB 0 to 70 24 Ld SOIC M24.3 HIN208CB-T 0 to 70 24 Ld SOIC
HIN211CA 0 to 70 28 Ld SSOP M28.209 HIN211CA-T 0 to 70 28 Ld SSOP
HIN211CB 0 to 70 28 Ld SOIC M28.3 HIN211CB-T 0 to 70 28 Ld SOIC
HIN213CA 0 to 70 28 Ld SSOP M28.209 HIN213CA-T 0 to 70 28 Ld SSOP
RANGE (
C) PACKAGE
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Pin Descriptions
PIN FUNCTION
V
V+ Internally generated positive supply (+10V nominal).
V- Internally generated negative supply (-10V nominal).
GND Ground Lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead. T
T
OUT
R
R
OUT
EN SD, SD
NC No Connect. No connections are made to these leads.
Power Supply Input 5V ±10%, (5V ±5% HIN207).
CC
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to V
IN
Transmitter Outputs. These are RS-232 levels (nominally ±10V). Receiver Inputs. These inputs accept RS-232 input levels. An interna l 5kΩ pull-down resistor to GND is connected to each input.
IN
Receiver Outputs. These are TTL/CMOS levels.
, EN Receiver enable Input. With EN = 5V (HIN213 EN = 0V), the receiver outputs are placed in a high impedance state.
Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state (except R4 and R5 of HIN213) and the transmitters are shut off.
is connected to each lead.
CC
PKG.
DWG. #
M24.3
M24.3
M28.209
M28.3
M28.209
2
Page 3
Pinouts
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
HIN202 (PDIP, SOIC)
TOP VIEW
HIN206 (SOIC)
TOP VIEW
R1
R2
0.1µF
0.1µF
T1
T2
OUT
OUT
1
T3
16
V
CC
15
GND
14
T1
OUT
13
R1
IN
12
R1
OUT
11
T1
IN
10
T2
IN
9
R2
OUT
T2
C1+
C2+
OUT
R2
V+
C1-
C2-
V-
1 2 3 4 5 6 7 8
IN
+5V
16
V
1
C1+
+
3 4
+
5
11
IN
10
IN
VOLTAGE INVERTER
C1­C2+
VOLTAGE INVERTER
C2-
+5V
400kΩ
+5V
400kΩ
CC
+5V TO 10V
+10V TO -10V
T1
T2
R1
R2
5kΩ
5kΩ
V+
V-
0.1µF
+
2
6
0.1µF
+
14
7
1312
89
T1
T2
R1
R2
OUT
OUT
IN
IN
GND
15
0.1µF
0.1µF
R1
R2
R3
T1
T2
T3
T4
OUT
OUT
OUT
IN
IN
IN
IN
EN
OUT
2
T1
OUT
3
T2
OUT
4
R1
IN
OUT
T2 T1
GND
V
CC
C1+
V+
C1-
5 6
IN
7
IN
8
9 10 11 12
R1
+5V
10
C1+
+
12
C1-
13
C2+
+
14
C2­+5V
400kΩ
7
+5V
400kΩ
6
+5V
400kΩ
18 1
+5V
