Datasheet HCSM2818 Specification

Page 1
Rev Date: 11/4/2022 1 www.seielect.com
This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use.
HCSM Series
Stackpole Electronics, Inc.
Resistive Product Solutions
Features:
5W power rating in a small chip size 2818 size
Excellent long-term stability
100% RoHS compliant and lead free without exemption
Halogen free
AEC-Q200 compliant
REACH compliant
Applications:
Power modules
Frequency converters
Inverter control
Power management
Current sensor for power hybrid sources
Power Derating Curve:
Operating temperature range of -55ºC to 170ºC. Storage condition: 5ºC ~ 35ºC, humidity of 40% ~ 75%.
Mechanical Specifications
Electrical Specifications
Ohmic Range (Ω) and Tolerance
1% and 5%
± 100 0.002 ± 200
0.003, 0.004, 0.005
(*)
± 75
0.01, 0.015, 0.02, 0.025
(*)
(*) Other values may be available, but may require higher MOQ. Contact Stackpole.
TCR (ppm/ºC)
HCSM2818
5
Type/Code
Power Rating (W)
Type/Code Unit
0.281 ± 0.010 0.195 ± 0.010 0.065 ± 0.010 0.114 ± 0.010 inches
7.15 ± 0.25 4.95 ± 0.25 1.65 ± 0.25 2.90 ± 0.25 mm
HCSM2818
THL
W
Page 2
Rev Date: 11/4/2022 2 www.seielect.com
This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use.
HCSM Series
Stackpole Electronics, Inc.
Resistive Product Solutions
Environmental Performance Characteristics
Function Performance Characteristics
Test Test Method Test Specification Test Condition
Resistance to Solder
Heat
MIL-STD-202,
Method 210
ΔR: ± (1% + 0.0005 Ω)
Mount the chip to test substrate. Apply pressure in direction of arrow
unit band width reaches 2 mm (+0.2 / -0 mm) illustrated in the picture
below and hold for 10 ± 1 seconds. (JIS-C5202-6.1)
Bending Strength
ΔR: ± (1% + 0.0005 Ω)
JIS-C5202-6.1
Verify marking
permanency. (Not
required for laser
etched parts or parts
with no marking).
The chip is completely immersed in isopropyl alcohol
for 3 (+5/-0) minutes at 25°C ± 5°C.
Solvent Resistance
MIL-STD-202,
Method 215
The chip shall be immersed into the flux specified in the solder bath
260°C ± 5°C for 10 ± 1 seconds.
Test Test Method Test Specification Test Condition
Short Time Overload JIS-C5202-5.5
ΔR: ± (1% + 0.0005 Ω) 4 times rated power for 5 seconds
+25ºC / +125ºC
Operating temperature range is -55°C to +170°C
The chip (mounted on board) is exposed, -55°C ± 3ºC (30 minutes) /
+125 ± 2ºC (30 minutes) for 5 cycles.
The following conditions as the figure below.
Rapid Change
of Temperature
ΔR: ± (1% + 0.0005 Ω)
ΔR: ± (1% + 0.0005 Ω)
JIS-C5202-7.10
JIS-C5202-7.4
Load Life
Apply rated power at 70°C ± 2°C for 1000 hours with 1.5 hours ON
and 0.5 hour OFF.
JIS-5202-5.2
Temperature
Coefficient
of Resistance (TCR)
Refer to
Electrical Specifications
JIS-C5202-7.2
Damp Heat with Load
The chip (mounted on board) is exposed in the heat chamber,
125ºC ± 3°C for 1000 hours
High Temperature
Exposure
The specimens shall be placed in a chamber and subjected to a relative
humidity of 90 ~ 95% and a temperature of 40°C ± 2°C for a period of
1000 hours with applied rated power, 1.5 hours ON and 0.5 hour OFF.
ΔR: ± (1% + 0.0005 Ω) ΔR: ± (1% + 0.0005 Ω)
MIL-STD-202
Method 103
ΔR
R x Δt
10=TCR (ppm/ºC)
x
6
Page 3
Rev Date: 11/4/2022 3 www.seielect.com
This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use.
HCSM Series
Stackpole Electronics, Inc.
Resistive Product Solutions
Function Performance Characteristics (cont.)
