Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6113-B
Issued Date : 1992.09.30
Revised Date : 2000.09.20
Page No. : 1/3
HE8551
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HE8551 is designed for use in 2W output amplifier of portable radios
in class B push-pull operation.
Features
High Tot al Power Dissipat ion (PT: 2W, TC=25°C)
•
High Collector Current (IC: 1.5A)
•
Complementary to HE8051
•
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature....................................................................................................... -55 ~ +150 °C
Junction Temperature ............................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)................................................................................................... 1 W
Total Power Dissipation (Tc=25°C)................................................................................................... 2 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage.................................................................................................... -40 V
VCEO Collector to Emitter Voltage ................................................................................................. -25 V
VEBO Emitter to Base Voltage......................................................................................................... -6 V
IC Collector Current...................................................................................................................... -1.5 A
IB Base Current ............................................................................................................................ -0.5 A
(Ta=25°C)
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -40 - - V IC=-100uA, IE=0
BVCEO -25 - - V IC=-2mA, IB=0
BVEBO -6 - - V IE=-100uA, IC=0
ICBO - - -100 nA VCB=-35V, IE=0
IEBO - - -100 nA VEB=-6V, IC=0
*VCE(sat) - - -0.5 V IC=-0.8A, IB=-80mA
*VBE(sat) - - -1.2 V IC=-0.8A, IB=-80mA
VBE(on) - - -1 V VCE=-1V, IC=-10mA
*hFE1 45 - - VCE=-1V, IC=-5mA
*hFE2 85 - 500 VCE=-1V, IC=-100mA
*hFE3 40 - - VCE=-1V, IC=-800mA
fT 100 - - MHz VCE=-10V, IC=-50mA, f=100MHz
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification on hFE2
Rank B C D E
Range 85-160 120-200 190-300 250-500
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6113-B
Issued Date : 1992.09.30
Revised Date : 2000.09.20
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000 10000
Current Gain & Collector Current
hFE @ VCE=1V
Collector Current (mA)
On Voltage & Collector Current
10000
10000
1000
BE(sat)
V
@ IC=10IB
100
Saturation Voltage (mV)
10
1
0.1 1 10 100 1000 10000
CE (sat)
V
@ IC=10I
Collector Current (mA)
B
Capacitance & Reverse-Biased Volt age
100
Saturation Volt age & Coll ector Current
1000
On Voltage (mV)
100
1 10 100 1000 10000
BE(on)
V
@ VCE=1V
Collector Current (mA)
Cut off Fr equency & Collector Cu rrent
1000
VCE=10V
100
Cutoff Frequency (MHz)
Cob
10
Capac itanc e (pF)
1
0.1 1 10 100
Reverse-Biased Vol t a ge ( V)
Sa fe Operating Area
10000
1000
(mA)
C
100
Collector Current -I
10
PT=1ms
PT=100ms
PT=1s
10
1 10 100 1000
Collector Current (mA)
1
1 10 100
Forwar d Voltage-VCE (V)
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6113-B
Issued Date : 1992.09.30
Revised Date : 2000.09.20
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Base 3.Collec tor
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
F
DIM
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
1
α
2
α
3
α
Min. Max. Min. Max.
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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