400kΩ
19 24
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
T2
T3
T4
R1
R2
20
R3
24
T4
OUT
23
R2
IN
22
R2
OUT
21
SD
20
EN
19
T4
IN
18
T3
IN
17
R3
OUT
16
R3
IN
15
V-
14
C2-
13
C2+
9
V+
V-
0.1µF
+
11
15
0.1µF
+
2
3
T1
OUT
T2
OUT
T3
OUT
T4
R1
OUT
IN
45
5kΩ
2322
R2
IN
5kΩ
1617
R3
5kΩ
21
IN
SD
GND
8
3
Page 4
Pinouts (Continued)
HIN207 (SOIC, SSOP)
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
TOP VIEW
HIN208 (SOIC)
TOP VIEW
R1
R2
R3
0.1µF
0.1µF
T1
T2
T3
T4
T5
OUT
OUT
OUT
T3
1
OUT
T1
2
OUT
T2
3
OUT
R1
4
IN
R1
5
OUT
T2
6
IN
T1
7
IN
8
GND
V
9
CC
C1+
10
V+
11
C1-
12
+5V
10
C1+
+
12
C1-
13
+
14
IN
IN
18 1
IN
19 24
IN
21 20
IN
VOLTAGE DOUBLER
C2+
VOLTAGE INVERTER
C2-
+5V
400kΩ
7
+5V
400kΩ
6
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
9
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
T5
R1
R2
R3
GND
8
5kΩ
5kΩ
5kΩ
T4
24
OUT
R2
23
IN
R2
22
OUT
T5
21
IN
T5
20
OUT
T4
19
IN
T3
18
IN
R3
17
OUT
R3
16
IN
V-
15 14
C2­C2+
13
T2 T1
R2
R1
OUT OUT
R2
OUT
T1
OUT
R1
GND
V
CC
C1+
V+
C1-
T3
1
2
3
IN
4
5
IN
6
7
IN
8
9
10 11 12
24
OUT
R3
23
IN
R3
22
OUT
T4
21
IN
T4
20
OUT
T3
19
IN
T2
18
IN
R4
17
OUT
R4
16
IN
V-
15
C2-
14
C2+
13
+5V
V+
V-
0.1µF
+
11
15
0.1µF
+
2
3
45
2322
1617
T1
T2
T3
T4
T5
R1
R2
R3
OUT
OUT
OUT
OUT
OUT
IN
IN
IN
0.1µF
0.1µF
T1
T2
T3
T4
R1
R2
R3
R4
10
C1+
+
12
C1-
13
+
14
5
IN
18
IN
19 24
IN
21 20
IN
OUT
OUT
OUT
OUT
VOLTAGE DOUBLER
C2+
VOLTAGE INVERTER
C2­+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
9
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
R1
R2
R3
R4
V+
V-
5kΩ
5kΩ
5kΩ
5kΩ
0.1µF
+
11
15
0.1µF
+
2
1
76
34
2322
1617
T1
T2
T3
T4
R1
R2
R3
R4
OUT
OUT
OUT
OUT
IN
IN
IN
IN
GND
8
4
Page 5
Pinouts (Continued)
HIN211 (SOIC, SSOP)
T3
1
OUT
T1
2
OUT
3
T2
OUT
R2
4
IN
R2
5
OUT
T2
6
IN
T1
7
IN
R1
8
OUT
R1
9
IN
GND
10
V
11
CC
C1+
12
V+
13 14
C1-
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
TOP VIEW
28
T4
OUT
27
R3
IN
R3
26
OUT
SD
25 24
EN R4
23
IN
R4
22
OUT
T4
21
IN
20
T3
IN
R5
19
OUT
R5
18
IN
V-
17 16
C2-
15
C2+
NOTE: R4 and R5 active in shutdown.