Taping Specifications – Embossed Plastic Tape
Recommended Pad Layouts
Test Test Method Test Specification Test Condition
JIS-C5202-6.11
The chip shall be immersed into the flux specified in the solder bath
235°C ± 5°C for 2 ± 0.5 seconds.
It shall be immersed to a point 10mm from its root.
(Sn96.5/Ag3.0/Cu0.5)
Solderability
Note: 5W with total solder pad trace size of 500 mm2. The surface temperature of component should be below 100°C.
Solder shall cover 95%
or more of the
electrode area
Type/Code Unit
0.205 ± 0.004 0.303 ± 0.004 0.069 ± 0.004 0.295 ± 0.004 0.630 ± 0.012 0.012 ± 0.002 inches
5.21 ± 0.10 7.69 ± 0.10 1.75 ± 0.10 7.50 ± 0.10 16.00 ± 0.30 0.30 ± 0.05 mm Unit
0.157 ± 0.004 0.315 ± 0.004 0.079 ± 0.004 0.059 ± 0.004 0.059 ± 0.004 inches
4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.10 1.50 ± 0.10 1.50 ± 0.10 mm
t
HCSM2818
P0P1P2D0D1
WABEF
Type/Code a b c d Unit
0.138 0.209 0.020 0.024 inches
3.50 5.30 0.50 0.60 mm
HCSM2818
Page 4
Rev Date: 11/4/2022 4 www.seielect.com
This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use.
HCSM Series
Stackpole Electronics, Inc.
Resistive Product Solutions
Soldering Recommendations:
Peak reflow temperatures and durations
IR Reflow Peak = 260ºC max for 10 seconds Wave Solder = 260ºC max for 10 seconds
Compatible with lead and lead-free solder reflow processes
Recommended IR reflow profile:
RoHS Compliance
Stackpole Electronics has joined the worldwide effort to reduce the amount of lead in electronic components and to meet the various
regulatory requirements now prevalent, such as the European Union’s directive regarding “Restrictions on Hazardous Substances ”
(RoHS 3). As part of this ongoing program, we periodically update this document with the status regarding the availability of our compliant components. All our standard part numbers are compliant to EU Directive 2011/65/EU of the European Parliament as amended by Directive (EU) 2015/863/EU as regards the list of restricted substances.
“Conflict Metals” Commitment
We at Stackpole Electronics, Inc. are joined with our industry in opposing the use of metals mined in the “conflict region” of the eastern Democratic Republic of the Congo (DRC) in our products. Recognizing that the supply chain for metals used in the electronics industry is very complex, we work closely with our own suppliers to verify to the extent possible that the materials and products we supply do not contain metals sourced from this conflict region. As such, we are in compliance with the requirements of Dodd-Frank Act regarding Conflict Minerals.
Compliance to “REACH”
We certify that all passive components supplied by Stackpole Electronics, Inc. are SVHC (Substances of Very High Concern) free and
compliant with the requirements of EU Directive 1907/2006/EC, “The Registration, Evaluation, Authorization and Restriction of Chemicals”, otherwise referred to as REACH. Contact us for complete list of REACH Substance Candidate List.
RoHS Compliance Status
HCSM
High Current Shunt Resistor SMD YES 100% Matte Sn over Ni Always Always
Standard
Product
Series
Description
Package /
Termination
Type
Standard
Series
RoHS
Compliant
Lead-Free Termination
Composition
Lead-Free
Mfg. Effective Date
(Std Product Series)
Lead-Free
Effective Date
Code
(YY/WW)
Page 5
Rev Date: 11/4/2022 5 www.seielect.com
This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you order and/or use.
HCSM Series
Stackpole Electronics, Inc.
Resistive Product Solutions
Environmental Policy
It is the policy of Stackpole Electronics, Inc. (SEI) to protect the environment in all localities in which we operate. We continually strive to improve our effect on the environment. We observe all applicable laws and regulations regarding the protection of our environment and all requests related to the environment to which we have agreed. We are committed to the prevention of all forms of pollution.
Code Tol Code Quantity
F 1%
T 3500
J 5%
0.004 ohm = 4L00
0.01 ohm = 10L0
Description
Size
Four characters with
"L" used as multiplier
of 10-3 for any value
under 0.1 ohm
0.015 ohm = 15L0
2818
13" Reel - Plastic Tape
HCSM
Product Series
Resistance Value
Tolerance
Packaging
Size
2818
How to Order
H C S M 2 8 1 8 F T 2 0 L 0
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