R2
R1
T3 T1 T2
OUT OUT OUT
R2
OUT
T2 T1
OUT
R1 GND
V
CC
C1+
V+
C1-
IN
IN IN
IN
HIN213 (SSOP)
TOP VIEW
1 2 3 4 5 6 7 8
9 10 11 12 13 14
T4
28
OUT
27
R3
IN
R3
26
OUT
SD
25
EN
24
R4
23
IN
R4
22
OUT
T4
21
IN
20
T3
IN
R5
19
OUT
R5
18
IN
V-
17 16
C2-
15
C2+
R1
R2
R3
R4
R5
0.1µF
0.1µF
T1
T2
T3
T4
OUT
OUT
OUT
OUT
OUT
EN
+5V
11
12
C1+
+
14
C1-
15
C2+
+
16
C2-
+5V
400kΩ
7
IN
+5V
400kΩ
6
IN
+5V
400kΩ
20 1
IN
+5V
400kΩ
21 28
IN
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
T2
T3
T4
8
R1
R2
R3
R4
24
R5
GND
10
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
V+
V-
+5V
0.1µF
+
13
17
0.1µF
+
2
3
9
45
2726
2322
1819
25
T1
T2
T3
T4
R1
R2
R3
R4
R5
OUT
OUT
OUT
OUT
IN
IN
IN
IN
IN
SD
0.1µF
0.1µF
R1
R2
R3
R4
R5
12
C1+
+
14
C1-
15
+
16
T1
T2
T3
T4
OUT
OUT
OUT
OUT
OUT
7
IN
6
IN
20 1
IN
21 28
IN
8
24
EN
VOLTAGE DOUBLER
C2+
VOLTAGE INVERTER
C2­+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
11
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
R1
R2
R3
R4
R5
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
V+
V-
0.1µF
+
13
17
0.1µF
+
2
3
9
45
2726
2322
1819
25
SD
T1
T2
T3
T4
R1
R2
R3
R4
R5
OUT
OUT
OUT
OUT
IN
IN
IN
IN
IN
GND
10
5
Page 6
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
-0.3V) <V+ < 12V
CC
Input Voltages
T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
IN
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
IN
Output Voltages
T
. . . . . . . . . . . . . . . . . . . .(V- -0.3V) < V
OUT
R
. . . . . . . . . . . . . . . . . (GND -0.3V) < V
OUT
TXOUT
RXOUT
< (V+ +0.3V) < (V+ +0.3V)
Short Circuit Duration
T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
R
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
OUT
Thermal Resistance (Typical, Note 1)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 110
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300
(SOIC and SSOP - Lead Tips Only)
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 1
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
o
C to 70oC
o
C to 85oC
θ
(oC/W)
JA
o
C to 150oC
o
o
C
C
Electrical Specifications Test Conditions: V
T
= Operating Temperature Range
A
= +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, I
CC
Shutdown Supply Current, I
(SD) TA = 25oC HIN206, HIN211 - 1 10 µA
CC
No Load, T
= 25oC
A
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V Input Logic High, V
Transmitter Input Pullup Current, I
lL
lH
P
TTL/CMOS Receiver Output Voltage Low, V
TTL/CMOS Receiver Output Voltage High, V TTL/CMOS Receiver Output Leakage EN
TIN, EN, SD, EN, SD --0.8V T
IN
EN
, SD, EN, SD 2.4 - - V
TIN = 0V - 15 200 µA
OLIOUT
OHIOUT
= 1.6mA
(HIN202, I
= -1mA 3.5 4.6 - V
= VCC, EN = 0, 0V < R
RECEIVER INPUTS
RS-232 Input Voltage Range, V Receiver Input Impedance, R Receiver Input Low Threshold, V
Receiver Input High Threshold, V
Receiver Input Hysteresis, V
IN
IN
(H-L) VCC = 5V,
IN
(L-H) VCC = 5V,
IN
HYST
TA = 25oC, VIN = ±3V 3.0 5.0 7.0 kΩ
T
= 25oC
A
T
= 25oC
A
VCC = 5V No Hysteresis in Shutdown Mode
HIN202 - 8 15 mA HIN206, HIN207, HIN208,
-1120mA
HIN211, HIN213
HIN213 - 15 50 µA
2.0 - - V
-0.10.4V
= 3.2mA)
OUT
OUT
< V
CC
-0.05±10 µA
-30 - +30 V
Active Mode 0.8 1.2 - V Shutdown Mode
0.6 1.5 - V
HIN213 R4 and R5 Active Mode - 1.7 2.4 V Shutdown Mode
-1.52.4V
HIN213 R4 and R5
0.2 0.5 1.0 V
6
Page 7
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Electrical Specifications Test Conditions: V
T
= Operating Temperature Range (Continued)
A
= +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
TIMING CHARACTERISTICS
Baud Rate 1 Transmitter
Switching Output Enable Time, t Output Disable Time, t
EN
DIS
Transmitter, Receiver Propagation Delay, t
HIN206, HIN211, HIN213 - 400 - ns
HIN206, HIN211, HIN213 - 200 - ns
HIN213 SD = 0V, R4, R5 - 0.5 40 µs
PD
HIN213 SD
HIN202, HIN206, HIN207, HIN208, HIN211 - 0.5 10 µs Transition Region Slew Rate, SR
T
RL = 3kΩ, CL = 2500pF Measured from
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
TRANSMITTER OUTPUTS
Output Voltage Swing, T Output Resistance, T
OUT
OUT
RS-232 Output Short Circuit Current, I
SC
Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V
VCC = V+ = V- = 0V, V
T
Shorted to GND - ±10 - mA
OUT
NOTE:
2. Guaranteed by design.
R
= 3kΩ 120 - - kbps
L
= VCC, R1 - R5 - 0.5 10 µs
3-30V/µs
= ±2V 300 - - Ω
OUT
V
CC
GND
RC
OSCILLATOR
VOLTAGE DOUBLER
S1
C1+
+
-
C1
S3
-
C1
S2
S4
GND
CC
S5
S7
V+ = 2V
+
C3
-
V
CC
FIGURE 1. CHARGE PUMP
VOLTAGE INVERTER
C2+
C2-
S6
+
C2
-
S8
GND
+
C4
-
- = - (V+)
V
7
Page 8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Detailed Description
The HIN202, HIN206, HIN207, HIN208, HIN211, HIN213 family of RS-232 transmitters/receivers are powered by a single +5V power supply feature low power consumption, and meet all ElA RS232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 125kHz. During phase one of the clock, capacitor C1 is charged to V added to V V
. During phase two, C2 is also charged to 2VCC, and
CC
then during phase one, it is inverted with respect to ground to produce a signal across C4 equal to -2V pump accepts input voltages up to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage inverter section (V-) is approximately 450Ω . A typical application uses 0.1µF capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies.
During shutdown mode (HIN206 and HIN211, SD = V HIN213, SD = 0V) the charge pump is turned off, V+ is pulled down to V current is reduced to less than 10µA. The transmitter outputs are disabled and the receiver outputs (except for HIN213, R4 and R5) are placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of V 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ - 0.6V). Each transmitter input has an internal 400kΩ pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of ±5V minimum with the worst case conditions of: all transmitters driving 3kΩ minimum load impedance, V
= 4.5V, and maximum allowable operating temperature.
CC
The transmitters have an internally limited output slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300Ω with ±2V applied to the outputs and V
. During phase two, the voltage on C1 is
CC
, producing a signal across C3 equal to twice
CC
. The charge
CC
, V- is pulled up to GND, and the supply
CC
, or 1.3V for VCC = 5V. A logic
CC
= 0V.
CC
CC
,
Receivers
The receiver inputs accept up to ±30V while presenting the required 3kΩ to 7kΩ input impedance even if the power is off (V
= 0V). The receivers have a typical input threshold of
CC
1.3V which is within the ±3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to V
. The output will be low whenever the input is
CC
greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis (except during shutdown) to improve noise rejection. The receiver Enable line (EN
on HIN206 and HIN211, EN on HIN213) when unasserted, disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode (except HIN213 R4 and R5).
V+
V
CC
T
XIN
GND < T
XIN
V-
-30V < R
XIN
T
IN
OR
R
IN
T
OUT
OR
R
OUT
AVERAGE PROPAGATION DELAY =
FIGURE 4. PROPAGATION DELAY DEFINITION
400kΩ
< V
CC
FIGURE 2. TRANSMITTER
V
CC
R
XIN
< +30V
GND
FIGURE 3. RECEIVER
t
PHL
5kΩ
300Ω
GND < V
t
PLH
t
PHL + tPLH
2
V- < V
R
ROUT
OUT
T
OUT
TOUT
< V
< V+
CC
V
OL
V
OL
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which remain active in shutdown mode. During normal operation the receivers propagation delay is typically 0.5µs. This propagation delay may increase slightly during shutdown. When entering shut down mode, receivers R4 and R5 are not valid for 80µs after SD mode, all receiver outputs will be invalid until the charge pump circuitry reaches normal operating voltage. This is typically less than 2ms when using 0.1µF capacitors.
= VIL. When exiting shutdown
8
Page 9
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Typical Performance Curves
12
10
8
6
4
V- SUPPLY VOLTAGE (V)
2
0
3.5 4.0 4.5 6.0
FIGURE 5. V- SUPPLY VOLTAGE vs V
Test Circuits (HIN202)
-
0.1µF C3
+
C1+
1
V+
2
-
+
­+
C1-
3
C2+
4
C2­V­T2
R2
OUT
IN
R1
R2
5
­6
7 8
0.1µF C1
0.1µF C2
3kΩ
T2
OUTPUT
RS-232
±30V INPUT
+
0.1µF C4
T1
V
CC
V
GND
OUT
R1
OUT
T1 T2
OUT
CC
0.1µF
5.0 5.53.0
CC
+4.5V TO
+5.5V INPUT
16 15 14 13
IN
12 11
IN
10
IN
9
3kΩ
T1 OUTPUT RS-232 ±30V INPUT TTL/CMOS OUTPUT TTL/CMOS INPUT
TTL/CMOS INPUT TTL/CMOS OUTPUT
12
10
8
6
4
SUPPLY VOLTAGE (|V|)
2
0
V- (VCC = 4V)
TA = 25oC TRANSMITTER OUTPUTS
OPEN CIRCUIT
|I
LOAD
V+ (VCC = 5V)
| (mA)
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
1 2 3 4 5 6 7 8
R
OUT
VIN = ±2V
C1+ V+ C1­C2+ C2­V-
T2
OUT
R2
IN
= VIN/I
T1
R1
R2
V
GND
OUT
R1
OUT
T1 T2
OUT
T2
CC
IN
IN IN
OUT
T1
A
16 15 14 13 12 11 10
9
OUT
V+ (VCC = 4V)
V- (VCC = 5V)
302520151050
35
FIGURE 7. GENERAL TEST CIRCUIT
Application Information
The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kW resistor connected to V+.
9
FIGURE 8. POWER-OFF SOURCE RESISTANCE
CONFIGURATION
In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters.
Page 10
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
INPUTS
OUTPUTS
TTL/CMOS
C1
0.1µF
C2
0.1µF
+5V
TD
RTS
RD
CTS
16
1
+
3
-
+
-
HIN202
4
5
T1
11
R2
T2
R1
10 12
9
-
+
CTR (20) DATA TERMINAL READY
DSRS (24) DATA
6
-
+
14
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
8
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
SIGNALING RATE SELECT
RS-232 INPUTS AND OUTPUTS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
INPUTS
OUTPUTS
TTL/CMOS
INPUTS
OUTPUTS
TTL/CMOS
C1
0.1µF
C1
0.1µF
DSRS
TD
RTS
RD
CTS
0.2µF
DTR
DCD
R1
R1
R1
T2
T2
4
+
C2
5
0.1µF
-
14
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
8
CTS (5) CLEAR TO SEND
15
V
16
26
2
CC
-
CC
+5V
RS-232 INPUTS AND OUTPUTS
C3
+
0.2µF V
16
4
+
C2
5
0.1µF
-
14
DTR (20) DATA TERMINAL READY
7
DSRS (24) DATA SIGNALING RATE SELECT
13
DCD (8) DATA CARRIER DETECT
8
R1 (22) RING INDICATOR
1
+
-
C4
+
+
-
HIN202
3
T1
11
10 12
R2
9
-
V- V+
6
HIN202
1
3
T1
11
10 12
R2
9
SIGNAL GROUND (7)15
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
10
Page 11
Die Characteristics
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
DIE DIMENSIONS:
160 mils x 140 mils
METALLIZATION:
Type: Al Thickness: 10k
Å ±1kÅ
SUBSTRATE POTENTIAL
V+
Metallization Mask Layout
R3
OUT
R3
IN
PASSIVATION:
Type: Nitride over Silox Nitride Thickness: 8k
Å
Silox Thickness: 7kÅ
TRANSISTOR COUNT:
238
PROCESS:
CMOS Metal Gate
HIN211
ENSHD
R4
IN
R4
OUT
OUT
IN
IN
R5
T3
T4
R5
IN
V-
C2-
T4
T3
T1 T2
OUT
OUT
OUT
OUT
R2
C2+
C1-
V+
C1+
IN
R2
OUTT2INT1INR1OUT
R1INGND
V
CC
11
Page 12
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Dual-In-Line Plastic Packages (PDIP)
N
D1
-C-
E1
-B-
A1
A2
E
A
L
e
C
C
L
e
A
C
e
B
INDEX
AREA
BASE
PLANE
SEATING
PLANE
D1
B1
12 3 N/2
-A­D
e
B
0.010 (0.25) C AM BS
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE­DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
7. e
e
A
ular to datum .
and eC are measured at the lead tips with the leads unconstrained.
B
e
must be zero or greater.
C
-C-
8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 ­B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 ­D 0.735 0.775 18.66 19.68 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC ­e
A
e
B
0.300 BSC 7.62 BSC 6
- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N16 169
NOTESMIN MAX MIN MAX
Rev. 0 12/93
12
Page 13
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
N
INDEX AREA
123
-A­D
e
B
0.25(0.010) C AMB
E
-B-
SEATING PLANE
A
-C-
S
M
0.25(0.010) B
H
α
µ
A1
0.10(0.004)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In­terlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen­sions are not necessarily exact.
M
L
h x 45
M
o
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.053 0.069 1.35 1.75 -
A1 0.004 0.010 0.10 0.25 -
B 0.014 0.019 0.35 0.49 9 C 0.007 0.010 0.19 0.25 ­D 0.386 0.394 9.80 10.00 3
E 0.150 0.157 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.228 0.244 5.80 6.20 -
h 0.010 0.020 0.25 0.50 5
C
L 0.016 0.050 0.40 1.27 6
N16 167
o
α
0
o
8
o
0
o
8
Rev. 1 02/02
NOTESMIN MAX MIN MAX
-
13
Page 14
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
N
INDEX AREA
123
SEATING PLANE
-A­D
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
h x 45
o
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 ­D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e 0.050 BSC 1.27 BSC ­H 0.394 0.419 10.00 10.65 ­h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N16 167
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
14
Page 15
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
N
INDEX AREA
123
SEATING PLANE
-A­D
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
h x 45
o
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 ­D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6
N24 247
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
15
Page 16
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX AREA
123
SEATING PLANE
-A­D
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen­sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.078 - 2.00 ­A1 0.002 - 0.05 - ­A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
o
α
0
o
8
o
0
NOTESMIN MAX MIN MAX
o
8
Rev. 1 3/95
-
16
Page 17
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
N
INDEX AREA
123
SEATING PLANE
-A­D
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
h x 45
o
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In­terlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen­sions are not necessarily exact.
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 ­D 0.6969 0.7125 17.70 18.10 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC ­H 0.394 0.419 10.00 10.65 -
C
h 0.01 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6 N28 287
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
17
Page 18
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX AREA
123
SEATING PLANE
-A­D
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual in­dex feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dam­bar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.078 - 2.00 ­A1 0.002 - 0.05 - ­A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.390 0.413 9.90 10.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N28 287
o
α
0
o
8
o
0
o
8
Rev. 1 3/95
NOTESMIN MAX MIN MAX
-
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data she ets are current before placin g orders. Information furn ished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or othe rwise under any patent or patent rights of Intersil or its subsidia ries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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